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OSD32MP1-RED – A Full Featured Development Platform

Posted on by mixos

The OSD32MP1-RED is a full-featured Reference, Evaluation, and Development platform for the STM32MP1 based SiP, the OSD32MP15x.  It provides access to a number of standard communication interfaces like WiFi and Bluetooth, 1Gb Ethernet, and CAN.  It supports HDMI or DSI displays and has a connector for a camera. The OSD32MP1-RED expands easily by providing connectors that are compatible with Raspberry Pi, MikroElektronika mikroBUS™ Click, and STMicroelectronics Motor Control Header.

The onboard eMMC comes preloaded with an Opensource Linux Distribution allowing you to begin development straight out of the box.

OSD32MP1-RED Features

  • Full Featured Reference, Evaluation, Development Platform
  •  OSD32MP157C-512M-BAA
    • STM32MP157C Dual Arm® Cortex® A7 + M4
    • 512MB DDR3 Memory
    • STPMIC1A Power Management
    • EEPROM
    • Oscillator
    • Passives
  • Connectivity
    • WiFi/Bluetooth
    • 10/100/1000 Ethernet
    • CAN FD
    • USB Host
    • USB-C OTG
    • UART
    • JTAG (STLink)
  • Memory
    • µSD Card
    • eMMC
  • Display
    • HDMI
    • DSI
  • Camera
  • Expansion
    • Raspberry Pi Compatible Header
    • MikroElektronika Click Header
    • Motor Control Header
  • 4 Layer Design

Block

With its communication interfaces, peripherals, and expansion capabilities, the OSD32MP1-RED is a perfect platform for quickly developing IOT, high-end HMI, or real time control applications.

more information: https://octavosystems.com/octavo_products/osd32mp1-red/

Fast Sense brings 8x performance to mobile robots with its revolutionary Edge Computational AI platform

Posted on by mixos

Fast Sense Studio, a leading developer of mobile robotics solutions, today announced that its Fast Sense AI Edge Computer has been launched at the Embedded world 2021 DIGITAL.

Fast Sense AI Edge Computer is a powerful on-board computer bringing scalable Edge AI capabilities to mobile robotics.

It is a board-level circuit that integrates the power of six computers in a single module. Six independent AI inference engines (Intel GPU, 2x Myriad X, 3x Coral) operate in one compact device enabling the running of six different neural nets simultaneously without performance degradation, while receiving data from several sources in real time.

Fast Sense AI Edge Computer delivers massive artificial intelligence capabilities and has eight times more computational power compared to existing products in the market.

Thanks to six independent Edge AI engines, Fast Sense AI Edge Computer has sufficient hardware resources to run different AI algorithms and control a robot that needs to process data from different sensors like video cameras and react to changes in its environment in real-time.

The Fast Sense AI Edge Computer makes it possible to run a robot with three video cameras pointing in different directions where each video stream has to be processed with three different neural nets: object detection, semantic segmentation and depth estimation. It consists of a single board COM

Express module with Intel CPU, a set of edge AI accelerators to inference several neural nets on-board in real time and has numerous hardware interfaces to robotic sensors and actuators. The platform is shipped as a ready-to-use device with software examples of running ROS (Robot Operating System) algorithms with integrated neural nets meaningful for robotic applications, running in isolated Docker containers.

The Fast Sense AI Edge Computer can be integrated with multiple robotics platforms, e.g. drones and robots with wheels for a great number of use cases. This universal reasoning system can be applied across different classes of physical agents such as delivery robots, autonomous machines, facilities inspection, logistics robots (AGV) and disinfection drones.

“We believe in the future where reliable physical agents become relevant for routine tasks that most of us perform today. Reliability is what we are working on today, creating the environment for robots to process a large amount of data on board, learning from this and making independent, safe, and reliable decisions,” said Yuri Rumyancev, Co-founder of СТО Fast Sense Studio. “Bringing together hardware and robotics engineers, software developers and data scientists, we have developed a prototype computer for mobile robotics with six independent edge AI accelerators from Intel and Google. It is fully tested and already integrated into our wheeled robot. The launch of the Fast Sense AI Edge Computer indicates a new benchmark for end-to-end robotic systems to help people achieve a new level of productivity.”

Fast Sense X Robotics AI Platform is being demonstrated at the Embedded World 2021 from 1 to 5 March, 2021.

In order to request a Demo, please visit the Fast Sense Studio website.

6-Channel Capacitive Touch Sensor Module

The module described here is a 6-channel capacitive touch sensor. The project is based on CAP1206 IC which contains six (6) individual capacitive touch sensor inputs with programmable sensitivity for use in touch sensor applications. Each sensor input is calibrated to compensate for system parasitic capacitance and automatically recalibrated to compensate for gradual environmental changes. The CAP1206 features Multiple Pattern Touch recognition that allows the user to select a specific set of buttons to be touched simultaneously. If this pattern is detected, a status bit is set and an interrupt is generated. The CAP1206 has Active and Standby states, each with its own sensor input configuration controls. Power consumption in the Standby state is dependent on the number of sensor inputs enabled as well as averaging, sampling time, and cycle time. Deep Sleep is the lowest power state available, drawing 5μA (typical) of current. In this state, no sensor inputs are active, and communications will wake the device.

Refer to the datasheet of CAP1206 for more information on configuration and controlling the module using a microcontroller, Arduino, or Raspberry Pi.

Features

  • Operating Supply 3.3V to 5V DC
  • Onboard SMBUS/I2C Interface
  • Onboard Power LED
  • 6 PCB Touch Pads
  • I2C ADDRESS 0x28
  • PCB dimensions: 83.82 x 24.13 mm

Schematic

Parts List

NO.QNTY.REF.DESCMANUFACTURERSUPPLIERSUPPLIER PART NO
11CN15 PIN MALE HEADER 2.54MM PITCHADAM TECHDIGIKEY 2057-PH1RA-05-UA-ND
21C10.1uF/50V SMD SIZE 0805MURATA/YAGEO
31C210uF/16V SMD SIZE 1210 OR 1206MURATA/YAGEO
41D1LED RED SMD SIZE 0805OSRAMDIGIKEY 475-1415-1-ND
53R1,R2,R310K 5% SMD SIZE 0805MURATA/YAGEO
61R41K 5% SMD SIZE 0805MURATA/YAGEO
76TP1-TP6PCB TOUCH
81U1CAP1206 14SOICMICROCHIPDIGIKEY CAP1206-1-SL-CT-ND

Connections

Gerber View

Photos

CAP1206 Datasheet

NVIDIA introduces low cost Jetson TX2 NX SO-DIMM module

Posted on by mixos

NVIDIA® Jetson™ TX2 NX delivers the next step in AI performance for entry level embedded and edge products. It provides up to 2.5X the performance of Jetson Nano, and shares form-factor and pin compatibility with Jetson Nano and Jetson Xavier™ NX.

The compact, power efficient Jetson TX2 NX system-on-module (SOM) is perfect for creating mass-market AI products in the fields of manufacturing, logistics, retail, service, agriculture, smart city, and healthcare and life sciences. Intelligent machine OEMs can now scale their product offerings with pin-compatible Jetson modules, while leveraging cloud-native technologies to build, deploy, and manage the same software across all of them.

Pre-trained AI models from NVIDIA NGC™, together with the NVIDIA Transfer Learning Toolkit, provide a faster path to inference with optimized AI networks, while containerized deployments bring flexible and seamless updates.

NVIDIA JetPack™ SDK enables development of AI applications for Jetson TX2 NX with accelerated libraries supporting all major AI frameworks, as well as computer vision, graphics, multimedia, and more. Together with the latest NVIDIA tools for application development and optimization, JetPack ensures fast time to market and reduced development costs.

Technical Specifications

  • AI Performance 1.33 TFLOPs
  • GPU NVIDIA Pascal™ Architecture GPU with 256 CUDA cores
  • CPU Dual-core NVIDIA Denver 2 64-bit CPU and quad-core ARM A57 Complex
  • Memory 4GB 128-bit LPDDR4, 1600 MHz – 51.2 GBs
  • Storage 16GB eMMC 5.1 Flash Storage

Ease of development and speed of deployment—plus a unique combination of form-factor, performance, and power advantage—make Jetson TX2 NX the ideal mass-market AI product platform to get to market and continuously update over the lifetime of a product.

Samples of Jetson TX2 NX modules are available now for $200 on Arrow or 140 EUR on Silicon Highway Direct. Further details may be found on the Jetson product page. [via www.cnx-software.com]

Introducing tCam-Mini – An IR thermal camera board with ESP32 module

Posted on by mixos

tCam-Mini is a small wireless streaming thermal imaging camera designed by Dan Julio to make it easy to get and use radiometric data from a Flir Lepton 3.5 sensor. Radiometric data includes the temperature of every pixel captured by the Lepton allowing all kinds of interesting thermographic analysis. Of course that data can also be turned into the beautiful false-color images everyone associates with thermal imaging.

tCam-Mini comes with a capable desktop application, running on Linux, Mac OS X and Windows, making it easy-to-use, right out of the box. Custom applications running on any platform can easily communicate with tCam-Mini via a socket interface. Commands and data are transferred as easy-to-parse json strings.

Capabilities

  • The tCam-Mini camera exposes the full capabilities of the Lepton.
  • The camera can operate in either Radiometric/TLinear (each pixel contains temperature data) or AGC modes (no temperature data in each pixel but better images).
  • Simple json-based command set with communication of a TCP/IP Socket. Makes interfacing with the camera very simple from a custom application.
  • AP or STA (client) Wifi modes (static or DHCP-served IPV4 address).
  • Single image or streaming data modes.
  • Control over sensor emissivity, gain and spotmeter location.

The companion desktop application makes it easy to use the camera and analyze the data from it.

  • Display images or streams with multiple palettes.
  • Save and load images or streams in files preserving the radiometric data for use later or by other applications. Two file formats: image and video (described in the github repository).
  • Export images as jpg, png or tiff files.
  • Copy current image to computer’s clipboard.
  • Histogram display and analysis of pixel populations.
  • Spotmeter and up to four additional markers showing temperature at various points in an image.
  • Graphing function to plot spotmeter and marker data over time.
  • Graph baseline mode to allow comparing temperatures to a reference point in the scene (for example to compare a temperature to a blackbody constant).
  • Export graph data in a text file for analysis by other programs.
  • Print graph (or create a PDF on computers that can print to PDF).

Hardware Overview

  • Espressif ESP32-WROVER-E Module (ESP32-D0WD0V3, 8 MB PSRAM, 8 MB Flash) with built-in antenna
  • Flir Lepton 3.5 (160×120 pixel radiometric LWIR camera with shutter)
  • CP2102N-A02 USB to UART bridge with ESP32 boot loader control
  • Multi-voltage power supply (3.3V, 3.0V, 2.8V, 1.2V)
  • Dual color (Red/Green) status LED
  • Factory Wifi Reset button

Open Source

The hardware and firmware design files are available in Dan’s Github repository.  The firmware is designed to be compiled using Espressif IDF tools and new code can be loaded via the built-in USB Serial port.  Precompiled binary files are also provided for easy upgrades.

Development is ongoing with new features and additional software support planned including a python library and web server.

more information: https://groupgets.com/campaigns/919-tcam-mini

Capacitech Cable-Based Capacitor

Posted on by mixos

Capacitech Cable-Based Capacitor (CBC) offers a 1.6VDC rated voltage, 1.25A current rating, and 0.3mA maximum leakage current. The CBC is a flexible, wire-shaped supercapacitor that offers space and aesthetic advantages through the ability to be used as part of a product or system’s wiring infrastructure. This supercapacitor’s thin and flexible design allows it to be built inside of DC power cords, rather than be limited to a printed circuit board. Capacitech Cable-Based Capacitor is ideal for emergency lighting, automotive systems, energy harvesting, and renewable energy systems.

Features

  • Flexible and wire-shape form factor
  • Use as part of wiring infrastructure
  • Cable-based backup power
  • Cable-based boost power
  • Size, space, aesthetic advantages
  • Electronics miniaturization

Applications

  • Peak power complement
  • Emergency lighting
  • Renewable energy systems
  • Automotive systems
  • IoT, automation, and security devices
  • Backup system
  • Energy harvesting
  • Advanced and smart metering

more information: https://www.capacitechenergy.com

Texas Instruments TPS3899 Precision Voltage Supervisor

Posted on by mixos

Texas Instruments TPS3899 Precision Voltage Supervisor is a nano power, precision voltage supervisor with ±0.5% threshold accuracy, programmable sense, and reset time delay in a 6-pin space-saving 1.5mm x 1.5mm WSON package. The TPS3899 is a feature-rich voltage supervisor that offers the smallest total solution size in its class. Built-in hysteresis, along with programmable delay, prevents false reset signals when monitoring a voltage rail or push-button signals.

The separate VDD and SENSE pins allow for the redundancy sought by high-reliability systems. SENSE is decoupled from VDD and can monitor rail voltages other than VDD. Optional use of external resistors is supported by the high impedance input of the SENSE pin. Both CTS and CTR provide delay adjustability on the rising and falling edges of the RESET signals. CTS also functions as a debouncer by ignoring voltage glitches on the monitored voltage rails and operates as a “manual reset” that can be used to force a system reset.

The precision performance, best-in-class features in a compact form factor makes the Texas Instruments TPS3899 an ideal solution for wide-ranging industrial and battery-powered applications such as Factory/Building Automation, Motor Drives, and consumer products. The device is fully specified over a temperature range of –40°C to +125°C (TA)

Features

  • Precision voltage and push-button monitor
  • 0.85V to 6V (DL and PL outputs) VDD range
  • 1V to 6V (PH output) VDD range
  • Programmable sense and reset delay
  • 125nA (typ) nano quiescent current
  • ±0.5% (typ) high threshold accuracy
  • 5% (typ) precision hysteresis:
  • 0.505V (typ) adjustable threshold voltage
  • 0.8V to 5.4V fixed threshold voltage
    • Fixed threshold level available in 100mV steps
  • Multiple output topologies
    • DL – open-drain active-low
    • PL – push-pull active-low
    • PH – push-pull active-high
  • –40°C to +125°C temperature range
  • 1.5mm × 1.5mm WSON package

more information: https://www.ti.com/product/TPS3899

FWS-2365: Powering Faster, More Flexible Network Structures

Posted on by mixos

AAEON, a leading manufacturer of network appliances and white box solutions, has released the FWS-2365 desktop network appliance. Designed with a range of powerful features including 5G support and four SFP+ ports, the FWS-2365 powers faster, smarter networks for SD-WAN and uCPE applications.

The FWS-2365 is powered by Intel® Atom™ C3000 processors (formerly Denverton) with support for processors from four to sixteen cores, delivering performance to power more functions. With the Intel processors, the system supports vital performance acceleration tools including Intel QAT, SR-IOV, AES-NI, Virtualization Technology and DPDK. The FWS-2365 also supports TPM and Secure Boot to help maximize data and system security.

The FWS-2365 is built to deliver faster network speeds and higher throughput with up to four SFP+ Fiber 10 Gbps ports, and up to six copper Gigabit LAN ports, two of which can be upgraded to SFP. The FWS-2365 supports LAN Bypass functionality to provide uninterrupted connection and service.

The FWS-2365 is also built to maximize wireless performance, supporting up to three wireless expansion cards and six antennas. The FWS-2365 can support a combination of cards including Wi-Fi, 4G and 5G cellular communication. This allows for greater support for IoT connected devices and leverages the benefits of 5G to enable more flexible network structures.

Features

  • Intel® Atom® Processor C3000 series
  • 10/100/1000Base-TX Ethernet x 6
  • Supports 1 pair bypass (LAN 3 ~ 4)
  • Up to 4 x 10G SFP+ Port (C3558 only supports 2 port)
  • DDR4 SODIMM socket x 2
  • SATA III Port x 2
  • On board 16GB eMMC, up to 128GB
  • Mini-card slot x 1 (Half-size, PCIe), Mini-card slot x 1 (Full-size, PCIe + USB2.0) with SIM slot
  • M.2 B key 3052 x 1 (USB3.0) with SIM slot
  • USB3.0 TypeA Port x 2 (1 Port only support USB2.0 signal)

The FWS-2365 is purpose built for white box uCPE and SD-WAN network applications. It is easy to setup and configure for a range of NFV functions such as firewall and router, as well as VPN. The FWS-2365 also supports Zero Touch Provision (ZTP) to make deployment, setup and network authorization even easier. The system also supports remote console connection for more flexible system management and monitoring.

AAEON provides industry leading service and support to ensure long lasting, reliable performance. AAEON also provides a range of manufacturer and OEM/ODM services, from software support to custom configurations and even full ground-up system design to ensure every requirement is met.

“With the combination of high core count Intel processors and focus on delivering greater speeds and throughput, the FWS-2365 is the perfect solution for white box uCPE and SD-WAN network applications,” said Fredy Hsu, Product Manager with AAEON’s Network Security Division. “With 5G connectivity and 10Gbps SFP+ support, it allows NFV, VNF vendors, and communications service providers (CSP) to accelerate deployment of SD-WAN, SD-security, QoS and other SDN/NFV applications.”

more information: https://www.aaeon.com/en/p/white-box-desktop-network-appliance-fws-2365

ADLINK adopts Upverter to offer customers full automation of SMARC carrier board design

Posted on by mixos

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter — a web-based drag-and-drop designer tool. The Upverter tool requires minimal engineering skills, allowing customers to create their own SMARC based carrier board design within hours, and receive prototypes within weeks. Upverter generates the electrical design files of fully custom-defined carrier board designs on demand, as well as an instant Bill of Materials (BOM) complete with pricing, a customized device tree, documentation, and mechanical models.

The Upverter tool is a core component of Altium’s cloud technology platform. As Ted Pawela, Chief Ecosystem Officer, explains,

“Altium’s embeddable experiences can be added to partner websites using only a couple of lines of code. Upverter offers ADLINK’s customers a simple yet innovative way to bring new products to life.”

ADLINK’s design ecosystem called I-Pi SMARC accelerates industrial grade AIoT/IoT hardware development with standardized modular building blocks and up to 15 years longevity. The design service is available for SMARC modules based on NXP’s IMX8M and i.MX8M Plus and Rockchip’s PX30.

Accessible through ADLINK’s I-Pi SMARC website: https://www.ipi.wiki/pages/carrier-designer

The ADLINK I-Pi SMARC modular approach to hardware and software addresses the aggressive timeline issue that customers face and has become the most challenging aspect of a professional engineer’s job. The I-Pi SMARC ecosystem combines industrial grade components, extreme software portability, and Raspberry Pi-like flexibility and expansion in a SMARC form factor. Fast prototyping and proof of concept are key milestones of a successful project.

“The Upverter tool is an innovative improvement of handling the proof-of-concept and prototyping phase for custom products. It will reduce the needed time to almost 50% in comparison to current approaches,” said Carsten Rebmann, Modules Product Manager at ADLINK.

Upverter is available through ADLINK’s I-Pi SMARC website starting on March 1st 2021 as a trial for interested adopters. ADLINK will release the tool for production later in 2021.

Visit the website: https://www.ipi.wiki/

Energous Partners With e-peas to Advance At-a-Distance Wireless Charging Applications Greater Than 1 Meter

Posted on by mixos

Energous and e-peas will develop an evaluation board to support at-a-distance wireless charging applications for smart buildings, industrial IoT sensors, retail electronic displays and more. (Photo: Business Wire)

Energous Corporation, the developer of WattUp®, a revolutionary wireless charging 2.0 technology, announced a partnership with e-peas S.A. (“e-peas”), a leading semiconductor company developing energy harvesting PMICs and extremely low-power microcontrollers, to develop an evaluation board combining e-peas’ power management IC technology with Energous’ radio frequency (RF) solution to support at-a-distance wireless charging applications for smart buildings, industrial IoT sensors, retail electronic displays and more.

“Our WattUp technology is designed for the growing retail, smart building and industrial IoT markets to address concerns around battery life and maintenance logistics.”

Tweet this“As a leader in at-a-distance wireless charging, we are excited to work closely with e-peas, the leading supplier of IoT energy harvesting power management and extremely low-power microcontrollers at the edge, to offer integrated solutions like this board to allow for faster evaluation of distance-based wireless charging,” said Stephen R. Rizzone, president and CEO of Energous Corporation. “Our WattUp technology is designed for the growing retail, smart building and industrial IoT markets to address concerns around battery life and maintenance logistics.”

“The results of this joint effort between Energous and e-peas will be to introduce the capabilities and advantages of a small form factor, highly integrated solution that will enable charging distances greater than one meter, eventually extending out to several meters,” said Cesar Johnston, COO and executive vice president of Energous Corporation. “The core WattUp technology supporting this evaluation board is an outgrowth of the common architecture we have developed, which emphasizes scalability for all chip, hardware, software and antenna elements of the technical solution. “

Belgium-based e-peas provides energy harvesting and processing solutions to give infinite battery life to wireless devices by increasing the amount of harvested energy and by drastically reducing the energy consumption. Key applications for e-peas solutions include smart buildings, industrial IoT sensors and retail. This evaluation board will allow companies to integrate this technology for testing and evaluation in the smart buildings, wireless sensors market and electronic displays. The wireless sensors market alone is projected to grow nearly 3x in the next four years, from $5B in 2019 to $14.6B by 2025.

“As the wireless sensors market grows, so too is the need for avoiding battery maintenance costs. That is why at-a-distance solutions capable of charging more than a meter away are critical,” said Geoffroy Gosset, CEO and co-founder of e-peas. “We believe that the combination of both Energous’ WattUp and e-peas AEM technologies on a single evaluation board will ease the deployment of zero-maintenance solutions on multiple markets.”

The evaluation board functionality is expected to include:

  • DA2210 WPT rectifier
  • E-peas AEM30940 harvesting PMIC
  • Supercap or rechargeable lithium battery support
  • Smartbond DA14531-based BLE SoC
  • Ambient light and temperature/humidity sensors
  • Support for E-Ink display charging (optional)
  • Support for external harvesting antenna

Energous’ WattUp wireless charging technology is based on radio frequency, which provides a number of benefits for wireless charging including the ability to be designed into small form factor products and devices without flat surfaces.

To learn more about Energous, please visit Energous.com or follow the company on Twitter, Facebook and LinkedIn. To learn more about e-peas, please visit e-peas.com or follow the company on Twitter and LinkedIn.

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