Panasonic PAN B511-1C: nRF54L15-Based Bluetooth 6.0 and 802.15.4 Module with Secure IoT Features

Panasonic Industry has launched the PAN B511-1C, a small, cost-effective Bluetooth 6.0 module designed for high-performance Bluetooth Low Energy applications and ultra-low-power wireless communication. Built around the Nordic nRF54L15 single-chip controller, it offers impressive performance and memory while keeping power consumption to a minimum.

Featuring a hybrid Castellated holes and LGA footprint design, the module supports both Bluetooth 6.0 and 802.15.4. At its core, a 128 MHz Arm Cortex-M33 microcontroller is paired with 1.5 MB of non-volatile RAM and 256 KB of SRAM. A built-in chip antenna, 8 dBm output power, and certifications for CE RED, FCC, ISED, and MIC ensure strong performance and regulatory compliance. With a reception sensitivity of -98 dBm at 1 Mbit/s and -106 dBm at 125 kbit/s in long-range (LE) mode, the PAN B511-1C is a powerful solution for next-generation wireless applications.

We previously covered the Laird Connectivity BL54L15 and BL54H20 nRF54 modules. The BL54L15 series is based on Nordic’s nRF54L15 SoC, while the BL54H20 series features the Nordic nRF54H20 SoC. We also covered the nRF54L15 development board.

PAN B511-1C module specification:

• SoC: Nordic Semiconductor nRF54L15
  • MCU Cores:
    • Arm Cortex-M33 with Arm TrustZone @ 128 MHz
    • RISC-V coprocessor for software-defined peripherals
• Memory and Storage:
  • 256KB SRAM
  • 1.5MB non-volatile memory
• Wireless Connectivity:
  • Bluetooth 6.0
  • IEEE 802.15.4 radio for Thread, Zigbee, and Matter
  • Nordic proprietary 2.4 GHz ultra-low-power multiprotocol radio (up to 4 Mbps)
  • Data rates: 2 Mbps, 1 Mbps, 500 kbps, 125 kbps
  • Frequency: 2402 to 2480 MHz
  • Tx Power: Up to +8 dBm
  • Rx Sensitivity:
    • -98 dBm at 1 Mbps
    • -106 dBm at 125 kbps (LE long-range mode)
• Antenna: On-board chip antenna with RF-bottom pad
• Peripherals:
  • 32x GPIOs
  • 4x SPI/UART/TWI
  • High-speed SPI/UART
  • PDM, I2S, PWM, QDEC, ADC (14-bit)
• Misc.:
  • Angle of Arrival (AoA) / Angle of Departure (AoD)
  • Channel Sounding
• Security: Arm TrustZone-M
• Power Supply: 1.7V to 3.6V
• Operating Temperature: -40°C to 85°C
• Dimensions: 10.35 x 9.8 x 1.9 mm (Hybrid castellated holes & LGA footprint)
• Certifications: Expected to be certified for CE RED, FCC, ISED, and MIC

The PAN B511-1C features a cryptographic accelerator with side-channel leakage protection and built-in security functions, including secure boot, secure firmware updates, and tamper detection. These capabilities make it well-suited for IoT, industrial automation, smart home, medical wearables, and battery-powered applications.

The PAN B511-1C module will be available in three variants:

• ENW89861A1KF (Premium): Includes a 32.768 kHz crystal and an additional 4 MB Flash.
• ENW89861A2KF (Standard): Features a slow clock but no extra Flash.
• ENW89861A3KF (Economy): Does not include a slow clock or extra Flash.

The ENW89861AXKF evaluation board comes with the PAN B511-1C Economy module but is equipped with 8 MB memory and a slow clock on the EVB.

The PAN B511-1C supports the nRF Connect SDK, which includes Zephyr RTOS, nRF Connect for Desktop, and Segger Embedded Studio for programming and debugging.

Mass production of the PAN B511-1C Bluetooth 6.0 and 802.15.4 module is expected to begin in June 2025. More details can be found on the product page and in the press release.

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