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Bringing Low Power Machine Learning to Endpoint IoT Devices

Posted on 9 March, 2020 by mixos

QuickLogic Corporation and Antmicro jointly-announced QuickFeather™, a small form factor development board designed to enable the next generation of low-power Machine Learning (ML) capable IoT devices. On top of the open source hardware design, available on GitHub today, Antmicro has also added support for the QuickFeather board in the Zephyr Real Time Operating System (RTOS) as well as in its open source Renode simulation framework.

The QuickFeather board is powered by QuickLogic’s EOS™ S3, the first FPGA-enabled SoC to be fully supported in the Zephyr RTOS, with flexible eFPGA logic integrated with an Arm Cortex®-M4F MCU and functionality such as:

16-Mbit of flash memory
MC3635 accelerometer
Infineon DPS310 pressure sensor
Infineon IM69D130 PDM digital microphone
User button and RGB LED
Powered from USB or a single Li-Po battery
Integrated battery charger
USB data signals tied to programmable logic

The QuickFeather development board was created to give developers a powerful and effective way to explore the functionality of the EOS S3 platform and enable compatibility with extensions available for the Feather PCB format from Adafruit, recently also added as a Zephyr Project member.

As announced in late 2019, the EOS S3 is supported in Antmicro’s Renode open source simulation framework for rapid prototyping, development and testing of multi-node systems, offering a more efficient hardware/software co-design approach. Utilizing Renode gives developers the flexibility and functionality to fully evaluate the QuickFeather development board across a number of deployment and configuration scenarios with or without access to hardware.

“An open hardware development board for a cost effective, FPGA-enabled SoC platform coupled with useful sensors, supported in a mainstream open source RTOS and the open source Renode simulation framework, QuickFeather is ideally positioned for use in tiny ML applications such as SensiML’s AI Software Platform and Google’s TensorFlow Lite,” said Michael Gielda, vice president of business development at Antmicro. “We are proud to be helping QuickLogic build an open hardware and software ecosystem that can serve as a model for the entire industry.”

“Machine learning applications are being deployed at an amazing rate and the new QuickFeather board will further accelerate that trend,” said Brian Faith, president and chief executive officer of QuickLogic. “Developers love the fact that it and its associated Renode simulation framework are open source, making it even more attractive for implementing ML algorithms on endpoint IoT applications.”

Availability

The QuickFeather board with integrated EOS S3 voice and sensor processing SoC, and the Renode simulation environment are all sampling now and will be available in early Q2.

On The Web: QuickLogic Corporation , Antmicro

ON Semiconductor NFAQ1060L36T Intelligent Power Module (IPM)

Posted on 9 March, 2020 by mixos

NFAQ1060L36T – Three-phase 10 A / 600 V IGBT module with integrated drivers using DBC substrate.

The NFAQ1060L36T is a fully-integrated inverter power stage consisting of a high-voltage driver, six IGBT’s and a thermistor, suitable for driving permanent magnet synchronous (PMSM) motors, brushless-DC (BLDC) motors and AC asynchronous motors. The IGBT’s are configured in a 3-phase bridge with separate emitter connections for the lower legs for maximum flexibility in the choice of the control algorithm.

The power stage has a full range of protection functions including cross-conduction protection, external shutdown, and under-voltage lockout functions. An internal comparator and reference connected to the over-current protection circuit allow the designer to set the over-current protection level.

Features

Three-phase 10 A / 600 V IGBT module with integrated drivers using DBC substrate
Typical values: VCE(sat) = 1.9V, VF = 2.4V, ESW = 400 µJ at 10 A
Compact 29.6 mm x 18.2 mm dual in-line package
Adjustable over-current protection level
Integrated bootstrap diodes and resistors
Thermistor
Short lead length (3.4mm, module bottom to pin end)

Benefits

Good heat dissipation with DBC (low thermal resistance)
Using the latest tech to optimize loss, good EMI
PCB size reduce with compact sized packaged
Adjustable OCP level
Multi function integrated for compact design, cost optimization
More accurate module temperature measurement by embedded NTC
Module assembly to PCB more closely to reduce stress from vibration

more information: www.onsemi.com

Free Elektor Article: Current Transformer for Oscilloscopes

Posted on 9 March, 2020 by mixos

Commercial current clamp devices certainly are able to measure current by potential-free means but they are not suitable for capturing rapid alterations in current over time. In addition, many low-cost examples of these do not provide an output for connecting to an oscilloscope. Here now comes a DIY alternative.

Original publication: Elektor Magazine 2/2018 (March & April) on page116
Author: Karsten Böhme
Free download expires: Friday 13 March 2020
Original article production number: 150170
Software, Bare PCB available, see PRODUCTS below

Like what you’re seeing? Then go to the article page and download a pdf copy of the full, original article. Downloading is free from Friday 6 March to Friday 13 March 2020.

EBC3A1-1G Y0: the Optimum Embedded Board for ATM Kiosks and Vending Machines

Posted on 9 March, 2020 by mixos

EMBUX introduces its newest ARM embedded board, the EBC3A1-1G Y0, particularly intended for machine manufacturers and system integrators. The embedded board is selectively based on the NXP ARM Cortex-A9 i.MX6 processor to ensure high performance at a lower cost. With multiple, distinct I/Os, the sky’s the limit as to how to connect the EBC3A1-1G Y0 with different interfaces in ATM kiosks, vending machines, and industrial gateways/controllers.

ARM yourself with the best processor for automated uses

ARM processors are typically used for site-specific devices, like automated vending and ATM machines and other embedded systems, due to its low power consumption and smaller size. However, EMBUX embraces the advantages in cost/performance ratio and size with our meticulous selection of the ARM Cortex-A9 i.MX6 processor for our scalable embedded system solution, saving you space and energy. The 10.8 to 26.4 VDC wide input voltage range also allows the device to have versatility in usage environments.

Rich I/O selection makes this your flexible friend

As a compact 3.5” board, the EBC3A1-1G Y0 integrates easily with ATMs, in addition to vending, parking, and other automated machines. The assortment of I/Os gives the computer flexibility in connectivity options. Multiple USB and RS-232 ports are available to link to site-specific devices, while the CAN bus makes the board suitable for transportation vehicle uses. Additionally, having both HDMI and LVDS connectors allows flexibility in taking advantage of the graphics support. Lastly, the EBC3A1-1G Y0 offers mini-PCIe expansion sockets for additional needs or extra ports.

Main Features

ARM Cortex-A9 i.MX6 DualLite 1.0 GHz
Onboard DDR3 1GB, 4GB eMMC Flash
HDMI, 18/24-bit LVDS output
6 x RS-232, 2 x RS-485, 2 x CAN, 4 x USB 2.0
Dual mini-PCIe for Wi-Fi/3G support
10.8~26.4 VDC wide power input
Diversified OS support for Yocto/Android/WEC7 (OEM)

Ordering Information

EBC3A1-1G Y0 (P/N: 10E0003A106X4)

3.5″ SBC, i.MX6DL 1GHz, DDR3 1GB, 2 x mini-PCIe, with Yocto OS, HDMI/LAN/4GB, eMMC/4 x USB/6 x RS 232/2 x RS, 485/2 x CAN/10.8V 26.4V

The EBC3A1-1G Y0 appears to be available now at an undisclosed price. More information may be found in Nexcom’s announcement, as well as Nexcom’s EBC3A1-1G Y0 product page and Embux’s EBC 3A1-1G product page.

DIY 18650 Powerwall with onboard BMS

Posted on 9 March, 2020 by mixos

peter6960 shared a new project. It’ s about a 18650 cells power brick with onboard battery management system. He writes:

While I cannot afford a Tesla PowerWall, I’ve spent some time drawing up a PCB to house 7x 18650 cells in series. Each board has onboard Battery Management:

Overvoltage Protection (per cell)
Undervoltage Protection (per cell)
Balance Charging
Overcurrent Protection
Main pack Fuse

Each PCB has pads that allow you to stack them on top of each other with some 25mm Brass spacers, to increase the pack capacity by joining several 7S strings in series (for example stacking 10x PCBs gives you a 7S10P Battery. If you used 2500mAh cells, that would be a 21-29v 25Ah pack!

Costs are looking good, in the region of under $15 per board, keeping in mind it includes the BMS circuitry, that’s pretty cheap!

If you want to order some boards, checkout: https://www.pcbway.com/project/shareproject/18650_PowerWall_with_Onboard_BMS.html

Eagle Files: https://github.com/openhardwarecoza/DiyBMSv418650pack

New ZVS Buck-Boost Regulator operates down to -55°C for application in harsh environments

Posted on 9 March, 2020 by mixos

Vicor has released its PI3740 ZVS buck-boost regulator with an extended operating temperature range of -55 to +115°C and optional Tin-Lead BGA packaging. The PI3740 is a high-density and high-efficiency buck boost regulator with an 8 – 60V input voltage range and supports output voltages from 10 – 50V. The device offers up to 140W in a 10x14mm SiP package and higher power delivery can be achieved with additional devices in parallel. The ZVS switching topology also enables efficiency as high as 96%.

About Vicor Corporation

Vicor Corporation designs, develops, manufactures and markets modular power components and complete power systems based upon a portfolio of patented technologies. Headquartered in Andover, Massachusetts, Vicor sells its products to the power systems market, including enterprise and high performance computing, industrial equipment and automation, telecommunications and network infrastructure, vehicles and transportation, aerospace and defense. www.vicorpower.com

AMD launches two more Ryzen Embedded chips for low-power PCs

Posted on 4 March, 20204 March, 2020 by Emmanuel Odunlade

A few days back, AMD announced the expansion of its Ryzen™ Embedded ecosystem with the addition of two new, low-power, AMD Ryzen™ Embedded R1000 processors designed to provide customers with a low TDP range of between 6 to 10 Watts. The new processors named the R1102G and R1305G, were designed to serve the needs of customers who need a fairly high computing power but can’t afford the power consumption rates of other processors in the ecosystem.

According to the companies, Corporate Vice President and General Manager for Embedded Solutions, Rajneesh Gaur, the new processors highlights AMD’s desire to provide the embedded industry with high-performance computing. In his words, Rajneesh said

“AMD is ushering in a new age of high-performance computing for the embedded industry. We are doing this with cutting-edge technology to display immersive graphics in 4K resolution with AMD Ryzen Embedded processors, and we are now offering access to high performance in power-efficient solutions with these new low-power Ryzen Embedded R1000 processors.”

Being part of the Ryzen R1000 series, the new processors retain the DNA of the Ryzen series as they are also 14nm processors, and are built on the first-gen “Zen” CPU cores with Radeon Vega graphics. They also offer better CPU performance per watt, and better graphics performance compared to the predecessors like the AMD R-Series processors.

The new chips support DDR4-2400 memory and AMD Ryzen 3 graphics, with GPU frequencies of 1 GHz, and CPU base frequencies of 1.5GHz(for R1305G) and 1.2GHz(for R1102G), which puts the processors a bit behind when compared with the previous Ryzen versions in terms of speed. This is however understandable, as it might be a necessary trade-off that needed to be made to reduce power consumption.

Their numbers probably gave this next point away already, but there are significant differences between the two processors, with the R1305G seaming the one with higher performance. Some of the differences between the two processors are highlighted below;

R1305G processor supports up to 3 displays, while the R1102G only supports a max of 2.
The R1102G processor supports single-channel memory (w/ECC), while R1305G supports dual-channel (w/o ECC)
R1102G comes with 4 PCI lanes, While the R1305G processor comes with 8.

A more detailed comparison is provided in the table below;

Processor	TDP (W)	Cores/Threads	CPU Base Freq. (GHz)	1T CPU Boost Freq. (GHz) (up to)³	GPU CU (SIMD)	Max GPU Freq. (GHz)
R1305G	8-10W⁴	2/4	1.5	2.8	3	1.0
R1102G	6W⁵	2/2	1.2	2.6	3	1.0

Source: AMD.com

The Low TDP range of between 6( R1102G) to 10( R1305G) watts at which the processors operate, give customers the ability to reduce system costs with less memory DIMMS and lower power requirements. It also opens up possibilities around the development of fanless systems, creating room for the development of new kinds of solutions.

While the processors were just released, there already exists quite impressive lists of customers who are already building one solution or the other around it. Some of the customers as announced by AMD include Kontron with a scalable mini-ITX platform, and Simply NUC with a new mini PC unit called Red Oak, which offers affordable mainstream performance solutions with a cost-optimized feature set to its lineup of Ryzen Embedded based Mini PCs.

The two new processors are expected to be available for order at the end of March. More information on features and performance of the processors can be obtained from the announcement post on AMD’s Website

Ampere debuts 80-core ARM server processor

Posted on 4 March, 2020 by mixos

Ampere Computing LLC has announced a 64-bit ARM-based processor for servers comprising 80 cores and targeting 7nm manufacturing process technology. By Peter Clarke @ eenewseurope.com

Altra is a follow-up to the 32-core Skylark processor, otherwise known as eMAG, which has been manufactured in TSMC’s 16nm FinFET process. Even as that product came to market in 2018 the company was advising of a 7nm processor to follow (see Startup Ampere prices ARM server chips ).

Altra is an 80-core processor based on Neoverse N1 license, designed for predictable high performance, security isolation, scalability and leading power efficiency. It comes in single socket and dual socket versions, which are sampling to customers.

The device is scalable up to 80 cores per chip with a power consumption footprint of up to 210W. The cores are specificed up to 3.0GHz clock frequency. The core is a four-instruction wide superscalar out-of-order processor based on the ARMv8.2 instruction set architecture. Each core is single-threaded to provide reduced performance variability and increased security against system-level side-channel attacks.

There are 64kbyte level-one instruction and data caches per core and 1Mbyte level 2 data caches per core. There is also a processor-wide 32Mbyte system-level cache.

There are 8 72bit-wide DDR4 interfaces per chip and 128 lanes of PCIe Gen4 for highest IO bandwidth.

Altra is Ampere’s cloud-focused product, and first in a new class of CPUs rolling out on an annual basis from Ampere’s roadmap. The increased performance and power efficiency will make Altra suitable for many workloads including data analytics, artificial intelligence, database, storage, telco stacks, edge computing, web hosting and cloud native applications.

Jeff Wittich, senior vice president of products at Ampere, said that for some intensive training loads arrays of GPUs or some more specialized tensor processors or neural network accelerators could possibly provide superior power efficiency. “Training on TPU, IPU or GPU can make sense, but inference we can do. In other circumstances we will be the host node for an accelerator,” he told eeNews Europe .

“Our team’s attention is on solving customers’ needs and ensuring execution that delivers an annual cadence of new capabilities to the market. It is an exciting time for our young company as we work diligently to invent the future of the server CPU business,” said Renee James, Ampere founder and CEO, in a statement.

It is estimated that data centers are currently utilizing 3 percent of the world’s electricity and that is projected to grow to 11 percent by 2030, Ampere said. Ampere has benchmarked Altra against Epyc processors from AMD and Xeon processors from Intel and found significant improvements in performance and power efficience.

Wittich said Ampere intended to introduce a processor each year. The processor ‘Mystique’ is developed and aimed at 7nm manufacturing process and introduction in 2021. This will provide more cores and direct compatibility. ‘Siryn’ is in development and intended to come in 2022 and is defined for 5nm production.

Mount Jade and Mount Snow are two- and single-socket servers, respectively, from Gigabyte Technologies Inc.

Related links and articles: https://www.amperecomputing.com/

FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs with Built-in Type-C/PD Controllers

Posted on 4 March, 2020 by mixos

Always at the forefront of embedded connectivity innovations, FTDI Chip’s latest series of multi-channel USB interface ICs. These have the capacity to deal with next generation power requirements, as larger items of hardware start to make use of the protocol.

Available in both 2-channel (FT2233HP) and 4-channel (FT4233HP) versions, the new Hi-Speed (480Mbits/s) devices have serial UART (RS232, RS422 or RS485) and MPSSE (JTAG, I2C, SPI or Bit-Bang) interfacing capabilities. Furthermore, they are fully compliant with Rev 3.0 of the USB power delivery (PD) specification. Each features a Type-C/PD controller for taking care of all negotiation and power gauging, then deciding on the appropriate course of action (thereby offloading work that the system microcontroller would otherwise have to perform). This will enable any equipment that these ICs are integrated into to either draw or provide power as the situation dictates – with power levels of up to 100W being supported.

Based on a 32-bit RISC processor core, with 8kB of data RAM and 48kB of code ROM embedded, the PD Policy Engine manages the respective PD ports. The PD1 port can act as either a power sink or power source, while the PD2 port only acts as a power sink. Since all USB protocol handling can be accomplished directly on chip, there is no need for USB specific firmware programming to be embarked upon – which significantly streamlines the whole implementation process. Furthermore, access to FTDI’s royalty-free USB drivers (for Windows, Linux, Mac and Android) negates the need for engineers to create their own drivers from scratch.

The FT2233HP and FT4233HP ICs are available in 76-pin QFN packages, as well as 80-pin LQFP packages. An extended operational temperature range of -40°C to 85°C is supported, in order to allow deployment in harsh industrial environments. Among the key applications for these devices are domestic appliances, test instrumentation, factory automation systems, power tools, lighting equipment, barcode readers and consumer electronics products.

SEH Technology launches new dongle servers for virtualisation and outsourcing in the digital age

Posted on 4 March, 2020 by mixos

Advancing digitalisation continues to produce huge challenges for businesses across all industries. Businesses want to stay ahead of the curve and remain competitive. System houses, data centers, consultants, and vendors demand solutions that can handle the increased data volume. To fulfill these market demands and adapt to new working conditions, SEH Technology has introduced its next generation dongle servers with USB 3.0. With its extensive capabilities, the next generation dongle servers will satisfy customer demands for increased performance and functional product design.

Flexible chassis channels data streams in data centers

SEH replaces both models of the USB Dongleserver family with brand-new versions: the dongleserver Pro replaces the myUTN-80 while the dongleserver ProMAX fills the shoes of the myUTN-800.

The updated hardware combines the best of the previous generation with innovative improvements, which have been identified in detailed customer interviews as well as market analyses. Leading dongle manufacturers have pushed the first USB 3.0 dongles onto the market. Thus in order to fulfill customer requests and be future-proof, the new SEH models feature USB 3.0 SuperSpeed. Completely new CPUs assure that this standard can be used to the fullest potential, meaning USB 3.0 dongles with integrated storage can now be embedded perfectly.

The RJ-45 network connectors have been moved to the back, to ensure installation in office environments as well as in data centers is much easier. This design change assures that the new dongle servers fit perfectly into rack wiring management and changes are no longer required. The new rack mount kit allows for optimal installation of the dongle server Pro into a rack and its “push to open” technology provides easy access for regular handling and maintenance. The dongleserver ProMAX can also be installed into a rack immediately and extended with the RMK3 for ultimate usability.

Low-maintenance bodyguard for maximum security

The entire USB communication between client and dongle servers can now be encrypted. Whereas before only payload was encrypted, control and protocol data are now protected from illegal access as well. In addition, it is easier to configure the encryption—previously it had to be activated for each port individually, now it’s one click. The USB port key feature has also been redesigned. Formerly, only one key could be assigned to a port and then had to be entered in order to unlock the port and use the connected USB dongle. Now not only two keys can be assigned to one USB port, but each key also supports a time slot. This feature accommodates mainly Software-as-a-Service (SaaS) providers who use them to provide automated time restricted access to dongle-based applications such as demo versions or accounting software.

Increased control with monitoring and logging

Monitoring and logging are essential for centralised management and secure supervision in server and data centers. Therefore, the new monitoring and logging features can trace all dongle server activity, automatically and with a timestamp. For example, the connection or removal of a dongle can be verified as a logged event, in addition to new system error warning. (De)activation and changes to the configuration setup are recorded as well, alongside the SD card status. The logged data are stored locally on the dongle servers and they can be sent to a syslog-ng and/or WebDAV server.

New hardware with a single software package

The next generation solution from SEH will also boast one single software. The frustrating separation into firm and software is a thing of the past, meaning updating the new dongle servers will be easy.

The new dongle servers are available through SEH’s UK subsidiary and partner Bechtle UK. For more information, please visit https://www.seh-technology.com/uk/products/usb-dongle-servers.html