BeagleV-Ahead: RISC-V Raspberry Pi Replacement?

In the SBC industry, long dominated by devices like Raspberry Pi and their competitors, BeagleBoards aims to bring innovation by announcing their new BeagleV-Ahead SBC based on the new RISC-V architecture.

RISC-V is an Instruction Set Architecture (ISA) released in 2015 that has proven to be compatible with a wide variety of hardware concerning power, performance, size, and complexity. Historically, SBCs like Raspberry Pis used ARM SoCs to achieve their performance target on small form factor boards. This introduced a limiting factor in compatibility with the board’s choice of software and the performance these processors provided. Despite these limitations, the ARM processors were enough for many IoT-related applications and were widely adopted for their platform support.

What makes the BeagleV-Ahead different?

BeagleBoards, the manufacturer of the BeagleV-Ahead, has designed it to be versatile, powerful, and a compelling option against the mainline SBCs. Thus, the BeagleV-Ahead shares many similarities with a Raspberry Pi 4 in features but is also different in its functionality.

Powering this board is an Alibaba T-Head TH1520 RISC-V SoC with 50 GFLOPS BXM-4-64 GPU, 4 GB LPDDR4 RAM with 16 GB of eMMC storage. It is also equipped with a 4 TOPS INT8 NPU and 2 ISPs which are helpful for image recognition and other machine-learning tasks without requiring additional equipment. Besides all the necessary GPIO found on mainline SBCs like UART, PWM, and I2C, the board is also kitted out with 2 USB connections, Ethernet as well and Micro HDMI. Also, wireless connectivity is provided via the latest standards of WiFi and Bluetooth.

BeagleV Vs Raspberry PI

The Capes Ecosystem of Shields

For adding functionality to the board, BeagleBoards has an alternative like the Raspberry Shields. BeagleBoards markets ‘Capes’ as add-on shields that are specifically designed for boards in the BeagleBone and PocketBeagle family to add more functionality to the existing package without much hassle. MikroBus pin-outs in combination with Capes, can provide an advantage in the development of applications with requirements of large amounts of I/O in less amount of time.

BeagleV-Ahead Features

Linux Powers the RISC-V Board

The BeagleV-Ahead supports Android, FreeRTOS, Fedora, and Linux (even mainline Linux) as the official operating systems. This ensures that the software remains open-standard, developer-friendly, and widely accessible for the development of new projects for the RISC-V architecture.

While the AI and machine-learning capabilities of this board are complemented by Linux, the speed of the NPU and the non-configurable 4GB of RAM limit the applications to the likes of running pre-trained data models or certain calculation accelerations.

RISC-V, being a somewhat new architecture implies that immediate support for all the hardware features as well as pre-developed applications is a rare occurrence and support might flourish once the new architecture gains a wider user base. For developers and users looking for immediate solutions, they should consider other options on the market not based on RISC-V or develop the applications themselves.

Conclusion

In conclusion, the BeagleV-Ahead is a great SBC alternative to the Raspberry Pi with all its features and also the RISC-V architecture. This board also provides a good testing ground for developers who are looking into the development of applications based on the RISC-V architecture.

The Beagle-V Ahead is distributed by various channels and more information can be found on their official webpage. For more information, refer to the documentation.

High-Performance Mixtile Core 3588E: A Compact System-on-Module with Advanced AI Capabilities

Mixtile Core 588E SOM by Mixtile: A high-performance System on Module powered by Rockchip RK3588 SoC, designed for compatibility with NVIDIA Jetson TX2 NX carrier boards.

Mixtile develops Core 588E SOM, a high-performance SOM with an edge connector. Powered by Rockchip RK3588 SoC, this board is compatible with NVIDIA Jetson TX2 NX carrier boards.

Mixtile, a well-known IoT hardware and compute module manufacturer, has recently announced the mixtile core 3588E System on Module. The SOM boasts a powerful Rockchip RK3588 SoC with a 260-pin SO-DIMM connector. The system designers at Mixtile designed the board to be compatible with NVIDIA Jetson TX2 NX carrier boards, making the integration process seamless.

The Rockchip RK3588 system-on-chip ships with four Arm Cortex-A76 high-performance cores at 2.4GHz and four Cortex-A55 low-powred cores at 1.8GHz. It also has a Mali-G610 graphics processor with 6 TOPS NPUs. There’s also 15GB eMMC storage as standard and support for an 8K video encoder and decoder. Designed with the latest 7nm Technology, the total TDP of this device is only 7W. The company has confirmed that the module includes four PCI Express Gen 3 lanes for external accelerators or other hardware integration.

Mixtile Core 3588E: Compute Module Specifications

  • SOC is A Rockchip RK3588.
  • Features an octa-core CPU with 4x Arm Cortex-A76 (2.4 GHz) and 4x Arm Cortex-A55 (1.8 GHz).
  • GPU is the Arm Mali-G610 MP4, supporting various graphic standards.
  • VPU supports multiple video formats, including 8K, and encodes 8K H.265/H.264 and JPEG.
  • NPU is 6 TOPS for generic AI tasks.
  • It comes with 8GB, 16GB, or 32GB LPDDR4 Memory configurations.
  • Internal storage is 32GB eMMC 5.1 flash.
  • It uses a standard 260-pin SO-DIMM, compatible with Jetson designs.
  • It has support for the SD 3.0 interface.
  • Has Support for HDMI 2.1 (up to 8Kp60), DisplayPort 1.4, and MIPI DSI.
  • Offers multiple MIPI CSI connections for cameras.
  • Audio can be accessed by interfacing with the 2x I2S ports.
  • supports a Gigabit Ethernet connection.
  • USB Port Includes 2x USB 3.0 and 2x USB 2.0 ports.
  • PCIe Features include a PCIe Gen 3.0 slot.
  • It requires 5V @ 3A via a USB-C port.
  • It measures 69.6 x 45 mm in size.
  • Operating Temperature is -20°C to 70°C and can be stored between -40°C to 85°C.

Mixtile provides Android 11 and Debian 11 BSPs for the Rockchip RK3588 module. On the other hand, the Jeston Nano module comes with Ubuntu 18.04 or 20.04. Apart from the software difference, the Mixtile’s module is expected to give more value for its cost compared to the NVIDIA Jetson modules. However, that depends on the use case.

According to the product page, the Mixtile core 3588E SOM is available to order in two variants — the 4GB model comes at $109, and the 16GB version at $159; they also announced a 32GB version, but it is not available at the time of writing this article.

The pricing is based on an early bird pre-order, which is already 18% less than the original price. But they will increase on August 31. Additionally, these devices are expected to be delivered in mid-October via international air mail.

Why Mixtile Core 3588E?

  • Powered by Rockchip RK3588 SoC with a 260-pin-SO-DIMM connector compatible with NVIDIA Jetson TX2 NX
  • 6 TOPs AI performance supports Large Language Models (LLMs) such as GPT, LLaMA, ChatGLM, and Bloom
  • Support creating an ARM Server with clusters of up to 75 Core 3588E SoMs in a standard 2U, 19-inch chassis
  • Industrial-grade Mixtile Core 3588JE can withstand temperatures from -40 °C to 85°C for extended periods

UPDATE: 2/2/2024: The Mixtile Core 3588E is in stock and shipping now for $109.00 – $278.00 depending on configuration.

Starting on February 7, Mixtile Core 3588E SoM will officially resume its original price as follows:

  • $109 -> $132 (4GB RAM+32GB eMMC)
  • $159 -> $190 (16GB RAM+128GB eMMC)
  • $269 -> $329 (32GB RAM+256GB eMMC)

JLCPCB Revolutionizes Metal 3D Printing with a Remarkable 40% Price Reduction

JLCPCB, a pioneering force in PCB prototyping, has announced a remarkable up to 40% price reduction in its metal 3D printing services, a strategic move that underscores their commitment to accessible innovation. This reduction in costs opens new doors for industries to leverage the potential of metal 3D printing, from aerospace to healthcare. JLCPCB’s dedication to maintaining quality while making advancements affordable cements its reputation as an industry leader. This milestone stands as an invitation for both existing and new customers to explore the possibilities of metal 3D printing, further propelling JLCPCB’s journey of technological excellence.

JLCPCB, a pioneering name in PCB and SMT prototyping, has once again taken the lead in innovation by announcing an astonishing up to 40% price reduction in its metal 3D printing services. This strategic move comes as a result of the company’s continuous commitment to providing cutting-edge solutions that are not only high in quality but also affordable for a wide range of customers.

In 2022, JLCPCB entered the 3D printing arena, extending its expertise from PCBs and SMT to offer 3D printing services. Recognizing the considerable expense associated with metal printing, the company embarked on a mission to diversify options for its customers. This endeavor aligned seamlessly with JLCPCB’s legacy of delivering value-driven solutions to its clients.

The focal point of this major price reduction lies in JLCPCB’s concerted efforts to curtail production costs. One notable achievement is the company’s substantial expansion of its metal printing manufacturing capacity, which has been increased by an impressive fivefold. By optimizing material utilization and employing advanced production technologies, JLCPCB’s R&D teams have significantly reduced overall costs.

“JLCPCB SLM 3D printing service is so speedy and easy-to-use. Now we can use metal 3D printing not only for making parts for business, but also for hobby because they also offer an affordable price. It’s a game changer!,” stated Ryota Suzuki, the founder of TYE’s Tech Lab. “Our decision to substantially reduce the cost of metal 3D printing underscores our dedication to making advanced manufacturing processes accessible to a broader spectrum of industries. This milestone not only benefits our existing clients but also extends a warm invitation to new customers who can now explore the advantages of metal 3D printing without the inhibitions of high costs.”

This strategic move is bound to disrupt the metal 3D printing landscape. With reduced costs, manufacturers and designers can now harness the potential of metal 3D printing for various applications, including aerospace, automotive, healthcare, and beyond. The cost-effectiveness of JLCPCB’s services opens doors to rapid prototyping and low-volume production without compromising on the quality and precision the metal 3D printing is renowned.

Video

As JLCPCB takes this leap, it remains steadfast in its commitment to maintaining the high quality and precision that customers have come to expect. The company’s reputation as an industry leader is built upon a foundation of trust, reliability, and technological excellence.

In conclusion, JLCPCB’s groundbreaking up to 40% price reduction in metal 3D printing services, coupled with its expansion of metal printing manufacturing capacity, stands as a testament to its unwavering dedication to innovation and customer satisfaction. By mitigating cost barriers and expanding the horizons of metal 3D printing, JLCPCB is poised to empower industries and individuals alike to bring their boldest ideas to life.

For further information, and inquiries, and to explore the world of affordable metal 3D printing, please visit JLCPCB Online 3D Printing Service.

cover photo: depositphotos.com

New Rugged i.MX8M Plus 6x GbE Single Board Computer

Gateworks is proud to announce the release of the Venice GW7400 Industrial Single Board Computer. This is the most powerful member of the Venice family and based on the NXP i.MX8M Plus 64-Bit Quad Core ARMv8 SoC. The processor features a Neural Processing Unit (NPU), VPU, GPU and DSP. This rugged SBC features six Gigabit Ethernet ports, three Mini-PCIe slots for WiFi and one M.2 slot with dual SIMs for cellular modems. The GW7400 additionally features USB 3.0, dual CAN Bus, DIO, I2C, SPI and UART interfaces. A TPM 2.0 secure crypto-processor is optional for ensuring system security and integrity. The Gateworks System Controller (GSC) provides advanced system health monitoring, RTC, secure key storage and power control.

Gateworks Venice GW7400 Highlights:

  • NXP i.MX8M Plus Quad Core CPU at 1.6GHz
  • 1GB LPDDR4 RAM (4GB Optional)
  • 8GB eMMC Flash (64GB Optional)
  • Six GbE Ports for wired connectivity
  • Three Mini-PCIe Sockets for WiFi or Cellular
  • M.2 Slot with Dual SIM for 5G Cellular Modems
  • USB 3.0, DIO, SPI, I2C, UART, ADC Interfaces
  • Dual CAN Bus
  • Digital 3-axis MEMS Accelerometer
  • Optional TPM, GPS, WiFi/BLE
  • Industrial Temperature -40 to +85C
  • Ubuntu Linux BSP
  • Made in USA

The GW7400 is available now in both standard and max versions. The max version features 4GB DRAM memory and 64GB eMMC Flash memory along with TPM, GPS and WiFi/BLE loaded.

The rugged and powerful GW7400 excels in handling any gateway or networking application.

Low-Power IB838 Single Board Computer Powered by Intel Core i3 N-series (Alder Lake-N) Processor

IBASE Technology Inc., a renowned provider in the design and manufacturing of embedded computing solutions, rolls out the low-power IB838 3.5” single board computer powered by Intel® Core™ i3 N-series (formerly Alder Lake-N) processor. Combining robust computing performance with advanced features, it is positioned to meet diverse needs across multiple industries, including industrial automation and control, retail displays, transportation, and automotive applications.

Fortified with intelligent power handling and a 9V~36V DC input range, the IB838 ensures reliability and consistent operations in transportation applications that may encounter variable power conditions. Versatile connectivity makes it ideal for automation processes and data acquisition systems. The SBC offers Type-C, DP++, and eDP or LVDS display options, along with a rich set of I/O interfaces, including two Intel® PCI-E 2.5G LAN ports, two USB 2.0 ports, and four USB 3.2 ports (1x Type-C + 3x Type-A).

IB838 FEATURES:

  • Intel® Core™ i3 N-series (formerly Alder Lake-N) processor
  • 1x DDR5 SO-DIMM, Max. 16GB
  • Supports Type-C & DP++ and eDP or LVDS
  • 2x Intel® PCI-E 2.5G LAN
  • 2x USB 2.0, 4x USB 3.2 (1x Type-C + 3x Type-A), 4x COM, 1x SATA III
  • 2x M.2 sockets (E-key + B-key), supports CNVi
  • 9V~36V wide-range DC input
  • Supports fTPM, Watchdog timer, Digital I/O

With CNVi support, the 5G-ready IB838 comes equipped with a high-speed SATA III port and two M.2 sockets (E-key + B-key), providing ample storage and expansion possibilities. Additionally, it boasts four serial ports and digital I/O, facilitating comprehensive connectivity to diverse devices and peripherals. Enhanced security and functionality are integrated through fTPM (firmware-based Trusted Platform Module) and a Watchdog timer for system stability. For more information, please visit www.ibase.com.tw

New 4X4 BOX 7040 Series Mini PC: Sprint Faster and Run Longer with AMD Ryzen™ 7040U Series APU

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen™ 7040U Series APUs, featuring up to 8 “Zen 4” cores and 16 threads. With the new AMD Ryzen™ AI, the first AI engine for an x86 platform, and support of dual-channel DDR5 5600MHz memory up to 64GB, the new Series sprint ahead in speed, performance, and AI capability, while guaranteeing extended runtime. The 4X4 BOX 7040 Series comes with enriched I/O connectivity in a compact appearance, enabling 4K quad-display outputs, five USB ports with two USB4, dual storages, and dual LAN up to 2.5G, Wi-Fi 6E. The faster performance with AI engine and longer runtime bring about productivity boost and next-level experience in content creation, gaming, entertainment, commerce, and many other AIoT applications.

AMD Ryzen™ 7040U Series APU with DDR5 5600 RAM

Powered by AMD Ryzen™ 7040U Series APU (Ryzen™ 7 7840U/Ryzen™ 5 7640U), ASRock Industrial’s 4X4 BOX 7040 Series contain selections: 4X4 BOX-7840U and 4X4 BOX-7640U. Featuring 4nm “Zen 4” architecture with up to 8 cores and 16 threads, and enhanced dual-channel DDR5 5600MHz SO-DIMM memory up to 64GB, the Series guarantee faster productivity, content creation, and gaming with extended runtime. Moreover, with built-in AMD Ryzen™ AI – the pioneer of dedicated AI hardware in an X86 processor, the 4X4 BOX 7040 Series usher in advanced potentials in power, efficiency, and intuition for the future AI working world. This integration transforms the 4X4 BOX 7040 Series into a reliable personal virtual assistant, propelling dynamic AI applications, enhancing video conferencing, and delivering AI-inspired visuals.

Rich I/O Connectivity in Compact Appearance

The 4X4 BOX 7040 Series’ enriched I/O connectivity in a compact size of 117.5 x 110 x 47.85 mm comes with two USB4, one USB 3.2 Gen2 (Type-A), and two USB 2.0 ports, one audio jack, one DC jack. With integrated AMD Radeon™ Graphics, the Series support 4K quad-display outputs through two HDMI 1.4b and two DisplayPort 1.4a (two from Type-C), providing outstanding visual experience upgrades. For dual-storage, the Series include one SATA3.0 and one M.2 (Key M, 2242/2260/2280) with PCIe Gen 4×4 for SSD for maximum scalability. Besides, the 4X4 BOX 7040 Series are equipped with dual LAN ports- one 2.5G and one 1G port with DASH for remote management, alongside Wi-Fi 6E and Bluetooth 5.2 support to deliver high-speed communication. The 4X4 BOX 7040 Series sprint in the lead with versatile connectivity, perfect for multi-faceted usages.

Here’s more: 4X4 7040 Motherboard Series

ASRock Industrial also introduces 4X4 7040 Motherboard Series powered by AMD Ryzen™ 7040U Series APU (Ryzen™ 7 7840U/Ryzen™ 5 7640U), inclusive of 4X4-7840U and 4X4-7640U. Key features comprise two SO-DIMM DDR5 5600 MHz up to 64GB memory support, dual LAN up to 2.5G, and 4K quad-display through two HDMI 1.4b and two DP 1.4a (with two from Type-C). Optimized overall capacity are achieved by I/O connectivity and expansions with two USB4, two USB 3.2 Gen2, two USB 2.0, one M.2 Key E slot, and dual storage supported by one M.2 Key M and one SATA3.0. Moreover, a 12~19V DC-in design with flexible power input, 0~70°C wide range operating temperature, while AMD FW TPM is for software-based security. The 4X4 7040 Motherboard Series can bring about next-level business and embedded solutions, plus enhanced gaming experience and productivity boost on PCs.

Sprint Faster, Run Longer – the 4X4 BOX 7040 Series and 4X4 7040 Motherboard Series powered by AMD Ryzen™ 7040U Series APU, have arrived to unlock unprecedented possibilities in computing speed, graphics performance, and runtime. With significant enhancement of CPU, GPU, and extended runtime, this compact Mini PC and Motherboard Series are ready to sprint ahead in applications across diverse fields.

For more detailed product information, please visit our Website or contact us at Product Inquiry.

e-peas Introduces First Energy Harvesting PMIC to Handle Two Independent Energy Sources at the Same Time

AEM13920 gives valuable new flexibility to deploy the ideal mix of PV, RF, thermal and kinetic energy sources for the application

e-peas, the leading supplier of energy harvesting ICs, today launched its first PMIC that can handle simultaneous inputs from two independent harvested energy sources.

The new AEM13920 can maximize the energy harvested from any combination of two sources, including photovoltaic (PV) cells, a thermo-electric generator (TEG), RF energy harvester, or pulsed (kinetic) energy sources. Before the introduction of the AEM13920, specialized PMICs have been optimized for a single type of energy harvester.

The flexible dual-source capability opens up interesting new design options for the use of energy harvesting in small electronic devices such as remote controls, PC peripherals, wireless sensors and more. For instance, a remote control could have separate PV cells on its front and rear, to maintain an energy input whether the device is left face up or face down. A smart wireless light switch could operate on mechanical energy for short RF transmissions, and on stored mechanical or light energy for longer operations such as downloading and installing a firmware update.

In these and other applications, the AEM13920 provides a complete power management solution that maximizes energy recovery from the source. In the AEM13920, e-peas has also added valuable new features for system optimization and protection.

The PMIC achieves ultra-high source-to-storage and storage-to-load conversion efficiencies of higher than 90%. Independent maximum power point tracking (MPPT) algorithms for each source, and an ultra-low cold-start input condition of 275 mV/5 µW, maximize the amount of energy drawn from any type of harvester. The AEM13920 also offers the option of constant source-voltage regulation.

Use of the AEM13920 simplifies power-system development and minimizes component count and bill-of-materials cost, because it implements in a single chip all the functions required to store and use energy from an external harvester. Two independent on-chip boost converters manage source voltage conversion and the supply to the storage element. A separate on-chip buck regulator converts the output from the storage element to a fixed voltage required by the application between 0.6 V and 2.5 V. The AEM13920 also manages a 5 V power input, which can be used to charge the storage element in the event of a prolonged period of operation without an input from an energy harvester.

New control and configuration features introduced in the AEM13920 include:

  • Average Power Monitoring – a circuit which measures total energy transferred from each of the two sources to storage, and total energy supplied to the load. This enables the host microcontroller to calculate the state of charge of the storage element, and to monitor system operation in detail.
  • I2C interface for control of 33 register settings by the host MCU, and for system data read-outs

The AEM13920 also offers a full suite of system monitoring and protection features, including:

  • Thermal monitoring of the storage element
  • Selectable over-charge and over-discharge limits for protection of the storage element
  • Shipping mode to protect the storage element

The AEM13920 is compatible with many types of rechargeable batteries and storage elements, including lithium-polymer, LiFP and li-ceramic batteries, and hybrid lithium capacitors.

Christian Ferrier, Chief Marketing Officer of e-peas, said: ‘e-peas has been pioneering the technology of energy harvesting for years, and the AEM13920 is the latest product of our innovation – a fully integrated PMIC that enables designers to use the combination of two energy sources that is exactly right for their application.

‘And because our technology is so efficient and effective, the AEM13920 should encourage more OEMs to stop relying on wasteful primary batteries, and so reduce the amount of electrical waste that goes to landfill.’

The AEM13920 is supplied in a 40-pin QFN package with a board footprint of 5mm x 5mm. It is available for sampling now. For sample requests and for information about the 2AAEM13920J051 evaluation board, go to www.e-peas.com.

HQ NextPCB Introduces New PCB Gerber Viewer: HQDFM Online Lite Edition

HQ NextPCB is proud to announce the release of HQDFM Online Gerber Viewer and DFM Analysis Tool, free for everyone. With HQDFM, NextPCB hopes to empower designers with the DFM tools and knowledge to perfect their designs as early as possible, where problems are the least costly.

The PCB manufacturing industry has and still relies on the Ucamco Gerber standard to communicate PCB production to manufacturers, which are often located overseas. While the 2D image format overcomes language barriers, the language of PCB Design for Manufacture is still ambiguous to many inexperienced designers and the division between PCB design and PCB manufacture remains an expensive obstacle leading to missed deadlines, hit-and-miss runs and quick-to-fail products.

“There are still many designers that send off their production files without any knowledge of what the files contain. Resolving issues with the fab house becomes a challenge for both sides without the appropriate tools and knowledge to debug the design, which is something we hope to change for everyone’s benefit,”  HQ NextPCB CEO, Alex Chen

HQDFM Gerber Viewer is a completely free, online tool for displaying and reviewing PCB Gerber files and OBD++ files. It incorporates HQDFM’s Design for Manufacture (DFM) algorithms based on NextPCB’s 15 years of high-reliability manufacturing expertise and current industry standards.

Unlike EDA software’s built-in DRC checks, HQDFM allows designers to navigate and analyze the production files and check for design issues that may impact manufacturing or cause long-term reliability issues. With HQDFM, designers are given a manufacturer’s perspective and have valuable insights into how they can improve their designs.

Features:

  • Check for over 20 Design for Manufacture issues
  • Navigate your PCB layer-by-layer
  • Free downloadable DFM Report for more detailed analysis
  • Easy, one-click ordering with HQ NextPCB
  • Absolutely free, no sign-up or obligation

Based on the free desktop version, the cross-platform, online HQDFM makes the easy-to-use Gerber Viewer function and DFM analysis available to everyone, including Mac and Linux users with no download or installation and no sign-up. Anyone can freely upload PCB production files to the online interface and view their design in seconds.

HQDFM supports X2 and RS-274x PCB Gerber formats, Excellon drill files and OBD++ files and works with Google Chrome, Safari, Microsoft Edge, Mozilla Firefox and Opera browsers.

Innodisk Introduces the First PCIe nanoSSD 4TE3 with Compact Size

Innodisk, a leading global AIoT solution provider, announces the release of the first nanoSSD PCIe 4TE3 in response to the increasing demands of edge AI miniature design and high computing performance.

The nanoSSD 4TE3 is a PCIe 4.0 x4 BGA SSD featuring compact size, enhanced performance and reliability to unlock the potential for 5G, automotive and aerospace applications.

Enhanced Performance with Tiny Size

Edge AI devices often demand efficiency and substantial capacity within a minimal space and are positioned in rugged external environments. These devices installed at, for example, 5G base stations, aerospace and in-vehicle systems require a small size to save space in devices with large capacity to support AIoT applications. Innodisk’s nanoSSD PCIe 4TE3 emerges as a solution designed in M.2 type 1620 BGA form factor with a height of only 1.65mm but with large capacity reaching up to 1TB, which is suitable for the needs of space-limited devices and increasing design flexibility. Beyond this, the nanoSSD offers high performance with a transmission speed of up to 3.6GB/s and a bandwidth of up to 8GB/s catering to high-speed computing needs.

By employing 12-nanometer controller and a 112-layer 3D TDC NAND Flash, the nanoSSD PCIe 4TE3 performs optimized efficiency and reliability, as well as low power consumption and reduced heat energy, contributing to a small footprint for sustainability. Furthermore, the PCIe 4TE3 comprises Innodisk’s iSLC technology extending its lifespan by 33 times to fulfill high performance demands and the needs for embedded and most industrial applications, providing high endurance and reliability.

Tailored Solutions for Design Flexibility

Unlike conventional plugged-in SSDs, the nanoSSD is solder-down and integrated onto the device motherboard against instabilities in outdoor environments, such as shaking and vibrations, ensuring uninterrupted signal and operation. At the same time, the circuit design is supported by pre-sales service, including a design kit before integration. The series is designed in-house, which brings advantages to enhanced quality and highly customized solutions for flexibility. Further customized options, including namespace and security features, are designed to align with specific requirements. For instance, namespaces enhance storage allocation flexibility, while security features such as AES-256, TCG Opal, quick erase and write protection can be added for mission critical applications where security safety is crucial.

For more information, please visit: https://innodisk.ai/G4Kpfs

MYIR Launched Six-core ARM-A55 D9-Pro based SoM for Industrial Applications

MYIR has launched a new ARM SoM MYC-JD9360 CPU Module based on the intelligent industrial processor D9-Pro (D9360) from SemiDrive, equipped with six high-performance Arm Cortex-A55 cores (up to 1.6GHz) and one dual-core lockstep high real-time and high-reliability Cortex R5 core (800MHz). In addition to the D9-Pro MPU, the MYC-JD9360 CPU Module has integrated 2GB LPDDR4, 16GB eMMC, 16MB QSPI Flash, 256Kbit EEPROM, Watchdog timer chip and Isolated power supply. It carries out a variety of peripherals and IO signals through the0.5 mm pitch 314-pin gold-finger-edge-card expansion interface including TSN-enabled Gigabit Ethernet, USB3.0, PCIe 3.0, SDIO, UART, I2C, SPI, ADC, CAN FD, MIPI-DSI, MIPI-CSI, LVDS, etc. It also takes advantage of the D9-Pro processor to support high-performance 3D graphics processing,high-efficiency AI accelerator, and high-definition visual processing. This enables the MYC-JD9360 module to be seamlessly connected and applied to various industrial applications at an affordable cost. Typical applications are industrial robots, engineering machinery T-BOX, intelligent cockpits, in-vehicle entertainment, intelligent medical equipment, and so on.

MYC-JD9360 CPU Module

The MYC-JD9360 CPU Module measures 82mm by 45mm. It is capable of running multiple different operating systems including Linux, Ubuntu, and Android OS. The module is provided with plenty of software resources including but not limited to, bootloader, kernel, drivers, images, and relative development tools, together with a detailed user manual and documentation to help customer start their development rapidly.

MYC-JD9360 CPU Module Block Diagram

Features of MYC-JD9360 CPU Module

  • Dimensions: 82mm x 45mm
  • PCB Layers: 8-layer design
  • Power supply: 5V/5A
  • Working temperature: -40~85 Celsius (industrial grade)
  • SemiDrive D9-Pro Processor (D9360)
  • * 6 x [email protected]
  • * 1 x Cortex-R5
  • * IMG PowerVR 9XM GPU @100GFLOPS
  • * VPU H.264 Video Encoder/Decoder, H.265/VP8/VP9 Video Decoder
  • * [email protected] (SemiDrive SlimAI Engine)
  • 2GB LPDDR4
  • 16GB eMMC
  • 256Kbit EEPROM
  • 16MB QSPI Nor Flash
  • 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector
  • * 2 x GigabitEthernet
  • * 2 x PCIe3.0
  • * 2 x USB3.0(DRD)
  • * 2 x SDIO
  • * 11 xUART(supports up to 16 x UART)
  • * 2 x CAN-FD (supports up to 4 x CAN-FD)
  • * 4 x I2C(supports up to 12 x I2C)
  • * 2 x SPI(supports up to 8 x SPI)
  • * 4 x 12bitADC
  • * 1x MIPI-DSI
  • * 2 x LVDS
  • * 1 x ParallelCSI
  • * 1 x MIPI CSI
  • * 4 x Single-channel I2S/TDM
  • * 2x Multi-channel I2S
  • * 1 x JTAG
  • * Up to 135x GPIOs (Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and CPU Module pin-out description file.)
  • Linux
  • Ubuntu
  • Android (coming soon)

The MYD-JD9360 Development Board is a starter kit for evaluating the MYC-JD9360 CPU Module. It has a versatile base board to facilitate the expansion from the MYC-JD9360 through the 314-pin expansion interface, a rich set of peripherals and interfaces have been brought out such as two RS485, two RS232, two CAN, two Gigabit Ethernet, two USB Host, one DRD, one USB based 5G/4G module interface and one WiFi/BT module. It also has advanced multi-media capabilities to support dual LVDS display, audio and camera, and HDMI display support via MIPI-DSI. The MY-CAM003M MIPI Camera Module and MY-LVDS070C LCD Module can be used as options for the MYD-JD9360 board which allows customers to acquire a better development experience. It is an excellent reference design for using D9-Pro solutions.

 

MYD-JD9360 Development Board (top-view)

 

MYD-JD9360 Development Board (bottom-view)

 

MYD-JD9360 Development Board Block Diagram

The MYC-JD9360 CPU Module is priced at only $65/pc. Discount is to be offered for volume quantities. MYIR also provides OEM/ODM services to help customers accelerate their time to market and save costs.

More information about the above new products can be found at: https://www.myirtech.com/list.asp?id=738

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