Search Results for : M.2 form factor
Geniatech’s XPI-S905X Board supports HDMI 2.0 and optional M.2 slot
Geniatech is popular for their Amlogic based Tv boxes but recently have launched some development boards such as Developer Board IV and Developer Board 8 powered by Snapdragon 410E and 820E respectively. Recently, Geniatech launched a new Raspberry Pi pseudo-clone called the...
Continue ReadingThe PICO-APL4: Everything You Need for Factory Automation and IoT Gateway Systems
(Taipei, Taiwan – August 21, 2018) – AAEON, a leading developer of advanced embedded controllers, releases the PICO-APL4, a compact and cost-effective SBC. The PICO-APL4 features onboard memory and storage along with dual Gigabit Ethernet support, and it’s ideally suited for...
Continue ReadingIBASE Partners with AI Chipmaker Hailo to Launch Edge AI Computing System with 5G Connectivity
IBASE Technology Inc., a leading provider of robust embedded computing platforms, is proud to announce its partnership with leading Artificial Intelligence (AI) chipmaker Hailo. IBASE and Hailo are launching the 11th Gen Intel® Core™ U-Series-based (formerly Tiger Lake)...
Continue ReadingFibocom Advances US CBRS Commercialization with LTE-A Wireless Module FM101-CG
Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the LTE Advanced wireless module FM101-CG. Featuring 3GPP Release 12 capabilities, the FM101-CG module is exclusively designed to boost the commercial...
Continue ReadingVecow Launches VAC-1000 Arm-based Edge AI Computing System
Featuring Foxconn Cortex-A53 MPU, running Hailo-8™/Lightspeeur® AI accelerator, with support for mainstream deep learning framework, Vecow VAC-1000 Edge AI Computing System provides greater flexibility in device architecture, making it an ideal solution for Public Surveillance,...
Continue ReadingFibocom Launches New 5G Module FM350 for PC before MWC 2021 with Intel and MediaTek
Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, announces the joint release of the FM350 5G wireless module on May 31st, before MWC 2021 (Mobile World Congress 2021). Partnered with Intel and MediaTek, Fibocom’s...
Continue ReadingQuectel RM50xQ Global 5G Modules are available
Quectel RM50xQ Global 5G Modules adopts the 3GPP Release 15 LTE technology to support both 5G Non-Standalone Architecture (NSA) and Standalone Architecture (SA) modes. These modules are optimized specially for IoT/eMBB applications. The RM50xQ modules are compatible with LTE-A Cat 6...
Continue ReadingHigh density robust SSD offers densities up to 1TB in a 16×20 mm BGA
2100AI/AT SSD Family - High density robust SSD offers densities up to 1TB in a 16x20 mm BGA Micron has officially launched the Micron 2100AI/AT– an industrial- and automotive-grade PCIe NVMe Industrial SSD family based on 64-layer triple-level cell (TLC) 3D NAND technology. Available...
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