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![AI accelerator module from Aetina integrates four Hailo-8 edge AI processors AI accelerator module from Aetina integrates four Hailo-8 edge AI processors](https://www.electronics-lab.com/wp-content/uploads/2023/04/AI-MXM-H84A-AI-accelerator-module.png)
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AI accelerator module from Aetina integrates four Hailo-8 edge AI processors
Aetina has introduced AI-MXM-H84A, an MXM-embedded graphics accelerator that is specifically intended for AI processing and has been launched by Impulse Embedded. The AI accelerator module from Aetina integrates four Hailo-8 edge AI processors that offer 104 TOPS performance on a single...
Continue Reading![Seeed Studio unveils another XIAO board, but this time with the ESP32S3 Seeed Studio unveils another XIAO board, but this time with the ESP32S3](https://www.electronics-lab.com/wp-content/uploads/2023/04/Seeed-Studio-XIAO-ESP32S3-1024x768.jpg)
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Seeed Studio unveils another XIAO board, but this time with the ESP32S3
We have previously covered many articles on the Seeed Studio XIAO, with the latest on the XIAO ESP32C3 low-power microcontroller board, designed to support Wi-Fi and Bluetooth wireless connectivity. This time, the company has decided to continue its XIAO series with the launch of its...
Continue Reading![ET980 COM Express Module with 12th Gen Intel Core Processors for Edge Computing ET980 COM Express Module with 12th Gen Intel Core Processors for Edge Computing](https://www.electronics-lab.com/wp-content/uploads/2023/04/IBASE_ET980_banner_300dpi.jpg)
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ET980 COM Express Module with 12th Gen Intel Core Processors for Edge Computing
IBASE Technology Inc, a world leader in the manufacture of embedded boards and solutions, has added the ET980 series of COM Express modules to its portfolio. Supporting the U-series and P-series of 12th Gen Intel® Core™ processors from i3-1220PE to i7-1265UE (12M Cache, up to...
Continue Reading![Fischer Connectors enhances IIoT connectivity with ultra-rugged solutions using Single Pair Ethernet and USB 3.2 protocols Fischer Connectors enhances IIoT connectivity with ultra-rugged solutions using Single Pair Ethernet and USB 3.2 protocols](https://www.electronics-lab.com/wp-content/uploads/2023/03/65963_Fischer_Connectors_Industry4.0-IIoT_infographic-1024x760.jpg)
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Fischer Connectors enhances IIoT connectivity with ultra-rugged solutions using Single Pair Ethernet and USB 3.2 protocols
Fischer Connectors, the Swiss-based global leader in high-performance connectivity, releases ultra-robust Single Pair Ethernet (SPE) and USB 3.2 Gen 2 connectivity solutions to meet the specific requirements of Industrial Internet of Things (IIoT) applications in rugged...
Continue Reading![Vecow and Allxon partner to provide advanced embedded AI solutions with remote management technology Vecow and Allxon partner to provide advanced embedded AI solutions with remote management technology](https://www.electronics-lab.com/wp-content/uploads/2023/03/Vecow-EAC-500-has-OOB-remote-management-capability.jpg)
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Vecow and Allxon partner to provide advanced embedded AI solutions with remote management technology
Vecow has teamed up with Allxon, a company that offers solutions for remote device management, to provide integrated solutions for the Vecow EAC Series, which is powered by the NVIDIA Jetson Platform. The Vecow EAC Series, including the EAC-5000, EAC-3000, and EAC-2000, runs on Jetson...
Continue Reading![Quectel introduces the RedCap Rx255C module series for IoT applications Quectel introduces the RedCap Rx255C module series for IoT applications](https://www.electronics-lab.com/wp-content/uploads/2023/03/Quectel-RedCap-Rx255C-module-series-e1679575745482.jpg)
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Quectel introduces the RedCap Rx255C module series for IoT applications
Quectel Wireless Solutions has launched its 5G RedCap (Reduced Capability) modules, the Rx255C series. The company has designed these modules to improve wireless performance and low-latency communication. Along with its integrated 5G connectivity, the modules offer significant...
Continue Reading![Powercore EDM Cuts through solid metal With Ease Powercore EDM Cuts through solid metal With Ease](https://www.electronics-lab.com/wp-content/uploads/2023/03/001.jpg)
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Powercore EDM Cuts through solid metal With Ease
The popularity of 3D printing has spurred a competition to make automated machine tools and fabrication methods more accessible to hobbyists. Laser cutting is a great example of this, as it used to be too expensive for hobbyists, but now can be purchased for a few hundred dollars....
Continue Reading![Wide-Temp SMARC Module with Qualcomm QCS610 SoC Wide-Temp SMARC Module with Qualcomm QCS610 SoC](https://www.electronics-lab.com/wp-content/uploads/2023/03/IBASE_RM-QCS610_banner_300dpi.jpg)
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Wide-Temp SMARC Module with Qualcomm QCS610 SoC
IBASE Technology Inc., a global leader in the manufacture of embedded computing products, has launched the new RM-QCS610 SMARC 2.1 compliant module powered by an Octa-core Qualcomm QCS610 SoC and designed for the creation of devices with edge artificial intelligence (AI) and machine...
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