PiSugar – Battery for Raspberry Pi zero

Raspberry Pi zero is very small, but it’s not cute with a power bank which maybe five times bigger. PiSugar is a battery project designed for Pi zero. It’s super easy to use, no need for soldering, no conflict with other piHats. It perfectly matches the size of Pi zero. via Jdaie @ hackaday.io

Many software engineers are able to developing products base on raspberry pi, but few of them are good at soldering. Pi zero is very small, it’s a good choice when you plan to create a portable prototype. But when it comes with a power bank connected, it’s not longer that cute. So we are thinking if there is a portable, solderless solution to supply power for pi zero, it will be very friendly for raspberry pi beginners!

PiSugar is a combination of a 3.7V, 900mAh lithium-ion battery and a PCB that provides voltage regulation and charging. Both the battery and PCB have the exact same footprint size as the Raspberry Pi Zero and Zero W.

The project is open-source, so you can find all of the files on GitHub, including 3D-printable enclosures.

App note: How to use power inductors

A great guide from TDK about power inductors used in DC-DC converters.

As electronic devices become more advanced, the power supply voltage of LSIs used in them is lowered, so their power consumption can be reduced and their speed increased. However, a decrease in the power supply voltage also causes the requirements regarding voltage fluctuations to become more severe, creating a need for high-performance DC-DC converters to fulfill these characteristic requirements, and power inductors are important components that greatly affect their performance. TDK has a widely varied lineup of power inductor products, and this article describes and explains effective methods for using power inductors, and key points for selecting them, according to the required characteristics of DC-DC converters.

App note: How to use power inductors – [Link]

VersaLogic new Android based SBC is an avenue to the Android Markets

VersaLogic, a frontier in the development of single board computers, has recently launched a new SBC that is designed for the Android markets called the Android Eval Kit.

The new kit will be an upgrade from Versalogic having generally been know to produce mostly Linux, and sometimes Windows-based single board computers like the Zebra SBC, SandCat, or the Tetra SBC. VersaLogic’s new Android Eval Kit provides an easy way to evaluate Arm/Android performance and includes everything needed to run the Android OS on a high-reliability embedded system.

Versalogic Android Eval Kit Tetra
Versalogic Android Eval Kit

The “Android Eval Kit” is based on the old NXP i.MX6 that powers both the Tetra and Zebra SBC but comes with a notable 7-inch HDMI 1024 x 600 touchscreen, adapters, hubs and basically everything to make you kickstart your Android experiences. It is pre-loaded with Android 8.0. There are no needs for additional carrier cards, companion boards or other add-ons, it’s just a full fledge SBC, think about it as Raspberry PI that supports Android.

The kit is basically a Tetra Single Board Computer (SBC) with a Quad-core i.MX6 – 7″ display with touch screen. Android Oreo is loaded on the accompanying microSD card, so need to worry about installing or downloading the OS. Also, you will get a wall power adapter, USB hub, startup guide, and all required cables.

Considering the kit is based on the Tetra SBC, it is expected to have a similar footprint of 125 x 95mm, that also matches the COM Express basic computer-on-module specification. Due to i.MX6 processor, power consumption is relatively low, something around 5 Watts.

Versalogic Tetra SBC
Versalogic Tetra Single Board Computer

RAM specification still follows the existing Tetra design, ships with 2GB or 4GB DDR3L SDRAM. All storage is optional, including 32GB eMMC, SATA II, and mini-PCIe-based mSATA. Other features like the 2x USB 2.0 host ports, an HDMI 1.4 port, CAN and serial interfaces, 2-lane MIPI-CSI for a camera, and a GbE port, with the usual i.MX6 bandwidth restrictions will be available.

The kit is designed and tested for industrial temperature (-40° to +85°C) operation and meet MIL-STD-202 specifications for impact and vibration.

What will you get in shipping package?

  • Tetra Single Board Computer (SBC) with Quad-core i.MX6
  • 7″ 1024 x 600 HDMI Touch-screen flat panel display
  • Pre-loaded Android (Oreo 8.0) on MicroSD card
  • Wall power adapter
  • USB Hub
  • Start-up guide
  • Required cables

The Versalogic’s Android Eval Kit (P/N: VL-EVK-ARM-AND1) is available for $599. More information may be found here. More details on the device specifications are available on the Tetra product page.

MAX86150 Integrated in-Sync PPG and ECG Biosensor Module for Mobile Devices

Maxim’s MAX86150 delivers both photoplethysmogram (PPG) and electrocardiogram (ECG) measurements for health monitoring from a mobile, battery-powered device. The MAX86150 is a biosensor module comprised of internal LEDs, photodetectors, and an ECG analog front-end (AFE) to provide highly accurate, FDA-certifiable PPG and ECG performance in compact power-saving designs which include mobile phones, laptops, tablets, and smart speakers.

Delivering synchronized PPG and ECG measurements has been challenging because designers have had to utilize two separate biosensors that together consume more board space and power than a mobile device can typically afford. In addition, achieving high accuracy in the measurements has also been challenging, particularly in cases where sensor sensitivity might be impacted by low perfusion levels or dry skin. The MAX86150 overcomes these challenges, sampling both PPG and ECG simultaneously to provide the highest sensitivity of pulse transit time. The module can be shut down through software with near-zero standby current which reduces the battery drain but allows the power rails to remain powered at all times. The MAX86150 is available in a 3.3 mm x 6.6 mm x 1.3 mm, 22-pin optical module.

Block Diagram

Features

  • Electrocardiogram (ECG) Optimized for Dry Electrode Operation
  • Reflective Heart Rate Monitor and Medical-Grade Pulse Oximeter
  • Miniature 3.3mm x 5.6mm x 1.3mm 22-pin Optical Module
  • Optical-Grade Glass for Long-Term Optimal and Robust Performance
  • Ultra-Low Power Operation for Mobile Devices
  • Ultra-Low Shutdown Current (0.7μA Typical)
  • Robust Motion Artifact Resilience (Heart Rate Monitor)
  • High SNR and Robust Ambient Light Cancellation
  • -40°C to +85°C Operating Temperature Range

Applications

  • Fitness assistant devices
  • Smartphones
  • Tablets
  • Wearable devices

more information on Maxim’s website and on digikey.com. Available units: MAX86150EFF+T and MAX86150EFF+

[Update 2/05/2019] Related Project: Blood Pressure Without a Handcuff Using the New MAX86150

Ganymede MEMS Speakers can be retrofitted into standard enclosures

USound GmbH’s Ganymede Achelous and Adap MEMS speakers with their compact size of 4.7 mm x 6.7 mm x 1.6 mm are ideal for in-ear headphone designs and wearables such as true-wireless headsets. The perfect addition to traditional speakers, they can be easily retrofitted into standard enclosures to improve treble or implement 3D audio systems.

Achelous is a MEMS speaker designed for occluded-ear headphones. It can also be used as a micro-tweeter for wearables and array applications. This speaker provides higher excursion and more damping ideal for in-ear designs. In free-field, the resonance is lower than Adap, which allows a lower crossover frequency.

Adap is a MEMS-based micro-speaker for occluded-ear headphones and can also be used as micro-tweeter for wearables and array applications. It is optimized as a tweeter with high SPL above resonance. The Adap has a higher resonance frequency.

Features

  • Small form factor
  • High flexibility for acoustic system integration
  • Low heat generation
  • No magnetic field
  • High input impedance suitable for thin wires or PCB traces
  • Efficient MEMS actuator
    • High force and displacement
    • High signal-to-noise ratio (SNR)
    • Low power consumption compared to conventional speaker systems
    • Creates a clear and crisp sound for a vivid audio experience
  • High integratability
    • Easy integration with MEMS microphones
    • Capable of operating as a piezo microphone
    • The compact size enables array/matrix configurations and audio functionalities, such as ultrasonic applications and beam-forming
  • Noise cancellation
    • Ideal speaker technology for active noise cancellation applications
    • Perfect for 3D audio applications for augmented and virtual reality

Video

Availability

GEN2 650V SiC Schottky Diodes Offer Improved Efficiency, Reliability and Thermal Management

Power Semiconductor sic schottky LSIC2SD065DxxA LSIC2SD065ExxCCA group image

Littelfuse, Inc. today introduced two second-generation series of 650V, AEC-Q101-qualified silicon carbide (SiC) Schottky Diodes. The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are available with a choice of current ratings (6A, 8A, 10A, 16A or 20A). They offer power electronics system designers a variety of performance advantages, including negligible reverse recovery current, high surge capability, and a maximum operating junction temperature of 175°C, so they are ideal for applications that require enhanced efficiency, reliability, and thermal management.

When compared to standard silicon PN-junction diodes, the 650V Series SiC Schottky Diodes support dramatic reductions in switching losses and substantial increases in the efficiency and robustness of a power electronics system. Because they dissipate less energy and can operate at higher junction temperatures than Si-based solutions, they allow for smaller heat sinks and a smaller system footprint. This provides end-users with all the advantages of more compact, energy-efficient systems and the potential for a lower total cost of ownership.

Typical applications for 650V Series SiC Schottky Diodes include:

  • power factor correction (PFC),
  • buck/boost stages in DC-DC converters,
  • free-wheeling diodes in inverter stages,
  • high-frequency output rectification and
  • electric vehicle (EV) applications.

These new series are our first 650V SiC Schottky Diode offerings; all our previous releases were 1200V-rated devices, so we can now address a wider range of applications and further complement the Littelfuse SiC MOSFET portfolio,” said Christophe Warin, Silicon Carbide Product Marketing Manager, Semiconductor Business Unit at Littelfuse. “Their AEC-Q101 qualification puts these diodes in a higher class than similar devices in terms of quality and reliability.

The 650V Series SiC Schottky Diodes offer these key benefits:

  • AEC-Q101-qualified diodes exhibit exceptional performance in demanding applications.
  • Far lower switching losses than silicon bipolar diodes and fast, temperature-independent switching behavior make these devices suitable for high-frequency power switching.
  • The positive temperature coefficient enables safe operation and ease of paralleling.
  • The 175°C maximum operating junction temperature provides a larger design margin and relaxed thermal management requirements.

Availability
LSIC2SD065CxxA Series SiC Schottky Diodes are available in TO-252-2L (DPAK) packages, in tape and reel format, with a minimum order quantity of 2,500 devices. LSIC2SD065AxxA Series SiC Schottky Diodes are available in TO-220-2L packages, with 50 devices packed in a tube, with a minimum order quantity of 1,000 pieces. Sample requests may be placed through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit Littelfuse.com.

For More Information
Additional information is available on the LSIC2SD065CxxA Series SiC Schottky Diodes product page and LSIC2SD065AxxA Series SiC Schottky Diodes product page. For technical questions, please contact: Christophe Warin, Silicon Carbide Product Marketing Manager, Semiconductor Business Unit at Littelfuse, cwarin@littelfuse.com

Win a TE AmbiMate MS4 Dev Kit!

Here’s your chance to win a TE AmbiMate MS4 Sensor Module Dev Kit, together with an Arduino MKR1000! TE AmbiMate MS4 development kits enable you to build prototypes and evaluation boards for systems incorporating TE’s state-of-the-art AmbiMate MS4 Series sensor modules.

To enter the giveaway, you must subscribe or be a current subscriber to our newsletters covering the newest products and latest applications. But hurry, the giveaway ends April 30th, 2019.

>> ENTER NOW

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SiFive Launches the World’s Smallest Commercial 64-bit Embedded Core

RISC-V Leader brings unmatched advanced 64-bit Core IP capability to embedded space.

SiFive, the leading provider of commercial RISC-V processor IP, yesterday announced the launch of the S2 Core IP Series at the Linley Spring Processor Conference in Santa Clara. The S2 Core IP Series is a 64-bit addition to SiFive’s 2 Series Core IP and brings advanced features to SiFive’s smallest microcontrollers. The S2 Series further adds to SiFive’s extensive, vastly customizable, optimized, silicon-proven, embedded core IP portfolio, which comprises the 2, 3, 5, and 7 Core IP Series in E (32-bit) and S (64-bit) variants.

Edge SoCs face the diverse requirements of real-time latency, deterministic capability and stringent power constraints. The S2 enables SoCs to have an always-on low power CPU that can be combined with high-performance CPUs that switch on only when applications demand performance, such as in voice-activated smart devices. The 2 Series can be configured to be as small as just 13,500 gates (in RV32E form). The S2 is just half the size of a similarly configured S5 core. Security is enhanced by separation between secure and non-secure domains. This degree of flexibility is what is needed to meet the constraints in terms of power, area and real-time demands as well as the requirements in terms of performance of modern edge workloads and applications. The S2 Series will be available as a customizable Core IP Series as well as in the form of standard cores via SiFive’s Core Designer.

SiFive’s 64-bit S Cores bring their hallmark efficiency, configurability and silicon-proven Core IP expertise to 64-bit embedded architectures,

said Ted Speers, head of product architecture and planning at Microchip Technology’s Microsemi subsidiary and RISC-V Foundation board member.

The S Cores will enable innovation for the next generation of embedded compute.

The ever-growing number of connected devices with artificial intelligence, machine learning, IoT, and real-time workloads have generated a massive demand for greatly enhanced embedded intelligence in compute at the edge. Legacy architectures have long ignored the need for small, efficient, 64-bit, real-time embedded processors. SiFive has secured more than 25 design wins for the 2 Series Core IP alone since its launch at DAC in June 2018 and is now launching the S2 Series for power- and area-constrained, high performance 64-bit embedded applications. The S2 has no direct competitive equivalent in the market in terms of offering 64-bit capabilities or advanced features within the footprint of a SiFive 2 Series Core IP. The 64-bit capability of the S2 allows for far easier integration than 32-bit physical addressing and provides the benefit of fast and efficient access to slow or far-away memories via flexible memory maps and micro instruction caches. SiFive is the sole RISC-V Core IP provider to offer 64-bit fully coherent heterogenous compute all the way up to nine cores per cluster where high-throughput processing is needed. Existing and new features are shared across E and S variants of the 2 Series, which include enhanced debug and trace.

To achieve SiFive’s mission to democratize silicon and compute, we must rapidly enable embedded intelligence where data touches the real world,

said Yunsup Lee, CTO and co-founder, SiFive.

SiFive recognized a deep need for a full 64-bit embedded solution. We leveraged our unique methodology to rapidly innovate and architect 64-bit, fully heterogenous and coherent, real-time core capability. Our S2 Core IP Series is silicon proven and brings efficiency, performance, and security to enable greater innovation at the edge.

About SiFive

SiFive is the leading provider of market-ready processor core IP, development tools and silicon solutions based on the free and open RISC-V instruction set architecture. Led by a team of seasoned silicon executives and the RISC-V inventors, SiFive helps SoC designers reduce time-to-market and realize cost savings with customized, open-architecture processor cores, and democratizes access to optimized silicon by enabling system designers in all market verticals to build customized RISC-V based semiconductors. Located in Silicon Valley, SiFive has backing from Sutter Hill Ventures, Spark Capital, Osage University Partners, Chengwei, Huami, SK Hynix, Intel Capital, and Western Digital. For more information, visit www.sifive.com.

NexDock 2 Transforms Your Smartphone Into a Laptop

These days smartphones devices have tremendous computing power, and can do virtually everything an actual computer can do. When we are at work, we mostly use our laptops and desktops, but outside the work environment, we mostly our smartphones. However, due to the fact that our smartphones have small screens and lack of keyboard, we still stick so much to our laptops and desktops. There has been various attempts to make lapdocks and laptop shells over the years, with varying degrees of success. However, the team behind 2016’s NexDock is back with a sequel on Kickstarter, called the NexDock 2.

The new NexDock 2 offers you a large screen, and a keyboard which turns your smartphone into a laptop. Launched recently on Kickstarter, the NexDock 2 has already reached nearly triple its funding goal. The NexDock 2 is designed like an ultra-portable laptop, but without a processor, RAM, or hard drive. It comprises of just a screen, keyboard, and battery housed within the laptop. When a smartphone is plugged into the NexDock 2, the laptop utilizes the processor of the smartphone for all of the computing work. For now, the NexDock 2 can only work with smartphones that have a “Desktop Mode,” which is only available on Samsung and Huawei devices, but we hope to see this feature implemented by other smartphones manufacturers in the future.

NexDock 2 is not only compatible with smartphones, but also with single-board computers like the Raspberry Pi. There are plans also, to potentially develop “Compute Sticks” that turn the NexDock 2 into a laptop. The 13.3 screen of the NexDock 2 is a IPS LCD with a full-HD resolution of 1920×1080. The keyboard has a full QWERTY layout, with a multi-touch trackpad. For audio output feature, there are four 1W speakers. Available also are the standard USB, HDMI, and headphone jacks. The first NexDock, on the other hand, delivered a 768p TN panel, a mini-HDMI port, and full-sized USB ports only. The NexDock 2 comes with a 38 Wh battery, but the battery life span isn’t specified. It weighs 1420g, and 15.9mm in thickness.

The Kickstarter campaign for the NexDock2 will run until April 20th. The NexDock 2 is available for $199 for early birds, and it is expected to retail for $279. Backers should be delivered their Rewards in September.

ON Semiconductor continues to make battery-less IoT a reality with Bluetooth® Low Energy

ON Semiconductor, driving energy efficient innovations, continues to enable battery-less and maintenance-free IoT with the introduction of its RSL10 Multi-Sensor Platform powered solely with a solar cell. This complete solution supports the development of IoT sensors using continuous solar energy harvesting to gather and communicate data through Bluetooth® Low Energy, without the need for batteries or other forms of non-renewable energy.

The powerful combination of ultra-low-power wireless communications, small form-factor solar cell and low duty cycle sensing applications makes it possible to develop and deploy totally maintenance-free IoT sensor nodes. The RSL10 Solar Cell Multi-Sensor Platform is enabled by the RSL10 SIP, a complete System-in-Package (SiP) solution featuring the RSL10 radio, integrated antenna and all passive components.

The platform combines the RSL10 with a solar cell and a host of low power sensors from Bosch Sensortec, including the BME280 all-in-one environmental sensor (pressure, temperature, humidity) and the BMA400 ultra-low-power 3-axis accelerometer. Together, they will allow developers and manufacturers to create complete IoT nodes that are entirely powered through renewable energy or energy harvested from the sensor’s surroundings.

After the success of the RSL10 Sensor Development Kit, we are thrilled to work with ON Semiconductor on a new cutting-edge sensor development platform that is entirely solar powered,” said Dr. Peter Weigand, Vice President of Marketing, Bosch Sensortec. “The BMA400 is the first real ultra-low-power accelerometer that doesn’t compromise on performance. Combined with the BME280 integrated environmental sensor, this provides a comprehensive sensing solution for IoT applications such as climate control, intrusion detection and asset tracking.

Commenting on the release of the RSL10 Solar Cell Multi-Sensor Platform, Wiren Perera, who heads IoT at ON Semiconductor, said:

To support the growth of IoT, manufacturers are actively investigating alternative sources of energy to power their designs, helping to reduce environmental impact and lower manufacturing and maintenance costs. With this solution, established on the RSL10 Bluetooth Low Energy radio, we are proving that a battery-free and maintenance-free approach to smart sensor development is not only possible but can help manufacturers improve their designs.

There are a growing number of IoT sensor applications where the duty cycle is low enough to support intermittent communications, allowing the energy needed to support operation to be harvested using renewable sources. The energy efficiency of the RSL10 is augmented by the highly efficient power management system and the ultra-low-power sensors implemented in the platform. Applications are expected to include smart home and building automation such as HVAC control, window/door sensors and air quality monitoring. Asset tracking including package open/close detection, shock monitoring, and temperature and humidity data logging are also possible applications.

Features

  • Provides continuous sensor technology with no battery required
  • Provides industry’s lowest power Bluetooth® Low Energy technology enabled by the RSL10 SIP
  • 55 nw in Standby Mode , 10 mW in Rx, and Tx at 0 dbm
  • Supports Beacon and telemetry transmission
  • Fully re-programmable with SEGGER J-Link with Arm® Cortex® Debug connector (10-pin) adapter.
  • Ultra-low leakage
  • Adaptive duty cycle (self-detection of energy availability for transmission)
  • Dual solar cell interface (Through-holes wire soldering or ZIF interface )
  • Ultra-low-power smart sensors
  • Low voltage, high accuracy temperature sensor with wide temperature range (- 40 to 125C ) (NCT203)
  • Combined digital humidity, pressure and temperature sensor (BME280)
  • Smart 3-axes ultra-low power accelerometer (BMA400) with integrated wake up and sleep function
  • Pre-flashed with interweaving Beacon firmware:
  • Eddystone TLM Beacon
  • Broadcasts storage capacitor voltage level, temperature, time since power-up and advertisement packets since power-up
  • Compatible with BLE Scanner applications (iOS® or Android™).
  • Custom Environmental Service Beacon
  • Broadcasts temperature, humidity and pressure
  • Software libraries and examples are available in the B-IDK CMSIS-Pack
  • Supports a wide range of lighting conditions (Artificial or solar light, as low as 180 lux)

For easy development, the platform is supplied with all design files (Gerber, schematic and BoM) and customisable source code as part of a CMSIS software package. The RSL10 Solar Cell Multi-Sensor Platform is available now from ON Semiconductor alongside a number of other energy-efficient rapid prototyping platforms for IoT, including the Energy Harvesting Bluetooth Low Energy Switch which just was just named 2018 China’s Most Competitive IoT Solution by China Electronic Magazine.

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