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SiTime's ultra-small micropower 1 MHz to 26 MHz oscillators are ideal for battery-powered mobile, wearable, and IoT devices SiTime's SiT8021 oscillator is 90% lower in power consumption and 40% smaller in size than quartz oscillators. The unmatched combination of ultra-low power, an...

Bourns' high-power surface-mount PPTC resettable fuses expand the hold current range to 0.75 A ~ 6.0 A Bourns' Multifuse® product line expands its model MF-LSMF series high-power surface-mount polymeric positive temperature coefficient (PPTC) resettable fuses. These models expand the...

Omnivision’s OS03B10 3-MP image sensor with DVP and MIPI interface support brings high-quality images to security, IP, and HD cameras. Omnivision has introduced the OS03B10 3-megapixel (MP) 1/2.7-inch optical format CMOS image sensor for security surveillance, IP, and HD analog...

Toshiba has launched a 150V N-channel power MOSFET “TPH9R00CQH” that uses the latest generation process, “U-MOSX-H,” and that is suitable for use in switching power supplies for industrial equipment - including those deployed in data centers and communications base stations....

All motherboards are equipped with a CMOS battery. In the past, it was necessary to maintain the operation of the CMOS memory, which was responsible for storing BIOS data and other parameters of a personal computer. Previously, BIOS settings were stored in CMOS memory which was powered...

AAEON, an industry leader in embedded solutions, is delighted to announce the PICO-TGU4-SEMI, a new addition to its range of compact Pico-ITX boards. With an 11th Gen Intel® Core™ i7/i5/i3/Celeron Processor SoC, the PICO-TGU4-SEMI has extremely high CPU performance, and is the...

Sum of Product A digital logic circuit can be represented by Boolean Algebraic expression. It is a simple and effective way to describe digital circuit behavior and switching action. It is known that Boolean Algebra uses a set of rules and laws to reduce the logic gates or Boolean...

New innovation provides weight savings for applications where size, weight and power (SWaP) are key Teledyne Labtech announces a major new capability allowing the embedding of layers of synthetic graphite within RF and microwave printed circuit boards (PCBs). Heat management is a...