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Sound to Colour Light Effects – Arduino Compatible

Posted on by mixos

This is a fun-loving project based on the Arduino platform. The project creates color light effects with sound level sense by an onboard condenser microphone. The project consists 20 x WS2812B RGB LEDs, an Atmega328 micro-controller, condenser microphone along with pre-amplifier, RCA connector, and trimmer potentiometer to direct feed audio. The project can be used in fun parties, disco parties etc. Just power the board and RGB LEDs will create different colors as per sound level. Board has the option of direct audio input or sound sense by the microphone, users may change the Arduino example code as per requirement or write their own code.

Sound to Colour Light Effects – Arduino Compatible – [Link]

Universal Op-Amp Board for SMD SOIC-8 Package

Posted on by mixos

This is an easy to build and very useful project for hobbyists and students to learn and create OPAMP-based projects. The project accommodates a single op-amp in a SOIC8 package. The project provides the user with multiple choices and extensive flexibility for different applications circuits and configurations. It provides the user with many combinations for various circuit types including active filters, differential amplifiers, external frequency compensation circuits etc. A few examples of application circuits are given below. LM358 op-amp is the right choice to use but any SOIC8 OPAMP with the same pin configuration can be used. It supports dual supply or single supply, Jumper J1 is provided to use this board with a single supply, D1 is the power LED.

Universal Op-Amp Board for SMD SOIC-8 Package – [Link]

600W – 230VAC – High Voltage DC Motor Speed Controller – Heater Controller – Lamp/LED Dimmer

Posted on by mixos

This is a very powerful DC Motor speed controller for DC motors up to 330V DC and current up to 2A. Basically, the project is a high voltage PWM source with adjustable frequency and adjustable PWM duty cycle range 0 to 99%.  The board has been designed considering many applications and the circuit can be used as a heater controller, DC Motor speed controller, LED dimmer, Lamp dimmer, and High voltage PWM driver. The circuit can handle load up to 600W (330V DC @ 2A). The operating input supply is 100V AC to 250V AC or 100V to 330V DC. It is important to provide the input supply as per the operating power supply of the load. Trimmer pot PR1 is provided to adjust the frequency, and P1 to adjust the PWM duty cycle.

600W – 230VAC – High Voltage DC Motor Speed Controller – Heater Controller – Lamp/LED Dimmer – [Link]

Universal Op-Amp Board for DIP-8 Package

Posted on by mixos

This is an easy to build and very useful project for hobbyists and students to learn and create op-amp-based projects. The board accommodates a single op-amp in DIP-8 package. The project provides the user with multiple choices and extensive flexibility for different applications circuits and configurations. It provides the user with many combinations for various circuit types including active filters, differential amplifiers, and external frequency compensation circuits etc. A few examples of applications circuits are given below. LM358 op-amp is the right choice to use or any DIP-8 op-amp with the same pin configuration as LM358 can be used. It supports dual supply or single supply, Jumper J1 is provided to use this board with a single supply, D1 power LED.

Universal Op-Amp Board for DIP-8 Package – [Link]

Open Source Arduino-compatible Cellular IoT Hardware Development Platform

Posted on by Saumitra Jagdale

IoTa

POEM Technology is preparing to launch a crowdfunding campaign for IoTa, an Arduino-compatible development platform board that simplifies Internet of Things prototyping for developers. The board is designed for use with cellular and mobile connections for embedded applications. Despite its compact form factor, IoTa packs enough functionality and features a wide range of lightweight, powerful, remote applications. Thus, it is perfect for drone operation, Grid Monitoring, Sensor networks, cellular carrier scanner, etc.

IoTa makes development easier since it has a separate system processor and user processor. Hence, the dual-processor design eliminates the need for the developer to provide a processor to run user code. The Arduino IDE allows you to quickly deploy your IoT design by developing code on the user processor.

Technical Specifications of IoTa

The System microcontroller has a 32-bit ARM CortexM0+ processor with 256 kB Flash and 32 KB RAM that runs at 48 MHz. This microcontroller manages the u-blox modem as well as connections to Hologram’s cloud. The user microcontroller, on the other hand, has a 32-bit ARM Cortex-M4 that operates at 120MHz and has 1MB Flash and 256kB RAM. This microcontroller is only used to run user programs that are Arduino API compatible.

Furthermore, this open-source cellular development board facilitates connectivity by allowing embedded applications to connect to peripherals and sensors via an array of GPIO pins and serial interfaces. Additionally, IoTa is excellent for low-power applications since its battery management encompasses charging and fuel gauge functions.

Front and Back of IoTa

Talking more about the IoTa, the board features a u-blox SARA-R410 modem for rapid IoT development on CAT-M and NB-IoT networks worldwide. This is a cost-efficient solution offering multi-band data transmissions for Low Power Wide Area solutions in a compact form factor. The modem is ideal for mission-critical IoT solutions, as it includes a unique and immutable root-of-trust. They support IoT Security-as-a-Service and provide the foundation for a trusted set of advanced security functionalities.

IoTa also comes with a Hologram SIM card for seamless cloud service integration. Along with this, hologram also provides a free developer account to test your design and develop your portal. With the Hologram SIM card and a low-cost data plan, it’s certified on over 500 carriers in 170 countries.

For more information on the IoTa Internet of Things prototyping platform visit the Crowd Supply website. You can also sign up to be notified when the campaign launches.

VxWorks on Zynq UltraScale+ MPSoC

Posted on by mixos

iWave Systems is pleased to inform about the VxWorks BSP release for its XILINX UltraScale+ MPSoC System on Modules. VxWorks 21.03 has now been ported on the iW-RainboW-G30M system on module, which is powered by the ZU 4/5/7 MPSoC.

VxWorks is Industry’s leading real-time operating system for building embedded devices& systems.

The ZU 4/5/7 System on module, integrated with high-speed interfaces when built with VxWorks BSP, ensures the scalability, safety, and reliability required for mission critical applications.

The Zynq® UltraScale+™ MPSoC series provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. These Adaptive SoCs complement the decade long availability of soft-core CPU’s and other soft IP for building system on FPGAs. Adaptive SoCs then are particularly useful when high performance is required for a portion of an algorithm that can be implemented in hardware using parallel or pipelined (or a combination) techniques.

Why VxWorks on Zynq UltraScale+ MPSoC

The combination of VxWorks on the Zynq UltraScale+ MPSoC provides the foundation for secure high-speed high-performance computing application. Highlighted below are the key features of VxWorks and UltraScale+ MPSoC, together which power devices across verticals.

VxWorks is ideal for hard real-time embedded applications because it is a deterministic, priority based, pre-emptive RTOS with low latency and minimal jitter, with a few feature highlights as below:

  • Rich connectivity and communications: VxWorks has robust IPv4 and IPv6 stacks that are also time-sensitive networking (TSN) capable, guaranteeing real-time communications and packet delivery within a bounded time or latency on a switched Ethernet network
  • Modularity and Robustness: easy to choose and adapt capabilities as required, changing the modules only as needed.
  • Fault-tolerant file system: VxWorks supports the Wind River Highly Reliable File System (HRFS) for fault tolerance and recovery of operations in case of system error and shutdown, as well as a FAT-compatible dosFS file system.
  • Mixed OS support: VxWorks supports communicating with other operating systems in a mixed environment using OpenAMP, allowing developers to build interactive functionality across VxWorks real-time and other non–real-time environments.
  • Multimedia: VxWorks offers support for many standard graphic libraries, such as OpenGL, OpenGL ES, OpenCV, and Vulkan, and libraries that handle JPEG and PNG images
  • Security: VxWorks integrates an extensive and continuously evolving set of security capabilities that allows developers to meet rigorous security requirements and address security threats—from boot-up operation to power down. A few secure capabilities include kernel hardening, cryptography, firewall, TPM 2.0, secure data and configuration.

The true value of Zynq UltraScale+ MPSoC architecture lies in the tight integration of its programmable logic with the processing system, with a few highlights listed below:

  • Heterogenous Processing: Multiple processing engines enable the optimization of functions across an entire application, with programmable hardware providing further performance and safety handling
  • Integrated H.264/H.265 Video Codec: Zynq UltraScale+ EV devices include a video codec capable of low latency simultaneous encode and decode up to 4K resolution at 60 frames per second
  • Increased safety and multiple levels of security
  • Superior processing, I/O and memory bandwidth

Potential application of VxWorks on Zynq UltraScale+ MPSoC

With Zynq UltraScale+ MPSoC finding a fit in Industrial networking (time sensitive networking), high precision test and measurement equipment, medical imaging and avionics, VxWorks BSP helps strengthen the safety, security, and modularity on the device.

Safety-critical applications like automotive, industrial motor control, avionics, and many others need to have high reliability and required Safety Integrity Levels (ASILs), for which it is necessary to mitigate soft errors and implement redundancy to have better hard fault toleration, where the combination of VxWorks and UltraScale+ MPSoC is an ideal fit.

VxWorks finds a great fit in embedded applications that require real time, deterministic performance which require safety and security certification in industries such as medical, aerospace, robotics, and network infrastructure.

Scalability across the XILINX UltraScale+ MPSoC

The SOM approach for the FPGA SoCs further allows greater scalability for the end applications in terms of logic density, FPGA IOs and number of transceiver lanes. For example, a well-designed carrier board design architecture can cover system IO ports for multiple end products ranging from the Xilinx Zynq MPSoC UltraScale+ ZU4 with 192K logic cells to ZU19 with 1.1M logic cells. Also, the SOM approach allows migrating new generation SoC solution without changing the product mechanical architecture.

You can find more information on our XILINX System on Modules here.

For further information or enquiries, you can reach us at mktg@iwavesystems.com

Rohde & Schwarz demonstrates the all-new R&S RTO6 oscilloscope at DesignCon 2021

Posted on by mixos

Silicon Valley’s premier event for chip, board, and systems design engineers – DesignCon – returns in 2021 to San Jose, CA. Rohde & Schwarz, industry-leading T&M specialist, will be an exhibitor in person this year with its extensive and innovative product and solutions portfolio. As this year’s highlight, Rohde & Schwarz will be demonstrating live the all-new R&S RTO6 oscilloscope.

The R&S RTO6 delivers instant insight thanks to enhanced usability and performance. Featuring a fresh new user interface on a larger, 15.6-inch Full HD touchscreen and straightforward workflows, the new oscilloscope speeds up daily measurement tasks. The R&S RTO6 delivers deep insights into designs on the engineer’s workbench with state-of-the-art specifications such as an outstanding 9.4 ENOB, an unparalleled update rate of one million waveforms per second as well as a comprehensive toolset of analysis functions.

Rohde & Schwarz will also demonstrate for show attendees the R&S ZNA high-end vector network analyzer (VNA) which now features models with 50 GHz and 67 GHz maximum frequencies. This opens up the VNA’s outstanding RF performance, unique hardware concept and innovative touch operation to new areas of application. Signal integrity measurements as well as A&D and 5G component and module characterization are main applications for the new analyzer models.

Rohde & Schwarz will be exhibiting at DesignCon in booth 607 at San Jose McEnery Convention Center on August 17 and 18, 2021. Starting August 17, Rohde & Schwarz is sponsoring a day of complimentary technical seminars, beginning at 8 a.m. in room 210F, covering topics such as power integrity measurement fundamentals and mastering phase noise/jitter measurements. For those unable to attend the seminars in person, Rohde & Schwarz offers on-demand recordings of the seminars after the show. Click here to be notified, once available.

Computer-on-Modules target IoT gateway, AI edge computing

Posted on by mixos

congatec – a leading vendor of embedded and edge computing technology – introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.

Built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU and platform controller hub (PCH) the new flagship COM-HPC Client and COM Express Type 6 modules impress with a new bandwidth benchmark of up to 20 PCIe Gen 4.0 lanes for massive connected real-time IIoT gateway and intelligent edge computing workloads. To process such massive workloads, the new modules boast up to 128 GB DDR4 SO‑DIMM RAM, integrated AI accelerators and up to 8 high-performance CPU cores that achieve up to 65% gain [1] in multi-thread performance and up to 32% gain [2] in single-thread performance. Moreover, visualization, auditory and graphics intensive workloads are enabled with a boost of up to 70% compared to predecessors [3], enhancing performance for these immersive experiences even more.

Flagship applications that directly benefit from these GPU enhancements can be found in surgery, medical imaging and e-health edge applications as congatec’s new platform supports 8K HDR videos for optimum diagnostics. Combined with the platform’s AI capabilities and the comprehensive Intel OpenVINO toolkit, doctors can gain easy access and insights into deep learning based diagnostic data. But this is just one benefit of the integrated Intel UHD graphics, which also supports up to four 4K displays in parallel. In addition, it can process and analyze up to 40 HD 1080p/30fps video streams in parallel for 360 degree views in all directions. These AI infused massive vision capabilities are also important for many other markets, including factory automation, machine vision for quality inspection in manufacturing, safe spaces & cities, as well as collaborative robotics and autonomous vehicles in logistics, agriculture, construction, and public transport, to name just a few.

AI and deep learning inference algorithms can seamlessly run either massively parallel on the integrated GPU, or on the CPU with built-in Intel Deep Learning Boost that combines three instructions into one, accelerating inference processing and situational awareness.

The new COM-HPC Client and COM Express Type 6 platforms have integrated safety functions that are important for the fail-safe operation of many mobile vehicles and robots, as well as stationary machinery. As real-time support is mandatory for such applications, the congatec modules can run RTOSes such as Real Time Linux and Wind River VxWorks, and provide native support from Real-Time Systems’ hypervisor technology, which is also officially supported by Intel. The result for customers is a truly rounded ecosystem package with the most comprehensive support possible. Further real-time capabilities include Intel Time Coordinated Computing (Intel TCC) and Time Sensitive Networking (TSN) for real-time connected IIoT/industry 4.0 gateways and edge computing devices. Enhanced security features that help to protect systems against attacks make these platforms ideal candidates for all types of critical customer applications in factories and utilities.

The feature set in detail

The conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm) will be available with new scalable 11th Gen Intel Core, Xeon and Celeron processors, with selected variants even for extreme temperatures ranging from -40 to +85°C. Both form factors support up to 128 GB DDR4 SO-DIMM memory with 3200 MT/s and optional ECC. To connect peripherals with massive bandwidth the COM-HPC modules support 20 PCIe Gen 4 lanes (x16 and x4), and the COM Express versions support 16 PCIe lanes. In addition, designers can leverage 20 PCIe Gen 3 lanes with COM-HPC, and 8 PCIe Gen 3 lanes on COM Express.

To support ultra-fast NVMe SSD, the COM-HPC module provides 1x PCIe x4 interface to the carrier board. The COM Express board has NVMe SSD even onboard for optimum utilization of all native Gen 4 lanes supported by the new processor. Further storage media can be connected via 2x SATA Gen 3 on COM-HPC, and 4x SATA on COM Express.

Where the COM-HPC module offers latest 2x USB 4.0, 2x USB 3.2 Gen 2, and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification. For networking, the COM-HPC module offers 2x 2.5 GbE, whereas the COM Express module executes 1x GbE, with both supporting TSN. Sound is provided via I2S and SoundWire in the COM-HPC version, and HDA on the COM Express modules. Comprehensive board support packages are provided for all leading RTOSes, including hypervisor support from Real-Time Systems as well as Linux, Windows and Android.

Vecow Launches Compact Integrated Solution with Intel Atom® x6000 Series Processor

Posted on by mixos

Vecow Co., Ltd., a team of global embedded experts, announced Compact Integrated Solution with Intel Atom® x6000 Series processor. The solution comprises SPC-6000 and PBC-1000 Ultra-compact Fanless Embedded Box PC, and EPBC-1000 2.5″ Single Board Computer. Powered by Intel Atom® x6000 Series processor, Vecow compact integrated solution brings power-efficient, enhanced graphics performance and flexibility capabilities to empower the edge applications such as Intelligent Control, Energy Management, M2M, In-Vehicle Infotainment, factory Automation, and any AIoT/Industry 4.0 applications.

Vecow SPC-6000 and PBC-1000 are ultra-compact fanless embedded with energy-efficient innovations in a small form factor. Based on Intel Atom® x6000 Series Processor, Vecow brand-new ultra-compact fanless embedded Box PC delivers up to 40% faster computing and two times improved 3D graphics performance than the former generation solution. Equipped with max. dual display with 4K resolution, 32GB of DDR4-3200MHz SO-DIMM memory, M.2 slot for expansions and SATA storage, Vecow SPC-6000 and PBC-1000 provide an uncompromised visual experience, enhanced I/O and storage options for AIoT applications. Furthermore, these systems are optimized to run VHub one-stop AIoT Solution Service that supports OpenVINO based AI accelerators and advanced Edge AI applications for faster time to market for any AI-vision applications.

Vecow EPBC-1000 is a 2.5″ Pico-ITX SBC based on Intel Atom® x6211E processor and allows low-power consumption with up to TDP 6W. With a variety of functionalities in a small form factor (measuring only 100mm x 72mm), EPBC-1000 includes 2 GigE LAN, 2 USB, 2 COM, 1 DisplayPort, and 1 SIM card socket for 5G/WiFi/4G/LTE/GPRS/UMTS. In addition, EPBC-1000 supports -40°C to 70°C operating temperature and 12V DC-in, providing trusted reliability for multiple embedded use cases.

“Vecow Compact Integrated Solution is powered by Intel Atom® x6000 Series processor,” said Judy Hu, Product Manager, Embedded Systems & Platform Division at Vecow. ”The solution features a low-power CPU and compact designs, giving industrial users flexibility and performance they need for a wide range of IoT use cases.”

“With demands for smaller architecture, flexible and lower power consumption for diverse industrial environments, Vecow launched SPC-6000, PBC-1000 and EPBC-1000, namely, the compact integrated solution.” said Joseph Huang, Sales Manager, Sales & Marketing Division at Vecow. “They feature the ultra-compact design, along with form factor options with Intel Elkhart Lake platform that gives our customers the balance of power, performance and capabilities for modern AIoT applications.”

Powered by Intel Atom® x6000 Processor, Vecow compact integrated solution delivers improved computing capability and graphics performance for enhanced AIoT deployment. Featuring a fanless design, -40°C to 70°C operating temperature, 12V DC-in, Vecow SPC-6000, PBC-1000 and EPBC-1000 are ideally suited for intelligent Control, Energy Management, M2M, In-Vehicle Infotainment, factory Automation, and any AIoT/Industry 4.0 applications.

SPC-6000 Ultra-compact Fanless System

Intel Atom® x6425RE Processor (Elkhart Lake) Ultra-Compact Fanless Embedded Box PC, 1 GigE LAN, 2.5G LAN, 4 USB, 4 COM, 1 SIM, 12V DC-in, Fanless -40°C to 70°C extended temperature

PBC-1000 Ultra-compact Fanless System

Intel Atom® x6211E Processor (Elkhart Lake) Ultra-compact Fanless Embedded Box PC, 2 GigE LAN, 2 USB, 2 COM, 2 M.2, 1 SIM Socket, 12V DC-in, -40°C to 70°C Extended Temperature

EPBC-1000 Industrial Motherboards

Intel Atom® x6211E Processor (Elkhart Lake) 2.5″ Pico-ITX Embedded Single Board Computer

To know more about Vecow Ultra-compact Fanless System and Industrial Motherboards, please visit the product page or www.vecow.com for details.

ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors

Posted on by mixos

The Express-TL module with 11th Generation Intel processors is ideal for performance-demanding applications in embedded and industrial conditions

ADLINK Technology Inc., a global leader in edge computing, today introduces its new Express-TL COM Express Type 6 module with Intel® Core™, Xeon® W and Celeron® 6000 processors and octa-core (8-core) performance. Intel® UHD Graphics and Intel® AVX-512 VNNI provide superior artificial intelligence (AI) inferencing performance. The Express-TL is well-suited for image processing and analysis, high speed video encoding and streaming, medical ultrasound, predictive traffic analysis and other demanding applications.

“The Express-TL with Intel’s 11th Generation processors is a big boost for high-performance computing,” said Alex Wang, COM Express Product Manager ADLINK. “The integration results in a product that delivers uncompromised system performance and responsiveness – ideal for high-computing and heavy use settings.”

Key features include:

  • Intel® UHD® Graphics core support for one 8K or four 4K independent displays, including High-Definition Multimedia Interface (HDMI), DisplayPort (DP), LVDS, Embedded DisplayPort (eDP) and legacy VGA displays.
  • The Express-TL module provides 2.5 GbE Ethernet and 4 USB 3.2 Gen 2 ports, allowing 10+ Gb/s transfer rates.
  • Intel Time Coordinated Computing (TCC) combined with Time-Sensitive Networking (TSN) Ethernet controller allows Industry 4.0 factories to be smart, agile, and increasingly autonomous while maintaining robustness and reliability.
  • Additional 8C at 25 Watt TDP with ECC memory feature and on-board NVMe storage make it suitable for space constrained applications

AI, machine learning and internet of things (IoT) devices increase demand for real-time processing—from the edge to the cloud. The Express-TL module offers advanced tuning controls, immersive graphics, and unmatched connectivity, which allows new possibilities for AI, workload consolidation, and other intensive computing demands.

ADLINK’s Express-TL COM Express Type 6 module is a result of its close partnership with Intel.  With vibration resistance, wide operating temperature range and reliable system performance, the module helps shorten development cycles and reduce costs. Industrial system integrators, distributors, engineers, and others creating industrial applications will find that the Express-TL delivers impressive performance for power-constrained applications.

ADLINK plays a critical role as a key driving force in developing open standards such as the COM Express® specification. ADLINK has held leadership positions in the PCI Industrial Computer Manufacturers Group (PICMG); PICMG is responsible for many widely accepted standard form factors in the embedded industry. ADLINK’s leadership, authority and technical expertise gives customers the tools they need to develop their carrier boards.

For more information, visit here.

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