Melexis expands IMC-Hall® current sensor portfolio exceeding measurement

Melexis, a global microelectronics engineering company, has introduced the MLX91216 XHF extra high-field current sensor, extending the ease and accuracy of its unique IMC-Hall® technology into high-current measurement for emerging automotive applications.

Capable of measuring current to beyond 2000 A, the MLX91216 XHF is suited to redundant monitoring of battery-management systems (BMS), over-current detection in smart fuses, and measuring phase currents in traction inverters and boost/recuperation inverters. With user-programmable filtering to adjust resolution, response time, and bandwidth for optimum signal-to-noise ratio, the sensor features built-in diagnostics, including broken-wire detection.

The SOIC8 surface-mount device contains Melexis’ patented Integrated Magnetic Concentrator (IMC) that enables accurate contact-free measurement of busbar current in combination with a simple U-shape magnetic shield. When mounted on a PCB, the sensor is positioned over the busbar, within the shield, allowing easier assembly than conventional Hall sensors. What differentiates the proven IMC-Hall® technology from coreless solutions is that position is much less critical. The design can accept more mechanical movement because the measurement is not dependent on a magnetic field gradient. Other technologies that are can result in very severe bus bar machining causing important thermal hot spots. On the other hand, IMC-Hall® technology carries the advantages of coreless technologies, so it lends itself to smaller assemblies with surface mount package solutions. This avoids the use of more complex through-hole packages that often require specific lead bending/forming native to core-based solutions.

The MLX91216 XHF extends the family of Melexis IMC-Hall® sensors that provide accurate, high-speed current measurement for a wide range of automotive and industrial applications.

  • MLX91216 High field (HF) versions: 200 to 600 A
  • MLX91216 Very High Field (VHF) versions: 400 to 1200 A
  • MLX91216 eXtra High Field (XHF) versions: 800 to 2000 A

Available now, the MLX91216 XHF is AEC-Q100 Grade-0 qualified for automotive applications and operates over the temperature range -40 °C to +150 °C. The sensor has a wide measurement range from ±20 mT to ±350 mT with linearity down to ±0.2% full scale, 2 μs response time, and high thermal stability with offset drift below 5 mV and sensitivity drift within 1%.

SOM-6883: Performance Breakthrough with 11th Gen. Intel® Core™ Processors and Advanced I/O Technology

Advantech, a leading embedded and AIoT solutions provider, has released SOM-6883 for use in a wide variety of applications. SOM-6883 is a COMe Compact Type 6 Module with 11th Gen. Intel® Core™ processors (formally known as Tiger Lake UP3). It offers excellent Intel Iris Xe graphics combined with improved processing performance and AI acceleration. The new real-time, low-latency capabilities in a low-power package make the TigerLake a perfect fit for AI inference, medical imaging, and edge applications in space-constrained environments. Designed with DDR4 3200 memory, one channel memory down and the other SO-DIMM reserved for higher memory capacity configurations enabling improved memory bandwidth and breakthrough graphics effect; SOM-6883 also delivers industry-leading super speed I/O technology such as 2.5Gbase-T TSN LAN, PCIe Gen 4 and USB 3.2 Gen 2. Additionally, Advantech provides a reference design to enable USB4 (Thunderbolt) via the development carrier board to help users speed up this new technology implementation. Its onboard NVMe SSD, IBECC (InBandECC) memory, wide-range power inputs, as well as wide operating temperatures — making it the reliable choice for medical, machine learning, high-end test equipment and defence applications.

Extreme Performance with 11th Gen. Intel 10nm Processors and Iris® Xe Graphics

Integrated with 10nm microarchitecture 11th Gen. Intel® Core™ processors that deliver CPU & GPU compute with AI acceleration; SOM-6883 presents excellent computing performance that up to 25% faster than the previous models, 2.95x graphics performance upgrade and responsiveness with 12-28W low power consumption. Adopting up to 96 GPUs and dual video decoder boxes with Intel Iris® Xe graphics, SOM-6883 is the first COMe Compact module that supports up to four ports independent 4K displays or two ports 8K HDR outputs. Meanwhile, this platform is known for its AI Acceleration with Intel® Deep Learning Boost engine, VNNI, which can improve the efficiency and increase the inferencing performance dramatically. To help our partners accelerate the AI revolution, Advantech will offer the Intel OpenVINO toolkit based on the demand.

Enhanced Data Transmission via 2.5GbE with TSN, PCIe Gen 4 and USB4

SOM-6883 supports multiple cutting-edge I/O technologies. It enables super-speed data transmission capability with wider bandwidth of 2.5G LAN, PCIe Gen 4 and NVMe SSD, to transfer massive data between AIoT applications. The 2.5G LAN equipped with TSN (Time Sensitive Networking) is the best choice for automation or edge applications in need of low-latency. This technology fulfills the demand of real-time traffic, allowing the critical data to get the priority in the communication process, such as transferring command, actions or safety information in time. On the other hand, SOM-6883 is the first COMe that supports PCIe Gen 4 for double data transition rate. It also supplies extraordinary USB4, which can be configured as DisplayPort, Thunderbolt, USB 3.2, and USB 2.0 in a low profile USB-Type-C connector. Advantech will offer USB4 reference design guide and starter kit of carrier board with a Mezzanine card, named SOM-MZ10, to help the partners to accelerate the design-in of new I/O technology easily.

Reliable and Ruggedized Design for Harsh Environments

Besides its excellent performance, the new SOM-6883 has more reliable design to adapt in diverse applications. SOM-6883 features soldered 16GB DDR4 3200 memory and NVMe SSD for better anti-vibration and anti-shock. It also supports IB-ECC memory for error correct function, TPM2.0 chip onboard to prevent cyber-threats, 8.5-20V wide range power input, and -40o~85oC wide operating temperature, thus it can comply with the requirements from mission-critical applications, including aerospace, defense, railway, transportation, and outdoor communication applications. Not only hardware, SOM-6883 also supports BIOS storage protection, and security boot, BIOS power-management, plus WISE-DeviceOn for remote hardware monitoring and over the air software update to prevent system malfunction, then create a dependable product applicable to a myriad of AIoT and IIoT scenarios.

Key Features

  • COM Express R3.0 Compact Type 6 Module
  • 11th Gen. Intel® Core™ i7/i5/i3/Celeron™ Processors
  • Up to 16GB On-board DDR4 3200MT/s and up to 32GB SO-DIMM 3200MT/s
  • Four independent displays with 3x DDI, eDP/LVDS or VGA.
  • 1 PCIe x4 Gen 4, 5 PCIe Gen 3, 4 USB 3.2 Gen 2, 2.5G LAN, 2 SATA III Ports
  • Supports Advantech iManager and WISE-DeviceOn
  • Operating Temp: Standard: 0 ~ 60 °C (32 ~ 140 °F), Extended: -40 ~ 85 °C (-40 ~ 185 °F)

Advantech’s COMe Compact SOM-6883 C7A-S8A1 is ready for order from February, 2021.

For more information, please contact your Advantech’s sales support team locally or visit our website: https://www2.advantech.com/embedded-boards-design-in-services/com/

AAEON Partners with KingTiger and AMI to Accelerate Deployment of iMS Memory Error Prevention Software

AAEON, an industry leader in edge computing solutions, collaborated with KingTiger, a leader in memory testing solutions, to help with testing and developing their intelligent Memory Surveillance (iMS) memory error prevention software. Developed in conjunction with AMI, a leading provider of firmware, manageability and security solutions for the global computing industry, this innovative software, which is embedded in Aptio V UEFI Firmware from AMI, allows systems to avoid memory errors without ECC support, ensuring secure, reliable, and accurate data reporting in edge computing and big data systems.

Data integrity is vital for a wide range of big data and data-based applications. From medical records to finance, memory errors can wreak havoc on accuracy, reliability and even data safety and security. For larger and more powerful computing systems, this is usually solved with the use of error-correcting code (ECC) memory. However, ECC memory is often limited based on whether or not the processor chipsets support this hardware solution. This often requires developers and users to upgrade their hardware platforms to higher performance, and thus more expensive, platforms where the extra power and cost are otherwise unjustified, such as in edge computing applications.

KingTiger, specialists in memory testing solutions, recently developed iMS, a software-based approach to error correction memory. The iMS, or intelligent Memory Surveillance, software is deployable on platforms which otherwise don’t support ECC memory, allowing developers and users to use platforms with more appropriate processing capabilities, saving costs while maintaining data integrity. The software can detect erroneous bits and mask them before they cause errors within the data and avoid system crashes. iMS provides an advantage over ECC memory in that it can detect and mask an unlimited number of bits, whereas ECC memory is typically limited to one bit per address. It also, in effect, extends the lifecycle of memory/RAM modules by being able to handle a greater number of error bits.

KingTiger worked with AMI to integrate the iMS software into Aptio V UEFI BIOS Firmware from AMI. As longtime users of AMI’s UEFI BIOS Firmware and with expertise in OEM/ODM platform testing, AAEON provided support through testing the iMS integrated Aptio V UEFI Firmware on a range of platforms featuring the 8th Generation Intel® Core™ U processors (formerly Whiskey Lake). Thanks to these efforts, KingTiger is officially launching iMS, and AAEON will soon be offering the Aptio V UEFI Firmware with embedded iMS on their 8th Generation Intel Core based products in early 2021, and plans to have the KingTiger iMS featured on the soon to be released lineup of platforms with 11th Generation Intel® Core™ U processors (formerly Tiger Lake).

Axiomtek’s Intel® Coffee Lake-Based Mini-ITX Motherboard Featuring Three Displays– MANO522

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to announce the MANO522, a mini-ITX motherboard powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 processor (code name: Coffee Lake) with the Intel® H310 chipset. With a small form factor of 17 x 17 cm, this industrial motherboard is an excellent choice for space-constrained environments. Its high computing power, 4K-ready and high expandability make it well-suited for intelligent transportation, factory automation, self-service kiosks, infotainment, and digital signage.

“Axiomtek’s MANO522 is a great embedded board for industrial edge computing applications which require high-resolution graphics and reduced energy consumption,” said Michelle Mi, the product manager of the Product Planning Division at Axiomtek. “This industrial motherboard is integrated with Intel® integrated Gfx graphics engine with UHD 4K resolution and provides rapid video acceleration and dual-view capability through the VGA, HDMI and LVDS. To ensure reliable operation, the MANO522 has a wide operating temperature range of 0°C to 60°C. It also supports watchdog timer and hardware monitoring and offers Trusted Platform Module 2.0 (TPM 2.0) for optimum security.”

The MANO522 supports two 260-pin DDR4-2666/2400 SO-DIMM sockets for up to 64GB of memory. It comes with rich I/O options, including two Gigabit LANs with Intel® Ethernet controller i211-AT and Intel® Ethernet Connection i219-LM, one HD Codec audio, four USB 3.2 Gen1, two USB 2.0, one RS-232/422/485 with +5/+12V power, five RS-232, one VGA, one HDMI, and one LVDS. The industrial-grade mini-ITX motherboard features two SATA-600 connectors and one M.2 Key M supporting NVMe for additional storage. In addition, it is equipped with one PCIe x16 and one M.2 Key E slot for wireless devices such as Wi-Fi, Bluetooth. The MANO522 is compatible with Windows® 7 and Windows® 10 operating systems.

Advanced Features:

  • LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor (code name: Coffee Lake)
  • Intel® H310 chipset
  • 2 DDR4 SO-DIMM for up to 64GB of memory
  • 4 USB 3.2 Gen1 and 2 USB 2.0
  • 6 COM ports (one RS-232/422/485 with +5V/+12V power)
  • 2 SATA-600 and 1 mSATA
  • PCIe x16 and M.2 Key E

Axiomtek’s new mini-ITX motherboard, the MANO522, is now available for purchase. For more product information or pricing, please visit our global website at www.axiomtek.com or contact one of our sales representatives at info@axiomtek.com.tw

SATA FerriSSD – Silicon Motion’s single-chip solid-state drive enables reliable and high-performance solutions

Silicon Motion’s FerriSSD is optimally designed for a wide range of embedded applications that require faster access speed, a small, flexible form-factor, and reliable serial ATA (SATA) or parallel ATA (PATA) storage. The FerriSSD combines industry-proven controller technology, NAND Flash, and passive components into a single small BGA package which simplifies design efforts and reduces time-to-market while protecting from NAND technology migration concerns.

The FerriSSD products consist of SATA and legacy PATA series that feature a high-throughput transfer rate with optional embedded DRAM to enhance data storage efficiency and high random read and write input/output operations per second (IOPS). The 4th generation FerriSSD leverages Silicon Motion’s highly advanced technologies, including IntelligentScan, DataRefresh, high-bandwidth, low-density parity check (LDPC) error correcting code (ECC) engine with group page RAID, and end-to-end data path protection to provide unsurpassed data integrity in a non-volatile storage device. The FerriSSD products support 3D single-level cell (SLC), multi-level cell (MLC), and three-level cell (TLC) modes NAND Flash options.

Features
  • Plug-and-play only requires format/fdisk prior to use
  • Full end-to-end data path protection with recovery algorithms
  • Remote firmware updates available via a secured digital signature
  • Eliminates the requalification cost from the NAND generation cost
  • Cost-saving with flexible TLC, MLC, and SLC modes, configurable capacities
  • Supports S.M.A.R.T. and advanced SSD telemetry logging features
  • Small footprint for space-limited designs
  • Rugged and reliable (no moving parts)
  • IntelligentScan and DataRefresh enhances data integrity
  • 4th generation LDPC ECC engine with group page RAID

MAX40108 1V, Low-Power, Precision Operational Amplifier

Maxim Integrated’s MAX40108 tiny, low-power, high-precision op-amp operates with a power supply voltage as low as 0.9 V

Maxim Integrated’s MAX40108 is a low-power, high-precision operational amplifier (op amp) that operates with a power supply voltage as low as 0.9 V up to 3.6 V. It is specified over the -40°C to +125°C extended operating temperature range. Available in a space-saving 1.22 mm x 0.92 mm 6-bump wafer-level package (WLP) with a 0.4 mm bump pitch, it is designed for use in portable, consumer, medical, and industrial applications.

MAX40108EVKIT Evaluation Board

Features

  • Supply voltage range: 0.9 V to 3.6 V
  • Low 25.5 μA quiescent current
  • Internal EMI rejection
  • 168 kHz GBW
  • Low input bias current
  • Power-saving shutdown mode
  • Available in tiny, 1.22 mm x 0.92 mm, 6-bump WLP and 8-pin TDFN

Applications

  • Wearable devices
  • Home medical (blood glucose, weight scales, blood pressure, EKGs)
  • Fitness and health (smartwatches, heart-rate monitors)
  • Industrial IoT (pressure, flow, level, temperature, and proximity)

more information: https://www.maximintegrated.com/en/products/analog/amplifiers/MAX40108.html

RA2E1 – 48MHz Arm® Cortex®-M23 Entry Line General Purpose Microcontroller

Renesas Electronics has announced the release of 48 new RA2E1 Group microcontrollers for cost-sensitive and space-constrained applications. Based on the 48-MHz Arm Cortex-M23 core, these new entry-line single-chip devices offer 16-KB SRAM memory, 128-KB code flash, and support a wide operating voltage range of 1.6V to 5.5V and a large selection of packages viz. LQFP, QFN, LGA, BGA, and Wafer Level Chip Scale Package (WLCSP).

The RA2E1 Group of microcontrollers with key features like optimized combinations of superior performance, ultra-low-power consumption, innovative peripherals, and small package options are ideal for cost-sensitive applications and space-constrained applications. Additionally, these MCUs serve as an entry point into our RA2 Series, offering a seamless upgrade to larger RA Family devices with hardware and software scalability. Besides, these devices include an AES cryptography accelerator, a true random number generator (TRNG), and memory protection units that provide the fundamental blocks to develop a secure IoT system.

Key Features of RA2E1 Microcontrollers

  • 48 MHz Arm Cortex-M23 CPU core
  • Integrated flash memory options from 32KB to 128KB; and 16KB RAM
  • Support for wide operating voltage range: 1.6V – 5.5V
  • Pin counts from 25- to 64-pin
  • Package options including LQFP, QFN, LGA, BGA, and WLCSP (2.14 x 2.27mm)
  • Low power operation: 100µA/MHz in active mode; 250 nA in software standby
  • Integrated next-generation innovative capacitive touch sensing unit with no external components required, lowering BOM costs
  • Enables system costs reduction with on-chip peripheral functions, including a high precision (1.0 percent) internal oscillator, background operation data flash supporting 1 million erase/program cycles, high-current IO ports, and a temperature sensor
  • Pin and peripheral compatibility with RA2L1 Group devices for quick and easy upgrade paths

The RA2E1 Group is supported by the easy-to-use Flexible Software Package (FSP), which includes a best-in-class HAL driver. The FSP uses a GUI to simplify and dramatically accelerate the development process and customers can transition from an original 8/16-bit MCU design easily. Using RA2E1 MCUs designers get access to the extensive Arm partner ecosystem, offering a wide range of tools that help speed time-to-market. The RA2E1 MCUs are available from Renesas’ worldwide distributors

1Khz to 20Mhz Low Power Oscillator

This is a precision, low power oscillator that occupies very little space.  The oscillator frequency is adjustable using an onboard multi-turn trimmer potentiometer. The output of the circuit is very accurate and has a 1.5% frequency error. The project operates with a single 5V power supply and provides a rail-to-rail, 50% duty cycle square wave output. The CMOS output driver of the chip ensures fast rise/fall times and rail-to-rail switching. A multi-turn trimmer provided to adjust the master oscillator frequency between 1Khz to 20Mhz. Jumper provided for the three-state DIV input which determines the master clock is divided by 1, 10,100 before the output, providing three frequency ranges spanning 1Khz to 20Mhz. The output of the project can drive 5 KΩ and/or 10pF loads. The output of the project is limited to 50mA.

1Khz to 20Mhz Low Power Oscillator – [Link]

Latest Higher Resolution EVE ICs from Bridgetek Now Designed into High-End Riverdi Displays

Bridgetek has gained a high-profile endorsement for its latest generation of embedded video engine (EVE) graphic controllers. Relying on the recently announced BT817 EVE4 devices, leading optoelectronics manufacturer Riverdi has introduced a new family of displays. These industrial-grade units are targeted at challenging higher-end applications but are positioned at attractive price points that are in line with commercial level products.

Thanks to the heightened degrees of precision associated with the BT817 ICs, the new Riverdi displays are able to benefit from 1280×800 pixel resolution. Treating the rendered content as a series of objects reduces the data overheads involved dramatically. This translates into a more streamlined solution, with a substantially lower component count plus accelerated responsiveness.

“By engaging with Bridgetek, we have been able to develop a display family that sets new benchmarks. The ultra-integrated EVE4 solution means that quicker reaction times and superior resolution levels are possible, while still saving valuable board space and keeping power budgets down,” states Kamil Kozłowski, CTO at Riverdi. “Consequently, we have decided to take a platform approach and apply it across the whole family, from the smaller units all the way up to the largest formats,”

“It is clear that the user experiences which people are familiar with from interacting with consumer goods have set elevated expectations for HMIs in other areas too,” adds Bridgetek’s founder and CEO Fred Dart. “Higher resolution displays with faster responsiveness are now mandated in a wide array of different sectors. This is why the value of our BT817 and BT818 is becoming so apparent to OEMs, giving them the opportunity to meet their customers’ requirements without needing complex expensive subsystems that take up board real estate or draw excessive power.”

The EVE-based Riverdi displays are available in a wide range of different size formats, spanning from 3.5-inch all the way through 4.3-inch, 5.0-inch, and 7.0-inch to 10.1-inch. Use of in-plane switching (IPS) technology results in a brighter output (delivering up to 1000cd/m2). It also means that these units have enhanced color rendering and much wider viewing angle capabilities. Optical bonding is incorporated into the display assemblies as standard, even for single pieces – thereby preventing condensation, mitigating internal reflections, and boosting optical performance, as well as delivering far greater durability. The projected capacitive touchscreens featured in these displays allow touch interaction through the protective glass that is as much as 15mm thick and also enables gloved operation to be supported.

Assisted by innovative Bridgetek engineering, the new Riverdi displays are optimized for addressing the most demanding tasks. They will be implemented into medical diagnostic instrumentation, home healthcare monitoring equipment, electric vehicle charging infrastructure, industrial automation systems, vending machines, etc. Exceptionally strong electro-magnetic interference (EMI) and electro-static discharge (ESD) immunity characteristics are exhibited, along with a working temperature range covering -20°C to +70°C.

For more information go to www.brtchip.com

PicoCore MX8MP Module features i.MX8M Plus CPU and ships with a Starterkit

F&S Electronics recently made some announcements regarding three of its Linux-driven modules built around NXP’s i.MX8 processors: the i.MX8M Mini based PicoCore MX8MM module, the i.MX8X-based efus MX8X module, and the NXP’s i.MX8M Plus-based PicoCore MX8MP module, which we will focus on here.

PicoCore™MX8MP Module

The new PicoCore MX8MP module is a very small and reliable module (40 mm x 35 mm) with good multimedia functions. It is suitable for compact devices for machine learning, industrial IoT, and medical applications.

PicoCore MX8MP runs Linux on NXP’s NPU-equipped i.MX8M Plus CPU and is equipped with up to 8GB LPDDR4 and 32GB eMMC EEPROM. The i.MX8M Plus CPU combines low power high-performance computing with enhanced system security for edge node computing, advanced multimedia and machine learning applications. It is a multi-core application processor that features a dual or quad ARM® Cortex®-A53 core running @ up to 1.8GHz, a Cortex®-M7 core @ 800MHz, and a 2.3-TOPs NPU. It also supports 1920 x 1080 @ 60fps encoding and decoding, 2D/3D GPUs, 800MHz HiFi4 DSP and 2x ISPs for stereo vision.

Other features of the 10-gram PicoCore MX8MP module include 802.11ac/a/b/g/n WLAN, BT 5.0 LE, dual GbE ports, 2x external SD card slot, 2x USB 2.0/3.0, 1x USB OTG 2.0/ 3.0, PCIe, SSI, QSPI, 2x CAN, 4x UART, 4x I2C, 2x SPI, 4x PWM, audio line in/ out/ Mic/ Headphone/ I2S, 2x GbE (opt. RGMII), LVDS/MIPI-DSI/HDMI display interfaces, 2x MIPI-CSI camera interfaces, SPDIF, ESAI, SAI, SSI, and an RTC powered through the CPU or external IC. Supply voltage is 3.5V – 5.5V DC while power consumption is 3W. The module supports operating temperature range of 0°C – +70°C with optional -20°C – +85°C and optional -40°C – +85°C.

You can order for the PicoCore MX8MP module directly from F&S Elektronik Systeme or from other dealers. The module ships with full Linux BSP with Builtdroot/Yocto installed and FreeRTOS for the Cortex-M78.

PicoCore™MX8MP Starter Kit

The company is also offering a ready-to-run PicoCore™MX8MP Starter Kit for an easy start of development. This kit includes an LVDS-equipped V4I-LIN version of the PicoCore MX8MP, a 7-inch analog-resistive PCAP touch panel, and a compact baseboard with dual GbE ports, dual USB host ports, micro-USB OTG port, microSD slot, and audio I/O jack.

The Starterkit is currently available for pre-order at $436 with delivery scheduled for later this quarter.

Further details on both the module and the starter kit can be found in the following links:

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