The University of Washington Develops A Recyclable PCB Made From Vitrimers

Researchers at the University of Washington (UW) have created A new kind of PCB what they are calling a “Vitrimers PCB” or vPCB for short. The unique characteristic of this PCB is that it’s made to be recycled. In the lab, scientists manufactured functional prototypes of Internet of Things (IoT) devices transmitting 2.4 GHz radio signals on vPCBs then they recycled that PCB and recovered 98% of the vitrimer and 100% of the glass fiber, as well as 91% of the solvent used for recycling.

The UW team also tested the Vitrimer PCB for its electrical, thermal, and mechanical properties and found that they are very similar to standard FR-4 PCB material. This suggests that Vitrimer PCBs could offer a viable solution to reduce landfill waste by facilitating the recycling of leftover copper, thereby maximizing resource recovery.

Vitrimers are a new class of plastics that are both strong and reprocessable. Unlike traditional thermosets, which are permanently hardened after being formed, vitrimers can be reshaped and recycled multiple times without losing their properties. This is because vitrimers have dynamic chemical bonds that can be broken and reformed with the application of heat, enabling them to be molded like glass. This unique ability makes vitrimers promising for a variety of applications where durability and sustainability are important.

A solvent is dissolving the VPCB

A solvent dissolves the vitrimer in vPCBs, separating it into a jelly-like substance for easy recovery of glass fibers and metal traces. Researchers were able to recover 98% of the vitrimer, 100% of the glass fiber, and 91% of the solvent. This recycling process could reduce the global warming potential by 48% and carcinogenic emissions by 81% compared to traditional PCBs.

While the new Vitrimers PCB appears to be a promising green solution, its real-world adoption depends on a few factors: it needs to be affordable to produce, there should be incentives in place to encourage the recycling of electronic waste, and more research is needed to ensure it can perform well in high-speed and demanding applications.

vPCB got dissolved into the solvent and only the fiberglass part is remaining

Key Features of Vitrimers-based Recyclable PCB:

  • Utilizes vitrimer epoxy, a polymer capable of repeated curing and uncuring without deterioration.
  • Environmentally conscious design aimed at reducing electronic waste and promoting a circular lifecycle for electronics.
  • Maintains electrical and mechanical performance similar to commonly used FR-4 PCB materials.
  • Recyclability features include repairability under heat and pressure, easy removal of components for reuse or responsible recycling, and the ability to recover and reuse base vitrimer and glass fibers in new PCBs.
  • Demonstrates high recovery rates for vitrimer, glass fiber, and solvent used in the manufacturing process.
  • Compatible with existing PCB manufacturing processes, requiring minimal adjustments.

More information on this Vermiters-based recyclable PCB can be found on the UW news page. The researchers mention that further research is ongoing to develop even better vitrimer materials for a wider range of applications.

SupTronics X1011 is Designed to add Four SSDs to Raspberry Pi 5

SupTronics X1011 is a HAT for Raspberry Pi 5 that uses the latest HAT+ standard to add in up to four M.2 NVMe SSDs to the Pi making it a great option for building a DIY! NAS. The HAT connects to the Pi and other SBCs with the PCIE Interface and offers PCIe Gen2 transfer speeds.

In our previous post, we wrote about various SSD Driver boards like Pimoroni’s NVMe Base52Pi HATs for the Raspberry Pi 5, and Geekworm X1004 HAT+ which holds 2 SSDs but this is the first time we have seen a dev board which have four SSD Support.

The company mentions that the HAT works with PCIe GEN2 Speeds, though it can be configured to PCIe Gen 3, however, this is not advantageous because the PCIe switch only supports PCIe Gen 2 x1. On top of that, this solution will provide approximately the same sequential read/write performance as SATA hard drives. But the good thing will be that it’s now in a small form factor. Despite this limitation, random I/Os are expected to perform considerably faster, for more technical details and instructions to get started, you can check out their wiki page.

To test the board to its capacity Jeff Geerling conducted performance tests on the sample and compared it to the FriendlyELEC CM3588 NAS Kit powered by the Rockchip RK3588, which is slightly pricier at around $20 more. The CM3588 NAS Kit boasts a PCIe Gen3 x4 interface, offering significantly better performance than the Raspberry Pi 5’s PCIe Gen2 x1.

SupTronics X1011 Specifications

  • Supported SBC: Compatible with Raspberry Pi 5 and other SBCs featuring a compatible 16-pin PCIe FPC connector and mounting holes
  • Chipset: ASMedia ASM1184e PCI express packet switch with 1x PCIe Gen2 x1 upstream port and 4x PCIe Gen2 x1 downstream ports
  • Storage Capacity: 4x M.2 sockets supporting up to 16TB storage capacity (4x 4TB) with M.2 NVMe 2280/2260/2242/2230 SSDs (SATA not supported)
  • Max Data Transfers: Up to 5 Gbps PCIe 2.0
  • Host Interface: Raspberry Pi 5 PCIe FFC connector (37mm FFC cable provided)
  • NVMe Boot: Not supported due to the current lack of Raspberry Pi firmware support for PCIe switches
  • Power Management:
    • 5V/5A DC via FFC & pogo pins (utilizing the USB-C port on the Pi 5)
    • 5V/5A DC via 5.5/2.1mm DC power jack
    • DC/DC step-down converter delivering a maximum of 10A to power the SSDs
    • Compatible with HAT+ standby power state, automatically turning off when the Raspberry Pi 5 shuts down
  • Caution: Do not power the Raspberry Pi 5 through its USB-C port simultaneously if using the DC jack
  • Dimensions: 109 x 87.2mm

More details about the new SupTronics X1011 SSD board can be found on the SupTronics website. While SupTronics does not sell directly to consumers, Geekworm is the first retailer to offer the board in single units. As a special launch offer, the board is currently available for $51, discounted from its planned retail price of $55.

FOCn BLDC Motor Driver – A ESP32-S3-based module that supports SimpleFOC

FOCn BLDC Motor Driver is an ESP32-S3-based BLDC driver with up to 10A current. Its USP? It supports the SimpleFOC Arduino Library for easy motor control.

Matej Planinšek of PLab, has developed the FOCn – A ESP32-S3-based medium-power BLDC Motor driver module that has the capability of delivering up to 10A of continuous current. The USP of this device is that it supports SimpleFOC Arduino Library making it easy to control BLDC and stepper motors with the field-oriented control algorithm.

The FOCn module uses the ESP32-S3ESP32-S3 MCU and offers Wi-Fi and Bluetooth connectivity. Additionally, the microcontroller supports ESP-NOW, a proprietary low-power, low-latency communication protocol designed by Espressif Systems. This unique feature enables seamless communication between multiple FOCn boards, fostering synchronized control and coordinated operation.

The developer was inspired to create the FOCn module when their search for a custom-made, SimpleFOC-compatible driver module that met all their requirements failed. The name is related to field-oriented control (FOC) and also means “face slap” in Slovenian, Matej’s native language.

The module has an onboard USB-C port that can be used to program and debug the driver module. The MOSFETS used in the module can drive loads mode that 10A. But Extra cooling (heat sink or cooling fan) is required to dissipate the heart that this load will generate.

FOCn BLDC Motor Driver Module Specifications:

  • MCU – ESP32-S3 dual-core XTensa LX7 microcontroller @ 240MHz
  • Wireless – 802.11 b/g/n Wi-Fi, Bluetooth 5 (LE)
  • USB – USB Type-C for programming and debugging
  • Pluggable terminal block
    • Input voltage – 9V to 45V (3s – 10s lithium)
    • Input current – 10A constant, fuse protected
    • Phase current – 10A constant, 25A peak (more possible with enhanced cooling)
    • Phase current measurement range – +-38A
    • PWM
      • Output current – 5A average
      • Load type – Supports inductive loads (flyback diode protection)
    • Hall/encoder supply voltage – 5V
    • Allowable external load on 5V supply – 300mA
    • 2x auxiliary input for I2C encoders
  • Idle current consumption (motor driver disabled, MCU seep sleep) – <200uA
  • Gate driver with shunt amplifier – DRV8323
  • Dimensions – 85.4 x 62 mm

The FOCn project is open-source meaning that you can get all the schematics, Altium files, and documentation for the project on their GitHub repo along with platform examples. If you want to get your hands on one you can do that as it is available on Tindie for $64.

ArmSoM SIGE7 SBC Giveaway – Winner announced!

The ArmSoM Sige7 is a compact single-board computer (SBC) powered by an octa-core 64-bit SoC with a 6TOPS NPU for AI tasks and supports up to 32GB of LPDDR4x RAM and 128GB of eMMC flash storage. It includes an M.2 2280 socket for NVMe SSDs. It offers three display interfaces (HDMI, USB-C, MIPI DSI) and two camera connectors. Connectivity options include dual 2.5GbE, WiFi 6, and Bluetooth 5.2, plus multiple USB ports and a 40-pin GPIO header for expansion.

Are these specs exactly what you’ve been looking for? If you’re ready to upgrade, get excited! We’re hosting a giveaway for this amazing product, and we will give away 1 x Sige7 to our readers. Check out the instructions below to enter for your chance to win!

The giveaway ends in:

The giveaway is over! Comments are closed and it’s time to select the winner.

The draw will take place on Monday – 20 May 2024.

The winner is… comment #29 -> Hüseyin Avni Sarıkaya, congrats!

ArmSoM SIGE7 Specifications:

  • CPU: Quad-Core [email protected]+Quad-CoreCortex-A55@ 1.8GHz,8nm process
    • 6 TOPS@INT8(3 NPU core)
  • GPU&VPU: GPU Mali-G610 MP4 (4x256KB L2 Cache)
    • Decode: 8K@60fps
    • Encode:8K@30fps H.265 / H.264
  • Storage: 8GB LPDDR4x + 64bit 64GB eMMC 5.1
  • Interface: 2x 2.5G Ethernet
    • Onboard IEEE 802.11a/b/g/n/ac/ax WIFI6 and BT5 (AP6275P)
    • 1x HDMI 2.1, supports 8K@60fps
    • 1x DP 1.4 up to 8192×4320@30Hz
    • 1x MIPI DSI up to 4K@60Hz
    • 2x 2-lane MIPI CSI, up to 2.5Gbps per lane

Board Layout

Giveaway Prize:  ArmSoM Sige7  (basic model worth $165)

Ready to win? Here’s how to enter our awesome giveaway:

  • Drop a comment! Tell us your country and anything else you’d like to share (but please, no links!). Missing your country will mean your entry won’t count.
  • One entry per person, please. We’ll be keeping an eye out for duplicate entries.
  • The winner will be chosen randomly and announced in the comments section. We’ll contact you by email, so make sure to use a real one – you’ll have 24 hours to respond!

Review of HQDFM – A Tool from NextPCB for Easy Analysis of your PCB

HQDFM by NextPCB - A free Gerber Viewer that simplifies PCB analysis with a simple interface, enhancing manufacturability and error detection

So you’ve just finished designing your new PCB, completed all ERC and DRC checks, and sent the files off to the manufacturer. Now, you’re eagerly awaiting the arrival of your new PCBs. If you’re like me, once you’ve generated your Gerber files, you head to an online Gerber viewer site like PCBWay or JLCPCB to inspect your PCBs for any additional aesthetic errors and then send them off to your manufacturers.

But what if I tell you there’s a better way to check your Gerber files which will give you various additional analysis tools to get those sneaky errors out of your design? That’s where NextPCB’s Free Gerber Viewer (HQDFM) comes in. Gerber files are the standard in PCB design, containing crucial data for manufacturers. Analyzing them can be complex, but HQDFM’s software simplifies the process, offering a user-friendly interface and resources, designers can ensure manufacturability and spot errors efficiently.

What Does DFM Stand for and Why It’s Important?

DFM stands for “Design for Manufacturability” or “Design for Manufacturing.” It’s an engineering approach that focuses on designing products in a way that makes them easier and more efficient to manufacture. DFM aims to streamline the manufacturing process, reduce costs, improve quality, and shorten time to market by considering manufacturing constraints and requirements during the design phase.

In a practical term we check for Trace width/spacing, Drill hole/slot sizes, Clearances to copper and board, Layer to Layer drill holes, solder mask openings, silk screen errors, and more.

What is HQDFM and What is so Special About it?

HQDFM is NextPCB’s Free Gerber Viewer tool It is a powerful and user-friendly tool that supports Gerber X2, RS-274X, and ODB++ file formats. With zoom, pan, and measurement tools, ensure quality and integrity in your PCB designs. Seamlessly compatible with Altium, Eagle, and KiCad, it offers advanced features like layer selection and transparency control for detailed analysis. Once you download the tool you need to create your own free account and log in to work with this tool.

The tool is easy to use, once installed just drag and drop the Gerber and it gets uploaded to the software, it also features a One-click PCB file checker for quick analysis and generates a report through which you can analyze the PCB. On top of that penalization, impedance calculator, routing distance calculator, and more features make the diagnosis process easier. It can also generate BOM and coordinate files to order the PCB from the next website. The tool is completely free and can be used by anyone.

How to Use the HQDFM Tool

To begin using the Design for Manufacturability (DFM) tool, import your Gerber file, and you also need to import your BOM file if you are willing to check a new window will open for that. Now click on the “DFM Analysis” A detailed analysis of your PCB will start presenting results for PCB and PCBA analyses. Now you can correct any design errors based on these results to prevent real-life issues. You will get an estimated price of 5 quantities of your PCB and expected making time.

HQDFM by NextPCB - A free Gerber Viewer that simplifies PCB analysis with a simple interface, enhancing manufacturability and error detection
All Layer View in HQDFM

The DFM analysis section offers CAM view, Real View, and profile creation as an added option. It includes layer and component lists for PCB inspection. The tools section in the menu bar provides additional features like an impedance calculator, file comparison, copper area calculation, and more.

BOM and centroid file checker

One of the most powerful features of this tool is the BOM and centroid file checker, the HQDFM identifies inconsistencies in BOM and Centroid files, which are hard to detect manually and can lead to confusion during assembly. It checks for quantity mismatches, duplicate entries, and incorrect part values, saving engineers from tedious manual review tasks. HQDFM also checks whether all the parts in the BOM are present in the centroid data system, which may be a result of poor version control setup.

Footprint Checker

The new update includes a powerful footprint checker that compares PCB design land patterns with the expanding HQDFM database. With a single click, it checks over half of the BOM parts and offers immediate feedback on problematic patterns. There is also the option for the Users can expand the database or manage a local one.

DFA analysis

DFA Found Misplaced VIA on the PCB

HQDFM’s DFA checks utilize component and x-y coordinate data to simulate accurate component placement, even without existing footprint data. It includes checks for pad size, hole diameter and placement, component clearances, pad contact areas, and PCB shadowing. Based on IPC guidelines and real assembly data, HQDFM’s generic feedback benefits all PCB layout engineers by focusing on general industry capabilities rather than specific assembler processes.

The new HQDFM additions offer significant verification checks for PCB design, addressing commonly encountered assembly problems. This free software educates designers and provides early resolution tools. Download the updated HQDFM suite from the official HQ Electronics (NextPCB) website. A free online Gerber Viewer version is also available for new users or non-Windows users needing bare PCB DFM features.

You may also find interesting (Promo offers):

  • Free assembly for 5 pieces PCBA: For free PCB assembly, no coupon code or application is required. Just go to the PCB assembly order page and follow the step-by-step instructions. If your order fulfills the free assembly conditions, the assembly, setup and operation fees will automatically be deducted on the spot and you only pay for the PCB, components and shipping. The free assembly offer can be used multiple times.
  • 50% off Batch PCB Assembly from HQ NextPCB: All users who log into their HQ Electronics account will receive a 50% off PCB assembly coupon. To use it, add the qualifying order to your shopping basket and select the coupon at the checkout. The coupon can only be used once (The coupon can be found in your account after logging in).

NextPCB offers the best value for money in the market with rich capabilities, quality, speed, and customer service. Whether you are developing a new product or a one-off project, there is no excuse not to give us a try. Visit the PCBA order page or try the links below to get started.

RF-star Expands Automotive Wireless Solutions with Bluetooth Modules RF-BM-2642QB1I and RF-BM-2340QB1

RF-star, a leading manufacturer of wireless modules and provider of wireless connectivity solutions, proudly announces the expansion of its Bluetooth module lineup tailored specifically for automotive applications. The latest BLE modules include the RF-BM-2642QB1I and RF-BM-2340QB1, designed to excel in automobile-critical applications such as digital car keys, T-Box, Tire Pressure Monitoring Systems (TPMS), Passive Entry Passive Start (PEPS), and more.

Designed to meet the evolving demands of the automotive industry, RF-star’s new modules offer a host of features to enhance reliability, durability, security, and ease of integration.

Compliance and security assurance are paramount in automotive applications

RF-star’s new Bluetooth Low Energy modules are based on TI chips, specifically the CC2642R-Q1 and CC2340R5-Q1 MCUs meeting Automotive Electronics Council (AEC-Q100) standards. RF-BM-2642QB1I and RF-BM-2340QB1 BLE modules integrated with the automotive-qualified MCUs can operate in Grade 2 temperature range (–40 °C to +105 °C), guaranteeing their reliability and durability in harsh automotive environments.

Additionally, RF-star’s CC2642R-Q1 and CC2340R5-Q1 modules incorporate AES 128-and 256-bit cryptographic accelerator, ECC and RSA public key hardware accelerator and true random number generator(TRNG). These advanced security enablers with robust encryption protocols and authentication mechanisms, provide peace of mind to both automakers and end-users.

Rich resources and ease of use are also taken into consideration by project decision-makers

Their high-performance processor and abundant resources, eg., RF-BM-2340QB1 with 512 kB Flash and 36 kB RAM, offer ample opportunities for firmware development. Meanwhile, they also support over-the-air upgrade (OTA).

Besides, the automotive modules feature UART, SPI, I2C, I2S, ADC and more digital peripherals, flexible RF output modes(eg., PCB antenna, IPEX connector and half-hole ANT RF pin), and user-friendly development kits. Hence, it is quite easy to integrate into existing vehicle architectures, especially the auto aftermarket applications.

Best of all, both support Bluetooth 5.0 Low Energy serial port transmission for master-slave wireless connections. These rich functions with AT commands streamline the integration process, reducing complexity and accelerating time-to-market for automotive projects. Whether experienced engineers or newcomers to wireless connectivity, they can leverage RF-star’s Bluetooth modules easily to unlock their full potential in ongoing projects.

RF-star – A powerful supplier with abundant experience stands out among competitors

Certified with ISO9001 and IATF16949 (automotive sector quality management systems), the enterprise and the manufacturer meticulously adhere to international quality management standards. RF-star is also honored as a member of the Car Connectivity Consortium (CCC) and Intelligent Car Connectivity Industry Ecosystem Alliance (ICCE).

Beyond indispensable compliance, RF-star has an innovative and professional development team. With over a decade of hands-on experience in manufacturing wireless modules, RF-star earns a high reputation from domestic and overseas customers based on the supply capacity of KK-level OEMs, reliable quality and expert service.

“We are thrilled to introduce our latest BLE modules tailored for automotive applications,” said King Kang, CEO of RF-star. “With the CC2642R-Q1 and CC2340R5-Q1 modules, we aim to empower automakers with robust, secure, and easy-to-integrate solutions that enhance connectivity and user experience in modern vehicles.”

RF-star’s RF-BM-2642QB1I and RF-BM-2340QB1 Bluetooth modules are in stock and ready for immediate shipment. For more information about the automotive BLE modules, please visit www.rfstariot.com.

Rohde & Schwarz introduces the MXO 5C series, the world’s most compact oscilloscope with up to 2 GHz bandwidth

Rohde & Schwarz extends its portfolio with a 2U high oscilloscope/digitizer tailored for rack mount and other applications where a low-profile form factor is critical. The new MXO 5C series is the company’s first oscilloscope without an integrated display. It delivers the same peformance as the previously introduced MXO 5 series, but with a fourth of the vertical height.

Rohde & Schwarz introduces the new MXO 5C oscilloscope with four or eight channels. The new series is based on the next-generation MXO 5 oscilloscope and specifically addresses rack mount and automated test system applications where users are often confronted with space limitations. The instrument’s 2U vertical height – just 3.5” or 8.9 cm – allows engineers to deploy it in test systems where a traditional oscilloscope with a large display would not fit. The compact form factor is also of value in applications with high channel density where users need a large number of channels in a small volume. Users operate the instrument via the integrated web interface, or they interact with it exclusively programmatically and use the instrument as a high-speed digitizer.

Like other MXO oscilloscopes, the new MXO 5C series builds on next-generation MXO-EP processing ASIC technology developed by Rohde & Schwarz. It offers the fastest acquisition capture rate in the world of up to 4.5 million acquisitions per second. This makes it the world’s first compact oscilloscope that allows engineers to capture up to 99% real-time signal activity enabling them to see more signal details and infrequent events better than with any other oscilloscope.

Philip Diegmann, Vice President Oscilloscopes at Rohde & Schwarz, said:

“While oscilloscopes with large displays work well for bench usage, we’ve had a number of customers ask for a version that is tailored for rack mount applications. At the same time, we have customers who need a large channel count, for example in physics. With the MXO 5C we created a unique instrument that offers the best possible performance for both scenarios.”

The new form factor allows to place many channels in close proximity. The eight-channel model of the MXO 5C provides a channel density of 1500 cm3 per channel and consumes just 23 watts per channel.

While primarily designed for rack mount usage, the instrument doubles as a stand-alone bench oscilloscope. Users can simply attach an external display via the built-in DisplayPort and HDMI connectors, or they can access the instrument’s GUI via a web interface by typing in the oscilloscope’s IP address into their browser. As the first oscilloscope to offer E-ink display technology, the MXO 5C shows the IP address and other critical information on a small non-volatile display on the front of instrument, which stays visible even when power is switched off.

Like the MXO 5, the MXO 5C series comes in both four and eight channel models, in bandwidth ranges with100 MHz, 200 MHz, 350 MHz, 500 MHz, 1 GHz, and 2 GHz models. The starting price of EUR 18 000 for the eight-channel models sets a new industry standard. Various upgrade options are available to users with demanding application needs, such as 16 digital channels with a mixed-signal oscilloscope (MSO) option, an integrated dual-channel 100 MHz arbitrary generator, protocol decode and triggering options for industry-standard buses and a frequency response analyzer to enhance the capabilities of the instrument.

The new MXO 5C series oscilloscopes are now available from Rohde & Schwarz and selected distribution channel partners. For more information on the instrument, visit : https://www.rohde-schwarz.com/product/MXO5C

www.rohde-schwarz.com

iWave Launches iW-RainboW-G61M: A Modular SoM Powered by the Advanced i.MX 95 Applications Processor from NXP

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity. The System on Modules and evaluation kits from iWave will be available for evaluation starting in April 2024.

The SoM helps you leverage the multi-core architecture of the NXP i.MX 95 applications processor family, offering high-speed data processing alongside secure, real-time, and low-power modes. The SoM offers high-speed connectivity options such as 10GbE, USB 3, PCIe® Gen 3, together with Wi-Fi 6 and Bluetooth 5.3 wireless connectivity. The System on Module caters to a wide range of products and applications ranging from automotive connectivity and infotainment systems to Industry 4.0 applications.

The flex domains on the NXP i.MX 95 SoC allows engineers to mix which pieces of IP they want to use in a particular domain. The Multimedia block includes an Arm Mali 3D GPU core, but also an independent 2D GPU with a real-time blend engine. The i.MX 95 SoC is also NXP’s first applications processor to support LPDDR5 DRAM, enabling increased bandwidth for applications leveraging the embedded workload accelerators

Key features of iW-RainboW-G61M:

  • NXP i.MX 95 applications processor
  • 6 x Cortex-A55 @ up to 2GHz
  • 1 x M33 core @333MHz
  • 1 x M7 core @800MHz
  • eIQ® Neutron NPU up to 2.0 TOPS
  • 16GB LPDDR5
  • 16Mb QSPI Flash and
  • 16GB eMMC Flash
  • Wi-Fi 6 & BT 5.3 Connectivity
  • 2x LVDS, 1x MIPI CSI, 1x HDMI
  • 2x Gigabit Ethernet, 2x PCIe 3.0
  • 4x USB 2.0 Host, 1x USB 3.0 OTG
  • 1x SerDes (10G), 2x CAN, 3x I2C, 1x SD (4bit)
  • SMARC v2.1.1 Standard (82mm x 50mm)
  • Linux 6.6 BSP Support
  • MX 95 SAMRC PR image

The SoM is available in Industrial Grade with the associated BSP support and regular software updates from iWave. iWave assures customers a SoM product longevity of 15+ years and complementary ODM models on hardware customization, software customization, and mechanical and thermal analysis.

“iWave is excited to launch the iW-RainboW-G61M System on Module in Embedded World 2024, offering designers a powerful SoC with advanced 3D graphics, neural processing, and a new flex domain architecture, “said Immanuel Rathinam, Vice President – System on Modules at iWave. As a premier partner with early access to NXP technology, iWave iW-RainboW-G61M System on Module, powered by the NXP i.MX 95 applications processor, enables customers to leverage the powerful features of the latest SoC from NXP.”

“The NXP i.MX 95 is designed to deliver the next generation of edge computing performance for the industrial IoT market;” stated Robert Thompson, Director, Secure Connected Edge ecosystem, NXP. “iWave has a long history of developing advanced system on modules based on NXP’s i.MX applications processors. The iW-RainboW-G61M not only extends this collaboration but delivers the features of the i.MX 95 in a module that will accelerate time to market for customers.”

Complementing our System on Module, iWave enables customers with NXP i.MX 95 SoM evaluation kits with the latest software packages to expedite their evaluation and time to market.

Evaluation Kit Features:

  • 2x Gigabit Ethernet Jack
  • 1x PCIe port & M.2 KEY B PCIe
  • 2x USB 2.0 Host Type-A, 1x USB 2.0 OTG Type microAB
  • USB 3.0 Host Type-A/ Type-C OTG
  • 1x Standard SD
  • HDMI-Type A Connector
  • 20pin LVDS Connector
  • MIPI CSI Camera Connector
  • 2x Audio In & Out Jack through I2S Codec
  • 2x CAN Header
  • MX 95 SAMRC Development kit image

Click here for more details on the NXP i.MX 95-based System on Module and Evaluation Kit.

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