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Deep Discharge Protector for 3.6V Li-Ion Battery

A rechargeable battery’s load should be disconnected at the point of complete discharge, to avoid a further (deep) discharge that can shorten its life or destroy it. Because a battery’s terminal voltage recovers when you disconnect the load, you can’t simply disconnect the load when the terminal voltage dips below the established threshold and then re-connect it when the voltage returns above that threshold. Such action may produce chatter in the disconnect switch. The project shown here is a complete solution to this problem.

The circuit disconnects the load when the battery level goes below a set point. The project is built using the MAX882 chip, which has a low-battery comparator and error amplifier that share the internal reference and the external resistor divider. With the resistor values shown, the low-battery output (LBO) goes low and disconnects both the battery and load when the output falls eighty percent below its nominal value. The battery and load then remain disconnected until RESET is clicked by SW1. Two factors enable the latching action in this circuit: the low-battery comparator remains active during shutdown (most regulators deactivate this comparator during shutdown), and the circuit monitors the regulated output voltage instead of the battery voltage (regulator voltage can’t recover until the regulator is turned back on). The circuit also provides an active-low POWER FAIL signal (LBO, pin 1) that goes low 50ms before the output is turned off. When LBO goes low, C1 discharges through R1 until the active low STBY input reaches its threshold (1.15V). The IC then enters its standby mode and disconnects the battery. IC1 is a linear regulator capable of sourcing 150mA with a 350mV dropout voltage. It has a 10µA standby current.

The disconnect voltage level is set to 3.08V. When the battery voltage drops to 3.08V, it disconnects the load, to reverse the condition, recharge the battery or replace and press the SW1.

Note: It is advisable to use low tolerance 0.1% resistors (R4, R5, R6, R7), for high accuracy,

Circuit Credits: Maxim Semiconductor

Connections and Other Details

CN1: Pin 1 +V 3.3V Output, Pin 2 GND
CN2: Pin 1 -Battery (GND), Pin 2 + Battery
SW1: Reset Switch

Features

Good for 3.6V Li-Ion Battery
Output 3.3V @ 150mA
Cut-off Voltage 3.08V
Load Up to 150mA
On Board Reset Switch
PCB Dimensions 23.18 x 17.46mm

Schematic

Parts List

NO	QNTY.	REF.	DESC	MANUFACTURER	SUPPLIER	PART NO
1	1	CN1	2 PIN MALE HEADER PITCH 2.54MM	WURTH	DIGIKEY	732-5315-ND
2	1	CN2	2 PIN MALE HEADER PITCH 2.54MM	WURTH	DIGIKEY	732-5315-ND
3	1	C1	1uF/10V SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
4	2	C2,C3	4.7uF/10V SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
5	1	R1	220K 5% SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
6	1	R2	1K 1% SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
7	2	R3,R4	1M 0.1% SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
8	1	R5	49.9K 0.1% SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
9	1	R6	604K 0.1%	YAGEO/MURATA	DIGIKEY
10	1	R7	0E SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
11	1	SW1	TACTILE SWITCH	NKK SWITCH	DIGIKEY	HP0215AFKP2-ND
12	1	U1	MAX882 SOIC8	ANALOG DEVICE	DIGIKEY	MAX882CSA+-ND

Connections

Gerber View

Photos

Video

MAX882 Datasheet

Forlinx Introduces SBC powered by TI’s newest quad-core Sitara AM6254 processor

Posted on 1 August, 2022 by Emmanuel Odunlade

Forlinx Embedded, a leading manufacturer and supplier focused on designing and providing customers with trusted, ready-to-use, and easy-going ARM single board computers have introduced a new OK6254-C single board computer compatible with a FET6254-C SoM which is based on the quad-core Sitara AM6254 processor from Texas Instruments. The OK6254-C SBC boasts up to 8GB of eMMC, 2Kbit EEPROM, and up to three displays (one 16-bit RGB parallel interface and two dual-channel LVDS ports).

The FET6254-C SoM is a cost-effective and high-performance SoM based on AM62x series industrial grade SoCs. These SoCs, powered by 1.4GHz ARM Cortex-A53 cores, come with dual display support, a 3D graphics processing unit, one general-purpose memory controller, and high-speed interfaces.

The SoM is designed with ultra-thin connectors on its back for mating with the carrier board and has a combined height of only 2mm that allows for plug operations and maintenance. The SoM also has rich peripheral interface resources including dual GbE LAN ports, USB 2.0, RGB parallel, UART, CAN-FD, Camera, and Audio.

The SoM is widely applicable in projects like edge computing, retail automation, medical and laboratory equipment, appliance user interface and connectivity, industrial computer, industry 4.0, Human Machine Interfaces (HMI), 3D Re-configurable automotive instrument cluster, Telematics Control Unit (TCU), etc.

Key Features and Specifications of the FET625x-C SoM Include:

Processor: TI AM6254
- CPU: 64-bit ARM Cortex-A53 quad-core processor (up to 1.4GHz)
- MCU: Cortex-M4F (up to 400MHz)
- GPU: AXE1-16M GPU that supports OpenGL ES 3.1 and OpenCL 3.0 and Vulkan 1.2
1GB DDR4 (option for 2GB)
8GB eMMC
-40 to +85℃ operating temperature range
5V DC working voltage
Dimensions: 60 mm x 38 mm; 4 x 80-pin board-to-board connector
OS: Linux 5.10.87 + QT5.14.2

OK6254-C Carrier Board Specifications Include:

128 Mbit QSPI
2 Kbit EEPROM
1x microSD card slot (up to 104 MB/s)
1x LVDS dual asynchronous channel (up to 1080×800 @60fps)
1x 16-bit RGB parallel via FPC connector (up to 1024×600 @60fps)
1x headphone output, 1x MIC input
1x FPC connector
2x GbE LAN ports
IEEE 802.11 a/b/g/n/ac dual-band Wi-Fi (via On-board AW-CM358M, up to 433.3Mbps)
Bluetooth 5.0 (up to 3Mbps)
1x MicroSIM card slot (optional)
3x USB 2.0 Host
1x USB 2.0 OTG
1x RS485
2x CAN FD, 2x I2C, 1x SPI (via pin headers)
16x ADC pins (via pin headers)
1x 20-pin JTAG
3x Debug UART
1x Onboard RTC
Power: DC 5V/3A (Type-C)
Dimensions: 190 mm x 130mm

Other useful details on the SoM, SBC, and recommended accessories can also be found on the product page. The company however did not state how much they cost at the moment.

Snapdragon W5+ Gen 1 Wearable Platform with Qualcomm Hexagon DSP V66K AI engine

Posted on 1 August, 20221 August, 2022 by Abhishek Jadhav

Snapdragon has launched a new hardware platform for next-gen wearable devices for extended battery life, enhanced user experience, and innovative design architecture– Snapdragon W5+ and W5. Adoption of these new hardware platforms comes with the announcement that Oppo and Mobvoi will release the first smartwatches with 25 designs in the pipeline across segments.

Snapdragon W5+ Gen 1 is designed with new enhancements to hybrid architecture offering 50% lower power, 2x better performance, 2x richer features, and 30% smaller size compared to the previous generator. The purpose-built platform is manufactured on a 4-nm-based system-on-chip and 22-nm-based integrated always-on co-processor. The hardware platform is capable of supporting low-power connectivity options– Wi-Fi, Bluetooth 5.3, and GNSS.

Inside the Snapdragon W5+ and W5 system architecture are the Qualcomm SW5100 and SW5100P powerful system-on-chip featuring a quad-core Arm Cortex-A53 processor, Qualcomm Adreno 702 GPU with dual ISPs supporting 16-megapixel cameras, 4G LTE multi-mode modem, and dual Qualcomm Hexagon DSPs. The always-on co-processor is an ultra-low-power Qualcomm QCC5100 system-on-chip featuring Arm Cortex-M55 processor core with U55 ML core, HiFi5 DSP, and integrated Bluetooth 5.3 connectivity.

“The new wearable platforms – Snapdragon W5+ and Snapdragon W5 – represent our most advanced leap yet,” said Pankaj Kedia, senior director, product marketing, and global head of Smart Wearables, Qualcomm Technologies, Inc. “Purpose-built for next generation wearables, these platforms address the most pressing consumer needs by delivering ultra-low power, breakthrough performance, and highly integrated packaging.”

Specifications of Snapdragon W5+ Gen 1 Platform:

SoC: Quad-core Arm Cortex-A53 at 1.7GHz optimized for wearables, fabricated using 4nm process technology and runs Wear OS by Google and AOSP
Co-processor: Arm Cortex-M55 at 250MHz, fabricated using 22nm process technology, and features a U55 machine learning core
GPU: Qualcomm Adreno 702 graphics unit at 1GHz
DSP: Dual Hexagon QDSP V66K
Memory:
Wireless connectivity: Bluetooth 5.3, Wi-Fi 802.11n, Co-ex for Bluetooth, Bluetooth LE, Wi-Fi, LTE, and NFC supported via third party
Display: MIPI-DSI for the SoC and QSPI with DDR for the QCC5100 co-processor supporting up to 1080 pixels at 60 frames per second, optimized for wearables
Camera: 2x 4-lane CSI Next-gen Spectra IS1×16 LPDDR4 2133MHzP with dual ISP supporting 16MP+16MP
Power management: New wearable PMIC optimized for low power and high integration systems
Operating system: Wear OS by Google and Android Open Source, FreeRTOS on AON co-processor

“We are thrilled to be working with a range of customers and partners, thus expanding our thriving wearable ecosystem, and are delighted to announce 25 designs in the pipeline across segments based on the new platforms. We have collaborated extensively with our first customers, Oppo and Mobvoi, over the last year and look forward to seeing their products,” said Kedia.

For more information, head to the official product page of the Snapdragon W5+ Gen 1 wearable platform.

PIX NII mini PC with powerful dual 4K HDMI video stream through Wi-Fi 6 connectivity

Posted on 1 August, 20222 August, 2022 by Abhishek Jadhav

Pixcore, a Shenzhen-based embedded device manufacturer, has launched a crowdfunding campaign that aims to raise $6300 USD for its powerful mini personal computer, PIX NII, with advanced dual 4K HDMI video streaming using Wi-Fi 6 connectivity. Pixcore PIX NII mini-PC is powered by the Intel Pentium N6005 CPU with a small form factor, perfect for those looking for a next-generation mini-PC to easily switch between work and entertainment.

Pixcore PIX NII mini-PC looks very similar to the Apple Mac mini but weighs only 160 grams and delivers high performance leveraging the four Tremont CPU cores at a speed of up to 3.3GHz with 10-nm process technologies. The company claims the PIX NII mini-PC outperforms most of the other mini-PCs on the market due to its improved CPU performance.

The PIX NII mini-PC is marketed with a feature that supports two 4K HDMI video streams at 60Hz output for high-end gaming or office work. This enables the user to utilize two monitors simultaneously for more screen space for efficient workflow. Regarding wireless connectivity, the PIX NII mini-PC is designed to support Wi-Fi 6 connectivity to provide 3x faster Wi-Fi speeds, lower latency of around 10ms, and advanced traffic management to deliver a smooth Internet experience.

There also comes Bluetooth 5.2, which is an essential connectivity protocol for any personal computer in the modern electronics ecosystem that allows the user to connect dozens of Bluetooth-compatible devices for easy and remote control of the mini-PC. The manufacturer has provided a list of devices that can be interfaced using various expansions, including HDMI, a USB 3.2 port, and a 3.5mm audio jack. These devices include a monitor, TV, projector, flash drive, keyboard, mouse, printer, speaker, mic, and headphones. For additional storage, the PIX NII mini-PC comes with a MicroSD slot for optional SD card storage.

To efficiently handle massive workloads, the PIX NII operates silently with a dedicated cooling solution to ensure optimal heat dissipation. The mini-personal computer delivers peak performance at all times without the noise of a fan through its highly efficient cooling system. For software support, the PIX NII works on multiple operating systems, including Windows, Ubuntu, and Linux, and gives the flexibility to the user to choose one for the best performance.

The crowdfunding campaign is actively looking for more supporters to help the manufacturer develop the NIX PII mini-PC. The pledge option starts at $249.00 for 16GB RAM and 1TB NVMe storage. Head to the official Indiegogo page and show your support.

MATRIX Industries PRMT11-18305-30 Prometheus Energy Harvest Module

Posted on 1 August, 20222 August, 2022 by mixos

MATRIX Industries PRMT11-18305-30 Prometheus Energy Harvesting Module converts thermal energy between small temperature gradients into useful electrical output, enabling users to power a device or recharge a battery or supercapacitor. The PRMT11-18305-30 integrates a Gemini Thermoelectric Generator (TEG) with a Mercury Energy Harvesting Boost Converter. This patented technology ensures perfect electrical impedance matching between the TEG and its companion Boost Converter.

The MATRIX Industries PRMT11-18305-30 Prometheus Energy Harvesting Module is offered in an 18.0mm x 30.0mm x 5.1mm form factor.