Android APP Contact Us
login / register Upload
TRENDING:

Tiny Reflow Controller V2 features an OLED display

Posted on by mixos

Rocketscream.com released their all-in-one Arduino compatible reflow controller powered by ATmega328P with OLED screen and built-in USB port. This reflow controller replaces the beloved “Tiny Reflow Controller V1” which had a character LCD display. Let’s see what’s new on this board.

First, it has the tiniest form factor they have ever made and now it comes with an OLED LCD display to plot the reflow curve along with current temperature value. On top of that, they have added a USB-serial interface chip to remove the necessity of an external USB-serial adapter.

Tiny Reflow controller V2 is powered by the ATmega328P coupled with the latest thermocouple sensor interface IC MAX31856 from Maxim, they also managed to remove the need of an Arduino board and reduce the overall cost. All components run on 3.3V to further simplify the design. All you need to build your own reflow controller is an external Solid State Relay (SSR) (rated accordingly to your oven), K type thermocouple (we recommend those with fiber glass or steel jacket), and an oven of course!

You can now select to run a lead-free profile or leaded profile from the selection switch. The example code running the reflow process utilized a PID control provided by the awesome PID library written by Brett Beauregard.

Features:

  • Powered by ATmega328P
    • 3.3V at 8 MHz
    • Arduino Pro / Pro Mini 3.3V 8MHz compatible
  • MAX31856 thermocouple interface
  • 0.96″ 128×64 OLED LCD yellow and blue color
  • 2 push button:
    • 1 to start and stop the reflow process
    • 1 to select the reflow profile (lead-free or leaded) and stored on the non-volatile EEPROM
  • 1 red LED for status indication
  • 1 terminal block for thermocouple type K
  • 1 terminal block for driving SSR (through an NPN transistor, 5mA @ 5V output) to control heating element/oven
  • 1 terminal block for driving SSR (through an NPN transistor, 5mA @ 5V output) to control fan
  • 1 buzzer with transistor for loud and annoying sound
  • 1 reset button
  • ISP pins breakout
  • Built-in USB-serial interface for firmware upload and serial interface
  • Unit is powered through a microUSB connector with 500 mA resettable fuse
  • Comes with extra 4 pieces of M2*5mm spacer (male-female) and 4 pieces of M2*5mm screws if you decided to mount it on the oven’s front panel
  • Dimension – 27.94 mm x 50.80 mm
  • FR4 TG140 PCB with immersion gold (ENIG) finish
  • RoHS compliant – Yes

Schematic

All design files are available on githiub.com and you can buy an assembled and tested unit on www.rocketscream.com for only 29.90 USD.

96Boards launched B-96AI & TB-96AIoT – their First Systems-on-Module (SOM)

Posted on by mixos

Linaro announces 96Boards System-on-Module (SOM) Specification and Rockchip powered compute SOM design.

At the first day of Linaro Connect Bangkok 2019, 96Boards SoM specifications have been announced, together with the introduction of Rockchip RK3399Pro powered TB-96AI and Rockchip RK1808 based TB-96AIoT, which are the first 96Boards compliant SoMs, along with 96Boards SoM Carrier Board.

96Boards System-on-Module Specifications

Two form factors are defined as SOM-CA and SOM-CB with a maximum of four 100 pin Connectors. The X1 connector is mandatory on all SOMs. The defined interfaces are shown in the table below.

List of signals associated to each connectors:

  • X1 – SoM managements, 1x UART, 2x I2C, 1x SD, 2x SPI, 1x CAN, 1x multiplexed DSI/eDP/LVDS, 2x USB 2.0 OTG/Host, 1x USB 2.0/3.0 host
  • X2 – 1x I2S, 1x multiplexed I2S/PCIe, 6x multiplexed GPIO/analog audio, 1x multiplexed MIPI CSI/DSI/Audio, 1x Ethernet, 1x PCIe 4x, 1x USB 2.0 OTG/Host, 1x USB 2.0/3.0 device, 1x smartcard/muxed with PCIe, 1x SATA
  • X3 – 7x GPIO, 4x MIPI CSI inc. 1x multiplexed with MIPI DSI, 1x MIPI DSI multiplexed with MIPI CSI,  1x Ethernet, 1x HDMI
  • X4 – 2x UART, 2x I2C, 1x I2S mux with SATA, 7x GPIO mux with ADC/SPI, 1x SD. 2x SPI, 2x CAN (1x mux), 1x PCIe x4, 1x USB 2.0 OTG/Host, 1x USB 2.0/3.0 host, 1x SATA mux with I2S

That’s plenty of multiplexed signals which at first sight open the door for potential incompatibilities between modules.

The 96boards Wireless specification defines wireless modules with 802.15.4, BLE, WiFi, LoRa, NB-IoT, LTE-M, and future wireless standards. Again two form factors are specified with SOM-WA and SOM-WB and 20-pin are defined with GPIO, PWM, UART, SD, SPI, I2C, ADC, USB, SWD, and VDD/ground.

 

TB-96AI SOM

The TB-96AI , equipped with RK3399Pro, has an integrated neural network processor NPU, computing power of up to 3.0 Tops, and offers compatibility across a variety of AI architectures. It can be combined with the backplane to form a complete industry application motherboard, and be applied to various embedded artificial intelligence fields.

TB-96AIoT SOM

Equipped with the RK1808 AIoT chip, 22nm process, ultra low power consumption with Independent NPU and AI computing power of up to 3.0Tops, the TB-96AIoT also provides rich interfaces and strong scalability.

96Boards SOM Carrier Board

The 96Boards SOM Carrier Board is compatible with both the TB-96AI and TB-96AIoT. It is designed to suit different markets and demonstrates how easy it is to support multiple different SOMs.

Key features:

  • 4x 100-pin connectors for 96Boards SoM
  • Storage – Micro SD card
  • Video Output – 4-lane MIPI DSI (eDP), HDMI 2.0, LCD header
  • Audio – 3.5mm audio jack, speaker header
  • Camera – 2x 4-lane MIPI CSI connectors
  • Connectivity – 2x Gigabit Ethernet, Dual band WiFi + Bluetooth module
  • USB – 3x USB 3.0 ports, 1x USB type-C port
  • Expansion
    • 2x PCIe sockets
    • LS & HS connectors for mezzanine products
    • CAN bus header
  • Debugging – micro USB debug port, JTAG
  • Misc – Reset, power, and 2x user buttons; user LEDs, and system LEDs; RTC battery socket
  • Power Supply – 12V DC

The full scope of Linaro engineering work is open to all online. To find out more, please visit http://www.linaro.org and http://www.96Boards.org. You’ll also find details about all three hardware platforms on the products page of the company.

Type 1LV – Lowest power WiFi/Bluetooth module opens new applications

Posted on by mixos


Type 1LV is a small and high performance module based on Cypress CYW43012 combo chipset which supports WiFi 802.11a/b/g/n + Bluetooth 5.0 BR/EDR/LE up to 72.2Mbps PHY data rate on Wifi and 3Mbps PHY data rate on Bluetooth. 2Mbps LE PHY is also supported. The WLAN section supports SDIO v2.0 SDR25 interface and the Bluetooth section supports high-speed 4-wire UART interface and PCM for audio data.

In IEEE 802.11ac-friendly mode, the WLAN operation supports MCS8 (256 QAM) in 20MHz channel for data rate up to 78Mbps.

The CYW43012 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorighms, which ensure that WLAN and Bluetooth collaboration is optimized for maximum performance.

Teaming with Cypress allows us to leverage our combined expertise in delivering breakthrough solutions that are game-changers for the market,” says Mehul Udani, Director, Connectivity Solutions for Murata Americas. “Using our proprietary packaging and miniaturization technologies, Murata leads in developing turnkey, transformational tools that ease integration and enable connectivity to help bring IoT to fruition. With this lowest power Wi-Fi module, we now enable a new class of products that were previously designated for Bluetooth.

Embedded IPv6 network stack for use with WICED SDK and TCP keepalive is handled internally, so that host processor can keep sleeping.

In addition to Bluetooth 5.0 2Mbps PHY support, all of optional Bluetooth 4.2 features, LE Secure Connections, LE Privacy 1.2 and LE Data Packet Length Extension, are supported.

Type 1LV module is packaged in an impressively small shielded form factor that facilitates integration into size- and power-sensitive applications such as IoT applications, handheld wireless system, gateway and more.

Shielded Ultra Small Dual Band WiFi 11a/b/g/n+Bluetooth 5.0 Module

  • 2.4GHz & 5 GHz WiFi+Bluetooth Module
  • Network Topology: AP and STA dual mode
  • Chipset: Cypress (CYW43012)
  • Processor: No
  • Modulation: DSSS / CCK / OFDM

High Performance Capabilities for Internet of Things

  • For Industrial IoT, Smart Home, Sensor Network, Gateway
  • 802.11 a/b/g/n 78Mbps
  • NXP i.MX Linux, Cypress WICED

he Type 1LV module is now in mass production and you can find more information on wireless.murata.com

New Artix-7 FPGA Board with M.2 Interface Fits in a Laptop

Posted on by mixos

The Aller board is specifically designed for development and integration of FPGA based accelerated features into other larger designs, it can be used with laptops, desktops, and servers featuring standard 2280 M.2 form factor M-key slot.

Nowadays, most of the new laptops come with M.2 M-key slots for NVMe storage modules and Aller can be seamlessly used with those slots. Open source PCI Express IP cores such as litepcie make the development of PCIe designs very cost-effective.

According to Rohit Sigh, Head of Development at the FPGA Division of Numato Lab, Aller was designed to help users with easier access to flexible and reconfigurable PCI Express infrastructure. With the decline of standard PCs and proliferation of M.2 connectors in Laptops, Servers and Desktop PCs, Aller breaks the barrier to PCI Express designs. Aller can also be used with standard PCI Express slots using M.2-to-PCI Express Adapter without any loss of functionality.

Aller is targeted for the users who want to experiment with PCI Express based FPGA designs using simple and cost-effective hardware. But this does not limit the usage of Aller. It can be used for a variety of PCIe acceleration applications.

The board features a Xilinx Artix-7 100T FPGA, the second-most powerful FPGA in the Artix-7 family. Xilinx FPGAs are at the forefront of the FPGA technology and are the most widely used FPGAs globally. The competitive pricing of Artix-7 puts Aller in the category of affordable PCI Express boards.

Features

  • Device: Xilinx Artix 7 FPGA (XC7A100T-1FGG484C)
  • DDR3: 2Gb DDR3 ( MT41J128M16JT-125:K TR )
  • 4 lane PCIe Gen1 (2.5GT/s)
  • Onboard 1Gb QSPI flash memory for FPGA configuration
  • JTAG header for programming and debugging
  • 100 MHZ CMOS oscillator
  • 1 x Trusted Platform Module (AT97SC3205)
  • M.2 Connector Interface, M-Key
  • Powered from M.2 connector
  • 1 RGB LED for custom use

The Artix-7 100T FPGA features ~101K LUTs, ~126K Flip-flops, ~600KiB Block RAM and 240 DSP slices making it very suitable for acceleration applications.

The compact M-key M.2 form-factor provides Aller with a vast number of motherboards and laptops as possible hosts. Most new systems these days ship with an M.2 M-key slot meant for SSDs. So Aller can directly leverage the huge ecosystem of the motherboards. As opposed to A, B or E-keys, the M-key is more common thanks to the SSD popularity and also sports 4x more PCI Express lanes. Since M-key M.2 form-factor supports PCI Express x4, it results in maximum theoretical bandwidth of 1GB/s between Aller and host system, i.e, four times more than competing products.

Featuring an onboard Trusted Platform Module (TPM) IC means Aller users can completely offload their security sensitive computations to the FPGA. TPM helps in secure management of cryptographic keys.

Applications

  • Product Prototype Development
  • Accelerated computing integration
  • Development and testing of custom embedded processors
  • Signal Processing
  • Memory Intensive FPGA development
  • Educational tool for Schools and Universities
  • High Hash Rate calculations for Blockchain technologies such as Bitcoin and Ethereum
  • Offloading computationally intensive algorithms to FPGA
  • Machine Learning and Artificial Intelligence

Aller is a perfect match for several applications such as hardware accelerators, machine learning, and neural network engines, high hash-rate calculations for blockchain technologies, PCI Express kernel driver development training, digital signal processing, and development and testing of embedded processors.

The board is available for purchase at their online store for an introductory price of $399.95 per unit with volume discounts available on request.

For more information, or to purchase Numato Lab products, please visit https://numato.com/ or you can also contact them directly via email at help@numato.com or by phone at 720-513-2210.

High Precision Solder Paste Stencil Printer

Posted on by mixos

This is the most traditional size and classic high precision Solder Paste Stencil Printer for PCBs. The platform can be rotated 30 degrees at most, and the precision can be kept all the way when repeat works. Easy to locate PCB board, high flexibility ensure high printing precision.The brackets using the bolt bar to adjust the height, convenient for controlling the thickness of PCB.
Note, Stencil plate and frame is customized for your own PCBs which is Not included. The picture is only for reference. The solder paste stencil printer starting at $309 with additional accessories available.

Technical Parameters

  • Overall Dimensions（L*W*H) 580*320*259(mm)
  • Platform Size 300*400（mm）
  • PCB Size 270*370（mm）
  • Stencil Size 370*470（mm）
  • Platform Height 180mm
  • PCB Positioning Mode Outside/ Reference Hole
  • Weight 12.7kg

Introduction to Classic 3040 Solder Stencil Printer

This post is a contribution of www.robotdigg.com. RobotDigg offers motorized and linear Delta Robots, Cartesian XYZ, SCARA, SLA 3D Printer, Benchtop Surface Mount, CNC Laser, Robotics and many more products.

Win a Texas Instruments Evaluation Module!

Posted on by mixos

Presenting the Texas Instruments Evaluation Module Giveaway

Here’s your chance to take home a Texas Instruments DUAL-DIYAMP-EVM. This “break apart” EVM has several popular op-amp configurations, including amplifiers, filters, stability compensation and other signal conditioning circuits that require two amplifiers. Build anything from a simple amplifier to complex signal chains by combining different configurations. To enter the giveaway, you must subscribe or be a current subscriber to our newsletters covering the newest products and latest applications. But hurry, the giveaway ends March 31st, 2019.

You just need to SUBSCRIBE or be a current subscriber to Mouser newsletters covering the newest products and latest applications to enter.

Texas Instruments DUAL-DIYAMP-EVM

The DUAL-DIYAMP-EVM is an EVM developed for dual package op amps to give users the ability to easily evaluate amplifier circuits.

Keep in mind, the giveaway ends March 31st, 2019.  View official rules »

Seco “SBC-C43” Module Features Cortex-A72 enabled i.MX8.

Posted on by Tope Oluyemi

Seco is developing a 3.5-inch “SBC-C43”, which runs Linux or Android on an up to hexa-core i.MX8, offering up to 8GB soldered DDR4 and 32GB eMMC plus WiFi/BT, 2x GbE, 3x USB, HDMI 2.0 in and out, 2x M.2, and -40 to 85°C support. Seco’s 3.5-inch SBC enables soldered memory and optional industrial temperature support. It’s built to support medical devices, digital signage, edge computing, industrial automation, IoT, smart vision, and vending.

There has been a host of compute modules based on the Cortex-A72 enabled i.MX8, like the Variscite’s VAR-SOM-MX8 and SPEAR-MX8, but Seco’s 3.5-inch SBC-C43, is the first SBC we have come a-cross to feature the Cortex-A72 enabled i.MX8. The Seco SBC-C43 enables NXP’s default Yocto Project Linux stack and also Wind River Linux and Android.

SBC-C43 back view

The SBC supports all three variants of i.MX8, inclusive of the QuadMax with 2x Cortex-A72 cores and 4x Cortex-A53 cores, the QuadPlus which features a single Cortex-A72 and 4x -A53, and the Quad with no -A72 cores and 4x -A53. The clock rates were not listed but judging from Toradex’s Apalis iMX8 module that clocks the -A72 cores at 1.6GHz and the -A53 cores at 1.26GHz, we can say the SBC-C43 will clocked within that range. The three models also feature 2x Cortex-M4F real-time cores as well as 2x Vivante GPU/VPU cores.

The QuadMax incorporates the GC7000XSVX GPU, but the other two models have the Lite version. The video support is the same, but with 4K30 decoding and the capacity to drive up to 4x displays simultaneously. However, the 4K resolution is being shared between the different outputs. The SBC-C43 enables up to 8GB DDR4 and up to 32GB eMMC, which are soldered to the board for a greater durability.

SBC-C43 block diagram

Available also are, a boot flash, a microSD slot, and SATA support through its M.2 Key B slot, which otherwise can load a modem card or other M.2 PCIe add-ons. Media I/O options offers HDMI 2.0a output and input ports, an optional eDP connector, and dual-channel LVDS. The SBC-C43 is further equipped with 4-lane MIPI-CSI, and an audio I/O connector. It offers a USB 3.0 and 2.0 host port and also a micro-USB 2.0 OTG port. Internal I/O features includes 2x USB, 3x serial, 3x CAN, and 6x GPIO. A non-storage ready M.2 Key E slot, and a SIM card slot are available on the module. The SBC offers 2x GbE ports, a WiFi 5 (ac) with Bluetooth module plus internal antennas.

Specifications listed for the SBC-C43 include:

  • Processor — NXP i.MX8 with VPU with H.265 (4K30) and H.264 (1080p60) decoding and H.264 (1080p30) encoding:
  • i.MX 8QuadMax — 2x Cortex-A72, 4x Cortex-A53, 2x Cortex-M4F, 2x Vivante GC7000 / XVSX GPU/VPU
  • i.MX 8QuadPlus — 1x Cortex-A72, 4x Cortex-A53, 2x Cortex-M4F, 2x GC7000Lite / XVSX GPU/VPU
  • i.MX 8Quad — 4x Cortex-A53, 2x Cortex-M4F, 2x GC7000Lite / XVSX GPU/VPU
  • Memory/storage: 2GB, 4GB, 6GB, or 8GB soldered, 1600MHz DDR4, 4MB Quad SPI NAND flash (boot only)
  • Up to 32GB soldered eMMC 5.1, MicroSD slot, SATA via M.2 Key B (see expansion below)
  • Networking/wireless: 2x GbE ports, 802.11 a/b/g/n/ac + BT LE 4.2 module with ceramic SMT antennas, M.2 slots (see expansion below)
  • Media I/O: HDMI 2.0a output port up to 4K, HDMI 2.0a input port, Optional eDP to 4K, Dual-channel 18/24-bit LVDS up to 1080p, Quadruple display support, 2x 4-lane MIPI-CSI, I2S audio codec, Mic-in, line-out via single combo TRRS connector
  • Other I/O: USB 3.0 host port, USB 2.0 host port, Micro-USB 2.0 OTG port, USB 2.0 header plus up to 2x more via M.2 slots, 3x UARTs (RS-485/RS-422, RS-232, TTL), 3x CAN, 6x GPIO, 4x analog inputs, SPI, I2C
  • Expansion: M.2 Key E for PCIe/USB wireless, etc., M.2 Key B for SATA, PCI-e x1, etc. (see memory/storage above), SIM slot
  • Other features — RTC
  • Power — 12VDC input
  • Operating temperature — 0 to or 60°C or -40 to 85°C
  • Dimensions — 146 x 102mm (3.5-inch)
  • Operating system — Yocto, Wind River Linux, Android

More information can be found on Seco’s SBC-C43 product page.

Allwinner H5 SBC is loaded with WiFi, BT, LTE, GPS, and triple CSI

Posted on by mixos

Introducing one of the smallest, most upgrade-able, most complete SBC’s on the market sporting the Allwinner H5, the Prime Series 1. The H5 Quad Core SOM (System on a Module) in our dev kit is perfect for makers and developers.

The SOM Module is loaded with features and the complete kit makes those features easier to access. The system is powered by a 64-bit ARM Cortex-A53 and a ARM Mali 450 MPR GPU. It has 512MB of RAM and 8GB eMMC storage. We found it hard to find a board with support for greater than one (1) MIPI/CSI camera so we included three (3) mipi csi camera ports. This means no multiplexed cameras or additional hardware to provide 360 degrees visibility. For connectivity, we found most systems only had Wi-Fi/Bluetooth or it was an add-on, so there are a plethora of wired and wireless options available. For wireless needs, the system rocks an Atheros 802.11 b/g/n and Bluetooth 4.0 dual-mode BLE all with the built-in antenna, and a GSM/LTE Global services modem with GPS/GLONASS.

Prime Series 1, front

 

Prime Series 1, back

The development board also adds a MicroSD slot for more storage, a 10/100 Ethernet port; so whether wired and/or wireless, we have you covered. The SOM module itself is upgradable, and in our future plans we will release more configurations. Right now it is 512MB, 8GB Emmc. The board itself has GPIO, HDMI, Audio In/Out, Dual USB Type-C, and a USB OTG.

Specifications listed for the Prime Series 1 include:

  • Processor (via H5 Quad Core SOM) — Allwinner H5 (4x 64-bit Cortex-A53 cores @ 400MHz to 1.4GHz) with Mali-450 MP4 GPU; ATECC508A Secure Element
  • Memory/storage:
    • 512MB DDR3 RAM (via H5 Quad Core SOM)
    • 8GB eMMC (via H5 Quad Core SOM)
    • MicroSD slot
  • Networking/wireless:
    • 10/100 Ethernet port
    • Atheros 802.11b/g/n with Bluetooth 4.0 dual-mode BLE (via H5 Quad Core SOM)
    • GSM/LTE global services modem with GPS/GLONASS
    • Internal ceramic antenna
    • Optional U.FL external antenna
  • Media I/O:
    • HDMI port
    • 3x MIPI-CSI
    • 3.5mm audio in and out jacks
    • I2S/PCM header
  • Other I/O:
    • USB 2.0 OTG port
    • 2x USB Type-C ports
    • 5x UART
    • 2x SPI
    • 4x I2C
    • 1x SDIO
    • 2x PWM
    • 60x GPIO
  • Other features — IR receiver; heatsink; micro-USB to USB cables; 2x DF40 80-pin B-to-B connectors to SOM
  • Operating temperature — -20 to 70°C
  • Power — VDD-IO: 3.3 V; Core: 1.1-1.3 V
  • Dimensions — 85 x 55mm
  • Operating system — Images for Yocto project (default); Ubuntu, Android, Windows Embedded ARM, and FreeBSD; optional Uptane OTA (also supports Mender, Balena, and OSTree

In today’s environment, we can’t forget about security. The system comes with the ATECC508A Secure Element for storing cryptographic keys, unique IDs, and supports the creation of FIPS random numbers. So you can provide crypto based security. You only find this in add-on boards from other vendors, and we understand today’s needs so we included it by default.

The Prime Series 1 will go on pre-order for $175 on GroupGets on Mar. 29. No ship date was mentioned, but the website states:

The Prime Series 1 is ready to be ordered, manufactured, and shipped to your destination.

More information on the Prime Series 1, including a link to the GroupGets page, is available on the Optimus Embedded website.

First COM Express Type 7 Module with Intel Atom C3000 Processor

Posted on by mixos

MSC Technologies Presents First COM Express Type 7 Module with Intel Atom C3000 Processor for Server Applications

Stutensee, Germany – MSC Technologies, the technology brand of Avnet Integrated Solutions, presents the MSC C7B-DV, its first COM Express™ module in accordance with the new Type 7 standard, at the embedded world 2018 in Hall 2, Booth 238. COM Express™ Type 7 was introduced in the current COM.0 Rev. 3.0 specification of the PICMG (PCI Industrial Computer Manufacturers Group).

The MSC C7B-DV COM Express™ Type 7 module is equipped with a powerful Intel® Atom™ C3000 series server processor (“Denverton”) and is especially designed for applications where large amounts of data are processed and transferred at high bandwidths. Such applications include edge servers, content servers, Wi-Fi routers in public transportation and image or video processing systems in industry and healthcare. For use in harsh environmental conditions, individual module variants are also specified for the industrial temperature range from -40°C to +85°C. The computer-on-module will be available for at least fifteen years from the product launch of the processor.

The modules can be equipped with seven different Intel® Atom™ server processors, offering broad scalability from four to sixteen processor cores. Relatively inexpensive entry-level models are also available. Via two 260-pin SO-DIMM sockets, the module can be equipped with fast DDR4 SDRAMs with a maximum capacity of 48 GB, optionally with Error Correction Code (ECC). The integrated Infineon Trusted Platform Module TPM 2.0 provides additional security for critical network installations.

Up to five Ethernet interfaces, four with 10Gb and one connection with 1Gb transfer rate, provide high network bandwidth. Up to 22 PCI Express™ (PCIe) lanes enable flexible system expansions and the connection of fast SSD memory. In addition, there are two SATA 6Gb/s interfaces, three USB 3.0 ports, four USB 2.0 and two serial high-speed connections.

To evaluate the MSC C7B-DV family of server modules, MSC Technologies supplies a matching Type 7 carrier board in ATX form factor and a comprehensive starter kit. In addition to numerous interfaces and PCIe slots, the carrier board can optionally be provided with a Board Management Controller (BMC) that supports out-of-band management.

An MSC C7-MB-EV Type 7 carrier board is available for evaluation. The 0 to 85°C tolerant, 305 x 244mm ATX board is equipped with an SD slot, dual SATA III sockets, 4x USB 3.0 ports, and 4x serial headers.

No pricing or availability information was provided for the MSC C7B-DV module. More information may be found in MSC’s MSC C7B-DV announcement and product page.

Qualcomm Unveils Snapdragon 855 Hardware Development Kit (HDK)

Posted on by mixos

Snapdragon 855 is a popular, high-end processor that is found in premium smartphones such as Samsung Galaxy S10 or Xiaomi Mi 9. Recently Snapdragon 855 Mobile Hardware Development Kit appeared on Qualcomm developer website. The Qualcomm® Snapdragon™ 855 mobile hardware development kit (HDK) is a highly integrated and optimized Android development platform designed for technology companies to integrate and innovate mobile device development on the Snapdragon 855 mobile platform.

Snapdragon 855 is a octa-core processor fabricated with 7nm process and comes with WiFi 5, Bluetooth 5.0, GNSS, Gigabit Ethernet, multiple MIPI DSI and CSI interfaces, DisplayPort over USB-C and HDMI outputs and more.

Snapdragon 855 HDK preliminary specifications:

  • SoC –  Qualcomm Snapdragon 855 Octa-core processor with 1x Kryo 485 Gold Prime core at up to 2.8 GHz, 3x Kryo 485 Gold cores at up to 2.4 GHz, and 4x Kryo 485 Silver low-power cores at up to 1.7 GHz, Adreno 640 GPU
  • System Memory – TBD
  • Storage – TBD flash, micro SD card slot
  • Video Output
    • 2x MIPI 4-lane DSI + touch panel
    • 1x HDMI
    • DisplayPort over USB 3.1 type-C port
  • Camera Input – 3x MIPI 4-lane CSI with support for 3D camera configuration
  • Connectivity
    • Gigabit Ethernet
    • WiFi 5 802.11ac 2×2 with MU-MIMO; “WiFi 6 ready”
    • Bluetooth 5.0
    • GNSS  – GPS/GLONASS/COMPASS/GALILEO
  • USB – 2x USB 3.0 type A ports, 1x USB 3.1 type-C port
  • Expansion
    • 2x Sensor I/O connectors
    • Audio input and output header
    • 3.5mm audio headset jack
    • Mini PCIe port
    • 96boards? HS and LS connectors
    • VERTIGO connector (what is it for?)
  • Debugging – 1x micro USB port
  • Misc – 4x user LEDs, WiFi and Bluetooth LEDs, power and volume buttons
  • Power Supply – 12V DC via power barrel, and maybe USB-C port
  • Dimensions – Not specified, but it sure looks like the board follows 96Boards CE Extended specs, so it should be 100×85 mm

The board supports Android 9, and the company provides optional accessories including a 5.7″ touchscreen display with 2560×1440 resolution and expansion board, as well as camera modules, namely 12MP + 5MP front camera, and DUAL 12MP + 13MP rear cameras.

Snapdragon 855 HDK shown with optional LCD display

There is no information accessible on availability and pricing and possibly it should be sold by Intrinsyc with a price tag well over $1,000 without accessories, since Snapdragon 845 HDK already sells for $1,079.

TOP PCB Companies