Laird Sentrius™ MG100 micro-gateway with LTE-M/NB-IoT and Bluetooth 5

Laird has introduced Sentrius™ MG100 micro-gateway with LTE-M/NB-IoT and Bluetooth 5

Based on Laird Connectivity’s Pinnacle 100 modem, the Sentrius MG100 Gateway captures data from Bluetooth 5 sensors and sends it to the cloud via a global low power cellular (LTE-M/NB-IoT) connection. Supports LTE bands 1, 2, 3, 4, 8, 12, 13, 20, and 28.Based on the Sierra Wireless HL7800 module, the MG100 includes Bluetooth 5 features like CODED PHY, 2M PHY, and LE Advertising extensions.

Key features

  • Wireless connectivity
  • Flexible power options
  • Certified for global deployment
  • Antenna choices

Additional features

  • LTE-M / NB-IoT radio via Sierra Wireless HL7800 module (Chipset: Altair ALT1250)
  • LTE bands 1, 2, 3, 4, 8, 12, 13, 20, 28
  • Nordic nRF52840 – BT v5, Coded PHY (Long range), 1MPHY & 2MPHY support
  • Onboard Cortex-M4F Microcontroller:
    • 32-bit @ 64 MHz, 256 KB of RAM, 1 MB internal flash, 8 MB QSPI
  • Certifications:
    • FCC, IC, CE, BT SIG plus PTCRB, GCF, and End Device certified
    • AT&T, Verizon, Vodafone (all pending)
  • Flexible Programming:
    • Hostless mode via Zephyr RTOS
  • Secure Firmware Upgrade:
    • Comes pre-programmed with Laird Connectivity’s secure bootloader
  • Antenna Options:
    • Unique integrated antenna variant plus external variant with SMA connectors
  • Compact form-factor:
    • 110.28 x 99.16 x 35.32 mm
  • Custom branding, packaging, application development, all available

more information: https://www.avnet.com/shop/emea/products/laird-connectivity/450-00011-k1-3074457345643563816/

Highly Expandable MB997 ATX Motherboard for 9th Gen Intel Core Processors

IBASE Technology Inc., a leading manufacturer of industrial motherboard and embedded systems, has rolled out the MB997 ATX motherboard for 9th Gen Intel® Core™ i7/i5/i3 and Xeon® processors. The Intel® C246/Q370/H310-based motherboard is designed for diverse applications, such as industrial automation, AI integrated systems, and smart retail systems.

The latest MB997 delivers high-performance computing for demanding industrial applications while providing multiple connectivity, expansion and functionality to meet customer requirements. The board supports up to 7 expansion slots including 1x PCI-E(x16), 1x PCI-E(x8)/Gen3.0, 1x PCI-E(x4), 2x PCI-E(x1), and 2x PCI, as well as 6x USB3.1, 2x USB 2.0, 2x SATA 3.0, and 6x COM ports. It can handle up to 128GB DDR4 memory across four slots and support three independent outputs (HDMI 2.0a, DVI-D, and DisplayPort) with 4K resolution each.

The board is loaded with advanced features such as TPM (2.0) hardware-based security to ensure platform integrity, iSMART 4.0 technology that enables power saving, power on/off and power resumption, and also NVMe and CNVi interfaces that bring various performance improvements. Like all IBASE industrial motherboards, MB997 comes with strict revision control, modification control and long-term support. Operating systems supported are Win10 IoT Enterprise and Linux Ubuntu.

MB997 FEATURES:

  • 9th Gen Intel® Xeon® E / Core™ i7/i5/i3 processors
  • 4x DDR4 DIMM, Max.128GB
  • Intel® processor integrated graphics supports HDMI(2.0a), DVI-D, and DisplayPort
  • Dual Intel® Gigabit LAN
  • 6x USB3.1, 2x USB 2.0, 2x SATA 3.0, 6x COM
  • 1x PCI-E(x16), 1x PCI-E(x8)(Gen3.0), 1x PCI-E(x4), 2x PCI-E(x1), 2x PCI
  • Watchdog timer, Digital I/O, iAMT (11.6), TPM(2.0), iSMART (4.0)

For more information, please visit www.ibase.com.tw.

Topway TFT LCD Display can shorten product’s time-to-market

Shenzhen Topway Technology Co.Ltd. has launched their TOPWAY Smart TFT LCD module, which embeds LCD driver, controller and MCU, in a color LCD module with digital brain. A thin-film-transistor liquid-crystal display (TFT LCD) is a variant of a liquid-crystal display (LCD) that uses thin-film-transistor (TFT) technology to improve image quality such as brightness and contrast.

A TFT LCD is an active matrix LCD, in contrast to passive matrix LCDs or simple, direct-driven LCDs with a few segments. Smart TFT LCD sets engineer free from tedious display programming, so that product engineer can focus on product development. Smart TFT LCD module can help users greatly reduce product’s time-to-market. And the product is more reliable with high EMI tolerance.

Taking over the duty of displaying content and respond to touch event, Topway launched Smart LCD module couple years ago. Smart LCD is a TFT LCD display module embedded with MCU, display engine and touch controller. Simple serial commands are all that is needed to interact with the screen, no more pixel programming.

Smart LCD module is between traditional TFT LCD module and HMI device. HMI device works as a standalone unit with higher cost. Topway Smart TFT LCD provides a cost effective way to quickly implement human – machine interface:

  • Graphical UI Editor, enables quick user interface construction, speeds up product’s time-to-market
  • Preloaded UI design in smart LCD, provides speedy showing and updating
  • Embedded display engine, reduces main board workload and over-all cost
  • Built-in Lue Script language engine, empowers rich and friendly user interface
  • RJ45 port, supports long-distant update and easy expansion
  • Unified body, improves EMC performance and increases reliability

Smart LCD module works with five basic items:

  • Page – container for one UI screen, it holds page elements
  • Element – functional display unit on a page. Such as Action, Character, Image etc.
    -9 action type elements
    -6 character type elements
    -6 image type elements
    -8 graphic type elements
  • Call Function – function that can be triggered by Page start, Touch Key or Virtual Touch Key press action
    -14 keyboard functions
    -20 operations
  • VP Variable – a RAM area for holding temporary value. It supports host access, on-screen keyboard input and value operations
  • Image Resource – images linked by elements or pages for displaying, including background images, icon and animated images

Topway’s UI Editor for smart LCD module provides a zero-coding way to construct human machine interface. User can drag & drop above basic items onto page and set up their properties according to need. You can find a short video demonstrating on how to build user interface in minutes with Smart LCD Module:

You can find more information about Smart LCD module by visiting the product page.

The world’s smallest Bluetooth SoC released

InPlay Technologies, headquartered in Shanghai, China, today launched the world’s smallest software-free programming Bluetooth beacon SoC, IN100, based on its NanoBeaconTM technology.

The product is a software-free programming SoC, which will greatly reduce the technical threshold. Any developer can easily build their own wireless applications without worrying about learning complex Bluetooth protocol stacks and embedded programming languages.

The package size of this SoC is as small as 2.0mm x 2.5mm, making it an ideal solution for the next generation of wireless beacon or wireless sensor applications.

IN100 integrates low-power Bluetooth 4.2 technology, supports LE broadcast and private protocol broadcast modes, and the format is compatible with mainstream iBeacon, Eddystone and WeChat Beacon. Developers only need to configure the pre-defined ID and broadcast parameters in the one-time programmable (OTP) memory of IN100. As long as the device is turned on, it will operate as a Bluetooth beacon and broadcast with the preset ID information .

IN100 also supports various types of sensor interfaces, including analog signals and single-bus digital pulse counting interfaces. Developers can easily connect IN100 to analog or digital sensors and configure sensor thresholds. Once the threshold is reached, they can wirelessly issue alarms or broadcast raw sensor data through its Bluetooth beacon working mode.

IN100 SoC is available in DFN8 (2.0mmx2.5mm) and QFN20 (3.0mmx3.0mm) packages. Samples will be available in the fourth quarter of 2020, and mass production is expected in the first quarter of 2021.

Power Integrations’ New MinE-CAP IC Reduces Volume of AC-DC Converters by Up to 40%

Power Integrations , the leader in high-voltage integrated circuits for energy-efficient power conversion, announced the MinE-CAP™ IC for high power density, universal input AC-DC converters. By halving the size of the high-voltage bulk electrolytic capacitors required in offline power supplies, this new type of IC enables a reduction in adapter size of up to 40%. The MinE-CAP device also dramatically reduces in-rush current making NTC thermistors unnecessary, increasing system efficiency and reducing heat dissipation.

Comments Power Integrations’ product marketing director, Chris Lee:

“The MinE-CAP will be a game-changer for compact chargers and adapters. Electrolytic capacitors are physically large, occupy a significant fraction of the internal volume and often constrain form factor options – particularly minimum thickness – of adapter designs. The MinE-CAP IC allows the designer to use predominantly low voltage rateding capacitors for a large portion of the energy storage, which shrinks the volume of those components linearly with voltage. USB PD has driven a major market push towards small 65 W chargers and many companies have concentrated on increasing switching frequency to reduce the size of the flyback transformer. MinE-CAP provides more volume saving than doubling the switching frequency, while actually increasing system efficiency.”

The MinE-CAP leverages the small size and low RDSon of PowiGaN™ gallium nitride transistors to actively and automatically connect and disconnect segments of the bulk capacitor network depending on AC line voltage conditions. Designers using MinE-CAP select the smallest high-line rated bulk capacitor required for high AC line voltages, and allocate most of the energy storage to lower voltage capacitors that are protected by the MinE-CAP until needed at low AC line. This approach dramatically shrinks the size of input bulk capacitors without compromising output ripple, operating efficiency, or requiring redesign of the transformer.

Conventional power conversion solutions reduce power supply size by increasing switching frequency to allow the use of a smaller transformer. The innovative MinE-CAP IC achieves just as significant overall power supply size reduction while using fewer components and avoiding the challenges of higher EMI and the increased transformer/clamp dissipation challenges associated with high-frequency designs. Applications include smart mobile chargers, appliances, power tools, lighting and automotive.

Said Bhaskar Thiagaragan, Director of Power Integrations India Ltd.:

“MinE-CAP ICs are excellent for all locations with wide ranging input voltages. In India we often design for voltages from 90 VAC to 350 VAC, with a generous surge de-rating above that. Engineers here often complain about the forest of expensive high-voltage capacitors required. MinE-CAP dramatically reduces the number of high-voltage storage components, and shields lower voltage capacitors from the wild mains voltage swings, substantially enhancing robustness while reducing system maintenance and product returns.

Housed in the miniature MinSOP-16A package, the new devices work seamlessly with Power Integrations’ InnoSwitch™ family of power supply ICs with minimal external components. MinE-CAP MIN1072M ICs are available immediately from PI offices and franchised distributors and are priced at $1.75 for 10 Ku. Two initial design example reports (DERs) pair the MinE-CAP IC with Power Integrations’ InnoSwitch3-Pro PowiGaN IC, INN3370C-H302. A 65 W USB PD 3.0 power supply with 3.3 V – 21 V PPS output for mobile phone / laptop chargers is described in DER-626, and DER-822 describes a 60 W USB PD 3.0 power supply for USB PD/PPS power adapters using INN3379C-H302.

Learn more about the family and download the reference designs at the Power Integrations website: https://www.power.com/products/MinE-CAP.

Silicon Labs’ explorer kit focuses on rapid prototyping and concept creation of IoT applications

Silicon Labs’ BGM220 Explorer Kit is focused on rapid prototyping and concept creation of IoT applications. It is designed around the BGM220P module, based on the EFR32BG22 system-on-chip, which is an ideal device family for developing energy-friendly connected IoT applications.

The kit features a USB interface, an on-board SEGGER J-Link debugger, one user-LED and button, and support for hardware add-on boards via a mikroBus™ socket and a Qwiic® connector. The hardware add-on support allows developers to create and prototype applications using a virtually endless combination of off-the-shelf boards from mikroElektronika, Sparkfun, AdaFruit, and Seeed Studios.

Features
  • User-LED and push button
  • 20-pin 2.54 mm breakout pads
  • mikroBUS socket
  • Qwiic connector
  • SEGGER J-link on-board debugger
  • Virtual COM port
  • Packet trace interface (PTI)
  • USB-powered

more information: https://www.silabs.com/wireless/bluetooth/efr32bg22-series-2-modules

Blokdots – Build Interactive Arduino Prototypes Without Writing a Single Line of Code

As a maker, often we are faced with people who are afraid to dive into this world, mainly because they are scared to start their own projects and think the task of learning to code is a total abomination (it is not) or just want to do very simple stuff and do not feel like their small idea is worth the effort of learning. Either way, there is a new way to go about very simple projects, the Blokdots platform. 

Now, to the obvious question: what is Blokdots? Simply put in their terms, it is “a simple to use software to build interactive hardware prototypes without writing a line of code”. Now, you may have seen the general principle before, where through a GUI you can configure your MCU with its initialization code (like on STM32CubeMX), the principle is not exactly the same here: in Blokdots, you get an even more simplistic (because you do not want to scare people off right away with PWM, GPIO and other technical terms), general language way of explaining what your prototype should do.

To easily interact with the app, you get a shield that plugs on top of your Arduino, that is meant to ease out the most technical details. When you open Blokdots, you get two windows: a “live view” window and the project on the right. On the live view, you configure the slots you plug components into (such as LCD’s buttons, LED’s, among others). If you are overwhelmed by the number of slots, they provide you with a wizard that will interactively show you where you connect the components. After configuring the connected components on the left, you can go the project window to add logic to them. From there, you select a card that tells you what the component should do. Once clicking on a card, you are presented with regular language and not the programming you are used to, making it easier for non-programmers to dive into this sort of projects. When you are done, you can add another card (as many as you like) or save and run it on the Arduino board. Quite easy as that!

Lastly, let us talk about what you need to get started. The Blokdots app, which is only available for Mac, which is the most saddening part, since a lot of people that may be interested in this sort of product use Windows. Then, you need the components, which follow the widely available Grove system. There are a lot of them to choose from, like LCD’s, motors and some sensors, so you are not limited there. Overall, aside from the development OS limitation, we think this can be very useful for people who are not very confortable with programming and just want to do something simple from time to time, because if you want to do more (and you can do some cool things there), you should program, it’s fun.

Blokdots Link: https://blokdots.com

There’s a new member in the Novasom’s SBCs M-Line family

The SBCs M-line was created for those advanced multimedia applications, where the computing power and the presence of specific HW accelerators, are needed as much as the advanced connectivity to various kinds of displays while maintaining the classic low-level industrial connectivity.

A new generation high performance industrial SBC

The latest product of the M-Line is Novasom M9 which joins the well-established M7 and M7Plus. This SBC is based on the prestige Rockchip 3399. This CPU offers the new Cortex A72’s performance and the multicore Quad A53 used to speed-up parallelism and lower consumption when needed, with one of the strongest GPU available on the market: the Mali-T860MP4. This board has been minded to offer the latest and strongest video input-output capability, while minding to our RASPMOOD approach with USB extender and low level GPIO to assure the compatibility with the famous community board’s started application. As any Industrial Novasom’s SBC, the unit is equipped with our famous protected power supply, minded as industrial in terms of emission, susceptibility, mission profile and assisted by our technical support that will assure the success of your application. This is an Android-graphics oriented minded SBC, offering a superior fluidity experience for any tablet like or digital signage application.

more information: www.novasomindustries.com

Axiomtek’s CAPA520 – High Performance, Expandable 3.5” Embedded Board Featuring 9th/8th Generation Intel® Core™ Processor

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to introduce the CAPA520, its new 3.5” embedded board featuring the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 and Intel® Celeron® processors (code name: Coffee Lake) with the Intel® H310 chipset (Q370 optional). The industrial-grade CAPA520 with a size of 146 mm x 104 mm features triple-display capability through HDMI, LVDS and DisplayPort interfaces, enabling multi-display applications in a limited space. This powerful embedded SBC is optimized for various industrial IoT-related applications in the embedded market, such as industrial control, machine vision, self-service terminal, digital signage, and medical imaging.

“With rich I/O connectivity and great expansions, the highly integrated CAPA520 was designed to shorten the time to market and reduce development costs. It delivers powerful 3D and 4K graphics through the integrated Intel® UHD Graphics 630. Moreover, it can operate in a wide temperature range from -20°C to 60°C,”

said Leo Chen, a product manager of the Product Planning Division at Axiomtek.

“To ensure reliable and stable operation, this 3.5-inch embedded SBC supports the Intel® AMT 12 for easy remote management and monitoring and has hardware monitoring function to monitor CPU/system temperature, voltage and fan speed.”

The CAPA520 supports one 260-pin DDR4-2666 SO-DIMM for up to 16GB of system memory. To meet customer varied needs, the Intel® Core-based embedded board is equipped with one PCI Express Mini Card slot with mSATA support and an exclusive Axiomtek ZIO connector with USB, PCIe, LPC and SMBus expansion buses. It has one RS-232/422/485 port, three Gigabit Ethernet ports with Intel® i211AT and intel® i219LM controllers, three USB 3.0 ports, three USB 2.0 ports, one HDMI port, one LVDS port, one DisplayPort port, HD audio and 8-channel DIO port. The outstanding CAPA520 has a +12V DC power supply input with AT auto power on. It supports Windows® 10 and Linux.

Advanced Features:

  • LGA1151 socket 9th/8th gen Intel® CoreTM i7/i5/i3 processor (code name: Coffee Lake)
  • Intel® H310 chipset (Q370 optional)
  • 1 DDR4 SO-DIMM for up to 16GB of memory
  • 3 GbE LAN
  • 1 PCI Express Mini Card slot
  • Intel® AMT 12 supported (optional)

The CAPA520 is now available for purchase. For more product information or customization services, please visit our global website at www.axiomtek.com or contact one of our sales representatives at info@axiomtek.com.tw.

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