Search Results for : Infineon Technologies
![Single-Ended, 2-Channel GaN Class D Amplifier – Evaluation Board Single-Ended, 2-Channel GaN Class D Amplifier – Evaluation Board](https://www.electronics-lab.com/wp-content/uploads/2020/05/Infineon-Class-D-feat.jpg)
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Single-Ended, 2-Channel GaN Class D Amplifier – Evaluation Board
The EVAL_AUDAMP24 e-mode GaN HEMT-based evaluation board from Infineon Technologies is a 2-channel, 225W/ch (4Ω at ±43V) or 250 W/ch (8Ω at ±63V) half-bridge class D audio power amplifier for high-end Hi-Fi audio systems. This evaluation board demonstrates how to use the IGT40R070D1...
Continue Reading![OptiMOS™ IPOL voltage regulators with COT engine for enhanced transients and easy design OptiMOS™ IPOL voltage regulators with COT engine for enhanced transients and easy design](https://www.electronics-lab.com/wp-content/uploads/2020/03/OptiMOS_IPOL_product_family-1024x739.jpg)
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OptiMOS™ IPOL voltage regulators with COT engine for enhanced transients and easy design
Infineon Technologies AG introduces the IR3887M, IR3888M and IR3889M devices in its new family of integrated-point-of-load voltage regulators featuring a fast constant-on-time (COT) engine. This product family is designed for today’s server, base station and telecom (operating at...
Continue Reading![High efficiency: A multi-mode, forced-frequency-resonant digital controller IC for SMPS applications High efficiency: A multi-mode, forced-frequency-resonant digital controller IC for SMPS applications](https://www.electronics-lab.com/wp-content/uploads/2020/02/Infineon_package_XDPS21071_DSO-12-10.jpg_1544565615-1024x854.jpg)
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High efficiency: A multi-mode, forced-frequency-resonant digital controller IC for SMPS applications
Infineon Technologies launches the XDP™ digital power XDPS21071, the first flyback controller in the industry with zero-voltage switching (ZVS) on the primary side to achieve high efficiency. This controller is aimed at fast-charging applications such as USB-PD or QuickCharge....
Continue Reading![CoolSiC™ MOSFET 650 V family offers best reliability and performance to even more applications CoolSiC™ MOSFET 650 V family offers best reliability and performance to even more applications](https://www.electronics-lab.com/wp-content/uploads/2020/02/650V_CoolSiC_MOSFET_TO247-4-1024x800.jpg)
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CoolSiC™ MOSFET 650 V family offers best reliability and performance to even more applications
Infineon Technologies AG continues to expand its comprehensive silicon carbide (SiC) product portfolio with 650 V devices. With the newly launched CoolSiC™ MOSFETs Infineon is addressing the growing demand for energy efficiency, power density, and robustness in a wide range of...
Continue Reading![New 600 V CoolMOS™ PFD7 series enables the next level of ultrahigh power-density designs New 600 V CoolMOS™ PFD7 series enables the next level of ultrahigh power-density designs](https://www.electronics-lab.com/wp-content/uploads/2020/02/600V_CoolMOS_PFD7_SOT223-2pin_vA-1024x1024.jpg)
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New 600 V CoolMOS™ PFD7 series enables the next level of ultrahigh power-density designs
Building on superjunction technology innovations and more than 20 years of experience, Infineon Technologies AG broadens its CoolMOS™ portfolio with the PFD7 product family combining best-in-class performance with state-of-the-art ease of use. The devices are suitable for...
Continue Reading![650 V half-bridge SOI driver families with integrated bootstrap diodes offers superior robustness 650 V half-bridge SOI driver families with integrated bootstrap diodes offers superior robustness](https://www.electronics-lab.com/wp-content/uploads/2020/01/2ED-Compact_DSO-8-1024x950.jpg)
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650 V half-bridge SOI driver families with integrated bootstrap diodes offers superior robustness
Infineon Technologies AG broadens its EiceDRIVER™ portfolio with the 650 V half-bridge gate drivers based on Infineon’s unique silicon on insulator (SOI) technology. The products provide leading negative transient voltage immunity, monolithic integration of a real bootstrap...
Continue Reading![3D Image Sensor REAL3 for Face Authentication announced at CES 2020 3D Image Sensor REAL3 for Face Authentication announced at CES 2020](https://www.electronics-lab.com/wp-content/uploads/2020/01/Infineon-miniaturizes-3D-image-sensor-for-facial-recognition-in-phones-FierceElectronics.png)
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3D Image Sensor REAL3 for Face Authentication announced at CES 2020
Infineon Technologies AG has collaborated with software and 3D Time-of-Flight (ToF) system specialist pmdtechnologies ag to develop reportedly the world’s smallest, most powerful 3D image sensor. Designated the REAL3, the single-chip solution measures just 4.4 x 5.1 mm and is the...
Continue Reading![EconoDUAL™ 3 with TRENCHSTOP™ IGBT7 for an unmatched 900 A power rating EconoDUAL™ 3 with TRENCHSTOP™ IGBT7 for an unmatched 900 A power rating](https://www.electronics-lab.com/wp-content/uploads/2019/12/Infineon-EconoDual3-TRENCHSTOP-IGBT7.jpg)
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EconoDUAL™ 3 with TRENCHSTOP™ IGBT7 for an unmatched 900 A power rating
Infineon Technologies AG introduced the new IGBT7 chip for its well-known Easy housing platform in March. Now it is taking the state-of-the-art TRENCHSTOP™ IGBT7 to the arena of medium power: in the standard industry package EconoDUAL™ 3. In this chip technology, the 1200...
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