Search Results for : Infineon Technologies
![CoolSiC™ MOSFET evaluation board for motor drives up to 7.5 kW CoolSiC™ MOSFET evaluation board for motor drives up to 7.5 kW](https://www.electronics-lab.com/wp-content/uploads/2019/11/EVAL-M5-E-1B1245N-SIC-1024x683.jpg)
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CoolSiC™ MOSFET evaluation board for motor drives up to 7.5 kW
Silicon carbide (SiC) is en route to mainstream for applications like photovoltaic and uninterruptable power supplies. Infineon Technologies AG is now targeting the next group of applications for this wide bandgap technology: The evaluation board EVAL-M5-E1B1245N-SiC will help to pave...
Continue Reading![NLM0011/NLM0010- LED Driver IC with effective NFC-PWM programming NLM0011/NLM0010- LED Driver IC with effective NFC-PWM programming](https://www.electronics-lab.com/wp-content/uploads/2019/10/NLM0011-NLM0010-LED-Driver-IC-with-Effective-NFC-PWM-Programming-.jpg)
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NLM0011/NLM0010- LED Driver IC with effective NFC-PWM programming
Infineon Technologies developed the NFC-PWM series (NLM0011 & NLM0010) for fast and cost effective implementation of NFC programming for LED drivers. The NFC programming can replace the labor intensive “plug-in resistor” current setting method with the contact less NFC...
Continue Reading![Photoacoustic spectroscopy (PAS) miniaturizes CO2 sensor XENSIV™ PAS210 Photoacoustic spectroscopy (PAS) miniaturizes CO2 sensor XENSIV™ PAS210](https://www.electronics-lab.com/wp-content/uploads/2019/06/PAS210_Top.jpg_505707273.jpg)
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Photoacoustic spectroscopy (PAS) miniaturizes CO2 sensor XENSIV™ PAS210
City dwellers often spend a large amount of their time indoors, either in an office, at school, or simply at home. Urbanized spaces, however, tend to trap and develop bad air quality as they get more insulated for energy efficiency purposes. The concentration of CO 2 is an indicator...
Continue Reading![New XENSIV KP276 absolute pressure sensor series covers a range of 10 kPa to 400 kPa New XENSIV KP276 absolute pressure sensor series covers a range of 10 kPa to 400 kPa](https://www.electronics-lab.com/wp-content/uploads/2019/06/Infineon_XENSIV_KP276-1024x955.jpg)
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New XENSIV KP276 absolute pressure sensor series covers a range of 10 kPa to 400 kPa
Infineon Technologies’ new XENSIV KP276 absolute pressure sensor series covers a range of 10 kPa to 400 kPa, is highly accurate and has fast measurement and communication. The new digital sensor is intended for applications such as the measurement of manifold air pressure...
Continue Reading![World’s first monolithically integrated linear Hall sensor for ASIL D systems World’s first monolithically integrated linear Hall sensor for ASIL D systems](https://www.electronics-lab.com/wp-content/uploads/2019/06/Infineon_XENSIV_TLE4999I3-670x1024.jpg)
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World’s first monolithically integrated linear Hall sensor for ASIL D systems
Infineon Technologies will launch a monolithically integrated linear Hall sensor which was developed entirely according to the safety standard ISO26262 for automotive applications. With just one device, the XENSIV TLE4999I3 enables the development of fault-tolerant systems that have to...
Continue Reading![Linear LED controller ICs target dimmable lighting applications Linear LED controller ICs target dimmable lighting applications](https://www.electronics-lab.com/wp-content/uploads/2019/04/Picture-BCR601-Hot-Plug-DSO-8.jpg_805466455-980x1024.jpg)
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Linear LED controller ICs target dimmable lighting applications
Two linear LED controller ICs have been added to the BCR portfolio, by Infineon Technologies. The BCR601 has voltage feedback to the primary side (also known as active headroom control or AHC), for cost effective and power efficiency LED driver applications. The BCR602 targets dimmable...
Continue Reading![REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution](https://www.electronics-lab.com/wp-content/uploads/2019/02/REAL3-ToF.png)
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REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution
Infineon Technologies AG is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in...
Continue Reading![World’s first industrial-grade eSIM in miniaturized package World’s first industrial-grade eSIM in miniaturized package](https://www.electronics-lab.com/wp-content/uploads/2018/12/eSIM_WLCSP_M2M-1024x900.jpg)
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World’s first industrial-grade eSIM in miniaturized package
Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage of the ubiquitous mobile networks, Infineon Technologies AG provides the world’s first industrial-grade embedded SIM (eSIM)...
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