Economical atomic battery offers increased power, reduced size

Scientists at the National University of Science and Technology MISiS (Moscow, Russia) say they have developed a compact atomic battery that can last up to 20 years. by Rich Pell @ smart2zero.com

Based on an original patented microchannel 3D structure of a nickel beta-voltaic element, the device, say the scientists, has dimensions that have been decreased by three times, a specific power that has been increased by 10 times, and a cost that has decreased by 50%. In this case, the radioactive element is applied on both sides of the so-called planar p-n junction, which simplifies the cell manufacturing technology, as well as the control of the reverse current that “steals” the battery power.

The special microchannel structure, say the scientists, provides an increase in the effective conversion area of the beta radiation by 14 times, which results in an overall increase of current.

“The output electrical parameters of the proposed design were: short-circuit current IKZ — 230 nA /cm 2 (in the usual planar construction — 24 nA), the final power — 31nW/cm 2, (in the planar one — 3nW),” says Sergey Legotin, Associate Professor of the Department of Semiconductor Electronics and Physics semiconductors at NUST MISIS. “The design allows to increase the efficiency of converting the energy released during the decay of a ß-source into electricity by an order of magnitude, which in the future will reduce the cost of the source by about 50% due to the rational use of an expensive radioisotope.”

At the same time, say the scientists, the development will make it possible to increase the specific power by an order of magnitude, due to which the weight and dimensions of the batteries based on them will decrease three times while maintaining the required output power level. The battery can be used in several functional modes:

  • as an emergency power supply and temperature sensor in devices used at extreme temperatures and in hard-to-reach (or completely inaccessible) places
    • in space
    • under water
    • in high-altitude areas

A battery based on beta-voltaic cells, say the scientists, has great potential since the demand for reliable batteries with a long service life is growing in all industries. Taking into account the latest development’s unique characteristics — small size and safety — the scientists believe it will be able to occupy a significant share of the power supply market.

The developers are completing the procedure for the international patenting of the invention.

Smart Lighting Module from Silvertel combines PoE with LED Driver

Silvertel created a smart lighting module that is aimed at developers of LED Lighting equipment such as Luminaires, Lighting Fixtures, Architectural Lighting, Smart Office, Store Lighting, and Agricultural Lighting. The Ag210 provides a configurable constant current output for LED string voltages up to 40V, together with an auxiliary 12W output which can be configured to provide an external 5V to 12V rail.

This Dual-in-Line (DIL) module is configured as a fixed Type 3, Class 6 PoE Powered Device (PD), complying with the latest IEEE standard 802.3bt.  It provides all of the signature and identification circuitry needed to support PoE.

There are two on-board high-efficiency DC-DC converters delivering regulated outputs with built-in short circuit and over voltage protection. One provides the configurable constant current output with a range of 300mA to 1000mA powering an LED string up to 40V.  The other provides a 12W output which can be configured to provide a 5V to 12V rail, useful in powering peripheral circuitry such as microcontrollers, Bluetooth, or WiFi interfaces.

Ag210 also incorporates an I2C user interface to allow access to features commonly used in smart lighting applications such as dimming control, brightness on start-up, and 15 user-defined dimming levels for scene setting, etc.  There is a second address for “broadcast” commands to multiple drivers and to facilitate read-back of PoE classification.

In addition to PWM dimming via the I2C interface, Ag210 also offers analog dimming (0 – 10V) using a potentiometer or a standard shunt dimmer.

According to the company, the Ag210’s ease of integration and its simplicity to program makes this module an ideal choice for designers and system integrators looking to get the most out of their LED lighting solution.

Designed and manufactured in the UK, and fully RoHS and WEEE compliant, the Ag210 further extends Silvertel’s range of Power over Ethernet products for both the Powered Device (PD) and Power Sourcing Equipment (PSE).

Product is available now from all Silvertel distributors and an Evaluation board, EvalAg210, can also be bought to help design engineers make a thorough assessment of the device.

For more information, visit: https://silvertel.com/

Feature-Rich Tabor LSxxx1B 3/6/12GHz Advanced Touch-Control Benchtop RF Generators

These all-new benchtop Lucid Series of versatile RF sources can generate signals for a wide range of applications such as 5G, radar, communications and more.

Saelig Company Inc. has introduced the Tabor Lucid LSxxx1B Series Analog RF Signal Generators – benchtop, single-channel signal sources with 3, 6, and 12 GHz models available. Featuring high power, fast switching speed, superior signal integrity and purity, removable memory card for maximum security, all the necessary modulated signals for analog communication systems, the Lucid Series is designed to meet today’s most demanding requirements.  This benchtop platform offers a 5” touch screen with user friendly GUI to quickly and easily generate required signals, while displaying all the needed critical information. For remote control, the series is equipped with Ethernet and USB interfaces, enabling remote programming from PC.

With an exceptionally low typical SSB phase noise of -145dBc at 100MHz, and -132dBc at 1GHz, at 10 kHz carrier offset, this Lucid series delivers one of the best quality signals available. Signal bursts and chirps are common in aerospace or defense applications. With Tabor’s Lucid Series, almost any signal modulation is possible, even if “narrow” or “standard” signals are required. The Lucid Series is also equipped with many CW interferers and modulated signals such as AM, FM, PM, Pulse, Pattern, and Sweep.

While the Lucid Series provides dedicated PC software GUI to control the instrument functions, modes and features, it also includes a complete set of drivers for applications in various environments, including LabVIEW, Python, CVI, C++, VB and MATLAB.  Low-level SCPI commands can also be used to program the instrument via Windows, Linux, or Macintosh operating systems.

  • 3,6 and 12GHz RF Analog Signal Generators
  • Extremely fast switching speed of <100us
  • Remotely programmable via MATLAB, Python, LabView, and other software programming environments
  • Easy to use benchtop platform with 5” touch screen and user friendly GUI
  • Small form factor and space efficient benchtop platform
  • AM, FM, PM, Sweep & Pulse Modulation
  • Removable SD card for instrument security
  • USB and LAN interfaces

The Lucid series can generate signals for a wide range of needs such as 5G, radar, communications applications, etc., all applications that demand outstanding dynamic range, fast switching, and pure RF signals, with easy remote programming for seamless system integration.  Designed and made in Israel by Tabor Electronics, a world-leading provider of high-end signal sources, Tabor Lucid LSxxx1B 3/6/12GHz Single Channel RF Signal Generators are available now from Saelig Company Inc. Fairport, NY.

Advanced RGB Lighting Controller Unit from Bridgetek Proves Quick & Easy to Deploy

Bridgetek continues to build up the portfolio of hardware available to support its pioneering PanL home/building automation platform. Designed to be straightforward for installation engineers to implement and subsequently upgrade, the company’s new PanL Mood Lighting (ML) units present a convenient and cost-effective RGB-enabled lighting control solution. Compliant with both DALI and DMX digital interface protocols, they offer users complete control of both the dimming level and colour hue in relation to every light in an assigned living/working space or a place of business (restaurant, bar, hotel, etc.).

By supporting DALI/DMX protocols, PanL ML smart lighting controllers provide customers with a fully scalable solution that has the scope to control a much larger number of light fixtures than would be possible using alternative protocols. The units can address up to 512 RGB DMX output channels and up to 64 DALI drivers – ensuring smooth dimming and better manipulation of different colour effects. They are based on Bridgetek’s FT903Q 32-bit RISC microcontroller units (MCUs), which are capable of 100MHz operation.

The FCC and CE certified PanL ML units are supplied in compact (145.7mm x 96.7mm x 29.0mm) enclosures. Simply connecting these units to the PanL Hub via a RS485 serial interface (through which they will receive both power and data), they can be applied with equal ease to either brand new lighting installations or existing ones. In scenarios where a larger number of light fittings are involved, there is provision to daisy chain multiple PanL ML controllers together.

For more information go to www.brtchip.com

mosaic-X5™ GNSS Receiver Module can track all GNSS constellations

Septentrio’s GNSS receiver module can track all GNSS constellations supporting current and future signals

Septentrio’s mosaic-X5 multi-constellation GNSS receiver is a low-power surface-mount module with a wide array of interfaces and is designed for mass-market applications such as robotics and autonomous systems. It can track all global navigation satellite system (GNSS) constellations supporting current and future signals.

The mosaic-X5 features Septentrio’s AIM+ technology, an advanced onboard interference mitigation technology that allows it to suppress a wide variety of interferers, from simple continuous narrowband signals to complex wideband and pulsed jammers. The radiofrequency (RF) spectrum can be viewed in real-time in both time and frequency domains.

mosaic-X5 comes with fully-documented interfaces, commands, and data messages. The included RxTools software allows receiver configuration and monitoring, as well as data logging and analysis. The mosaic-X5 also includes an intuitive web user interface for easy operation and monitoring, allowing the user to control the receiver from any mobile device or computer. The web interface uses easy-to-read quality indicators to monitor the receiver operation during the job at hand.

Features

  • Small in size, big in performance
  • All-in-view satellite tracking: multi-constellation, multi-frequency: GPS, Galileo, GLONASS, BeiDou, QZSS, and NavIC
  • Best-in-class reliable and scalable position accuracy with signal health/integrity indicators
  • Compatible with PPP, SSR, RTK, and SBAS corrections
  • Suitable for integration in INS systems
  • High update rate: RTK at 100 Hz
  • Futureproof: supporting current and future satellite signals
  • Advanced unique interference monitoring and mitigation system AIM+ plus advanced GNSS+ algorithms
  • Advanced anti-jamming and anti-spoofing solutions with an update rate at 100 Hz
  • Industry-leading ultra-low power consumption
  • Easy-to-integrate and optimized for automated assembly

more information: www.septentrio.com

Azzy Electronics Launches Breakout boards for the new AVR DA-series

AVR DA Product Family are known for real time control functionality and easy capacitive touch to the low power performance of AVR Microcontrollers. It pairs the latest Core Independent Peripherals (CIPs) with a robust Intelligent Analog portfolio to create a device that not only excels as a stand-alone processor but also as a companion MCU in designs that demand precision. The high memory density of the AVR DA family makes these MCUs well suited for both wired and wireless communication stack intensive functions. Azzy electronics Spence Konde has unveiled the Arduino- compatible boards or microchip AVR DA series of microcontrollers with the addition of the open source DxCore. Designed for Microchip’s new AVR DA series of eight-bit microcontrollers, these breakouts offer full Arduino compatibility.

The arrival of the DA series has shaped what an AVR Microcontroller is capable of providing compared to its predecessor, these take the AVR instruction set to a whole new level. With up to 128k flash, 16k SRAM, 55 I/O pins, 6 UART ports, 2 SPI and I2C ports, and all the exciting features of the tinyAVR 1-series and megaAVR 0-series parts like the event system, type A/B/D timers but for almost every major system, and enhanced pin interrupts. About the timer, Spence Konde says

“You liked the type A timer, but felt constrained by having only one prescaler at a time? Well now you have two of them (on 48-pin parts and up)! You wished you could make a type B timer count events? You can do that now! (this addresses something I always thought was a glaring deficiency of the new peripherals and event system). We still don’t have more prescale options (other than having two TCA’s to choose from) for the TCB – but you can now combine two TCB’s into one, and use it to do 32-bit input capture. Time a pulse or other event up to approximately 180 seconds long… to an accuracy of 24th’s of a microsecond! You thought events and the CCLs were really cool, but if only you could fire an interrupt from them? Yup, you can do that too now.”

All clock speeds are generated by an internal oscillator, so you don’t need any crystal, but you can connect a watch crystal and enable ‘AutoTune’ for more accurate clock speeds; Same great AVR instruction set — just better peripherals, and more memory.

The AVR Microcontrollers are easily programmed with the Arduino IDE, using any ‘common’ 328p-based Arduino as a programmer (ex, Nano, Pro Mini, Uno) (just connect three wires – or three wires and two resistors for a more versatile programmer). The ADC functions, with instructions to enable 12-bit mode. It features PWM on 10, 16, or 17 pins, and ADC (analogRead()) on 12, 18, or 22 pins. Azzy electronics launched three variants of the boards which offer 32, 48, and 64 pins also a 28-pin DIP version is available if it is necessary you have 28-pin DA series part. Each board is available in 5V, 3.3V, and 2.5V variants, as well as the option to bypass the regulator, to enable it run from a single-cell LiPo battery.

The boards are now available on Azzy’s Electronics Tindie store in assembled and unassembled variants, with prices going for $2.50 bare-board or $15 fully assembled. You can visit the GitHub page for the DxCore library.

ATX Industrial Motherboard with Server-class Intel® Xeon® E processor and ECC Memory for Smart Factory – IMB525R

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to announce the IMB525R, its new server-grade ATX motherboard powered by the Intel® Xeon® E, 9th/8th generation Intel® Core™, Intel® Pentium® or Intel® Celeron® processors with the Intel® C246 chipset. The ATX motherboard offers optimum processor performance, unparalleled flexibility, rich I/O expandability and superior graphics performance; additionally, the server-grade platform supports Error-Correcting Code (ECC) memory which provides improved data integrity and system reliability through automatic data correction. It also features five SATA-600 ports with software RAID 0/1/5/10 for reliable data storage and protection. The IMB525R is specifically suited for industrial workstations, embedded networks, factory automation, robotic motion control, machine vision, and testing and measurement.

“Powered by Intel® C246 chipset, Axiomtek’s IMB525R supports the latest Intel® Xeon® E processor and 9th generation Intel® Core™ processor and has four 288-pin DDR4-2666/2400 ECC DIMM slots with a maximum memory capacity of 128GB. In addition, the IMB525R offers flexible expandability with one PCIe x16 slot, two PCIe x4 slots, four PCI slots and one PCI Express Mini Card slot to meet customer-specific needs,” said Brandon Wang, the product manager of IPC Division at Axiomtek. “The IMB525R supports Trusted Platform Module 2.0 (TPM 2.0) to enhance network security whether as a cloud server, data center, or for IIoT applications. This Intel® Coffee Lake Refresh-based ATX motherboard is designed to reduce overall development cost and speed up time-to-market.”

The IMB525R is integrated with the Intel® UHD Graphics 630 for superb visual performance, enabling triple simultaneous displays via DisplayPort++, HDMI, DVI-D, and VGA for multi-display applications. The IMB525R comes with two USB 3.1 Gen 2 ports, four USB 3.1 Gen 1 ports and seven 180D type A USB 2.0 ports for ultimate connection flexibility. It has four RS-232, two RS-232/422/485, two Gigabit LANs with Intel® Ethernet controller I211-AT and Intel® Ethernet connection I219-LM, eight-channel digital I/O, one HD Codec audio, one SMBus, and one PS/2 keyboard and mouse. Furthermore, it can operate under a wide temperature range from 0°C to +60°C for use in harsh environments. More features include watchdog timer and hardware monitoring functions.

Advanced Features:

  • LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3, Intel® Xeon® E, Intel® Pentium® or Intel® Celeron® processor (code name: Coffee Lake Refresh)
  • Intel® C246 chipset
  • Four 288-pin DDR4-2666/2400 ECC DIMM for up to 128GB of memory
  • Supports DisplayPort++, DVI-D, HDMI and VGA with three independent display outputs
  • Five SATA-600 with RAID 0/1/5/10 function
  • Supports one PCI Express Mini Card slot
  • Supports two USB 3.1 Gen2 and four USB 3.1 Gen1 ports
  • TPM 2.0 (optional)

Axiomtek’s new IMB525R is now available for purchase. For more product information or pricing, please visit our global website at www.axiomtek.com or contact one of our sales representatives at info@axiomtek.com.tw.

Monarch Go Pi Hat features LTE Cat-M1 modem

The Monarch Go Pi HAT enables engineers to connect Raspberry Pi HAT-capable SBCs to the Monarch Go LTE Cat-M1 modem. The Monarch Go Pi HAT supports both the Monarch Go and Monarch Go-GPS modems. In addition to Monarch Go support, the Pi HAT includes a shuttle click expansion connector that enables 3.3V I/O I2C, SPI, UART, and GPIO-based click modules from MikroElektronika. Having access to the large array of click module offerings permits prototyping of various LTE-based applications.

The Monarch Go Pi HAT can operate in two modes. The first mode works with a SBC over a Pi HAT 40-pin GPIO UART interface. In this mode, the SBC performs the communication over the UART interface with the Monarch Go modem. The second operating mode for the Monarch Go Pi HAT is standalone. In standalone operation, the Monarch Go Pi HAT’s power and UART communication to the modem occur through the micro USB interface. In standalone operation, it functions like the Monarch Go Starter Kit and can be evaluated on many other platforms over the USB-UART interface.

Features

  • Raspberry Pi HAT Compatible
  • Monarch Go LTE modem
    • Cat-M1
    • Pre-installed Verizon ThingsSpace IoT SIM
    • Production ready
  • MikroElektronika shuttle click site
    • 3.3V I/O
    • I2C
    • SPI
    • GPIO
    • UART
  • Voltage I/O translator
    • 1.8V to 3.3V
  • Micro USB
    • Debug and Programming UART

The Monarch Go LTE Cat-M1 modem delivers the shortest possible route to market and lowest development cost for cellular IoT connected devices. Unlike traditional cellular modules, this modem is certified for use on the Verizon network, which avoids costly lab testing while improving time to market. The Monarch Go has an integrated antenna and pre-installed Verizon ThingSpace IoT SIM card, giving developers an easy, cost-effective approach to developing LTE IoT solutions.

The Monarch Go Pi HAT kit is available in the Americas for USD $72.95. Learn more about this product. Raspberry Pi products and accessories, including the new Raspberry Pi 4 Model B computer with 8GB of onboard memory, are available from Newark, an Avnet Company.

ST Release STM32WB Wireless Microcontrollers with Zigbee® 3.0

STM32WB55 microcontrollers also support Thread and Bluetooth 5.0 with Flash Memory up to 1Mb

STMicroelectronics STM32WB55 Wireless Microcontrollers now incorporate Zigbee® 3.0, based on Zigbee PRO protocol stack support, enabling STM32 developers to leverage the interoperability and power-saving features of Zigbee networking for projects such as home automation, smart-lighting, smart-building, and broader IoT connectivity.

Zigbee 3.0 unifies the features of Zigbee specifications for both consumer and industrial applications, a move that has driven major consumer and Internet brands to choose Zigbee connectivity for smart-home products. A long-term supporter of Zigbee technology, ST is a member of the Zigbee Alliance board of directors, a council member of the Zigbee Alliance Member Group China (ZMGC), and supportive of the Zigbee Alliance Connected Home over IP (CHIP) project.

ST’s Zigbee 3.0 software for STM32WB55 includes the highly regarded Exegin Zigbee PRO protocol stack, provided free of charge, and delivered and fully supported by ST. This stack is used in Exegin products certified as Zigbee Golden Units and is approved as a reference stack for use by test laboratories. To further assist development, ST’s offer supports 46 Zigbee 3.0 clusters that help users quickly establish device capabilities. A further 21 clusters support legacy products.

Leslie Mulder, Exegin’s President said;

“This is a milestone for the Zigbee Alliance, with the advent of ST’s Zigbee 3.0 offering, Zigbee is reaching a new level of maturity, one that has the potential to cement its and ST’s leadership roles in the IoT market.”

STM32WB55 microcontrollers also support Thread and Bluetooth 5.0, with over-the-air update (OTA) capability. There are currently 10 STM32WB55 variants, offering a choice of package styles and Flash density from 256Kbyte to 1Mbyte. Further variants scheduled to be introduced in the next quarter will give developers extra flexibility to meet application performance and cost targets. The devices feature the Arm® Cortex®-M4 with Floating Point Unit, DSP instructions, and a memory protection unit (MPU) that enhances application security. Arm® Cortex®-M0+ coprocessor dedicated to managing the integrated IEEE 805.15.4 radio and the MCU’s cyber-protection features ensures real-time low-layer operations run smoothly without compromising application execution. The RF transceiver has a link budget of 106dB, to ensure reliable connections over distance.

ST’s patented ultra-low-power microcontroller technologies and high feature integration, which include the radio balun circuitry, ensure STM32WB55 devices help designers meet tight power and size constraints in a wide range of IoT and wearable devices. There are rich analog and system peripherals, as well as cyber-protection and ID features including secure firmware installation (SFI), customer key storage, hardware public key authority (PKA), and cryptographic accelerators. Capacitive touch and LCD controllers also simplify user-interface integration.

The Zigbee 3.0 software is now included in the STM32CubeWB MCU Package, which provides embedded software including low-layer (LL) APIs and hardware-abstraction layer (HAL) drivers for STM32WB microcontrollers, as well as Bluetooth® 5.0, Mesh V1.0, and Thread® libraries, FreeRTOS™ kernel, FatFS file system, and the STMTouch™ capacitive-sensing library. The STM32Cube ecosystem, through STM32CubeMonitor-RF for RF testing and STM32CubeMX for device configuration and code generation, ensures more comfortable and easy development.

Features of the STM32WB55RG dual core Arm Cortex-M4, Cortex-M0+ Microcontroller include

  • Core
    • Arm® 32-bit Cortex®-M4 CPU with FPU, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
    • Dedicated Arm® 32-bit Cortex® M0 + CPU for real-time Radio layer
  • Radio
    • 2.4 GHz
    • RF transceiver supporting Bluetooth® 5 specification, IEEE 802.15.4-2011 PHY and MAC, supporting Thread and Zigbee® 3.0
    • RX sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
    • Programmable output power up to +6 dBm with 1 dB steps
    • Integrated balun to reduce BOM
    • Support for 2 Mbps
    • Accurate RSSI to enable power control
    • Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
    • Support for external PA
    • Available integrated passive device (IPD) companion chip for optimized matching solution (MLPF-WB55-01E3 or MLPF-WB55-02E3)
  • Memories
    • Up to 1 MB Flash memory with sector protection (PCROP) against R/W operations, enabling authentic Bluetooth® Low Energy and 802.15.4 SW stack
    • Up to 256 KB SRAM, including 64 KB with hardware parity check
    • 20×32-bit backup register
    • Boot loader supporting USART, SPI, I²C and USB interfaces
    • OTA (over the air) Bluetooth® Low Energy and 802.15.4 update
    • Quad SPI memory interface with XIP
  • Performance benchmark
    • 1.25 DMIPS/MHz (Drystone 2.1)
    • 219.48 CoreMark® (3.43 CoreMark/MHz at 64 MHz)
  • Energy benchmark
    • 303 ULPMark™ CP score
  • Ultra-low-power platform
    • 1.71 to 3.6 V power supply
    • – 40 °C to 85 / 105 °C temperature ranges
    • 13 nA shutdown mode
    • 600 nA Standby mode + RTC + 32 KB RAM
    • 2.1 µA Stop mode + RTC + 256 KB RAM
    • Active-mode MCU: < 53 µA / MHz when RF and SMPS on
    • Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA
  • Supply and reset management
    • High efficiency embedded SMPSstep-down converter with intelligent bypass mode
    • Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
    • Ultra-low-power POR/PDR
    • Programmable voltage detector (PVD)
    • VBAT mode with RTC and backup registers
  • Clock sources
    • 32 MHz crystal oscillator with integrated trimming capacitors (Radio and CPU clock)
    • 32 kHz crystal oscillator for RTC (LSE)
    • Internal low-power 32 kHz (±5%) RC (LSI1)
    • Internal low-power 32 kHz (stability ±500 ppm) RC (LSI2)
    • Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25% accuracy)
    • High speed internal 16 MHz factory trimmed RC (±1%)
    • 2 x PLL for system clock, USB, SAI and ADC
  • General-purpose inputs/outputs
    • Up to 72 fast I/Os, 70 of them 5 V-tolerant
  • Rich analog peripherals (down to 1.62 V)
    • 12-bit ADC 4.26 Msps, up to 16-bit with hardware oversampling, 200 µA/Msps
    • 2 x ultra-low-power comparator
    • Accurate 2.5 V or 2.048 V reference voltage buffered output
  • System peripherals
    • Inter processor communication controller (IPCC) for communication with Bluetooth® Low Energy and 802.15.4
    • HW semaphores for resources sharing between CPUs
    • 2 x DMA controllers (7x channels each) supporting ADC, SPI, I²C, USART, QSPI, SAI, AES, timers
    • 1 x USART (ISO 7816, IrDA, SPI Master, Modbus and Smartcard mode)
    • 1 x LPUART (low power)
    • 2 x SPI 32 Mbit/s
    • 2 x I²C (SMBus/PMBus)
    • 1 x SAI (dual channel high quality audio)
    • 1 x USB 2.0 FS device, crystal-less, BCD and LPM
    • Touch sensing controller, up to 18 sensors
    • LCD 8×40 with step-up converter
    • 1 x 16-bit, four channels advanced timer
    • 2 x 16-bits, two channels timer
    • 1 x 32-bits, four channels timer
    • 2 x 16-bits ultra-low-power timer
    • 1 x independent Systick
    • 1 x independent watchdog
    • 1 x window watchdog
  • Security and ID
    • Secure firmware installation (SFI) for Bluetooth® Low Energy and 802.15.4 SW stack
    • 3 x hardware encryption AES maximum 256-bit for the application, the Bluetooth® Low Energy and IEEE802.15.4
    • Customer key storage / key manager services
    • HW public key authority (PKA)
    • Cryptographic algorithms: RSA, Diffie-Helman, ECC over GF(p)
    • True random number generator (RNG)
    • Sector protection against R/W operation (PCROP)
    • CRC calculation unit
    • Die information: 96-bit unique ID
    • IEEE 64-bit unique ID. Possibility to derive 802.15.4 64-bit and Bluetooth® Low Energy 48-bit EUI

More information on the STM32WB55 Wireless Series of Microcontrollers is available on the ST Web site at STM32WB55 Arm Cortex Microcontrollers main page.

Vapor Phase One, The New Industry’s most dynamic PCB soldering process

A new crowd supply campaign has been launched for the Vapor Phase One, which is the industry’s most dynamic PCB soldering method available now to hobbyists and development engineers alike. Compared to infrared and conventional soldering, the vapor phase process works perfectly at controlling high thermal mass assemblies. Big SMD capacitors, high-power inductors, also metal substrate PCBs are no match for the Vapor Phase One, that are capable of soldering fine pitch structures and heat reactive components without risk of damage, also its analogous temperature distribution reduces warp and bow of the PCB, that reduces internal stresses on the assembly. Vapor Phase One depends on two integrated lifts to enable results similar to those you would get using an industrial production. The Vapor Phase One helps you improve your way of soldering, and guarantees less risk of cold-solder joints, PCB tombstoning, and solder bridges.

Vapor-phase soldering is also called condensation soldering and it depends on physics which is like those that drives a heat pipe. An inert liquid is used which is slightly above its boiling point, and it leads to a vapor phase being formed just over the surface. (For Vapor Phase One, the liquid is specially made and it’s known as Galden ® the medium boils between 230°C and 240°C). This newly made vapor moves energy from the heat source to one or more “heat sinks”. Those heat sinks are the PCB, the components, and the solder paste you have to use for application between them. Vapor condenses on a cooler surface first, so that it can transport a large amount of energy to those areas, slowly heating up your assembly. The solder paste will then melt as your PCB gets to its appropriate temperature, which depends on the solder paste which is mostly 180°C. Also, the maximum temperature it can reach is limited by the boiling point of the Galden. As soon as you remove your assembly from Vapor Phase One, the solder will solidify.

Features Of Vapor Phase:

  • Fast temperature profile:  The way the VP One is designed, enables the handler to run fast temperature profiles by using a height-adjustable PCB carrier. The assembly is placed on an open wire mesh, some distance above the heat-transfer medium, as determined by a fast temperature control loop.
  • Individual Soldering Profiles: VP One can import soldering profiles via a USB interface where they are stored as CSV formatted data. It makes use of these profiles to adjust heating-power, and lift position to account for different solder pastes and PCB technologies. You don’t need an external control software.
  • Conservation of heat-transfer medium: There is a quick cool feature that enables the entire capacity of Vapor Phase One’s cooling circuit, plus four additional fans mounted to its base, to be used to cool the process chamber as quickly as possible after a soldering process. This optional “Quick Cool” feature reduces the process time and ensures a minimum loss of Galden when the board is removed.
  • Lid lift : The lid to the process chamber lifts automatically to enable the injecting and ejecting of a PCB. This safety feature also contributes to the preservation of heat-transfer medium.
  • Viewing window: In addition to a screen that displays realtime temperature data, Vapor Phase One features a viewing window, complete with internal lighting, that enables you to see inside the process chamber.

Specifications:

  • Usable heat-transfer media: 230, XS 235, and HS 240
  • Volume of Galden : 500 to 1000ml (cost $170 to $340)
  • Cooling : Water and air
  • Dimensions: 50 x 46.5 x 32cm
  • Max. Power consumption: 1.1 kW(at 230V or 110V)
  • Maximum PCB size: 20 x 18.5 x 7 cm
  • Weight: 18 kg
  • Max. power consumption: 1.1 kW (at 230 V or 110 V)
  • Data interface: USB or SD card
  • Touchscreen: 4-inch display with 800 x 480 pixels

Vapor Phase One is an open hardware driven by open-source firmware,

“and we intend to publish everything that goes into building one. That includes a bill of materials, schematics, Gerbers, and step files, along with GPL-licensed firmware. You can already find much of this in our GitHub repository, but we will continue adding and updating source code and design files throughout the campaign. As soon as crowdfunding is complete, we will prepare for small-scale production of Vapor Phase One machines and begin pursuing CE and any other relevant certifications.”

Funding ends on Sep 08, 2020 at 04:59 PM PDT (11:59 PM UTC).

Visit the project’s Crowd supply page for more information.

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