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Hisense A7CC – 5G Smartphone with a 6.7-Inch Color E-Ink Display, 6GB RAM and 128GB storage

Posted on by Emmanuel Odunlade

Following the recent introduction of color E-Ink displays and color eReaders from several companies, Hisense, a well-known TV manufacturer has launched and is currently taking pre-orders for their Hisense A7CC 5G smartphone exclusively equipped with a 6.7-inch color E-Ink display. The Chinese company had earlier (sometime in December last year) launched Hisense A7 5G – the world’s first E-ink display smartphone with 5G connectivity – and now, just after a few months, they are back with the color screen version of the Hisense A7 5G.

The new Hisense A7CC is powered by UNISOC T7510 octa-core processor with support for 5G modem, and comes with 6GB RAM and 128GB internal storage. It is everything the same with the Hisense A7 5G, the only difference is that it comes with a colored E-ink display instead of a monochrome panel. So, you can already guess that it will cost more than the Hisense A7 5G (Hisense A7 5G sells for $309 while the Hisense A7 CC is priced at $371).

The Hisense A7 CC also boasts of the same 6.7-inch E-ink display that the A7 5G has, but with an RGB pixel arrangement. In addition to that, Pixels per inch (PPI) is now 100, instead of 300.

Features and Specifications of Hisense A7 CC smartphone include:

  • CPU: UNISOC Tiger T7510 octa-core processor with 4x Arm Cortex-A75 cores @ 2 GHz, 4x Arm Cortex-A55 cores @ 1.8 GHz
  • GPU: Imagination PowerVR GM9466
  • System Memory: 6GB RAM
  • Storage: 128GB flash
  • Display: 6.7-inch E-Ink display with 4096 colors, 100 dpi
  • 3.5mm headphone jack with AK4377AECB audio DAC for Hi-Res Audio
  • Built-in microphone and speaker
  • Different lockscreen support
  • Dynamic and constant refresh rate support
  • Dual rear cameras
  • Single front-facing camera
  • Cellular connectivity:
    • 5G (n41, n78, n79)
    • 4G FDD (B1, B3, B5, B8) / TD (B34, B38, B39, B40, B41)
    • 3G WCDMA
    • 2G GSM
  • WiFi or Bluetooth (though it’s not mentioned in the specs; we assume it was probably omitted unintentionally)
  • GPS / A-GPS
  • 1x USB OTG Type-C port
  • Fingerprint sensor
  • Additional Programmable key on the left side of the phone
  • Volume button
  • Power button
  • Refined UI based on Android 10
  • Available in two colors (Obsidian Black, Moonlight Silver)
  • Battery: 4,770 mAh battery with 18W fast charging
  • Dimensions: 172.4 mm x 86 mm x 9 mm

Since the 6.7-inch color E-Ink smartphone has a refined UI based on Android 10, we expect that the phone should be able to give a cool feeling while reading e-Books and browsing the internet with clearer text. Another aspect of a very good phone is the battery life. We don’t have any information on that yet, but we guess that a single full charge should take one for like a week thereabout, depending on how it is used.

If you’re interested in buying the new Hisense A7CC color E-Ink smartphone, you can check JD.com where the phone is currently selling for about $371 (2,399 CNY). The phone is available in two colors: Moonlight Silver or Obsidian Black.

ITEAD Zigbee 3.0 dongle powered by Silicon Labs EFR32MG21 wireless MCU Sells for $6.99

Posted on by Emmanuel Odunlade

ITEAD has just released a new Zigbee 3.0 dongle powered by the Silicon Labs EFR32MG21 wireless MCU.

The Shenzhen-based company, well known for its Sonoff line of home automation devices, had recently introduced a number of Zigbee compliant products like the Sonoff BASICZBR3 smart switch, the Sonoff ZBBridge WiFi to Zigbee Gateway, and the Zigbee-compatible USB dongle.

“ZigBee 3.0 USB Dongle is pre-flashed with the Silicon Labs Zigbee stack from their EmberZNet 6.7.8 SDK as the application firmware, which means that it can be used out of the box as a ZigBee coordinator on Home Assistant and openHAB,” ITEAD writes.

The Silicon Labs EFR32MG21 wireless MCU used in the ZigBee 3.0 USB adapter is a high-performance, low-power chipset designed to increase processing capability, improve RF performance, and lower active current. It is a very powerful MCU the same as the one used in the Sonoff ZBBridge, but this time with a faster core, more RAM, and a more powerful radio.

Key Features and Specifications of the ZigBee 3.0 USB Dongle Include: 

  • Wireless MCU: Silicon Labs EFR32MG21 Arm Cortex-M33 microcontroller @ up to 80 MHz with DSP and FPU, up to 1024 kB flash, up to 96 kB RAM, 2.4 GHz IEEE 802.15.4 for Zigbee or Thread
  • USB port (host interface)
  • 7-pin IO header with programming pins, one GPIO, 3.3V and GND
  • 2-pin header for Tx/Rx serial port
  • Button and reset buttons
  • LED
  • PCB antenna
  • Power Supply: 5V via USB port, LDO chip
  • Dimensions: 56 mm x 14 mm
  • Weight: 5 g

The company made it clear that they are targeting DIY home automation users, so you can use the Zigbee 3.0 to USB adapter in home automation setups and also control Sonoff Zigbee modules such as the smart switch, smart plug, temperature and humidity sensor, motion sensor and door/window sensor.

“It works with Home Assistant and openHAB straight out of the box,” ITEAD writes.

ZigBee 3.0 USB Dongle will be shipped with Silabs application firmware based on EmberZNet 6.7.8 SDK plus standard EZSP v8 interface and standard Gecko bootloader for possible recovery with serial interfaces.

The Zigbee 3.0 dongle is only about 14mm, so it’s not likely to disturb any other USB ports on your system. The ZigBee 3.0 USB Dongle has been proven to work with all SONOFF ZigBee sub-devices.

You can check the company’s Facebook page for Sonoff for more details on the Zigbee 3.0 dongle, especially how to add devices to it and its simple use on Home Assistant.

You can also visit the company’s product page where the adapter currently sells for $6.99.

Murata’s Silicon Capacitors

Posted on by mixos

Murata BBEC Silicon Capacitor

Murata BBEC Silicon Capacitor offers ultra-broadband performance up to 40GHz in a 0201M package with a 0.60mm x 0.30mm (L x W) footprint. This capacitor is resonance-free, allowing ultra group delay variation. It provides high reliability and high stability of capacitance value over temperature, voltage, and aging. Other features include ultra-low insertion loss as well as low ESL and low ESR in bypass grounding mode. Murata BBEC Silicon Capacitor has a thickness of 100µm and is compatible with standard wire bonding assembly (ball and wedge) and embedding.

Features

  • Ultra-broadband performance up to 40GHz
  • Resonance free, allowing ultra group delay variation
  • Ultra-low insertion loss thanks to impedance matching in transmission mode
  • Low ESL and low ESR in bypass grounding mode
  • High stability of capacitance value over temperature, voltage, and aging
  • High reliability
  • Compatible with standard wire bonding assembly (ball and wedge) and embedding

Specifications

  • -55°C to +150°C operating temperature range
  • 0201M size code
  • 0.60mm x 0.30mm (L x W) footprint
  • 40GHz frequency
  • 11VDC withstanding voltage
  • 10nF capacitance
  • 100µm thickness

Murata ULEC Silicon Capacitor

Murata ULEC Silicon Capacitor features high-frequency performance up to 20GHz for broadband applications. This device comes in a 0201M package with a 0.60mm x 0.30mm (L x W) footprint. The ULEC series is resonance-free, allowing ultra group delay variation, and offers low ESL and low ESR in bypass grounding mode. Other features include ultra-low insertion loss, high reliability, and high stability of capacitance value over temperature, voltage, and aging. Murata ULEC Silicon Capacitor is compatible with standard wire bonding assembly (ball and wedge) and embedding.

Features

  • Ultra-broadband performance up to 20GHz
  • Resonance free, allowing ultra group delay variation
  • Ultra-low insertion loss thanks to impedance matching in transmission mode
  • Low ESL and low ESR in bypass grounding mode
  • High stability of capacitance value over temperature, voltage, and aging
  • High reliability
  • Compatible with standard wire bonding assembly (ball and wedge) and embedding

Specifications

  • -55°C to +150°C operating temperature range
  • 0201M size code
  • 0.60mm x 0.30mm (L x W) footprint
  • 20GHz frequency
  • 11VDC withstanding voltage
  • 10nF capacitance
  • 100µm thickness

more information: https://www.murata.com/en-eu/products/capacitor/siliconcapacitors/ubec_bbec_ulec

Axiomtek Introduces Palm-Sized and Fanless Embedded Computer for Factory Automation – eBOX560-52R-FL

Posted on by mixos

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is proud to introduce its extremely compact fanless embedded system, the eBOX560-52R-FL. This palm-sized embedded system is powered by the onboard Intel® Core™ i5-8365UE or Intel® Celeron® 4305UE processors (codename: Whisky Lake-U). It provides high-performance, power-efficient, and abundant I/O interfaces in a compact device. The eBOX560-52R-FL is highly suitable for space-constrained applications with strict performance requirements such as industrial equipment computers, in-cabinet equipment integration, collaborative robots, and more.

“Axiomtek’s eBOX560-52R-FL is designed to provide customers with flexible, convenient, and simplified solutions for industrial and embedded applications. The fanless yet low-power embedded system can operate under wide temperatures ranging from -10°C to 50°C with 0.7 m/s airflows and endure up to 50G shock and 3Grms vibration. Moreover, it features two independent 4K Ultra HD displays through its DisplayPort++ and HDMI for multi-display applications,” said Janney Lee, a product manager of Product PM Division at Axiomtek. “Its compact size, excellent computing power, and ability to function in harsh environments making it ideal for diverse industrial applications such as factory, machine, and logistics automation, station gate controls, and ticket vending machines.”

The eBOX560-52R-FL has one 260-pin DDR4-2400 SO-DIMM slot with up to 32GB of system memory. The Intel® Whisky Lake-U-based embedded system adopts versatile I/O interfaces including two RS-232/422/485 ports, two Gigabit LAN ports, two USB 3.1 Gen2 ports, two USB 2.0 ports, one HDMI, one DisplayPort++, one AT/ATX quick switch, and two antenna openings. For extra expansions, the fanless box PC supports one M.2 Key E 2230 slot for Wi-Fi module and one 2.5″ SATA HDD drive bay for additional storage. It has one screw-type 12V DC power input connector with over-voltage protection (OVP), under-voltage protection (UVP) and short current protection (SCP). Its flexible mounting options include wall mount, VESA mount and DIN-rail mount. It also supports Axiomtek’s AMS.AXView software to help users remotely monitor and manage connected devices. For operating systems, it supports Windows® 10 IoT and Linux..

Advanced Features:

  • 8th gen Intel® Core™ and Celeron® processor onboard (Whisky Lake-U)
  • One M.2 Key E 2230 for Wi-Fi module
  • 260-pin DDR4-2400 SO-DIMM, max. up to 32GB
  • 2 GbE LAN and 2 USB 3.1 Gen2
  • Supports DisplayPort++ and HDMI for dual independent displays
  • Multiple mounting designs: Wall mount, DIN-rail and VESA mount

The eBOX560-52R-FL will be available for purchase in May 2021. For more product information or customization services, please visit our global website at www.axiomtek.com or contact one of our sales representatives at info@axiomtek.com.tw.

ATtiny Flasher – Breadboard Flashing Tool for the Atmel ATtiny

Posted on by mixos

ATtiny Flasher is a handy device that allows you to use your favorite IDEs and debugging tools when developing for the ATtiny microcontroller. Enjoy the classic Arduino development experience while working with bare metal. Whether you’re a design engineer, a hobbyist, or someone who’s just getting started programming MCUs, ATtiny Flasher can help you get from a great idea to a great implementation—without having to port your code to its intended platform when you’re done.

Features & Specifications

  • Flash ATtiny85, ATtiny45, ATtiny25, and ATtiny13 via breadboard or onboard header
  • Flash the entire Atmega MCU family using the ISP header
  • Flash using Arduino IDE, Platformio, or any other IDE of your choice
  • Two configurable power rails, either 3.3 V or 5 V
  • Six GPIO “weak” LEDs
  • Three flash-status LEDs
  • Onboard OLED screen connected to target MCU as a live terminal
  • Streams serial data to the host PC as if it were connected directly to the target MCU. (Yes, serial on ATtiny. Even ATtiny13!)
  • A buffer IC between target and host MCUs only connects the two while flashing
  • Open hardware driven by open source software

The project will soon launch on Crowdsupply.com, so you may stay tuned.

ClearLink: a new, EtherNet/IP Motion and I/O Controller – 4 axes for just $249!

Posted on by mixos

Teknic recently launched ClearLink, a Motion and I/O Controller offering users of EtherNet/IP compatible PLCs, such as CompactLogix™, MicroLogix™, and ControlLogix®, a new way to save space, money, and wiring in their automated machinery. ClearLink provides 4 axes of motion control, a serial port, 13 configurable digital & analog I/O points, and expandable I/O for just $249 in single piece quantities. Teknic includes a free, licensed, RSLogix/Studio5000-compatible EDS file with logical names and Add-On-Profiles which allows for easy mapping of I/O assemblies.

Key specifications and benefits of ClearLink include:

  • Multi-Axis EtherNet/IP Motion Control: ClearLink provides up to 4 axes of motion control for Teknic’s ClearPath integrated servos, 3rd party stepper drives, or any brushless servo motor with a digital servo drive.
  • Robust EtherNet/IP IO Module: ClearLink includes 13 industrially hardened and conditioned 24V I/O points, including digital and analog inputs and outputs. Outputs can directly control a power-off brake or other inductive loads without a separate relay or clamping diode. There’s also a dedicated LED for every I/O point for easy troubleshooting and diagnostics.
  • Expandable Output Modules: You can extend your I/O compliment with 8-point I/O expansion modules (CCIO-8) for a total I/O compliment up to 77 I/O points.
  • Fast Prototyping via Licensed EDS file: Teknic’s EDS file comes with a Rockwell licensed EDS key, which includes Add-On-Profiles and individual tags in your I/O assemblies to reduce development time. Download the ClearLink EDS file for free.
  • Short Lead Time: Teknic ships online ClearLink orders within 3 business days. ClearLink is backed with a 3-year warranty and 90 day money-back guarantee.

Order online at: https://www.teknic.com/products/ethernet-ip-io-motion-controller/clnk-4-13/.

PIR Motion Sensor LED Ceiling Light – Arduino Compatible

Posted on by mixos

This motion sensor LED ceiling light board has been designed using 4 white LEDs each of 1-3W, PIR sensor module, Atmega328 microcontroller, low ohm IRLR7843 MOSFET, and few other components. The PIR sensor detects the infra-red rays emitted by human motion within the detection area and switches on the 4 white LEDs for 10 seconds.  The project helps in energy-saving applications and new green building projects. Detecting distance: 1 to 20 feet. Detecting angle: 360 degrees. Installation height 2-15 feet. 2 mounting holes are provided to mount this board. It is advisable to use this board indoors.

PIR Motion Sensor LED Ceiling Light – Arduino Compatible – [Link]

Two Channel Smart Low-Side Power Switch for Inductive, Resistive and Capacitive Loads – Arduino Shield

Posted on by mixos

The project presented here enables users to switch all kinds of resistive, inductive and capacitive loads, limited by clamping energy (EAS) and maximum current requirement. The user may interface 2 x inductive, resistive, and capacitive loads such as solenoid, dc motor, high current contact switch, high current relay, LEDs, lamps, and piezo etc. The project is most suitable for inductive loads as well as loads with inrush current. The project has been designed using BTF3050TE IC which is a 50 mΩ single-channel Smart Low-Side Power Switch in a PG-TO252-5 package providing embedded protective functions. The power transistor is built by a N-channel vertical power MOSFET. The device is monolithically integrated. The BTF3050TE is automotive qualified and is optimized for 12V automotive and industrial applications. Two loads can be controlled using Arduino UNO. IC has a thermal-restart function. The device will turn on again, if input is still high, after the measured temperature has dropped below the thermal hysteresis.

Two Channel Smart Low-Side Power Switch for Inductive, Resistive and Capacitive Loads – Arduino Shield – [Link]

Seeed Studio’s Dual Gigabit Ethernet Carrier Board Brings The CM4 To Router Projects

Posted on by Emmanuel Odunlade

The latest design from Seeed Studio is one that will pique your interest if you are a software router enthusiast, a Linux developer, an HTPC maker, or just the regular Raspberry Pi user. It is a carrier board for the Raspberry Pi Compute Module 4 and it offers two Gigabit Ethernet ports.

“The Dual Gigabit Ethernet Carrier Board for the Raspberry Pi Compute Module 4 was designed with soft router applications in mind,” says Seeed Studio. “It features dual Gigabit Ethernet ports, dual USB 3.0 ports, a rich set of I/O peripherals such as MIPI CSI, MIPI DSI and micro-HDMI for display and camera connectivity, a standard 9-pin USB 3.0 for further USB expansion, microSD card slot and FPC connector. Despite this, the Dual Gigabit Ethernet Carrier Board maintains a small form factor of 75 by 64 by 21mm [around 2.95 x 2.52 x 0.82in] – that’s one third the size of the official I/O Board!”

The carrier board is designed in a way that allows users to explore more possibilities with CM4. The MicroSD card slot in the compact carrier board implies that it can support all Raspberry Pi CM4 boards including those without an onboard eMMC storage like the Compute Module 4 Lite family. The carrier board will support up to 8GB of LPDDR4 RAM and 32GB of eMMC storage. Extra connectivity for the carrier board is provided by the Wi-Fi and Bluetooth onboard selected CM4 boards.

Seeed Fusion team is launching a Raspberry Pi CM4 Sponsorship Program to support CM4-powered designs. Manufacture your custom Raspberry Pi CM4 Carrier Board with the Seeed PCB Assembly Service and get up to $500 Off! –

Features and Specifications of the Dual Gigabit Ethernet Carrier Board include:

  • 2x Gigabit Ethernet connectors for soft router applications
  • Camera / display connectivity using:
    • 1x MIPI CSI connector
    • 1x MIPI DSI connector, and,
    • 1x Micro HDMI connector
  • Onboard 2x USB 3.0 with 1x additional USB 3.0 9-pin header for more external ports
  • 1x microSD card slot to load system image for non-eMMC version of CM4
  • More expandability via FPC Connector (I2C, SPI)
  • External fan support with fan power connector
  • USB 3.0 to GbE (Gigabit Ethernet Bridge): Microchip’s LAN7800
  • Power Supply: 5V/3A using USB Type-C Port
  • Dimensions: 75 mm x 64 mm x 21 mm
  • Weight: 43 grams
  • Temperature Range: -40°C to +85°C

Application scenarios include:

  • Smart home
  • Internet of Things
  • Gateways
  • Routers
  • Camera projects

Pricing and Availability

The Dual Gigabit Ethernet Carrier Board is currently available for pre-order on Seeed Studio at $45 but the company is offering some discounts for those who will be purchasing in bulk units — $43 for quantities above 10 but less than 20, while $41 for 20 and above. Shipping is expected to start before the end of April this year.

Tiny microsupercapacitor that could power future wearables

Posted on by Emmanuel Odunlade

A group of researchers from the Ulsan National Institute of Science and Technology (UNIST), South Korea, have designed a really tiny and ultra-dense Micro-supercapacitor that can be printed directly into circuits.

“Microsupercapacitors (MSCs) have garnered considerable attention as a promising power source for microelectronics and miniaturized portable/wearable devices. However, their practical application has been hindered by the manufacturing complexity and dimensional limits.”

the team explains in the abstract of the paper.

The Micro-supercapacitor, as tiny as it is (roughly the width of a human fingerprint), is being positioned as the next big thing in the world of IoT — it could power both future wearables and embedded IoT devices.

The team from the School of Energy and Chemical Engineering was able to conduct a study, the first of its kind that exploits electrohydrodynamic jet printing in the micro-supercapacitors. They fabricated a new class of ultra-high areal number density solid-state MSCs directly on a chip via EHD jet printing. EHD jet printing is a high-resolution patterning technique that uses the electrode and electrolyte for printing purposes. It is similar to conventional inkjet printing but it can control printed liquid with an electric field.

And the results?

“We were able to produce up to 54.9 unit cells per square centimeter (cm2) via electro-hydrodynamic jet printing technique, and thus the output of 65.9 volts (V) was achieved in the same area,” the first author of the project, Kwonhyung Lee, explains.

Professor Lee and his team also claimed that they were able to fabricate 36 unit cells on a chip (area = 8.0 mm × 8.2 mm, 54.9 cells cm−2) and areal operating voltage (65.9 V cm−2) — something far beyond those of previously reported MSCs fabricated by other printing techniques. These cells also showed that they could withstand excessive heat that may be generated from the actual operation because they maintained the normal cyclic voltammetry profiles when exposed to very high temperatures.

The prototype MSCs from the study are so tiny but they can be printed during a chip’s manufacturing process, giving it an internal power source.

“In this study, we have demonstrated on-chip UHD SS–MSCs fabricated via EHD jet printing,” Professor Lee further explained. “The on-chip UHD SS–MSCs presented here hold great promise as a new platform technology for miniaturized monolithic power sources with customized design and tunable electrochemical properties,” he added.

Further Details

Full details on the team’s work concerning the micro-supercapacitors can be found in the “Science Advances” journal where it was published.

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