Omron USB and PCB Type Environmental Sensors

Omron’s 2JCIE environmental sensors are IoT sensors integrated with Bluetooth. These sensors are capable of tracking eight different environmental factors which include: temperature, humidity, light, UV index, barometric pressure, noise, acceleration and VOC (Volatile Organic Compounds) with wireless communication functionality in an ultra-small footprint.

The sensors can be used in the home to monitor room environments, sleeping conditions, infants, and the elderly. They can also be used in offices or factories to monitor conditions of work environments. Or, they can be used outdoors to alert users to weather changes and monitor UV exposure.

Features & Benefits

  • Multiple sensors (such as temperature, humidity, light, barometric pressure, sound noise), in one package, provide various information at same time
  • Information loss is prevented by saving date inside of built-in memory even if communication is not established
  • Small dimension packaging, allowing use anywhere

Industries

  • Appliance & Climate Control
  • Other

Applications

Smart home (example- room monitor for comfortable sleep conditions), building (example- office environment monitor), weather conditions, real estate, vacation rental

Introduction Video

more information is available here: estore.heilind.com/

Leaked Intel roadmap reveals a 2Q launch for 10nm Ice Lake chips and Lakefield processor

A leaked Intel roadmap reveals launch plans for Intel Core and Atom processors through the end of 2021. Of interest is a hybrid Lakefield processor design that combines a 10nm Ice Lake core and 4x Atom Tremont cores. The roadmap contains several surprises, like Intel’s plans for a market launch of its 10nm U- and Y-series Ice Lake chips, and also its partially Ice Lake-based Lakefield processors by the end of June, instead of the expected end-of-year launch.

Another info is that Lakefield will have a 3-5W TDP, which is lower than any Atom-level CPU to present. Intel is exploiting a chiplets design approach for the Lakefield, that incorporates two different product lines with cores fabricated with different processes on a single processor. For example, a 10nm Ice Lake “Sunny Cove” core will be incorporated with 4x 10nm Tremont architecture cores. The 12mm SoC will offer longer battery life than previous Atom SoCs, alongside featuring Intel Gen11 graphics. Lakefield’s high-powered Ice Lake core utilizes Sunny Cove, a new CPU microarchitecture with power/performance improvements and acceleration of tasks like AI and cryptography. According to Intel, Sunny Cove “enables reduced latency and high throughput, as well as offers much greater parallelism.

The Lakefield Atom chips will also utilize Intel’s first 10nm Atom architecture, known as Tremont, which in 2021 will be followed by a Gracemont architecture. The roadmap hints that the initial Ice Lake release will be limited, hopefully, there will be a larger quantity next year. There will also be another 10nm Intel Core called Tiger Lake. The Tiger Lake will also be initially limited to up to quad-core U-series and even lower-powered Y-series designs.

Intel 9th Gen feature diagram 9th Gen Mobile H-series processors

The roadmap also hints that Intel is planning at least two more 14nm Core generations. One of them is the Comet Lake, which is due in the second half of this year, beginning with U-series models. A higher powered H-series model will follow later, and a super low—power Y-series will follow in 2020. The Comet Lake will feature 6-core U-series chips for the first time, and also the first 10-core H-series models. A Rocket Lake design will be due in Q3 2020. It combines a 14nm CPU with 10nm graphics. This is another example of chiplets. Other Rocket Lake models will utilize 14nm for both CPU and GPU.

Visit Intel’s Newsroom for more information on Intel’s April announcements

Experience the Power of AI with Solutions from AAEON

AAEON is leading the industry with embedded solutions for AI and edge computing applications. Whether your project involves drones, robots, smart security systems, or intelligent street lights, AAEON has the hardware solutions to meet any need. With experience and expertise in creating rugged industrial platforms, these AI platforms will work anywhere you need.

AAEON meets the needs of developers for AI platforms by offering a mix of purpose-built compact and rugged systems, low-power high-performance maker boards configurable for any application, and AI modules which can install quickly and easily, expanding the capabilities of almost any system across AAEON’s entire range of embedded solutions.

Purpose built systems include the BOXER-8100AI family, powered by NVIDIA® Jetson® TX2. This powerful module pairs the Dual-Core NVIDIA Denver 2 64-Bit CPU with the Quad-Core ARM® Cortex®-A57 MPCore, offering up to 256 CUDA cores for embedded AI applications. The BOXER-8100AI family offers various I/O configurations, making each model suitable for a variety of AI tasks and connecting to different hardware, such as PoE or MIPI cameras. The BOXER-8100AI family feature compact sizes and fanless design, allowing these systems to fit anywhere and work anywhere.

AAEON’s range of UP maker boards offer developers ultimate flexibility and configurability to tailor our systems to their needs. Whether it’s the speed of the UP Squared or expandability of the UP Core Plus, our UP products can be built and configured to meet your needs. With low-power high-performance components, they are excellent for mobile applications such as inspection drones and service robots.

AAEON’s innovative embedded boards and systems have always been designed with expandability as a feature. Utilizing our innovative AI Core X and AI Core XM family of Intel® Myriad™ X modules, virtually all of our embedded systems can be deployed in AI and edge computing applications. This provides even greater flexibility for developers and clients looking for an AI solution tailored to their needs. Whether it’s our VPC-5600S deployed for intelligent security and virtual fence applications, or our din-rail mounted BOXER-6750 powering facial recognition and machine vision applications in a compact, easy to install form factor, there’s no end to the possibilities with AI Core X from AAEON.

AAEON also provides end-to-end support to deploy AI edge computing and AIOT networks. With our range of AIOT gateways and our very own LoRa Node, AAEON makes configuring and deploying AI Edge networks easier than ever. For more traditional networks, our network appliances are designed to handle the high-data flow requirements of AI edge computing while still providing vital services such as network function virtualization and unified threat management.

AAEON has proven itself a leader in industrial embedded design through constant innovation and developing for the future. In the near future we will be expanding our embedded AI systems even more, to power demanding tasks such as Automated Optical Inspection, and incorporating advanced AI optimized technologies such as the 2nd Generation Intel® Xeon® Processors (formerly Cascade Lake). AAEON also continues to offer our manufacturer services and OEM/ODM support, empowering developers and partners with the ability to configure and design systems to fit their exact and unique needs, speeding up development and reducing deployment times.

With AAEON’s range of compact embedded AI Edge computing systems and the innovative AI Core X, our clients will have no trouble finding the right solution for their application.

Breakthrough in CO2 Sensing: First Sensirion Miniaturized CO2 Sensor

Once again, Sensirion trailblazes innovation in environmental sensing to create healthier and more productive environments for people. At this year’s Sensor+Test 2019 in Nuremberg and SensorsExpo 2019 in San José, the expert in environmental sensing, Sensirion, is announcing the SCD40 – the first miniaturized CO2 and RH/T sensor that fits in a space of just one cubic centimeter. This disruptive innovation is based on the photoacoustic sensing principle and combines minimal size with maximum performance to open up numerous new integration and application possibilities. Due to its unprecedented price-performance ratio, the SCD40 is especially well suited for high-volume and cost-sensitive applications.

Sensirion’s profound expertise in miniaturizing sensors has enabled a breakthrough step in CO2 sensing: with dimensions of just 12 x 12 x 7 mm3, the SCD40 footprint has been miniaturized by a factor of 5 compared to its predecessor, the SCD30. Using the photoacoustic sensing principle, the dimensions of the optical cavity are drastically reduced without compromising on sensor performance. Moreover, the SCD40 CO2 and RH/T sensor leverages Sensirion’s outstanding environmental sensing expertise by incorporating a best-in-class humidity and temperature sensor that delivers two additional sensor outputs. Because of its unmatched size and its unprecedented price-performance ratio, the SCD40 is the sensor of choice for today’s and future CO2 sensing markets such as IoT, automotive, HVAC, appliances and consumer goods.

Visit Sensirion at the Sensor+Test 2019 at booth no. 316 in hall 1 as well as at the SensorsExpo 2019 at booth no. 324 in hall M2 to experience the new sensor solution live in action. Furthermore, there will be an exclusive meeting with a live demonstration for selected customers at both events, offering a deeper insight into the upcoming innovation and its availability.

Discover more about relevant environmental parameters and Sensirion’s other innovative environmental sensors at www.sensirion.com/environmental-sensing.

1.5V battery powers white-LED driver

Although white LEDs are common in a variety of lighting applications, their 3 to 4 V forward-voltage drop makes low-voltage applications challenging. Charge pumps and other ICs are available for driving white LEDs, but they generally don’t work with the low supply voltage of 1.5 V in single-cell-battery applications.

The low-voltage circuit of Figure 1 provides a current-regulated output suitable for driving white LEDs. The boost converter, IC1, can supply load currents to 62 mA with input voltages as low as 1.2 V, making it suitable for use with a 1.5 V, single-cell battery. Because a white LED draws negligible load current until the output voltage rises above 3 V, the boost converter can start with input voltages as low as 0.8 V.

Figure 1

By deriving feedback from a high-side current-sense amplifier, IC2, the circuit allows current regulation without sacrificing efficiency. IC2‘s 1.8-MHz bandwidth also eliminates instability in the feedback loop. IC2 amplifies the voltage across R1 with a gain of 20. This high gain boosts efficiency by enabling use of a small-valued current-sensing resistor. You can calculate the value of R1 from the desired output current:

For 1.5 V input and 62-mA output, the circuit efficiency of Figure 1 is approximately 80%. Zener diode D1 provides overvoltage protection at the output. When the output voltage rises above the sum of the zener voltage (VZ) and IC1‘s 1.235 V feedback voltage (VFB), the feedback voltage (Pin 3) rises and causes IC1 to stop switching. Thus, for an open-circuit output, the output voltage is regulated at VZ + VFB.

by Steve Caldwell via EDN

ASRock announces four Whiskey Lake-U based products

ASRock Industrial has announced four new products based on Intel’s 8th Gen Whiskey Lake-U: a thin Mini-ITX “IMB-1216” board, a 3.5-inch “SBC-350,” a NUC 4×4 form-factor “iBox-8365U” mini-PC and NUC-8365U mainboard. The IMB-1216 thin Mini-ITX board and the 3.5-inch SBC-350 boards run the quad-core, dual-threaded Core i5-8365U, clocking at 1.6GHz (4.1GHz Turbo). The iBox-8365U mini-PC and the NUC-8365U board that enables it, features the i5-8365U in a BGA 1528 package and also supports the 1.8GHz (4.6GHz Turbo), quad-core Core i7-8565U and the dual-core, 1.8GHz (3.9GHz Turbo) Core i3-8145U. Similar to the i5 model, these are both dual-threaded and enables Intel Gen9 UHD Graphics 620 with 24 EUs and a 15-25W TDP.

IMB-1216 portside view

ASRock’s announcement mentions only Windows 10 support, but other sites list Linux support. The iBox-8365U runs Linux 2.6. The four products offer up to up to 32GB of dual-channel, 2400MHz DDR4, including ECC RAM. The IMB-1216 offers a 170 x 170mm Mini-ITX design with a low profile, with support for industrial applications with a semi-extended 0 to 60°C range and offers a choice of 12V or 19-28V DC inputs with an AT/ATX switch. The IMB-1216 is fitted with 2x Gigabit Ethernet ports (Intel and Realtek) and 2x SATA III ports, and also a SATA power output. It utilizes the Whiskey Lake support for USB 3.1, and offers 4x USB 3.1 host ports and a fifth internal 3.1 interface. Available also, are three USB 2.0 headers, with 2x RS232/422/485, 3x RS-232, and 8x GPIO interfaces. Its triple display feature is supported via 4K-ready HDMI and DP++ 1.2 ports and internal VGA and LVDS (or eDP) headers.

iBox-8365U, front

Other features include dual audio jacks, a speaker header, watchdog and TPM security, triple M.2 slots are available, a Key-M (2242/2260/2280) socket with PCIe x4 or SATA III, and a Key-B (3042) with USB 2.0 for 4G, which is accompanied by a SIM slot. The SBC- 350 board offers a 0 to 60°C range and enables either a 12V or 12-36V input with an AT/ATX switch.

The SBC-350 is also equipped with 2x Intel-based GbE ports, 2x DisplayPort, and 4x USB 3.1 ports on the coastline. It also includes an LVDS interface, which enables triple simultaneous displays, and a SATA III port. 4x USB 2.0, 4x RS232/422/485, and 4x in/4xout GPIO are available. The SBC-350 is equipped with a Key-M (2242/2260/2280) socket for storage and a Key-E (2230) for wireless. Available also is a speaker, TPM, and SATA power headers.

There are no details on the separately available NUC-8365U, but it seems to be the board inside the iBox-8365U. The iBox-8365U mini-PC is similar to Ryzen’s R1000 based iBox-R1000, which similarly adopts the 4×4 NUC form-factor. The 171.8 x 150 x 71.5mm, 2.2 kg PC ships with an active heatsink referred to as “fansink.” The skin supports 0 to 50℃ temperatures. Available also is a standard 12V DC input and Kensington Lock support. The iBox-8365U is further equipped with a 2.5-inch SATA III bay, and 2x GbE ports (Intel and Realtek). Triple display feature is enabled via 2x DP and a single HDMI port. Other features include 3x USB 3.1 ports and a DB9 port with RS232/422/485. Internal interfaces features include a second USB 2.0, 2x RS-232, and an audio header, with watchdog being on board. There is no pricing or availability information provided for the “preliminary” IMB-1216, iBox-8365U, and NUC-8365U or the “coming soon” SBC-350.

More information can be found in ASRock Industrial’s announcement, and also IMB-1216, SBC-350, and iBox-8365U product pages.

Conversa – USB 3.1 Camera with Microphone supports Low Light

e-con Systems is a leading camera solutions provider making state of the art camera modules, and also have recently added a new camera module to their collection called Conversa. e-con system’s cameras include standalone MIPI camera modules, USB cameras, and stereo cameras.

The Conversa also known with the code name See3CAM_CU38 is a USB 3.1 Gen 1 based Camera with an inbuilt stereo microphone and supports low light environment. The camera module is a 3.4 MP custom lens fixed focus camera, and the built-in stereo microphone can provide 16bit audio @48KHz. Supplied with the camera is an S-mount (M12) lens holder that is expected to allow users to choose what sort of lens they choose to use with it.

Conversa – A USB 3.1 Camera with Microphone and supports Low Light

The Conversa camera module is based on its predecessor, the See3CAM_CU30, which is a similar low light USB camera but doesn’t feature a microphone. The camera is based on the AR0330 sensor from ON Semiconductor which gives it the superbly low light performance. The camera can stream FHD (1920 x 1080) at 60 fps and HD (1280 x 720) at 60 fps in both Uncompressed UYVY and Compressed MJPEG formats.

Conversa – A USB 3.1 Camera with Microphone and supports Low Light

With a dedicated ISP (Image Signal Processor) chip, the camera can perform all the Auto functions (Auto White Balance, Auto Exposure Control) with support for a processing pipeline which helps in providing video and MJPEG compressions. It is a plug-and-play (UVC and UAC) compliant USB 3.1 Gen1 SuperSpeed camera and is also backward compatible with USB 2.0 host ports.

Main Benefits

Main benefits of this camera are the high resolution along with the USB3.1 interface support which enables the user to capture details of the filming field without any lag or delay on the connection to your PC. The USB3.1 interface and the accompanying Windows and Linux software (e-CAMView and QtCAM) let you preview video and capture still photos with ease. Still images have a resolution of 3.4 MP (both MJPEG and BMP) and all parameters are automatically configured from the UVC control to enable you capture the best available image. Additionally there is a stereo microphone on board that help you record clear and vivid sound without much effort.

Device Specifications

Camera Module Features

  • Sensor: AR0330 from ON Semiconductors
  • Sensor Resolution and Optical Format: 4 MP CMOS Image Sensor. 1/3″ Optical format
  • Sensor type: 4 MP CMOS Electronic Rolling Shutter Sensor
  • Image Signal Processor: External ISP
  • Output Format: Uncompressed UYVY format and Compressed MJPEG format

Sensor Features

  • Pixel size:2μm x 2.2μm pixel
  • Sensor Active Area:2304(H) x 1536(V)
  • Responsivity:0 V/lux-sec (550 nm)
  • SNR:39 dB
  • Dynamic Range:5 dB
  • Shutter type: Electronic Rolling Shutter
  • Focus Type: Fixed focus
  • DFOV: 4MP – 120° (with the lens provided by e-con)

Microphone Features

  • Channels: 2 (Stereo)
  • Bit depth:16 bit
  • Sampling Frequency:48 KHz

Targeted Applications

  • Door bell camera
  • In-car security
  • Rescue AGV camera
  • Microscope Camera
  • Video conference
  • Badge camera

Others

  • OS Support: Windows, Linux, and MAC (requires talking with support)
  • Image Resolutions: 3.4MP (Both MJPEG and BMP)
  • Operating Voltage: 5V +/- 5%, Current – 512mA
  • Operating Temperature Range: -30°C to 70°C
  • Power requirements: Max – 2.55W & Min – 1.20W
  • Capture Mode: External trigger signal control & Software application control
  • Zero Shutter Lag: 3.4 MP still capture with zero-lag-shutter
  • UVC Controls: Brightness, Contrast, Sharpness, Saturation Control, Gamma Control, Pan-tilt zoom, Digital zoom (up to 8x), and many more.
  • UAC Controls: Volume, and mute.
  • Extras: Face detection, Smile detection, Orientation controls, Frame rate control, and Image capture -burst mode.
  • Dimension – 30 x 30 x 30.2 mm (without lens & with M12 holder)
  • Weight in Grams: 14 Grams (without lens) & 19 Grams (with lens)

e-Con System has also released sample applications for use with the camera:

  • e-CAMView – A Windows camera application for video preview and still capture.
  • QtCAM – Linux Camera application for Video Preview and Still Capture.
Conversa Evaluation Kit

In addition to Conversa, an evaluation kit is available and comes with e-CAMView (Windows) / QtCAM (Linux) – Sample application for Video Preview and Still Capture along with the UVC Extension features (for Windows 10, Windows 8.1, Windows 7, Linux and MAC *).

Introduction Video

The Conversa camera is available for purchase as sample in two options: The camera with lens is available for $169 here, and the camera without lens is available for $139 here. More information about the product is available on the product page, and the datasheet is available here.

3V DACs used in ±10V applications

Boosting DAC’s output to drive larger voltage tackled in this app note from MAXIM Integrated.

Many modern systems have the majority of their electronics powered by 3.3V or lower, but must drive external loads with ±10V, a range that is still very common in industrial applications. There are digital to analog converters (DACs) available that can drive loads with ±10V swings, but there are reasons to use a 3.3V DAC and amplify the output voltage up to ±10V.

3V DACs used in ±10V applications – [PDF]

4X4-R1000 – NUC-R1000 AMD RYZEN embedded CPU

Asrock introduced their “4X4-R1000” SBC along with some preliminary specifications and features. There is not much information available nor pricing, so we will limited on the the features and specifications provided. This SBC is based on AMD RYZEN embedded CPU, accompanied with up to 32GB DDR4 memory and various peripherals as seen below.

Spotlight Features

  • AMD RYZEN embedded CPU
  • Supports Dual Channel DDR4 SO DIMM 2400 MHz, up to 32GB
  • 2 x Displayport, 1 x HDMI
  • 3 x USB 3.1, 2 x USB 2.0, 1 x SATA3, 1 x COM
  • 1 x M.2 KEY M, 1 x M.2 KEY E
  • 2 x Realtek LAN
  • 1 x LPC header
  • 12V DC-In

Product page is located here: https://www.asrockind.com/overview.us.asp?Model=4X4-R1000

Siglent SDL1000X/X-E Series Programmable DC Loads offer advanced performance options

The new Siglent  SDL1000X/X-E Series Programmable DC Loads, which can be set to simulate a wide range of load characteristics.  Four models offer two different resolutions and two power capacity choices with an input range of 150V/30A.  The SDL1020X/SDL1020X-E versions are 200W models, while the SDL1030X/SDL1030X-E versions have a 300W capability. The ‘X’ versions have a measurement resolution of 0.1mV/0.1mA, and the ‘X-E’ versions offer a resolution of 1mV/1mA .  Both series have adjustable current rise times from 1mA/us to 2.5A/us. 

The SDL1000X/X-E Programmable DC Electronic Loads offer advanced performance specifications and user-friendly control featuring a 3.5” TFT-LCD display, capable of displaying multiple parameters and states simultaneously.  All models support four types of static/dynamic modes: constant current, constant voltage, constant resistance, and constant power. Remarkable for their high-speed response performance, these electronic loads offer a dynamic test mode, periodically switching between two preset levels at up to 25kHz.

Built-in additional features in the SDL1000X/X-E series help with numerous testing situations. For example, these loads have a CR-LED mode designed specifically for LED driver experiments. This can emulate an LED’s actual electrical characteristics.  Also, a 4-wire sense compensation mode has been included in the design, which can effectively remove any errors due to the voltage drop in the connection wires. In addition, an operator can use the Program function (with up to 50 groups) and a List function (with up to 100 steps) to simplify even complex experiments.  This can be especially useful when designing battery charging circuits.

These loads can be externally controlled by analog input or via the USB/LAN interfaces with the provided PC software. Comprehensive protection modes include adjustable over-current protection, over-voltage protection, over-power protection, over-temperature protection, and reverse voltage protection. When any of these occur, the loads will immediately turn input circuitry off and stop current sinking in order to keep equipment safe from damage.

The SDL1000X series delivers a stable load testing device for a wide range of testing requirements, including: power experiments, battery and handheld device design, LED lighting, automotive electronics, and aerospace and industrial applications.  These electronic loads are made by Siglent Technologies, a leading high quality test equipment manufacturer, with a growing worldwide reputation.  The SDL1000X/X-E Programmable DC Electronic Loads are available now from Saelig, their USA technical distributor.

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