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Bosch Application Board 3.0 accelerates development

Posted on by mixos

Bosch Application Board 3.0 is a versatile and sensor-independent development platform for evaluating various sensors. The Application Board 3.0 shuttle board socket allows a wide range of Bosch Sensortec’s sensors to be plugged in. The application board 3.0 and shuttle board 3.0 evaluate sensors and builds prototypes to test use cases.

The Bosch Sensortec Application Board 3.0 is a closed system used to configure sensor parameters and plot and log the resulting sensor readings through PC-based software (Desktop Development) and COINES.

The Application Board 3.0 uses the uBIox NINA-B302 Bluetooth Low Energy module based on the nRF52840 chipset from Nordic Semiconductor. The nRF52840, among other features, supports USB 2.0 and Bluetooth Low Energy 5.0. It is based on an Arm® Cortex®-M4F CPU and flash program memory.

Specifications

  • Length 37mm x width 47mm x height 7mm
  • 5V DC USB, 3.7V Li-ion battery supply voltage
  • 256KB RAM, 1MB internal flash, 2Gb external flash memory capacity (user data memory)
  • BLE 5.0 / USB 2.0
  • 2.4GHz, 40 channels BLUETOOTH® low energy frequency band
  • +0dBm Typical conducted output power
  • +2dBm Radiated output power (EIRP)

more information: https://www.bosch-sensortec.com/software-tools/tools/application-board-3-0/

Teledyne Relays DIP Packaged Reed Relays

Posted on by mixos

Teledyne DIP Packaged Reed Relays provide both the consistency and reliability of a sealed reed switch with the convenience of a Dual-In-Line package relay. The industry-standard 14-pin DIL package allows soldering directly into a PCB or inserted into sockets for convenient replacement. Rhodium switch contacts are hermetically sealed in glass, mounted on an integral lead frame, then encapsulated in thermoset plastic for easy handling. These DIP Packaged Reed Relays are available in multiple contact forms, with several coil voltages and with/without an internal suppression diode.

Features

  • Hermetically sealed contacts
  • Industry-standard DIL package
  • 1A, 1B, 1C, and 2A contact forms
  • Multiple coil voltage options
  • Long life
  • RoHS compliant

Specifications

  • Coil characteristics
    • Coil voltage
      • 5VDC to 24VDC nominal
      • 16VDC to 32VDC maximum
    • 200Ω to 2150Ω ±10% coil resistance at +20°C
    • 3.75VDC to 18VDC maximum operating voltage range
    • 0.6VDC to 2VDC minimum release voltage range
  • Relay characteristics
    • 1010Ω minimum insulation resistance
    • 150VDC to 1400VDC dielectric strength range
    • 1ms or 1.5ms typical operating time
    • 0.05ms or 2ms typical release time
  • +85°C/W thermal resistance
  • Contact characteristics
    • Rhodium contact material
    • Any operating position
    • 100V switching voltage
    • 0.25A or 0.5A switching current
    • 0.5A or 1A carry current
    • 3W or 10W contact rating
    • 150Hz or 200Hz maximum switching frequency
    • 0.15Ω maximum contact resistance
  • Temperature ranges
    • -40°C to +70°C operating (up to +85°C for the DIP2-1A)
    • -40°C to +105°C storage

more information: https://www.teledynedefenseelectronics.com/relays/ourproducts/reedrelays/Pages/Reed-Relays.aspx

AMD Ryzen Embedded V2000-based MI989 Mini-ITX Motherboard

Posted on by mixos

IBASE Technology Inc., a leading manufacturer of industrial motherboards and AIoT solutions, has released the MI989 Mini-ITX motherboard with AMD Ryzen™ Embedded V2000 Series processor that offers up to eight CPU cores and 16 threads, providing unprecedented speed and power efficiency for embedded applications in retail, healthcare, industrial automation, and smart cities. The AMD Ryzen Embedded V2000 family is built with 7nm process technology, achieving up to 30% better CPU performance and up to 40% faster graphics performance than previous-generation counterparts.

“By partnering with AMD, we are able to deliver powerful embedded boards and solutions to our customers. The AMD Ryzen V2000-based MI989 boasts system performance improvements, system security features, and an excellent performance-per-watt ratio with a TDP range between 10W to 54W,”

said Wilson Lin, Director of IBASE Product Planning Department.

MI989 FEATURES:

  • AMD Ryzen™ Embedded V2000 processor on board
  • 2x DDR4 SO-DIMM, Max. 64GB, ECC compatible
  • Dual Intel® Gigabit LAN
  • 4x DisplayPort 1.4
  • 3x USB 3.1, 2x USB 2.0, 4x COM, 1x SATA III
  • 1x PCI-E(x16), 3x M.2 (5G-compatible B-Key 3052, E-Key and M-Key)
  • Watchdog timer, Digital I/O, TPM 2.0

The MI989 features a 5G-compatible M.2 3052 socket and is packed with advanced graphics capabilities and versatile I/O connectivity. The integrated new generation AMD Radeon Vega graphics can drive four independent displays in full 4K resolution. The board also features support for up to 64GB DDR4-3200 modules, two GbE LAN controllers, TPM 2.0 hardware security, and expansion slots such as PCI-e(x16), M.2 E-key, M.2 B-key, and M.2 M-key.

Measuring 170x170mm, MI989 has external ports for 2x COM, 4x DP (1.4), 2x USB 2.0, 2x LAN, 2x USB 3.0, and jacks for HD audio. For more information, please visit www.ibase.com.tw

PICO-TGU4: Powering Edge AI Evolution with 11th Generation Intel® Core™ Processors

Posted on by mixos

The PICO-TGU4 brings the power of 11th Generation Intel® Core™ U processors and combines it with the expandability and flexibility to deploy the next generation of AI Edge Computing applications.

AAEON, an industry leader in AI Edge Computing solutions, announces the PICO-TGU4 compact PICO-ITX board powered by the 11th Generation Intel® Core™ U processors. By leveraging AAEON’s expertise and the cutting-edge technologies offered with this latest generation of processors, the PICO-TGU4 delivers performance and flexibility to power the next generation of industrial AI and machine vision applications.

The 11th Generation Intel Core processors (formerly Tiger Lake) are the third generation of Intel’s 10nm microarchitecture, delivering up to 15~20% better performance than the previous generation processors. The PICO-TGU4 offers users the choice of Intel Core U i3/i5/i7 or Intel Celeron® processors to power their projects. These processors support a range of technologies to ensure data integrity, accuracy and security, including on-board TPM 2.0 and in-band memory ECC (with select SKUs). Combined with up to 32GB of on-board LPDDR4x memory, the PICO-TGU4 helps unlock the performance needed to deploy a wide range of embedded and edge computing applications.

One of the core features of the PICO-TGU4 are its two expansion slots, allowing developers to quickly add on functionality to power their AI Edge applications. The M.2 2280 slot delivers PCIe 4.0 (x4) speeds, perfect for AI accelerator cards such as the AI Core XM2280, as well as providing the throughput needed to support the next generation of AI accelerators. The full-sized Mini Card (mPCIe) slot offers additional versatility with support for AI accelerators, wireless modules such as Wi-Fi or LTE, expanded storage with mSATA support and even more, including 30-bit DIO cards. This flexible expandability allows the PICO-TGU4 to be right at home with power AI and Edge Computing applications.

The PICO-TGU4 offers a broad I/O layout allowing the board to easily connect to a wide range of sensors and devices, or easily integrate with projects. The board features a total of eight USB connections, with two USB3.2 Gen 2 type A ports, two USB3.2 Gen 1 headers and four USB2.0 headers. The board also includes two serial port headers, as well as 8-bit GPIO and I2C/SMBUS connectors, allowing connections to an even wider range of devices.

The PICO-TGU4 also features dual LAN ports, one Intel i225 2.5 Gbps port for ultra-fast LAN connectivity, and on Intel i219 port with support for Intel vPro, enabling remote system monitoring. Additionally, the PICO-TGU4 offers storage flexibility with both SATA III (6.0 Gbps) and support for Mini Card mSATA storage. It also includes eDP and HDMI 2.0 delivering brilliant 4K 60Hz resolution.

“The PICO-TGU4 offers a combination of performance, flexibility and scalability support that is not often seen on the compact PICO-ITX form factor,” said Ariel Long, Product Manager with AAEON’s Embedded Computing Division. “The 11th Generation Intel Core U processors allows the PICO-TGU4 to leverage both performance and new technologies to power applications from robotics and machine vision to Smart Factories and AI Edge Computing.”

The PICO-TGU4 is backed by AAEON’s expertise in building compact, rugged solutions designed to operate in a wide range of industrial and other environments. AAEON also offers a range of manufacturer and OEM/ODM services, from customizing board layouts to helping developers create a board-level solution that fits the requirements of their applications.

Dual +5 V/-5V @ 200 mA Regulated Linear Power Supply

Posted on by mixos

The project presented here is a dual AC to DC output linear power supply. This power supply provides low ripple low noise DC regulated output. Usually, transformer-based linear power supplies are considered very bulky and inefficient, but this power supply still is very important for sensitive applications such as analog circuits, communications devices, radio devices, audio circuits, OPAMP-based projects etc.

Dual +5 V/-5V @ 200 mA Regulated Linear Power Supply – [Link]

Dual +12V/-12V @ 400mA Regulated Linear Power Supply with AC input

Posted on by mixos

The project presented here is a dual output linear power supply. This power supply provides low ripple low noise DC regulated output. It is a very useful tool to power Audio, Video, OPAMP-based circuits, and projects. The circuit provides regulated +/-12V DC output @ 400mA + 400mA. The project supports AC input supply 230V or 115V. On-board jumpers are provided for AC230V or AC115V selection. Besides regulated output, the board also has provisions to output the unregulated supply using CN2.

Dual +12V/-12V @ 400mA Regulated Linear Power Supply with AC input – [Link]

Dual Output Adjustable Linear Power Supply +/-1.2V to +/-12V @ 250mA

Posted on by mixos

This project is a solution to power up most devices or projects requiring dual (+/-) adjustable power. The circuit consists of a stepdown transformer, bridge rectifier, DC filter capacitors, LM317 positive and LM337 negative adjustable voltage regulators, 2 x trimmer pot for independent output voltage adjust, and power LEDs.

Dual Output Adjustable Linear Power Supply +/-1.2V to +/-12V @ 250mA – [Link]

Azoteq IQS7222A ProxFusion® ICs

Posted on by mixos

Azoteq IQS7222A ProxFusion® ICs offer a 1.71V to 3.5V voltage range, ±4000V electrostatic discharge, and +85°C max. temperature rating. These sensors are fully I2C compatible, and feature on-chip calculations that enable multiple application options. These highly flexible ProxFusion devices can configure up to 9 channels using external connections or internal sensors. Azoteq IQS7222A ProxFusion ICs are ideal for waterproof buttons, wear detection, SAR compliance in mobile devices, and HALL-effect dock detection.>

Features

  • Highly flexible ProxFusion device
  • 12 sensor pad connections (QFN-20) / 10 sensor pad connections (WLCSP-18)
  • Configure up to 9 Channels using the external connections or internal sensor
  • External Sensor Options
    • Up to 8 self capacitive touch/proximity sensors with additional distributed sensor padsi
    • Up to 9 projected capacitive touch/proximity sensors
    • Up to 4 inductive sensor elements
  • Internal sensor option
    • HALL-effect switch
  • Built-in basic functions
    • Automatic tuning
    • Noise filtering
    • Differential measurements
    • Debounce and hysteresis
    • Dual direction trigger indication
  • Built-in signal processing options
    • Slider output (0-255)
    • Gesture functions (swipe, tap, hold)
  • Design simplicity
    • PC Software for debugging and obtaining optimal settings and performance
    • One-time programmable settings for custom power-on IC configuration
    • Auto-run from programmed settings for simplified integration
  • Automated system power modes for optimal response vs consumption
  • I2C communication interface with IRQ/RDY (up to fast plus – 1MHz)
  • Event and streaming modes
  • Customizable user interface due to programmable memory
  • 1.8V to 3.5V supply voltage
  • Small Packages
    • WLCSP18 (1.62mm x 1.62mm x 0.5mm) – interleaved 0.4mm x 0.6mm ball pitch
    • QFN20 (3mm x 3mm x 0.5mm) – 0.4mm pitch

Block Diagram

Applications

  • SAR compliance in mobile devices
  • Wear detection
  • Appliance user interface (slider and buttons)
  • Waterproof buttons (inductive)
  • Low power wake-up buttons/proximity
  • HALL-effect dock detection

more information: https://www.azoteq.com/product/iqs7222a/

STSPIN32G4 – High performance 3-phase motor controller with embedded STM32G4 MCU

Posted on by mixos

STMicroelectronics’ high-performance 3-phase motor controller features an unprecedented level of integration and flexibility.

STMicroelectronics’ STSPIN32G4 is a high-performance 3-phase motor controller featuring an unprecedented level of integration and flexibility. It packs a complete motion control system in a single package. It is among very few products on the market that integrate a very high-performance Cortex®-M4 MCU (STM32G431) with 75 V / 1 A rated 3-phase gate driver and flexible power management regulators, all in a thermally efficient 9×9 QFN package.

It is designed to efficiently address a wide range of applications such as cordless power and garden tools, servo drives, e-bikes, robotic arms, home appliances (vacuum cleaners, dryers, and cleaning robots), pumps, fans, and many others.

Features

  • Three-phase gate driver:
    • 1 A sink/source current capability
    • VDS monitoring of the power stage MOSFETs
    • Integrated bootstrap diodes
    • I²C accessible configuration and status registers for best application fit
    • Cross-conduction prevention
  • STM32G431 microcontroller:
    • 32-bit Arm® Cortex-M4 MCU+FPU, up to 170 MHz clock frequency
    • CORDIC mathematical hardware accelerator for trigonometric functions
    • 128 kB Flash memory + 32 kB SRAM memory
    • 2x advanced timers for motor control with up to 6 x PWM channels each
    • 8x general purpose timers
    • 2x ADCs 16-bit resolution (up to 19 channels) with 4 Msps conversion rate
    • 4x 12-bit DAC channels
    • 4x ultra-fast rail-to-rail comparators
    • 3x rail-to-rail operational amplifiers usable also in PGA mode
    • Internal high precision voltage reference
    • Up to 40 GPIOs
    • Full set of interfaces: I²C, SPI, UART, and CAN
  • Self-supplied thanks to embedded flexible power management
    • VCC buck with up to 200 mA and programmable output and embedded MOSFET
    • 3.3 V LDO linear regulator up to 150 mA
    • Low quiescent linear regulator for MCU supply during standby
    • Full set of protections: thermal shutdown, short-circuit, and overload protection

more information: https://www.st.com/en/motor-drivers/stspin32g4.html

Nexperia ASFET for 36 V DC motors

Posted on by mixos

There is growing demand for 36 V DC motors, often being used with multi-cell lithium-ion battery packs, in an increasing range of applications

There is growing demand for 36 V DC motors, often being used with multi-cell lithium-ion battery packs, in an increasing range of applications. From cordless power tools to outdoor power equipment and even e-bikes and scooters. To drive these demanding applications safely and efficiently requires MOSFETs that have been optimized for high current, strong SOA and rugged avalanche rating. Nexperia has also optimized them for efficiency with our 50/55 V ASFET range.
Key features

  • Superjunction technology-enhanced SOA to withstand power dissipation due to short-circuit
  • ID of 200 A max. in a LFPAK56, enabling maximum torque from the motor
  • Low RDS(ON) characteristics deliver higher efficiency for longer battery life
  • LFPAK brings a unique level of board level reliability and ruggedness

Additional features

  • Nexperia’s Superjunction technology provides an  enhanced Safe Operating Area (SOA) to withstand power dissipation due to short-circuit faults
  • ID of 200 A (max) in an LFPAK56, enabling maximum torque from the motor and reliably managing high load and stall current conditions
  • Potential UIS (unclamped inductive spiking) energy dissipation 20% lower than a comparable 60 V MOSFETs
  • Nexperia’s low RDS(on) characteristics deliver higher efficiencies, ensuring longer battery life
  • As with all motor applications, there is a level of system vibration that cannot be dampened. LFPAK brings a unique level of board-level reliability and ruggedness.
  • Many devices are offered in logic level allowing them to be switched directly from a microcontroller device.

more information: https://www.nexperia.com/products/mosfets/power-mosfets/PSMN1R5-50YLH.html

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