M95P32-I – Ultra low-power 32 Mbit serial SPI page EEPROM

The M95P32-I is a high-density, page-erasable SPI EEPROM memory that combines flexibility, performance, and ultra-low power. It is a unique non-volatile memory solution for ultra-low power systems that require an external NVM to boot by downloading firmware before execution in RAM, to upload firmware versions by OTA, and to run parameter monitoring, data log, or event recording.

Key Features:

  • 32Mbit (4Mbytes) SPI Page EEPROM
  • Write byte flexibility
  • Write page 512 bytes
  • Extended range: -40 °C to +105 °C

Applications:

  • Wearable
  • Medical and healthcare
  • IoT for smart home and city
  • IoT for smart industry

more information: https://www.avnet.com/wps/portal/ebv/products/new-products/npi/2022/stmicroelectronics-m95p32-i

Vecow and Allxon partner to provide advanced embedded AI solutions with remote management technology

Vecow EAC-500 has OOB remote management capability

Vecow has teamed up with Allxon, a company that offers solutions for remote device management, to provide integrated solutions for the Vecow EAC Series, which is powered by the NVIDIA Jetson Platform. The Vecow EAC Series, including the EAC-5000, EAC-3000, and EAC-2000, runs on Jetson AGX Orin, Jetson AGX Xavier, and Jetson Xavier NX Series, and offers high-performance artificial intelligence suitable for a wide range of applications, such as in-vehicle computing, autonomous mobile robots, real-time video analytics, and AOI.

To streamline remote management operations, the industry requires remote management of edge devices and Out-of-Band remote management operation technology. The Allxon Device Management Solution platform caters to Edge AI devices with features such as In-Band Management, Out-of-Band Management, and Plugin Station. The In-Band Management component is specifically designed for NVIDIA Jetson-based Edge AI computers and offers various functionalities like CPU and GPU performance monitoring, remote command, BSP image-based OTA, and provisioning.

“As AIoT and number of use cases continue to grow, the market will demand a large amount of Edge AI appliances, as well as an optimized remote management tool for those devices, “said Thomas Su, Vice President of Vecow. “Our partnership with Allxon delivers an easy monitoring and control solution for Edge AI appliances anywhere, anytime while esnuring all Edge AI devices are reliable and robust.”

Out-of-Band (OOB) management is a hardware-based technology that allows service providers to remotely turn devices on and off and revive unresponsive systems. Cloud-based OOB management, using simple SaaS services, enables service providers to optimize the operations of edge AI devices more efficiently. By integrating OOB technology with SaaS, Managed Service Providers (MSPs) can overcome the challenges of deploying large numbers of edge AI devices in harsh, remote, and inaccessible locations.

The EAC-5000-OOB, which is part of the EAC Series, includes the OOB remote management operation technology, allowing it to offer robust disaster recovery services for Edge AI applications. Furthermore, the EAC-5000, EAC-3000, and EAC-2000 models all support In-Band Management Service.

Vecow Partners with Allxon

The Vecow EAC-5000 Series Edge AI Computing System, which uses NVIDIA Jetson AGX Orin, has a high-performance AI capability of up to 275 TOPS, thanks to the advanced NVIDIA Ampere architecture. As a result, it is a benchmark in the ecosystem of in-vehicle computing systems, making it a perfect fit for various applications such as automated agricultural machinery, robotic control, in-vehicle computing, intelligent video analytics, machine vision, mobile robots, and embedded AI.

Quectel introduces the RedCap Rx255C module series for IoT applications

Quectel RedCap Rx255C module series

Quectel Wireless Solutions has launched its 5G RedCap (Reduced Capability) modules, the Rx255C series. The company has designed these modules to improve wireless performance and low-latency communication. Along with its integrated 5G connectivity, the modules offer significant optimization in size and energy savings.

The modules are based on Snapdragon X35 5G Modem-RF System, which is ideal for various industries and mobile broadband applications. The new modules are backward compatible with LTE networks and meet the 3GPP Release 17 standards, supporting 5G standalone mode and a maximum bandwidth of 20MHz on the sub-6GHz frequency band.

The Rx255C series modules also offer theoretical peak downlink data rates of around 220 Mbps and uplink data rates of around 100 Mbps. They can be deployed in various IoT applications such as robotics, DTU, drones, smart ports, smart grid, AR/VR wearables, educational laptops, and entry-level mobile broadband devices.

Qualcomm Technologies Snapdragon X35 5G Modem-RF System

The onboard Snapdragon X35 5G Modem-RF System is claimed to be the world’s first 5G NR light Modem RF system. It features a streamlined and optimized architecture and system enhancements that expand the 5G ecosystem and fuel the 5G-connected intelligent edge. The optimized NR light Modem RF system combines the power efficiency benefits of lower complexity design with new Release 17 power-saving features and a tightly integrated modem RF, delivering superior power efficiency.

Qualcomm Technologies’ Snapdragon X35 provides a long-term migration path to replace LTE CAT4+ devices and enable various use cases, such as entry-level industrial IoT devices, mass-tier fixed wireless access consumer premise equipment, mass-tier connected PCs, and first-generation 5G consumer IoT devices like direct-to-cloud glasses and premium wearables.

RedCap technology allows the Rx255C series modules to optimize the number of antennas, reduce the transmitting and receiving bandwidth, and provide 64QAM/256QAM (optional) modulation to optimize the size. The high level of integration and unique architecture of Snapdragon X35 ensures that the modules have low power consumption, which drives 5G adoption in an entirely new category of devices.

To help customers facilitate their designs, Quectel offers a variety of high-performance 5G antennas that significantly boost wireless connectivity. With the launch of the Rx255C series, Quectel is taking a critical step toward the 5G vision of connecting virtually everything around us.

Lanner Launches 5G-Ready Edge AI Appliance EAI-I131 Powered by NVIDIA Jetson Orin NX and Orin Nano System-on-Modules

Lanner Electronics, a leading provider of intelligent edge computing appliances, has unveiled its latest industrial-grade Edge AI platform, the EAI-I131, designed for next-generation video analytics solutions. The EAI-I131 is powered by NVIDIA® Jetson Orin™ NX or Jetson Orin Nano™ system-on-modules, delivering up to 100 TOPS of AI computing performance for a wide range of AI workloads.

Designed to deliver high performance in challenging environments, the IP40-rated fanless EAI-I131 is equipped with a -40 ~ 75°C wide operating temperature design that enhances reliability and durability in industrial settings. The device also supports LTE, 5G Sub6, and WiFi wireless connectivity and provides rich connectivity options, including 2x GbE PoE, 2x COM, 2x USB, and 4x DI/DO ports.

The EAI-I131 is also compatible with the NVIDIA JetPack SDK, which provides Jetson Linux, developer tools, CUDA-X accelerated libraries, and other NVIDIA technologies. The NVIDIA JetPack SDK enables end-to-end acceleration for AI-based video analytics solutions across diverse industries, such as retail queue management, disaster response, traffic management, and critical asset protection.

“We are excited to launch the EAI-I131, which showcases our commitment to delivering robust and reliable edge AI computing solutions that meet the needs of our customers,” said Jeans Tseng, Chief Technology Officer, Lanner. “The EAI-I131’s powerful AI computing performance from NVIDIA Jetson Orin NX and Orin Nano system-on-modules, combined with its rugged design, makes it an ideal solution for enabling AI-driven decision-making in industrial settings.”

With the launch of the EAI-I131, Lanner continues to expand its portfolio of intelligent edge computing appliances, enabling solution providers to harness the power of AI in real-world applications.

https://www.lannerinc.com

Powercore EDM Cuts through solid metal With Ease

The popularity of 3D printing has spurred a competition to make automated machine tools and fabrication methods more accessible to hobbyists. Laser cutting is a great example of this, as it used to be too expensive for hobbyists, but now can be purchased for a few hundred dollars. However, these laser cutters are not powerful enough to cut through metal, which is why the new Powercore desktop EDM machine is so desirable, as it can cut through sheet metal. If you’re looking to make a project quickly, you do not have to wait days or weeks for laser-cut components to arrive when you can get high-quality parts in minutes with Electrical Discharge Machining (EDM). The Powercore is an ideal tool for Makers, as it is similarly priced to laser cutters, but can cut solid aluminum much faster.

EDM is a process that uses sparks to cut thin lines in hard metals like tool steel, which would be difficult for conventional mills to handle. It is a clean process that does not require powerful motors, as there is no physical contact between the tool and the material, thus requiring very little torque. This makes it suitable for desktop use, as the machine can be small and lightweight. The sparks are created by pulsing electricity between two electrodes with sheet metal in between them, and the electrodes are moved around the material at a relatively slow pace.

EDM is much more gentle than traditional subtractive manufacturing, making it an attractive option for home labs. Unlike metal-capable CNC mills which require large castings to contain cutting forces, EDM can use light-duty structures and still produce precise parts. Powercore is an example of this, as it is designed to replace the extruder of a 3D printer and is composed of parts that can be printed on the same machine.

EDM is a more attractive option for home labs than traditional subtractive manufacturing due to its gentleness, and it can produce precise parts with light-duty structures, unlike metal-capable CNC mills which require large castings to contain cutting forces. Powercore is designed to replace the extruder of a 3D printer and is composed of parts that can be printed on the same machine.

Rack Robotics claims they have been able to cut material as thick as 4mm, but suggest keeping it below 1mm for the small vat with a standard material stock of 3×3″ aluminum sheet. Cut rates are estimated to be around 10mm per minute. Rack Robotics suggests that the Powercore is best suited for cutting small, thin aluminum sheet metal parts that require precise, clean edges, as well as delicate parts that would be difficult to fabricate with conventional methods without damage. It is not suitable for cutting large sheets, very thick sheets, or fast jobs.

Rack Robotics‘ Powercore is currently on Kickstarter with a goal of $5,000, and has already raised over $120,000, showing how enthusiastic the hobbyist community is about this product. The Kickstarter campaign will end on April 1st, and the special price is $399. The package includes a power supply, ten brass electrodes, 10 pieces of aluminum stock, two electrode holder kits, and a work-holding kit.

However, backers will need to print some parts themselves in order to complete the build, and rewards are expected to be shipped out in July 2023.

Raspberry Pi Global Shutter Camera is an Ideal Camera for Machine Vision

Raspberry Pi has unveiled a new camera module, the Raspberry Pi Global Shutter Camera, which is a variation of its High-Quality Camera Module but with a global shutter instead of a rolling shutter. Since the first Raspberry Pi Camera Module, all subsequent models have utilized rolling shutters, which capture an image line-by-line. This works well for most applications, but if you’re trying to capture fast-moving objects, the image can become distorted. A global shutter, on the other hand, captures the entire image simultaneously, eliminating any shearing or smearing of the image. Eben Upton, co-founder of Raspberry Pi, explains that the Global Shutter Camera, which is built around Sony’s 1.6-megapixel IMX296 sensor, is able to capture rapid motion without introducing rolling shutter artifacts. This makes it an ideal choice for sports photography and machine vision applications, as even the slightest distortion can significantly reduce inference performance.

The Raspberry Pi Global Shutter Camera, based on the same design as the Raspberry Pi High-Quality Camera Module, features a backplate to protect the PCB, a feature that won’t be available on other models in the range. Additionally, there is no news yet on an M12-mount version. The company explains why the new Raspberry Pi Global Shutter Camera is useful ‘‘Fast-moving objects, like those propeller blades, are now easy to capture; we can also synchronize several cameras to take a photo at precisely the same moment in time. There are plenty of benefits here, like minimizing distortion when capturing stereo images. (The human brain is confused if any movement that appears in the left eye has not appeared in the right eye yet.)

The Raspberry Pi Global Shutter Camera can also operate with shorter exposure times – down to 30µs, given enough light – than a rolling shutter camera, which makes it useful for “high-speed photography.’’

It is easy to connect the camera. Insert the flex cable into the CAMERA connector on the Raspberry Pi, located between the Ethernet and HDMI ports, with the silver contacts facing the HDMI port. To open the connector, pull the tabs on the top of the connector upwards, then towards the Ethernet port. Make sure to insert the cable firmly, taking care not to bend the flex at too acute an angle. To close the connector, push the top part of the connector towards the HDMI port and down, while holding the flex cable in place. The company has provided a video on how to do it.

The Raspberry Pi Global Shutter Camera can now be purchased from any seller for $50, and further details can be found on the company’s documentation website, and announcement page.

Aetina Launches AIE-CP1A-A1 ASIC-based Edge AI System for Computer Vision Applications

Aetina Corporation is a Taiwanese company that designs and manufactures high-performance edge computing hardware and low or no-code software for AI and IoT. The company recently launched a new ASIC-based edge AI system designed for different computer vision applications; the AIE-CP1A-A1.

The AIE-CP1A-A1 system is powered by a compact Blaize Pathfinder P1600 Embedded SoM which is equipped with a dual ARM Cortex A53 processor, the Blaize GSP 16 TOPS AI accelerator, and H.264/H.265 video encoder & decoder for fast image recognition and video analytics tasks. The SoM also boasts extended temperature ranges that make it suitable for use in rugged and challenging environments and also in complex embedded systems and applications. Others include 4GB RAM, PCIe Gen 3.0, and MIPI CSI/DPI camera interfaces.

The ASIC-based AIE-CP1A-A1 embedded computer is fanless has a compact chassis design and can be used for a variety of applications including object detection, human motion detection, and automated inspection. It features an HDMI video output, one microSD card slot, one Gigabit Ethernet port, two USB 3.2 ports, one USB Type-C, a power LED, a reset button, and a host of many others. It enables the flexible development of highly-accurate custom AI algorithms via the Blaize NetDeploy and Picasso SDK. The software platform supports PyTorch, TensorFlow, and ONNX machine learning frameworks.

Features and Specifications of the AIE-CP1A-A1 System Include

  • Blaize PathFinder P1600 SoM with:
    • Blaize 1600 dual Arm Cortex A53 processors
    • Blaize GSP 16 TOPS AI accelerator supporting INT8, INT16, BF16, FP16, FP32 and FP64 data formats
    • H.264/H.265 encode and decode
    • MIPI CSI/DPI camera interfaces
    • 4GB RAM
    • 64MB Quad SPI NOR flash
    • PCIe Gen 3.0
    • 400-pin board-to-board connector
    • Thermal transfer plate and temperature sensing and fan control
    • Power Consumption: 10W typ.
    • Dimensions: 100 mm x 50 mm x 12 mm
    • Temperature range: 0°C – 70°C (commercial); -40°C to +85°C (industrial)
    • Certifications: RoHS, WEE, CE, FCC
  • 8GB eMMC flash
  • MicroSD card slot
  • 1x HDMI 1.4 with HDMI Type-A connector
  • 1x GbE RJ45 port
  • 2x USB 3.2 Gen1 Type-A ports
  • 1x RS232 COM port
  • 1x USB Type-C port
  • 1x Power LED for SoM
  • 1x Reset Button
  • Power Supply: 12V via DC jack or 4-pin connector
  • Dimensions: 160 mm x 125 mm x 80 mm
  • Weight: 1.886 kilograms
  • Temperature range: 0°C – 60°C (operating); -40°C – +85°C (storage)
  • Certifications: CE/FCC

You’ll find some additional information about the AIE-CP1A-A1 on the company’s news page or its product page.

You can also check here for more details on the Blaize P1600 SoM, the Blaize Graph Streaming Processor, and the Blaize Picasso software development kit.

UPSI-1208D Intelligent DC-UPS – 96W – 12V/8A

Avoid system downtimes and data loss!

Modular DC UPS system protects against power failure, voltage fluctuations and flicker.

When considering the purchase of computer accessories, ensuring a reliable and continuous power supply is crucial. An Uninterruptible Power Supply (UPS) system is an essential component for anyone looking to protect their hardware from unexpected power disruptions. Investing in quality peripherals, such as high-resolution monitors, ergonomic keyboards, and precision mice, can significantly enhance your computing experience. However, these accessories are only as reliable as the power source that supports them. A dependable UPS system guarantees that your valuable equipment remains powered and safeguarded against electrical anomalies.

The DC UPS charging and control unit UPSI-1208D for modular and flexible DIN-Rail mounting reliably bridges power failures and faults, so that an uninterruptible 12VDC power supply is ensured at the output at all times. LiFePO4 cells (BP-LFP-D) or Supercaps (BP-SUC-D) are available for energy storage:

10-year battery storage with LiFePO4 cells for long bridging times

Lithium-ion technology with high energy density is ideal for longer bridging times. Our battery packs with LiFePO4 cells convince in safety-relevant applications with a high cycle stability (6,000 charging and discharging cycles) and an integrated battery management system (BMS). The BMS monitors and controls the entire charging and discharging process of each battery cell and thus optimizes the service life and operational reliability of the energy storage device. The integrated cell balancing ensures that all cells are charged evenly so that the full capacity of the battery pack can be used over the long term.

Maintenance-free Supercaps for short and medium bridging times

In the area of short and medium bridging times, absolutely maintenance-free Supercaps (ultracapacitors) are available as highly efficient and particularly long-lasting energy storage devices with more than 500,000 charge and discharge cycles. In contrast to batteries, which store energy via a detour through a chemical reaction, Supercaps are based on electrophysical principles and are charged and ready for use within a very short time. Our Supercap energy storage devices have an integrated control and protection circuit as well as a Connect / Disconnect Power function.

Specifications

  • 12V DC UPS
  • For use with long-life LiFePO4 and Supercap battery packs
  • Intelligent power sharing
  • Regulated output voltage during backup operation
  • Min. load disconnect
  • Power fail timer
  • External signal shutdown
  • USB & RS232 Interface
  • Plug&Play – recognized as UPS by operating system
  • Extended functionality by UPScom management software
  • Reboot function
  • Fuel gauge
  • 3 years warranty

Intelligent charging and control unit UPSI

The compact charging and control module Bicker UPSI is connected to the appropriate energy storage device (LiFePO4 or Supercaps) via two cables. In addition to the energy transmission line (BAT PWR), all relevant operating data of the energy storage device is continuously monitored and controlled on the data line (BAT DATA) via the I2C interface. When changing the energy storage, which is even possible during operation (‘hot swapping’), a battery type ID authentication is carried out so that the appropriate charging and discharging parameters can be set automatically on the DC UPS.

PowerSharing function

On the input side, the intelligent ‘PowerSharing’ function ensures that the upstream AC/DC power supply does not have to be overdimensioned, but that the input power is kept constant and appropriately distributed to the load and battery charger. This means that when there is a low load at the output, more energy flows into the charger and vice versa.

Minimum load detection

The ‘minimum load detection’ of the UPSI control unit monitors the output load to be supplied from the energy storage in backup mode (battery mode). If the load at the output falls below a certain limit value, the energy storage device is automatically disconnected from the charging and control unit, so that the energy store is not unnecessarily emptied by the DC UPS electronics. In addition, the minimum load detection ensures that the computer system has been shut down properly after an initiated shutdown process, before the reboot function initiates the restart of the system.

more information: https://www.bicker.de/en/upsi-1208d_intelligent_dc-ups_96w_12v_8a_din_rail_version_dc-dc

AAEON Announces Products Incorporating Modules from the Entire NVIDIA Jetson Orin Series, Post-GTC

New additions to AAEON’s line of AI edge solutions will be powered by NVIDIA® Jetson AGX Orin™, NVIDIA® Jetson Orin™ NX, and NVIDIA® Jetson Orin Nano™ modules.

AAEON, an industry leading provider of edge AI solutions, will present new additions to its extensive line of platforms powered by NVIDIA® Jetson™ system-on-modules during GTC, a global conference on AI and the metaverse.

As a gold sponsor of the conference, which offers over 650 discussions, panels, and events from industry leaders in the AI space, AAEON highlights upcoming products from their range of embedded Box PCs across the entire NVIDIA® Jetson Orin™ series; including NVIDIA® Jetson AGX Orin™, NVIDIA® Jetson Orin™ NX, and NVIDIA® Jetson Orin Nano™.

The BOXER-8645AI and BOXER-8646AI systems will join BOXER-8640AI and BOXER-8641AI, which were released in December 2022, as part of AAEON’s product range powered by the NVIDIA® Jetson AGX Orin™. Equipped with one HDMI 2.1 and eight GMSL2 ports, the BOXER-8645AI will possess an exceptional interface for peripheral devices, making it particularly suitable for AMR applications. The BOXER-8646AI meanwhile, will feature an astonishing 12 PoE LAN ports, giving customers a versatile smart city solution.

Powered by the NVIDIA® Jetson Orin™ NX, the recently announced BOXER-8651AI and BOXER-8652AI will be accompanied by the BOXER-8653AI, featuring unprecedented connectivity via multiple LAN ports with PoE function and an I/O supporting RS-232/422/485, CAN Bus, and DIO. All three products are scheduled to go into mass production towards the end of Q2.

Product List:

  • BOXER-8645AI and BOXER-8646AI – NVIDIA Jetson AGX Orin
  • BOXER-8653AI – NVIDIA Jetson Orin NX
  • BOXER-8622AI – NVIDIA Jetson Orin Nano

In an exciting development, AAEON has also announced the BOXER-8622AI, which will join the BOXER-8621AI in being the first AAEON solutions powered by NVIDIA® Jetson Orin Nano modules. The BOXER-8622AI will come equipped with dense I/O and expansion options, including three USB Type-A ports, DB-9 for RS-232/422/485, 13 DIO, and CAN bus, along with Wi-Fi, 5G, and additional storage support via M.2 connectors.

“We have always aimed to provide our customers with world-leading AI edge computing solutions,” said Alex Hsueh, Associate Vice President of AAEON’s System Platform Division. “We are therefore very happy to announce products that will incorporate modules from the entire NVIDIA Jetson Orin series,” Hsueh added.

For more information about AAEON’s extensive line of solutions powered by NVIDIA® Jetson™ system-on-modules, please visit their dedicated section on the AAEON website.

Wide-Temp SMARC Module with Qualcomm QCS610 SoC

IBASE Technology Inc., a global leader in the manufacture of embedded computing products, has launched the new RM-QCS610 SMARC 2.1 compliant module powered by an Octa-core Qualcomm QCS610 SoC and designed for the creation of devices with edge artificial intelligence (AI) and machine learning capabilities such as vision-enhanced drones, advanced intelligent conferencing cameras, and smart robots.

“The low cost, low power RM-QCS610 offers high performance for devices with edge AI capabilities that have grown in popularity in the last few years,” explained Albert Lee, Executive Vice President at IBASE. “The module is our first Qualcomm-based platform. It provides flexible I/O interfaces and brings powerful visual edge computing to accelerate AI across devices with sensors or cameras to collect and process information, make decisions, and perform tasks in the same location in applications including traffic data collection and analysis, computer vision in manufacturing, and automated security validation.”

RM-QCS610 FEATURES:

  • Qualcomm QCS610 SoC
  • Up to 4GB LPDDR4,32GB eMMC
  • Qualcomm Adreno 612 GPU 3D graphics accelerator with 64-bit addressing 845 MHz
  • 4K video capture and playback at 30fps
  • 3.15 TOPS @Caffe
  • Validated with Open Linux Embedded 5.4 and Android 12 (2023/2, CS)
  • Long lifetime supply with Qualcomm solution
  • Compliant with SMARC™ 2.1

The RM-QCS610 features a Qualcomm Adreno 612 GPU 3D graphics accelerator with 4K video capture and 30fps playback support, up to 4GB LPDDR4, 32GB eMMC, and dual smart camera operation. Built to withstand harsh environments, it supports a wide-range operating range of from -30°C to +85°C. Aside from offering reliability and longevity in supply, the module has passed the OS validation procedure with Open Linux Embedded 5.414.04 and Android 12 (2023/2, CS). The RP-105 carrier board is available for the expansion of Micro SD, Mini PCI-E, TTL, HDMI, MIPI-DSI, and MIPI-CSI cameras.

The RM-QCS610 and RP-105 will be demonstrated at Avalanche Computing’s booth #R214 during the upcoming Smart City Summit & Expo, held from March 28-31, 2023 in Taipei, Taiwan. With the automatic programming and interface design developed by Avalanche Computing’s AI software, the RM-QCS610 helps achieve optimal computing performance with SaaS cloud management and reduces AI development time for faster time-to-market.

more information: https://www.ibase.com.tw/en/product/category/RISC_Platform/SMARC_Module/QUALCOMM_SMARC_2_1_Module/RM_QCS610

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