Seeed Studio teases WiLoBLIno, gets Seeed LoRa-E5 and ESP32 for rapid prototyping

Chinese embedded device manufacturer, Seeed Studio, along with Antonio Cotos Facal, CTO of Black Device have designed a WiLoBLIno hardware platform fueled by the in-house Seeed Studio’s LoRa-E5 and ESP32 modules. WiLoBLIno name is derived from Wi-Fi (Wi), LoRa (Lo), Bluetooth (BL), and Arduino-compatible stack (Ino). The hardware is still in the development phase, but Seeed Studio’s Amanda Sun, overseas marketing and development manager decided to reveal some details and schematics of WiLoBLIno. Through a rich set of wireless communication support, WiLoBLIno is expected to make its way through the overcrowded embedded device industry. The flexibility to interface with Arduino development boards enables the user to take advantage of the existing modules and sensors.

At the heart of the WiLoBLIno is the LoRa-E5 module integrated with STM32WLE5JC Arm Cortex-M4 low-power microcontroller and LoRa SX126X. The board is a compact and high-performance LoRa module designed for various IoT nodes, supporting EU868 and US915. Another onboard module is the ESP32-WROOM-32U which comes with an ESP32-D0WD chip with both the CPU cores that can be controlled individually, and the CPU clock frequency is adjustable from 80MHz to 240MHz.

Specifications of WiLoBLIno development board:

  • LoRa module: Seeed Studio LoRa-E5 wireless module
    • MCU: STM32WLE5JC with Arm Cortex-M4 processor core
    • LoRa: SX126X
    • Long distance use: 158dB link budget
    • Wireless connectivity: Embedded LoRaWAN protocol, AT command, support global LoRaWAN Frequency Plan
    • Serial communication: 3x UART, 1x I2C, 1x SPI
    • Modulation: LoRa, (G)FSK, (G)MSK, and BPSK
    • Power supply: 1.8V to 3.6V
    • Dimensions: 12x12x2.5 mm
  • ESP module: ESP32-WROOM-32U with ESP32-D0WD chip clocked up to a frequency of 240MHz
    • Wi-Fi: IEEE802.11b/g/n
    • Bluetooth: Bluetooth version 4.2 and Bluetooth Low Energy
    • Module interface: SD card, UART, SPI, I2C, LED PWM, Motor PWM, I2S, GPIO, ADC, DAC, etc.
    • Onboard sensor: Hall sensor
    • Storage: Integrated SPI flash of 4MB
    • Operating voltage: 3.0V to 3.6V
    • Operating temperature: -40°C to +85°C
    • Dimension: 18x19x2x3.2 mm
  • Power supply: 3V3 to 5V
  • Ports: USB Type-C for power supply and programming

Currently, we do not have any information on product availability or pricing, but we have contacted Seeed Studio for a response. Stay tuned for more updates as we update the article with more information as the development process progresses.

Meanwhile, you can check out the blog post on Seeed Studio’s website.

Nordic Thingy:53 gets the Edge Impulse firmware for rapid IoT prototyping

Nordic Thingy53

Norwegian embedded device manufacturer Nordic Semiconductor has announced the commercial availability of Nordic Thingy:53, a new addition to the Nordic Thingy family. This multisensor prototyping hardware platform features multiple onboard sensors and robust short-range wireless connectivity for embedded machine learning applications. The hardware also comes with an embedded Edge Impulse machine learning firmware to reduce the time to market and develop edge applications using an advanced wireless connection.

The Nordic Thingy:53 is based on the Nordic’s in-house nRF5340 dual-core Arm Cortex-M33 multiprotocol system-on-chip that incorporates an nPM1100 power management unit and a front-end module nRF21540. The Thing:53 is equipped with a six-axis inertial measurement unit and a low-power accelerometer. The onboard environmental sensor, includes temperature, humidity, air quality, and pressure. There also comes a color and light sensor, buzzer, and Pulse Density Modulation microphone.

“Nordic’s ‘Thingy’ family has already proven itself with the developer community as the fastest route to prototype and develop innovative short-range wireless and cellular IoT applications. Now with the addition of Thingy:53, we enhance the range by introducing a prototyping platform using our most powerful and capable multiprotocol SoC,” says Pär Håkansson, Nordic’s Product Manager for Thingy:53.

Specification of Nordic Thingy:53

  • SoC: nRF5340 system-on-chip featuring a high-performance Arm Cortex-M33 application core clocked at 128MHz and an ultra-low-power Arm Cortex-M33 network core clocked at 64MHz.
  • Wireless connectivity: nRF21540 FEM, Bluetooth Low Energy (Bluetooth LE), Thread, Matter, Zigbee, IEEE 802.15.4, NFC, and
  • Bluetooth mesh RF protocols,
  • LEDs: RGB, programmable
  • Interface: Qwiik/Stemma/Groove compatible 4-pin JST
  • Buttons: Available through the casing, programmable
  • Battery: 1350 mAh Li-Po, USB-C rechargeable
  • Sensors: Temperature, humidity, air quality, air pressure, 6-axis with accelerometer, colour and light sensor
  • Microphone: PDM, wake-on-sound capable
  • Buzzer: Piezoelectric, 4 kHz

Nordic Thingy53 Platform

The Nordic Thingy:53 is shipped with a pre-installed nRF Edge Impulse machine learning firmware to transfer training data wirelessly using wireless connectivity to the cloud via the Edge Impulse mobile application. The trained AI model can be wirelessly deployed on the hardware platform. The mobile application is capable of demonstrating the performance of the Thingy:53. The nRF Programmer application for the Nordic Thingy:53 also gives the user additional flexibility for prototyping IoT edge applications. The app will enable developers to flash firmware directly over-the-air from an iOS or Android device.

“The nRF5340 also incorporates Nordic’s PMIC and range extender for excellent battery performance and link budget, and multiple advanced sensors. And for the first time, developers who are not experienced in machine learning can easily leverage the technology through Thingy:53’s pre-programmed Edge Impulse firmware and the nRF Edge Impulse mobile app. Machine learning is the key to tomorrow’s advanced IoT edge processing,” Håkansson added.

For more information on Nordic Thingy:53, head to the official product page.

Google and SkyWater Technology collaborate to launch an Open-Silicon developer portal

Build Open Silicon

With the exponential increase in the demand and requirement of silicon-based chips, Google, in partnership with SkyWater Technology, has launched a new platform to encourage and help the developer community to get started with its Open MPW shuttle program. Leveraging SkyWater’s open-source process design kit (PDK), the platform allows developers to submit open-source integrated circuit designs to get manufactured at zero cost. Therefore, the partnership marks a major breakthrough for the open silicon ecosystem, enabling customers to develop complex and advanced silicons with ease.

Along with Moore’s law termination and the upsurge of connected devices (IoT), there is a significant need to discover more sustainable methods to expand computing. Moving toward more efficient dedicated hardware accelerators is what we need to do instead of just packing more transistors into smaller areas. Due to recent challenges with the global chip supply chain, consumers have seen significant rising prices, shortages, queues, and scalping. Hence, we must accomplish this by using more of the existing global foundry capacity, which provides access to older and proven process node technology.

Build Open Silicon Tapeout

Recommended reading: EFABLESS LAUNCHES CHIPIGNITE WITH SKYWATER TO BRING CHIP CREATION TO THE MASSES

The SKY130 process node (a 130nm technology), enables the development and prototyping of IoT applications that often need to maintain a balance between cost, power, and performance while including an amalgamation of analog blocks and digital logic. The availability of an open-source and manufacturable PDK alters the status quo in the custom silicon design industry and academia. Designers are now free to start their projects without the constraints of NDAs or usage limitations. Further, the open-source platform enables peer developers to replicate complex designs.

“By combining open access to PDKs, and recent advancements in the development of open-source ASIC toolchains like OpenROAD, OpenLane, and higher-level synthesis toolchains like XLS, we are getting us one step closer to bringing software-like development methodology and fast iteration of cycles to the silicon design world. We believe we are at the edge of a similar revolution for custom accelerator development, where hardware designers compete by building on each other’s works rather than reinventing the wheel”, claims Johan Euphrosine.

Previous versions of the Open MPW Shuttle Program received contributions varying from the Microwatt OpenPOWER 64-bit core to RISC-V cores to Sudoku accelerators, hardware implementations of games, SRAM/ReRAM generators, and other small ASICs. The design submissions also included crypto and ML operations accelerators along with multiple group submissions.

With this collaboration, the end-user can avail the advantage of a standardized 2.92mm x 3.52mm user area and 38 I/O pins for each project. The design can be hardened by a predefined harness. Additionally, the platform also provides the necessary test infrastructure to test and validate the chip specifications before submitting the design for tape out.

Google has launched its new developer portal that provides instructions to get started with various tools of the open-source silicon ecosystem. To get started on your silicon journey, check out the Google Open-Source Blog.

Crowdfunding ShaRPiKeebo handheld Linux computer comes with a Raspberry Pi

ShaRPiKeebo Linux Computer

French electronic designer Morpheans has launched a crowdfunding project, ShaRPiKeebo, a Raspberry Pi Zero W and Zero 2 W powered portable Linux computer that features a classic QWERTY keyboard and a 2.7-inch memory display. The tiny ShaRPiKeebo computer is designed with a low-power, black and white SHARP memory display that works efficiently even in the daylight. On the wireless connectivity side, the handheld Linux computer supports Wi-Fi and Bluetooth along with a long-range wireless transceiver.

Looks similar to the Pocket C.H.I.P. indie gaming machine, the ShaRPiKeebo computer brings the power of one of the famous Raspberry Pi tiny modules, Raspberry Pi Zero 2 W. After the successful launch of Raspberry Pi Zero W, there were a lot of developers looking for a better and more powerful computer in the same form factor when the Raspberry Pi Foundation released the new version– Raspberry Pi Zero 2 W. Thanks to the in-built wireless connectivity of the Raspberry Pi module, making the handheld Linux machine an ideal candidate for your IoT applications.

Specifications of the ShaRPiKeebo

  • Module: Raspberry Pi Zero W and Zero 2 W
  • Wireless connectivity: Wi-Fi IEEE802.11b/g/n, Bluetooth 4.2 LE, and long-range wireless communication with the 433 MHz RFM95 LoRa transceiver
  • Display: LS027B7DH01 2.7-inch SHARP memory display with low latency, low power and a resolution of 400×240 pixels
  • Power: 5V via Type-C USB port and support for an onboard battery module through the 2-pin JST connector (LiPo battery)
  • Dimensions: 115x66x20 mm
  • Weight: Approximately under 100 grams

ShaRPiKeebo Linux Computer View

Morpheans’ ShaRPiKeebo is a battery-powered nanocomputer designed for gamers, system administrators, developers, makers, and students. But as far as the hardware is concerned, it cannot serve applications requiring complex computational. For open-source hardware, the manufacturer has provided all the design files in the official GitHub repository for interested developers to engage and contribute. The portable Linux-powered computer offers a JST connector allowing the user to quickly connect to the LiPo battery of their choice to achieve an extended battery life.

Additionally, the portable computer offers four independently controlled LEDs that are easily programmable using the classic GPIO commands in C++ or Python. ShaRPiKeebo can be used as an external keyboard when attached to another device, for instance, a rack server. It extends its support for QMK-keyboard flashing or upgrades via the ISP programming port.

The crowdfunding goal of ShaRPiKeebo is $45,000, and the campaign runs until July 21, 2022. Priced at $150, the developer can pledge the price tag to get their own ShaRPiKeebo handheld Linux computer.

Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology

ST Metalenz metasurface technology

Metalenz, the fabless semiconductor company, and the Swiss semiconductor manufacturing company STMicroelectronics announced the VL53L8 direct Time-of-Flight (dToF) sensor, a market debut of the meta-optics devices developed through their partnership.

The meta-optics technology by Metalenz can replace existing complex and multi-element lenses and provide new functionality. This is achieved by supplying 3D sensor modules that improve performance, power, size, and cost in various consumer, automotive, and industrial applications. The metasurface technology has been made commercially available for the first time now for its use in consumer electronics.

The co-founder and CEO of Metalenz, Rob Devlin, said,

“We have multiple wins that mark the first application of our platform technology, and we are now designing entire systems around its unique functionality. Our meta-optics enable exciting new markets and new sensing capabilities in mobile form factors and at a competitive price.”

The metalens technology by Metalenz is completely planar, unlike traditional curved and molded lenses. The planar metasurface optics are now manufactured on silicon wafers alongside electronics in STMicroelectronics’ front-end semiconductors. While taking up less area, meta-optics collect more light, give several functionalities in a single layer, and enable new forms of sensing in smartphones and other devices. Certain existing optics in ST’s FlightSense ToF modules have been replaced by Metalenz’s flat-lens technology, allowing it to serve in applications like drones, robots, smartphones, and vehicles.

The executive vice president and general manager of ST’s Imaging Sub-Group, Eric Aussedat, said that

“Perfectly complementing ST’s advanced manufacturing capabilities and ToF technology, the introduction of products embedding Metalenz’s game-changing metasurface optics now enables significant power efficiency, optical performance, and module-size optimization that all bring benefit across consumer, industrial, and automotive markets.”

The collaboration between Metalenz IP and ST manufacturing brings together the accuracy and precision of the electronics chip industry to make very precise and repeatable meta-optics. This furthermore unlocks a completely new way to make lenses that combine high quality with large-scale, cost-effective manufacturing.

More information on this revolutionary optical technology can be found on the press release page in the newsroom.

Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules

Providing High-Performance Computing in a Globally Connected World

  • AAEON launches the latest 12th Generation Intel® Core™ processor (formerly Alder Lake-S) based Computer on Module (COM) with the new COM-HPC standard
  • Extensive lineup of COM Express modules from AAEON includes the Intel® Xeon® D series processor (formerly Ice Lake D) based COM Express Type 7 and the 11th Generation Intel® Core™ processor (formerly Tiger Lake UP3) based COM Express Type 10
  • Dedicated engineer team support for COM projects helps to shorten the time to market

In today’s globally connected world, data is shared more frequently and in greater volumes than ever before. Consequently, this requires more powerful information processing technology, yet there remains a demand across all computing mediums for the hardware processing this information to be smaller, faster, and more sophisticated.

For this reason, AAEON, a leading manufacturer of industrial IoT and AI Edge solutions, has introduced its latest Computer-on-Module (COM) innovations, including the 12th Generation Intel® Core™  processor-based COM-HPC standard client module, the Intel® Xeon® D series processor-based COM Express Type 7, and the 11th Generation Intel® Core™ processor-based COM Express Type 10.

The AAEON COM-HPC module, HPC-ADSC, features the 12th Generation Intel® Core™ processor (formerly Alder Lake S) for high-speed processing, widespread connectivity, and environmental resilience for flexible deployment in IoT industrial contexts. It supports PCIe x16 Generation 5 interface and two DDR5 SODIMM memory sockets with in-band ECC support for up to 128 GB capacity. It is integrated with 25 GbE and 2.5 GbE interfaces for huge data transmission.

The AAEON COM Express Type 7, COM-ICDB7, is powered by the latest Intel® Xeon® D series (formerly Ice Lake D). It’s a high-performance computing unit for enhancing connectivity, streamlining communication, and building the infrastructure of the future. It supports PCIe x16 Generation 4 and four DDR4 SODIMM sockets with in-band ECC support for up to 128 GB. It is integrated with four 10 GbE and one 1 GbE interface.

The AAEON COM Express Type 10, NanoCOM-TGU, features the 11th Generation Intel® Core™ series (formerly Tiger Lake UP3) for high-speed processing on the smallest form factor. It supports PCIe x4 Generation 4 interface, LPDDR4x for up to 16GB, and onboard NVMe for up to 512 GB. It is integrated with a 2.5 GbE interface, a DDI interface, and eDP interface. It supports a wide temperature range between -40~ +85C for harsh environment applications.

Additions, customizations, and project-specific features can be accommodated on AAEON COM Express modules thanks to AAEON’s expertise in OEM and ODM. For quick and high-quality technical service support on Computer-on-Module projects, AAEON offers the “Q Service.”

The AAEON Q Service is a dedicated engineering support team that will co-design and co-debug alongside customers during the development of their COM Express projects. With experienced design and field application engineers, AAEON’s Q Service is committed to helping customers reduce the time spent on troubleshooting and expediting the development process.

AAEON will showcase the new COM-HPC standard and COM Express product line at their booth in Embedded World on June 21 – 23, 2022. Visit Booth #306 in Hall 1 at Nuremberg Messe, Germany to learn more.

Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4

BPI-CM4

Banana PI has announced the release of its new cost-efficient computer module BPI-CM4 for enhanced performance in embedded applications. The company has stated that this new Banana Pi BPI-CM4 replicates Raspberry Pi’s Compute Module 4 (CM4). This board was developed as a substitute or replacement for the Raspberry Pi CM4. In addition to using its design, the BPI-CM4 also shares similar interfacing pins as the Raspberry Pi’s CM4. Banana Pi appears to have packed a lot of punch into its new small-sized computer module.

Deeper Look at Amlogic 311D

The system on chip (SoC) in the BPI-CM4 is Amlogic 311D, a powerful and advanced AI application processor by Khadas which can be also seen in the Banana Pi BMP-MS2. This processor comes with the high power-efficient Quad Arm Cortex-A73 cores clocked at 2.2 GHz and dual Cortex-A53 cores clocked at 1.8 GHz providing high performance. Essentially, the GPU is a mid-range Arm Mali-G52 MP4 (6EE) graphic card and a Neural Processing Unit (NPU) at 5.0 TOPS handling a good amount of computing operations.

Front and back view of BPI-CM4

Technical specifications of BPI-CM4

  • Memory -BPI-CM4 will have a 2GB RAM / 4GB RAM variant as well as 16GB of eMMC storage, expandable up to 128GB
  • Connectivity– Banana Pi offers an option of Wifi 5 /Wifi 6 wireless module providing fast experience and wireless range and GigabitEthernet connectivity fulfilling the high-speed internet needs. It is designed with B to B (board to board) connectors, and a solitary PCIe interface expansion for flexibly connecting high-speed components. Considering the industrial applications, the board is comes with an external antenna.
  • Display– It is pin-to-pin compatible with raspberry PI’s CM4 but this is the area where it is not a direct replacement as BPI-CM4 consists of only one HDMI port offering resolutions up to 4K whereas the Rasberry Pi Consists of a dual 4k resolution HDMI port

Unsupported pins in BPI-CM4

Compared to the pins of RasPi-CM4, the red boxes in the image above show the unsupported pins in BPI-CM4. While interfacing the BPI-CM4, it has the same connection interface as the RasPi-CM4, and the size of the BPI-CM4 is also said to be as same as that of RasPi CM4.

Pricing of BPI-CM4 is not confirmed by Banana Pi yet, but it is expected that this replica of the Rasberry Pi’s CM4 should be more cost-efficient when compared to RasPi-CM4. BPI-CM4 is an overall great power package offered by Banana Pi as it provides the option of the more reliable and less power-consuming latest Wifi version 6 and a powerful chipset Amlogic 311D. For more details visit the official forum page.

MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands

MediaTek Filogic 380 and Filogic 880 SoC

The Taiwan-based fabless semiconductor company, MediaTek, announces its Wi-Fi 7 platforms, Filogic 880 and Filigoc 380, which offer high-bandwidth applications in the operator, retail, enterprise, and consumer electronics industries. The IEEE 802.11be, also known as the 7th generation of Wi-Fi, is an extremely high throughput wireless network that makes use of 2.4GHz, 5GHz, and 6GHz frequency bands. Wi-Fi 7 makes use of modern technology to boost overall capacity, reduce latency, and improve performance for all devices.

The Corporate Vice President and General Manager of the Intelligent Connectivity business at MediaTek, Alan Hsu says,

“Our wireless connectivity solutions are designed to deliver the fastest performance using the most advanced technologies, and represent MediaTek’s commitment to driving Wi-Fi 7 adoption in a large number of new markets. With Filogic 880 and Filogic 380, our customers can deliver fast, reliable, and always-on connected experiences to meet the industry’s growing connectivity demands.”

The Filogic 880 platform

Combining Wi-Fi 7 access points with an advanced host processor, MediaTek’s Filogic 880 is a complete platform that offers the best of the industry router and gateway solutions for the operator, retail, and enterprise markets. The powerful host processor of the platform includes a quad-core Arm Cortex-A73 and an advanced NPU. Some of its key attributes include:

  • Incorporation of a networking crypto engine (EIP-197) for accelerating IPSec, SSL/TLS, DTLS (CAPWAP), SRTP and MACsec
  • High-speed interfaces such as 5Gbps USB and 10Gbps PCI-Express are supported
  • Its scalable architecture can accommodate up to pentaband 4×4 at 36Gbps.
  • The Filogic 880 platform supports Wi-Fi technologies such as 4096-QAM, 320MHz, MRU and MLO
  • Offers support for up to 10Gbps per channel.

MediaTek Filogic 880 Specs

The Filogic 380 platform

A combination of the single-chip 6nm Wi-Fi 7 and Bluetooth 5.3, the Filogic 380 is designed to offer the best connectivity. Owing to the Filogic 380 platform, all client devices, including smartphones, tablets, TVs, notebooks, set-top boxes, and OTT streaming devices, will now have access to the Wi-Fi 7 technology. Some of its key features include:

  • Supports Wi-Fi technologies such as 4096-QAM, 320MHz, MRU and MLO
  • Features the latest Bluetooth 5.3 with LE Audio
  • Dual 2×2 radios are supported for dual-band simultaneous operation
  • Supports 2.4GHz, 5GHz, and 6GHz frequency bands
  • MLOs with speeds up to 6.5Gbps are supported
  • Offers support for up to 5Gbps per channel

MediaTek Filogic 380

MediaTek is one of the first adopters of the Wi-Fi 7 technology, which will soon prove to be the backbone of PAN, LAN, and WAN networks to provide seamless connectivity from multi-player applications to 4K calls 8K streaming, and beyond. For more information on the company’s Wi-Fi 7 platforms, kindly visit their press release page.

MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones

Mediatek Dimensity 1050

The Taiwan-based fabless semiconductor company MediaTek announces its first mmWave 5G chipset, the Dimensity 1050 system-on-chip. The mmWaves are used for high-speed broadband access, which will facilitate powering the next generation of 5G smartphones with seamless connectivity. The dual connection using mmWave and sub-6Hz enables the Dimensity 1050 to offer the speeds and capacity required to provide smartphone users with an outstanding experience, even in the most densely populated regions.

The deputy general manager of the Wireless Communications Business Unit at MediaTek, CH Chen, says,

“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity, and superior power efficiency to meet everyday user demands. With faster, more reliable connections and advanced camera technology, this chip delivers powerful features to help device makers to differentiate their smartphone product lines.”

Combining both mmWave 5G and sub-6GHz, the Dimensity 1050 allows easy migration between network bands. Furthermore, it’s built on the TSMC 6nm production process with an Octa-core CPU, which supports 3CC and 4CC carrier aggregation on the FR1 and FR2 spectrums, respectively. Additionally, two premium Arm Cortex-A78 CPUs with speeds up to 2.5GHz and the latest Arm Mali-G610 graphics engine are included in the SoC.

MediaTek Dimensity 1050 Specs

Features of the Dimensity 1050

  • Supports dual 5G SIM (5G SA + 5G SA)
  • Facilitates dual VoNR, which removes the LTE anchor, allowing the voice call to stay at a 5G network
  • MediaTek MiraVision 760 offers 144Hz full HD+ displays with intense and vibrant colours
  • MediaTek APU 550 boosts AI camera action and provides supreme low-light shots with excellent noise reduction
  • Simultaneous streaming of both front and rear cameras is enabled for users with a dual HDR video capture engine
  • Wi-Fi 6E offers support for superior power efficiency, and the 2×2 MIMO antenna brings faster, more reliable connections
  • Supports high-end UFS 3.1 storage and LPDDR5 RAM, ensuring ultra-fast data streams for speedier application performance.

Additionally, to ensure low-latency connections with the new tri-band (2.4GHz, 5GHz, and 6GHz), that extends game duration and performance, the Dimensity 1050 delivers Wi-Fi optimizations alongside MediaTek’s HyperEngine 5.0 gaming technology.

MediaTek has further said that smartphones powered by the Dimensity 1050 will be available on the market during the third quarter of 2022. For more information on Dimensity 1050, kindly visit their press release page.

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