Search Results for : SoC
![Hardkernel Odroid-smartpower 3 Is A Low-cost Power Monitoring Solution That Sells At $45 Hardkernel Odroid-smartpower 3 Is A Low-cost Power Monitoring Solution That Sells At $45](https://www.electronics-lab.com/wp-content/uploads/2022/08/ODROID-SmartPower-3.jpg)
![](https://www.electronics-lab.com/wp-content/themes/elab/images/advertising_article_events_news_newspaper_icon.png)
Hardkernel Odroid-smartpower 3 Is A Low-cost Power Monitoring Solution That Sells At $45
Low energy consumption is one of the key catalysts for scalable product launches. If your product is power-hungry, customers will certainly give you negative feedback. Consequently, every developer strives to make their products have extended battery lives, and they are increasingly...
Continue Reading![Qwerty Embedded Design crowdfunding ICE-V Wireless FPGA Development Board at $75.00 Qwerty Embedded Design crowdfunding ICE-V Wireless FPGA Development Board at $75.00](https://www.electronics-lab.com/wp-content/uploads/2022/07/ICE-V-Wireless-FPGA-Development-Board-1024x576.jpg)
![](https://www.electronics-lab.com/wp-content/themes/elab/images/advertising_article_events_news_newspaper_icon.png)
Qwerty Embedded Design crowdfunding ICE-V Wireless FPGA Development Board at $75.00
ICE-V wireless mini development board is currently active on GroupGets for community support, which features an ICE40UP5K FPGA and an ESP32-C3-MINI system on chip. The development board looks fairly similar to the Feather board, but there is no confirmation on the dimensions yet. The...
Continue Reading![Forlinx Introduces SBC powered by TI’s newest quad-core Sitara AM6254 processor Forlinx Introduces SBC powered by TI’s newest quad-core Sitara AM6254 processor](https://www.electronics-lab.com/wp-content/uploads/2022/07/file-e1659352605859.png)
![](https://www.electronics-lab.com/wp-content/themes/elab/images/advertising_article_events_news_newspaper_icon.png)
Forlinx Introduces SBC powered by TI’s newest quad-core Sitara AM6254 processor
Forlinx Embedded, a leading manufacturer and supplier focused on designing and providing customers with trusted, ready-to-use, and easy-going ARM single board computers have introduced a new OK6254-C single board computer compatible with a FET6254-C SoM which is based on the quad-core...
Continue Reading![Snapdragon W5+ Gen 1 Wearable Platform with Qualcomm Hexagon DSP V66K AI engine Snapdragon W5+ Gen 1 Wearable Platform with Qualcomm Hexagon DSP V66K AI engine](https://www.electronics-lab.com/wp-content/uploads/2022/07/Snapdragon-W5-Gen-1-Wearable-Platform.jpg)
![](https://www.electronics-lab.com/wp-content/themes/elab/images/advertising_article_events_news_newspaper_icon.png)
Snapdragon W5+ Gen 1 Wearable Platform with Qualcomm Hexagon DSP V66K AI engine
Snapdragon has launched a new hardware platform for next-gen wearable devices for extended battery life, enhanced user experience, and innovative design architecture– Snapdragon W5+ and W5. Adoption of these new hardware platforms comes with the announcement that Oppo and Mobvoi will...
Continue Reading![Accurate Acoustic Sensor – Sound Frequency to Voltage Converter Accurate Acoustic Sensor – Sound Frequency to Voltage Converter](https://www.electronics-lab.com/wp-content/uploads/2022/07/001-4-1024x527.jpg)
Accurate Acoustic Sensor – Sound Frequency to Voltage Converter
The project presented here is a sensitive sound sensor. The circuit converts sound frequency and outputs DC voltage. The board consists of LM358 OPAMP and LM2907 IC. LM358 is used as a dual-stage microphone preamplifier and LM2907 acts as a frequency to voltage converter. The...
Continue Reading![4 x 45W Quad Bridge Audio Amplifier 4 x 45W Quad Bridge Audio Amplifier](https://www.electronics-lab.com/wp-content/uploads/2022/07/002a-1024x696.jpg)
4 x 45W Quad Bridge Audio Amplifier
This is an AB class audio amplifier based on the TDA7388 chip and it is a great choice for car audio applications. This compact board has 4 channels each 26W with 4 ohms speaker. Then IC consists of a fully complementary PNP/NPN configuration and the TDA7388 allows a rail-to-rail...
Continue Reading![The new UP 4000 aims to Bridge the Gap to the Next Generation UP Board The new UP 4000 aims to Bridge the Gap to the Next Generation UP Board](https://www.electronics-lab.com/wp-content/uploads/2022/07/UP-4000_Back_01_1200-01-1024x1024.png)
![](https://www.electronics-lab.com/wp-content/themes/elab/images/advertising_article_events_news_newspaper_icon.png)
The new UP 4000 aims to Bridge the Gap to the Next Generation UP Board
The UP 4000 retains the integrity of the original UP Board but with substantial improvements for modern industrial computing solutions. AAEON blends the classic with the modern with the introduction of the UP 4000, the successor to the trailblazing UP Board. Maintaining the classic...
Continue Reading![Munich-based high-tech startup Toposens is releasing its 3D Ultrasonic Echolocation Sensor ECHO ONE Munich-based high-tech startup Toposens is releasing its 3D Ultrasonic Echolocation Sensor ECHO ONE](https://www.electronics-lab.com/wp-content/uploads/2022/07/Lager_Shot_2_Function0302-768x432.jpg.png)
![](https://www.electronics-lab.com/wp-content/themes/elab/images/advertising_article_events_news_newspaper_icon.png)
Munich-based high-tech startup Toposens is releasing its 3D Ultrasonic Echolocation Sensor ECHO ONE
The Munich based high-tech startup Toposens is announcing the market launch of its first commercial Toposens 3D COLLISION AVOIDANCE SYSTEM for mobile robots based on the proprietary Toposens 3D ultrasonic echolocation technology. This represents a key milestone for the company following...
Continue Reading