Extend battery life with the 60nA quiescent current TPS62840

If you’re looking to reduce quiescent current and extend the lifetime of your system’s battery, then the TPS62840 is the device for you. At an astonishing 60nA of operating IQ, TPS62840 is the world’s lowest quiescent current DC/DC switching regulator. From IoT to smart meters, and patient monitors to wearables, your system’s battery craves a device like TPS62840. Try one today!

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Key features of the TPS62840:

  • 60nA operating quiescent current extends battery run-time and allows for the use of fewer or smaller batteries
  • 80% efficiency with a 1µA load is more than double that of the previous generation
  • 1.8V to 6.5V input range accommodates a variety of battery chemistries
  • STOP pin turns off all switching to provide a quiet supply rail for noise sensitive applications

Design support for TPS62840:

RK3328-based industrial SBC eases Raspbian porting

In February, Novasom Industries launched its Linux-powered, Rockchip RK3328 based SBC-M7 single board computer, which Novasom now calls the Novasom M7, along with an SBC-M8 board based on a Snapdragon 410E. Now, Novasom has followed customer feedback to upgrade the somewhat Raspberry Pi-like Novasom M7 with a Novasom M7+ (or M7Plus) model that provides a variety of hardware and software improvements.

SW difference with M7

The M7plus is totally SW compatible with any M7 and RP3 on the market.
As usual, plug and play, not pray… The specific GPIO mapping library we include in our SW package is the only thing you need to include in your RP3 SW, in order to make it run with Armbian-Debian without any trouble.
And our tech support is there to help you. A real technical support, not a simple blog…

HW difference with M7

USB Power

On the M7plus, it’s possible – not mandatory – to power the unit by a 5V coming from the USB type A connector in addition to having the usual protected 12V power input option.

A Stronger Backlight Driver for display

When driving the backlight of a display, with whichever technology you would like to use, the direct drive of the backlight allows us to dim or switch it off and on the display by software. Things you cannot do if the unit is not powering the display. And in order to drive a brighter display, we have up-scaled to 6A (@5V) the drive capability of the novasom board.

FCC cable for the HDMI output

The HDMI output it’s a huge video connector. But in some applications the cost – dimension of the HDMI cable and it’s rigidity, makes it hard to industrialize the solution “Novasom display” that we call NovaPC. So we have added an FCC connector that replicates the HDMI’s output so an easy cable and path can be used.

More Outputs on strip pin

We know that the famous J3 pin strip is considered almost a standard in the market, but we saw several applications where the USB bus, not present on the J3 RP3 “standard” would be more than welcome. So we added those outputs.

A 485 line:

To allow our industrial customers to be ready for a needed connection with the most udes industrial field bus.

The Novasom M7+ appears to be available with pricing undisclosed. More information may be found on the Novasom M7+ product page.

Samsung unveils 12-layer 3D-TSV chip packaging technology

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com

Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy to vertically interconnect the DRAM chips through a three-dimensional configuration of TSV holes. The thickness of the package (720㎛) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs.

In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption. “Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence (AI) and High Power Computing (HPC),” said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics.

“As Moore’s law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology.”

Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed. Also, by increasing the number of stacked layers from eight to 12, Samsung will soon be able to mass produce 24-gigabyte high bandwidth memory, which provides three times the capacity of 8GB high bandwidth memory on the market today.

Samsung – www.samsung.com

Nano Current Meter using ATtiny84

David Johnson-Davies published another great tiny project. He writes:

This project describes a simple low-current meter I devised to check the sleep current of different microcontroller circuits, such as ones based on AVR microcontrollers. It’s capable of measuring currents of between 10µA and 30nA with reasonable accuracy, using an ATtiny84 and a few other low-cost parts.

Measuring very small currents accurately is notoriously difficult with normal digital multimeters; they either don’t provide a low current range at all, or if they do, they create a voltage drop referred to as the “burden voltage” which can render the display inaccurate. One way round this is to use a precision current adapter, such as David L. Jones’s µCurrent [1], but such circuits are expensive.

Nano Current Meter using ATtiny84 – [Link]

Great Cow BASIC Introduction – Programming tools for Microchip PIC and Atmel AVR microcontrollers

Great Cow BASIC is a robust and fully functional compiler and assembler for 8-bit microchip PIC and Atmel AVR microcontrollers. It was developed to cater for all class of embedded system solution developers from experts to beginners but with a great tool to help beginners.

It was developed to achieve three major goals which include;

  1. To remove the need for repetitive assembly commands for developers
  2. To help embedded developers produce efficient code
  3. To make it easy to take code written for one microcontroller type and run it on another microcontroller type.

The third one which seems to be a viable solution to one of the pain points of developers is one of Great Cow BASIC’s most useful characteristic. The design intent was to remove the complexity of using and programming a microcontroller and by proxy, make Great Cow BASIC suitable for beginners, for those who do not like or wish to learn assembly language and for experienced microcontroller programmers all at the same time.

Great Cow Graphical BASIC

For beginners, Great Cow BASIC comes with the Great Cow Graphical BASIC which is an icon-based editor for Great Cow BASIC Programs. This user interface was designed for beginners and those who do not like or wish to learn assembly language, removing the burden of memorizing commands by allowing users to just drag boxes that represents the line of code they are trying to create in a manner that is similar to the popular scratch software. As mentioned above, the Great Cow Graphical BASIC is tightly integrated with Great Cow BASIC as such, it will work with all of the same chips, and loads and saves GCBASIC programs directly. You can even copy and paste between Great Cow Graphical BASIC and a text editor with a Great Cow BASIC program in it! GCGB (Great Cow Graphical BASICs) will load the GCB (Great Cow BASIC) libraries, and when you’re comfortable to leave the icons behind, your GCGB programs can be edited like any other Great Cow BASIC program.

Great Cow BASIC IDE

For more experienced microcontroller programmers, the Great Cow BASIC IDE is the way to go. The IDE, which is primarily based on Synwrite created by Alexey Torgashin but adapted, modified and maintained for GCB by Frank Steinberg, integrates several amazing features that make firmware development easy and less stressful.  It incorporates a simple to change programmer, the editor with syntax highlighting and code folding, sub/function list, autocomplete, context-sensitive help, multiple tabs, and bookmarks and a host of other attractive and engaging features.

Great Cow BASIC IDE

A highlight of some of the features of the GCB includes:

  • Integration with the Great Cow BASIC compiler
  • Simple to change the programmer
  • SynWrite editor with syntax highlighting and code folding
  • Sub/function list
  • Autocomplete
  • Context-sensitive help (F1)
  • Multifile tabs and bookmarksDoubleclick on compiler errors moves the cursor to the source code error line
  • One-click assemble/compile/flash microcontroller (F5, F6, F7, F8)
  • Serial Terminal software
  • Programming software

Great Cow BASIC demonstrations

Great Cow basic has been used in the development of tons of projects like game controllers and projects featuring different sensors for tasks like temperature monitoring, distance measurement with ultrasonic sensor, display of text and images on LCDs and so on. A good number of these past projects have been collated into an example folder that can be found here and it serves as a good resource for coding newbies as it contains different code blocks that may be needed in the when building a project and they are written in such a way that they can be reused in other projects.

Great Cow BASIC microcontroller supported

Great Cow Basic supports an impressive number of 8bits PIC ( including the; 10F, 12C, 12F, 16C, 16F, 18C and 18F chips), and AVR (Classic AVR, Tiny AVR and Mega AVR) microcontrollers and it generates standard MPASM compatible assembly code for PIC, or avrasm2 compatible code for AVR microcontrollers. This makes it easy to write code for different microcontrollers. For instance, you could develop code for TinyAVR microcontroller, and easily adapt it for a PIC microcontroler like the 18F series.

Support for more microcontrollers is being added regularly, so any microcontroller not currently supported should be supported soon.

Great Cow BASIC programmers supported

Supporting AVR and PIC Family of microcontrollers ensures Great Cow Basic supports some of the most popular programmers used in programming those microcontrollers.

To mention a few, some of the programmers and tools supported by Great Cow Basic include;

  1. PicKit2 and PicKit3
  2. AVRdude and Avrdude-GUI
  3. Microchip Xpress Board programmer
  4. Microchip IPE automation tool
  5. TinyMultiBootloaders

Great Cow BASIC distributions

The Great Cow BASIC toolchain is available for Windows, MacOS, and Linux users. Currently, the Great Cow Graphical BASIC will only run on Windows and requires the .NET Framework 1.1 or higher.

More information about the Great Cow BASIC, can be obtained from their website and the software can be downloaded from the Sourceforge page. Demonstration files for Great Cow BASIC.

3.5-inch SBC with 8th Gen Intel® Core™ Processors (Whiskey Lake-U)

IBASE Technology, a global provider of Industrial motherboards and embedded computing solutions, reveals the IB919 3.5-inch single board computer based on 8th Generation Intel®  Core™ i7/i5/i3 and Celeron® 4000 processors (codenamed Whiskey Lake-U) built on a further refined 14nm++ manufacturing process, offering greater computing and graphics performance than the previous generation. IBASE expands its portfolio of long-term available products with the launch of the IB919 3.5-inch SBC equipped with USB Type-C, 9V~24V wide-range DC input and optimized Thermal Design Power (TDP) of 15W that allows designers to configure systems with performance and low-power requirements.

“We are pleased with Intel’s long-term supply commitment for the Whiskey Lake-U platform, enabling us to back up the new IB919 SBC with a 15-year life cycle,” said Wilson Lin, Director of IBASE Product Planning Department. “The guaranteed availability ideally fits customer demands for their current and upcoming programs in smart retail, transportation, healthcare, and smart factory applications even in large field deployments.”

The IB919 comes in two series, the IB919AF (Core™ i7-8665UE, i5-8365UE) and IB919EF (i3-8145UE, Celeron 4305UE), both of which feature up to 32GB DDR4-2400 memory in dual channel and dual Intel Gigabit Ethernet. The board drives up to three independent displays with two DisplayPort (DP & Type C) and eDP or 24-bit dual-channel LVDS interface. Peripheral and external connections are made with a wide selection of interface via two M.2 slots (M2280 & E2230) for NVMe drives and CNVi wireless connectivity, four COM, two SATA III, four USB 3.1 Gen2 (10Gb/s), two USB 2.0 and a USB Type-C connector.

IB919 FEATURES:

  • Onboard 8th Gen Intel® Core™ i7/i5/i3 / Celeron® processor
  • 2x DDR4-2400 SO-DIMM, Max.32GB, Non-ECC
  • 2x DisplayPort (via DP & Type-C)
  • 1x eDP or 24-bit dual-channel LVDS display output
  • 2x Intel® PCI-E GbE LAN
  • Watchdog timer, Digital I/O, TPM (2.0)
  • 2x USB 2.0, 4x USB 3.1 (Type-A), 1x USB (Type-C), 2x SATA III
  • 2x M.2 socket (M/E key)

Specifications listed for the IB919 include:

  • Processor — Intel 8th Gen “Whiskey Lake” UE-series Core and Celeron (2x or 4x core @ up to 2.0GHz); Intel UHD Graphics 620 (Gen 9.5 HD Graphics with 24 EU); 15W TDP (configurable TDP of 12.5W to 25W)
  • Memory — up to 32GB of 2400MHz DDR4
  • Storage – 2x SATA III; M.2 M-Key 2280 with NVMe support
  • Networking — 2x Gigabit Ethernet ports (PCIe with Intel I219LM (model AF) or I219V (model EF) with I211AT)
  • Display/media:
    • 2x DisplayPort (DP and via USB Type-C)
    • eDP and/or LVDS
    • Triple independent display support
    • Audio I/O (Realtek ALC269 HD audio) with class-D amp
  • Other I/O:
    • 4x USB 3.1 Gen 2 host ports at up to 10Gbps
    • USB 3.1 Type-C port with USB and DP support
    • 2x USB 2.0
    • RS232/422/485 port
    • 3x RS232
    • 4-in, 4-out DIO
  • Expansion:
    • M.2 M-Key 2280 slot with NVMe support (see storage above)
    • M.2 E-Key 2230 slot with CNVi support
  • Other features — Watchdog; HW monitoring; TPM 2.0, 15-year availability; iAMT 11.6 only on AF models; optional heatsink and cable kit
  • Power — 9-24V DC input and 24V input; consumes 2.24 to 2.25A at 12V with 16GB
  • Operating temperatures — 0 to 60°C; 90% humidity (non-condensing at 60°C)
  • Dimensions — 147 x 102mm (“3.5-inch form factor”)
  • Operating system — Ubuntu Linux or Windows 10

The IB919 provides remote system management with iAMT (11.6), enhanced systems security using a Trusted Platform Module (TPM) chip and extended operating temperature range of 0°C to 60°C with optional thermal solutions and cable kits. It runs on both Windows 10 and Linux Ubuntu operating systems. For more information please visit www.ibase.com.tw.

Portwell’s New Com Express Type 6 Module Is Compact, Cost-Effective With Accelerated Graphic Processing

New MEDM-B603 features latest AMD embedded platform for medical imaging or multimedia imaging processing/control

American Portwell Technology, Inc., (https://www.portwell.com), a leading COM Express solution provider for the embedded computing market, announces its new compact (125 x 95 mm) MEDM-B603 Type 6 COM Express module. MEDM-B603 features the AMD Ryzen™ Embedded V1000 SoC Accelerated Processing Unit (APU) with up to 4 cores/8 threads at 3.35GHz, 3.80GHz Turbo Boost, and the AMD Radeon™ RX Vega 8 or 11 (based on APU) graphics processing unit (GPU).

According to Jack Lam, American Portwell Technology’s product marketing director, the new MEDM-B603 appliance is ideally suited for an embedded system that requires an accelerated graphic processing capability, such as medical imaging or multimedia imaging processing and control.

Fully-Featured and Optimized

In addition to its embedded APU and GPU, the new MEDM-B603 features dual-channel DDR4 ECC SO-DIMM up to 16GB; supports as many as 4 displays (DP/eDP, HDMI, LVDS and VGA); supports 2x USB 2.0, 4x USB 3.0, 2x SATA, 1x PCIe x8, 1x PCIe x2 and 1x PCIe x1 Gen 3; 1x Gigabit Ethernet; and fTPM 2.0.

“MEDM-B603 puts all this together in a compact COM Express package with a footprint of just 125 x 95 mm,” Lam says, “to provide the cost-effective and optimized performance balance of computing power, accelerated graphic processing and overall power consumption. In fact,” he adds, “in a benchmark comparison, the AMD Radeon™ RX Vega 11 GPU scores higher than the Intel® Iris® Plus graphic 650 engines. What’s more, users can easily upgrade previous Type 6 COM Express modules with the new MEDM-B603 to take advantage of all its new features and benefits.

“And as always,” Lam confirms, “our customers not only benefit from the most up-to-date technology and features, but they also gain peace of mind from the long lifespan support (7+ years) inherent with every Portwell product.”

No pricing was available for the “coming soon” MEDM-B603. More information may be found in Portwell’s announcement and product page.

PiezoListen™ Ultra-thin Piezo Speakers converts virtually any surface into a speaker

TDK’s PiezoListen series of ultra-thin, high-power actuators convert virtually any surface into a speaker without compromising structural design.

TDK’s PiezoListen ultra-thin piezo speakers balance design and functionality by allowing virtually any surface to be turned into a speaker. Unlike typical miniature speakers that tend to have a metallic sound, PiezoListen produces sound with dynamic range, volume, and richness (midrange and high-end) that easily fills a room or vehicle. Because PiezoListen can be attached directly to OLED, LCD, and back covers of display panels, sound emanates directly from the screen producing optimal sound localization.

Features and Benefits

  • Ultra-thin at ~1.0 mm
  • Lightweight at ~12.0 g
  • Optimal sound localization
  • Flexible acoustic design while maintaining existing set design
  • Can be attached directly to OLED, LCD, and back covers of screens
  • Wide frequency range: 1 kHz to 20 kHz
  • Operating temperature: -10°C to +60°C

Multilayered sheets of TDK’s original PZT piezoelectric ceramic material are connected through via-hole to achieve an ultra-thin body while maintaining a high displacement and high SPL (sound pressure level). PiezoListen products are available in various sizes with dimensions as small as 20 mm x 10 mm x 0.7 mm, which is up to 65% reduction compared with conventional products. PiezoListen is available for use in a variety of applications including car audio and infotainment systems, televisions, PCs, tablets, and more.

more information: https://product.tdk.com/info/en/products/sw_piezo/speaker/piezolisten/index.html

EFM8UB1 Breakout – DIP scale USB-MCU board

This breakout board converts Silicon Labs’ EFM8UB1 (Universal Bee series) to DIP scale. You can use the USB Type-C cable directly connected.

  • 300mil width DIP16 pin shape (substrate size 27.0 mm × 7.6 mm)
  • EFM8UB10F16G-C (16kBytes flash, 2304Bytes RAM, Internal OSC)
  • Development environment can be used free of charge
  • PCB-Edge Type-C connector
  • USB-CDC bootloader
  • USB bus-power supply
  • One user LED
  • Universal PCB mount available for single-sided parts mounting
  • Side-end face through terminal

more information: http://osafune.github.io/efm8ub1_breakout.html

UltraSoC announces next-generation hardware-based cybersecurity products

UltraSoC today announced next-generation hardware-based cybersecurity products that can be used to detect, block and record cyber-attacks in a broad range of applications – from vehicles and factory robots to consumer devices. Embedded monitors detect, block and record attacks, prevent propagation.

UltraSoC today announced next-generation hardware-based cybersecurity products that can be used to detect, block and record cyber-attacks in a broad range of applications – from vehicles and factory robots to consumer devices.

These new offerings embed advanced real-time cybersecurity features in the systems-on-chip (SoCs) that power and control every modern product. The first product in the range, the UltraSoC Bus Sentinel, allows SoC designers to control access to sensitive areas of their devices, instantaneously detect and block suspicious transactions, and build a long-term profile of system operation to secure against current and future cyber threats.

UltraSoC’s security solutions allow designers to incorporate an independent internal monitoring system into their chips. This continuously checks that the device is operating as expected, detecting anomalous behavior that might indicate a security breach. Because it is embedded in the hardware, it can respond in real time (in microseconds rather than the milliseconds required by traditional threat mitigation measures), is very hard to subvert or circumvent, and can even block “zero-day” type attacks that the chip’s designers have not anticipated. In addition to detecting and blocking cyber threats, it can be used to trigger actions that prevent propagation, and to provide a forensic “black box” record of events.

In the realm of cybersecurity, the emergence of groundbreaking tools is crucial to staying ahead of evolving threats. These Cybersecurity tools not only excel in detecting and obstructing cyber threats but also excel in triggering actions to prevent their propagation. As the cybersecurity landscape continues to evolve, tools like those offered by UltraSoC stand as indispensable assets, fortifying digital ecosystems against an ever-expanding array of threats. For further insights into the cybersecurity tool, you can explore the latest advancements in tools at vendict. If you have any specific questions or need more information, feel free to visit the website.

UltraSoC Chairman Alberto Sangiovanni-Vincentelli, commented:

“In an age of autonomous vehicles, ubiquitous connectivity and increasing dependence on technology, cybersecurity is one of the top challenges for technologists. We feel that we have a truly unique solution to these problems: which is why more and more customers are turning to UltraSoC to ensure that their products function safely, securely, and exactly as they were designed to do.”

The new Bus Sentinel module monitors and controls the internal bus of an SoC, observing how the chip’s interconnected sub-blocks are interacting. It can be configured at run time to detect specific transaction types; for example, if a process tries to access the control registers of the memory controller at any time other than a system re-boot; or if a process with insufficient privileges attempts to access a protected area of memory. The detection process itself is performed via a range of configurable filters which can be cascaded to implement complex conditions and detect even very subtle nuances of system behavior.

In addition to its detection functions, the Bus Sentinel can be configured to respond to threats in a variety of ways, also in real time: it can allow the transaction to proceed unmodified; it may block the transaction from proceeding beyond the monitor using a transaction gating technique; it can modify the transaction in some way – for example by marking it with a flag; and it can generate a response on the bus. It can also issue a trigger event across the dedicated UltraSoC communications fabric, allowing an immediate response to be generated by other system blocks, or by external threat mitigation systems.

David Rogers MBE, CEO of cybersecurity specialists Copper Horse, commented:

“As the threat landscape evolves and the consequences of attacks become more concerning, implementing security features in hardware has many advantages. By putting security at the heart of an SoC, UltraSoC’s technology helps by monitoring, detecting and addressing security concerns at the most fundamental level possible today.”

The Bus Sentinel’s system of filters, counters and timers allows it to be configured to detect common known security threats. These powerful capabilities give the system designer a wide variety of approaches to any given threat vector. Suspicious transactions can be detected and flagged, and subsequent transactions monitored without the attacker’s knowledge, to profile the threat. Transactions can be blocked, with the option to respond to the initiator and gather further information. Or the Bus Sentinel can trigger a response anywhere else within the on-chip system, communicating via the dedicated UltraSoC communications fabric.

Just as importantly, the Bus Sentinel is equipped with storage units that can record data for use by the filters in future transaction identification. It can also be used in concert with the overall UltraSoC infrastructure to gather rich statistical data. This can be used by an on-chip analytics engine, or passed to an external cloud-based analytics system, to profile the system and produce a “signature” of normal behavior based on many deployed instances of the device. This in turn allows the threat mitigation system to adapt to the rapidly evolving threat landscape.

The UltraSoC Bus Sentinel will be generally available in Q1 2020. Its modular design allows it to support any bus protocol, with immediate support for commonly-used on-chip buses including Arm APB, AHB, AXI-4 and ACE.

more: cybersecurity UltraSoC

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