SGT120R65AL – 650 V, 75 mOhm typ., 15 A, e-mode PowerGaN transistor

The SGT120R65AL is a 650 V, 15 A e-mode PowerGaN transistor combined with a well established packaging technology. The resulting G-HEMT device provides extremely low conduction losses, high current capability and ultra fast switching operation to enable high power density and unbeatable efficiency performances.

  • Enhancement mode normally off transistor
  • Very high switching speed
  • High power management capability
  • Extremely low capacitances
  • Kelvin source pad for optimum gate driving
  • Zero reverse recovery charge

more information: https://www.st.com/en/power-transistors/sgt120r65al.html

IXOLAR™ Thin 1.2 mm, 25% Efficiency Solar Cells

ANYSOLAR’s thin solar cells weigh 40% less and are ideal for charging lightweight battery-powered products

ANYSOLAR’s IXOLAR™ cells are made of high-efficiency monocrystalline solar cells with a power conversion as high as 25%. The 1.2 mm thick solar cells have a 40% reduced weight, making them ideal for charging many battery-powered products where weight is a concern. The Thin KXOB/SolarBits can be assembled and easily reflow soldered as one or many cells, incorporating any variation or number of cells into one product. Also offered is the Thin Solar MD as a module concept of multiple dies in one package. The module is fully encapsulated with polycarbonate (PC) film to protect it from the environmental elements associated with outdoor applications. The SolarMD can be soldered with low-temperature silver paste and oven cured or manually soldered.

The wide range of applications includes remote sensors, battery-powered lights, wireless self-powered security devices and systems, and handheld consumer products such as flashlights, mobile phones, cameras, PDAs, MP3 players, and more. They are also suitable for industrial applications, portable instrumentation, portable high-efficiency tools, portable medical devices, automotive toll transponders, portable radios, and charging emergency backup batteries.

Features

  • Thin 1.2 mm design reduces weight by 40%
  • High efficiency 25% power conversion
  • Operating temperature up to +100°C
  • No degradation of power output
  • No loss of frequency response

more information: https://ixapps.ixys.com/DataSheet/IXYS%20Solar%20Product%20Brief.pdf

VL53L4CD Time-of-Flight High-Accuracy Proximity Sensor measure from 1 mm up to 1200 mm

STMicroelectronics’ ToF sensor provides very accurate distance measurements from only 1 mm up to 1200 mm

Specifically designed for proximity and short-range measurements, STMicroelectronics’ VL53L4CD provides very accurate distance measurements from only 1 mm up to 1200 mm. A new generation laser emitter with 18° FoV (field-of-view) improves performance under ambient light, with ranging speed up to 100 Hz.

With very low power consumption, thanks to an Autonomous mode with programmable distance threshold, the VL53L4CD is ideal for use in battery-powered devices. Its fully embedded on-chip processing helps reduce design complexity and BOM cost since less powerful and less expensive microcontrollers can be used. Like all ToF sensors based on ST’s FlightSense technology, the VL53L4CD records an absolute distance measurement regardless of the target color and reflectance.

Housed in a miniature reflowable package that integrates a SPAD (single-photon avalanche diode) array, the VL53L4CD achieves excellent performance in various ambient lighting conditions and for a wide range of cover glass materials.

All of ST’s ToF sensors integrate a VCSEL (vertical cavity surface emitting laser). It emits a fully invisible 940 nm IR light that is totally safe for the eyes (Class 1 certification).

Features

  • High-accuracy proximity ranging
  • High-performance proximity sensor
  • From 0 mm to 1200 mm with full FoV
  • Short distance linearity down to 1 mm
  • FoV of 18°
  • Autonomous low power mode with programmable interrupt threshold to wake up the host
  • Fast ranging frequency up to 100 Hz
  • Fully integrated miniature module
  • 940 nm invisible laser emitter (VCSEL) and analog driver
  • Low power microcontroller running advanced digital Firmware
  • 4.4 mm x 2.4 mm x 1 mm size
  • Pin-to-pin compatible with VL53L0X, VL53L1X, VL53L1CB, VL53L3CX, and VL53L4CX
  • Easy integration
  • Reflowable component
  • Single power supply 2v8
  • Can be hidden behind cover glass
  • I²C interface (up to 1 MHz)
  • Full set of C software drivers (Linux compatible) for turnkey ranging
  • Embedded processing for very low memory footprint in the host

more information: https://www.st.com/en/imaging-and-photonics-solutions/vl53l4cd.html

Texas Instruments DRV8251 4.1A Brushed DC Motor Driver

Texas Instruments DRV8251 4.1A Brushed DC Motor Driver is an integrated motor driver with N-channel H-bridge, charge pump, current regulation, and protection circuitry. The charge pump improves efficiency by supporting N-channel MOSFET half-bridges and 100% duty cycle driving. The DRV8251 implements a current regulation feature by comparing the analog input VREF and the voltage across a current-sense shunt resistor on the ISEN pin. The ability to limit current can significantly reduce large currents during motor startup and stall conditions.

A low-power sleep mode achieves ultra-low quiescent current draw by shutting down most internal circuitry. Internal protection features include supply undervoltage lockout, output overcurrent, and device overtemperature. The Texas Instruments DRV8251 is part of a family of devices that comes in pin-to-pin, scalable RDS(on), and supply voltage options to support various loads and supply rails with minimal design changes.

Features

  • N-channel H-bridge brushed DC motor driver
  • 4.5V to 48V operating supply voltage range
  • Pin-to-pin, RDS(on), voltage, and current sense/regulation variants (external shunt resistor and integrated current mirror)
    • DRV8870: 6.5V to 45V, 565mΩ, shunt
    • DRV8251: 4.5V to 48V, 450mΩ, shunt
    • DRV8251A: 4.5V to 48V, 450mΩ, mirror
    • DRV8231: 4.5V to 33V, 600mΩ, shunt
    • DRV8231A: 4.5V to 33V, 600mΩ, mirror
  • High output current capability: 4.1A Peak
  • PWM control interface.
  • Supports 1.8V, 3.3V, and 5V logic inputs
  • Integrated current regulation
  • Low-power sleep mode
    • <1µA at VVM = 24V, TJ = 25°C
  • Small package and footprint
  • 8-Pin HSOP with PowerPAD™, 4.9mm × 6.0mm
  • Integrated protection features
    • VM undervoltage lockout (UVLO)
    • Latched overcurrent protection (OCP)
    • Thermal shutdown (TSD)

Block Diagram

more information: https://www.ti.com/product/DRV8251

Diodes Incorporated AP61300Q/AP61302Q Synchronous Buck Converters

Diodes Incorporated AP61300Q/AP61302Q Synchronous Buck Converters are automotive-compliant, 3A, converters having a wide input voltage range of 2.4V to 5.5V. These devices completely integrate a 70mΩ high-side power MOSFET and a 50mΩ low-side power MOSFET which provides high-efficiency step-down DC-DC conversion. The AP61300Q/AP61302Q buck converters can easily be used by minimizing the external component count as it adopts Constant On-Time (COT) control. The COT control helps in achieving fast transient response, easy loop stabilization, and low output voltage ripple. Applications include automotive power systems, automotive infotainment, automotive instrument clusters, automotive telematics, and Advanced Driver Assistance Systems (ADAS).

Features

  • AEC-Q100 qualified for automotive applications
  • Device temperature grade 1: -40°C to +125°C TA range
  • VIN: 2.4V to 5.5V
  • Output voltage (VOUT): 0.6V to VIN
  • 3A continuous output current
  • 0.6V ±2% reference voltage
  • 19μA low quiescent current (Pulse Frequency Modulation)
  • 2.2MHz switching frequency (VIN = 5V, VOUT = 1.8V)
  • Up to 84% efficiency at 5mA light load
  • Programmable operation mode through EN
  • Pulse frequency modulation
  • Pulse Width modulation regardless of output load
  • Low-Dropout (LDO) mode
  • Power-good indicator:
    • AP61302Q
  • Protection circuitry
  • Undervoltage Lockout (UVLO)
  • VIN Overvoltage Protection (OVP)
  • Peak current limit
  • Valley current limit
  • Thermal shutdown

Application Circuit

Block Diagram

more information: https://www.diodes.com/part/view/AP61300Q/

New N-Channel MOSFET with Maximum Power Dissipation of 0.5W

Compact N-Channel 30V MOSFET from Vishay in Stock at TTI

TTI, Inc., a leading specialty distributor of electronic components, has stock for immediate shipment of Vishay’s TrenchFET® Si1308EDL 30V N-Channel MOSFET in the compact SOT-323/SC-70 surface mount package. The three-leaded SC-70 package measures 2.0mm x 2.1mm and has a continuous drain current of 1.4A. Applications include DC/DC converters, boost converters and load switches. Maximum power dissipation of the Si1308EDL is 0.5W. Drain-source on-state resistance is a very low 0.110 ohms and total gate charge is 2.7nC.

For more information, visit Vishay Si1308EDL 30V N-Channel MOSFET at TTI.

MIT Researchers Develop An ASIC To Defend Against Power-based Side Channel Attacks

MIT chip for side channel attacks

A team of researchers affiliated with MIT School of Engineering, Indian Institute of Science, and Analog Devices have collaborated to design a tiny application-specific integrated circuit (ASIC) to defend against power-based side-channel attacks on an IoT device. Before getting into the details of the ASIC, let us first understand what are side-channel attacks. Side-channel attacks try to obtain secret information by exploiting the system or the hardware using channels such as sound, heat, time, and power consumption. Power analysis is a branch of side-channel attacks where power consumption data is used as the side channel to attack the entire system to break the secret key of the cryptosystem.

Most of the existing methods to prevent these side-channel attacks are power-intensive and demand more power which is not feasible for edge AI devices that are deployed in remote areas. The group developed an ASIC that can defend against power side-channel attacks while using less energy than common security techniques. Also, thanks to the minimalistic design with a size smaller than a thumbnail make it convenient to be integrated into edge devices and wearables to perform secure machine learning computations.

The goal of this project is to build an integrated circuit that does machine learning on the edge so that it is still low-power but can protect against these side channel attacks so we don’t lose the privacy of these models,” says Anantha Chandrakasan, the dean of the MIT School of Engineering, Vannevar Bush Professor of Electrical Engineering and Computer Science, and senior author of the paper. “People have not paid much attention to the security of these machine-learning algorithms, and this proposed hardware is effectively addressing this space.

The technique used to prevent some side-channel attacks is known as threshold computing. Unlike the neural network processing on the data, the data is first split into unique and random components which are then operated individually in random order. Due to randomness, the information leakage is reduced as it does not reveal the actual side-channel information. However, as it sounds, the approach is more computationally expensive and requires more memory to store the random ordered information.

To optimize the whole design flow, the researchers developed a function that reduces the multiplication of the neural network to process the data which in turn requires less memory. The neural network model parameters are also protected by grouping them before encryption to provide more security while reducing the amount of memory required on the chip. Sometimes, these model parameters can help hackers to gather information impacting the integrity of the system.

By using this special function, we can perform this operation while skipping some steps with lesser impacts, which allows us to reduce the overhead. We can reduce the cost, but it comes with other costs in terms of neural network accuracy. So, we have to make a judicious choice of the algorithm and architectures that we choose.

Maji says.

The team revealed future work and hopes to implement the approach to electromagnetic side-channel attacks as they are hard to defend because the hacker does not need the physical device to collect the information. The work is being presented at the International Solid-States Circuit Conference.

Nidec Develops the World’s Thinnest-class Linear Vibration Motor

Nidec Corporation announced today that it has developed the world’s thinnest-class linear vibration motor (the “Slider”).

A number of commercially available smartphones and smartwatches are equipped with a vibration motor nowadays. Though, in the past, an eccentric motor was used to create a simple pattern of vibration to notify users of an incoming message, such motors are equipped in recent years with functions to control vibrations to make users feel as if they were pressing a button, and to vibrate in synchronization with the scenes in a game they are playing. Such applications make vibration motors essential in enhancing the sense of immersion and realistic sensations that digital devices provide.

Slider” was developed based on Nidec’s magnetic circuit design technology, which was cultivated in the Company’s design of HDD spindle motors – the products of which we account for the largest global market share. This time, while maintaining an equal level of vibration strength of our existing products, we have successfully developed “Slider”, with a volume 40% less than its predecessors, and with the world’s best-class thinness of 2mm. This achievement enables digital devices to be more compact and thinner than they are now.

As of the end of March 2020, Nidec had shipped a total of more than 300 million vibration motors for smartphones. These motors, manufactured based on our technologies to make light, thin, short, and compact products, to improve efficiency, and to keep everything in control, are highly evaluated by our customers. As the world’s leading comprehensive motor manufacturer, Nidec will stay committed to providing innovative solutions to help shape a comfortable society.

more information: https://www.nidec.com/en/

Nidec Develops Linear Vibration Motors with Smallest-class Diameters in the World

Nidec Corporation announced that it has developed a series of linear vibration motors with smallest-class diameters in the world (the “CA series”).

A number of commercially available smartphones and smartwatches equipped with a vibration motor nowadays. Though, in the past, its primary purpose was to vibrate in a certain pattern to notify users of an incoming message, the motor is equipped with a function in recent years to control vibrations to make users feel as if they were pressing a button. Vibration motors are now expected to be installed in portable devices such as stylus pens, and VR units such as Smart Goggles/Gloves, among others. To accommodate such needs, Nidec has developed a “CA series,” a group of ultra-small cylindrical vibration motors developed based on larger conventional vibration motors.

The “CA series” comprises three vibration motors, “CA3,” “CA7-VH5,” and “CA7-VH9,” all of which are mainly intended to be built into stylus pens. By replicating the way a pen tip vibrates when writing words, the motors recreate a tactile sense to make users feel as if they were actually writing on paper. Additionally, with the motors’ sizes and vibration strength designed to differ by type, we are able to propose motors that satisfy our customers’ needs.

The “CA series” vibration motors were developed based on Nidec’s magnetic circuit design technology, which was cultivated in the Company’s design of HDD spindle motors – the products of which we account for the largest global market share. The “CA series” motors consume only 1.3mW to 6mW of electricity, which is approximately one-fiftieth of the power consumed by the vibration motors installed in general smartphones (data based on a comparison with Nidec’s standard vibration motors). This high-level energy efficiency reduces the required capacity of the battery to be installed in the smartphones, and helps us to trim their weights.

As of the end of March 2020, Nidec had shipped a total of more than 300 million vibration motors for smartphones. These motors, manufactured based on our technologies to make light, thin, short, and compact products, to improve efficiency, and to keep everything in control, are highly evaluated by our customers. As the world’s leading comprehensive motor manufacturer, Nidec will stay committed to providing innovative solutions to help shape a comfortable society.

*The information on the products in this press release is available in the technological contents of the Company’s website as well.

more information: https://www.nidec.com/en/technology/casestudy/tactile_new/

BT indoor positioning antenna board for commercial applications

u-blox, a global provider of positioning and wireless communication technologies and services, has announced the u-blox ANT-B10 antenna board for Bluetooth direction finding and indoor positioning applications. Designed for integration into commercial end-products, the board enables low power, high precision indoor positioning and speeds up evaluation, testing, and commercialisation of Bluetooth direction finding and indoor positioning solutions.

Bluetooth indoor positioning uses the angle of arrival (AoA) of a Bluetooth direction finding signal emitted by a mobile tag at several fixed anchor points to calculate the tag’s location in real-time with sub-meter accuracy. The technology, which benefits from Bluetooth’s vast ecosystem and interoperability across platforms, is gaining traction due to its low cost, high accuracy, and relative ease of installation and maintenance.

Assembling an AoA indoor positioning anchor in seconds

ANT-B10 is a self-contained Bluetooth low-energy antenna board for direction finding and indoor positioning. The board, which features an antenna array comprising eight individual patch antennas, is built around a u-blox NINA-B411 Bluetooth 5.1 module. After processing incoming RF signals emitted by mobile tracker tags in the module’s radio and angle calculation processor, the solution outputs the calculated angle of arrival without requiring any additional processes.

The release also includes the XPLR-AOA-3 explorer kit. It features an application board, which offers developers a quick and easy way to evaluate and test the ANT-B10 antenna board, as well as u-blox’s direction finding algorithm. An off-the-shelf pin header on the application board allows for easy bring-up and testing of ANT-B10 and third-party antenna boards. And connecting the two boards yields a ready-to-use AoA indoor positioning anchor point in seconds.

Ready to go for end-product integration

ANT-B10 and XPLR-AOA-3 complements the existing u-blox indoor positioning offering, which includes the popular XPLR-AOA-1 and XPLR-AOA-2 kits. Using u-connectLocate, which runs on ANT-B10’s Bluetooth module, solution developers can easily execute the angle calculation algorithms using AT commands. When combined, the solution suite is ready to go for end-product integration.

Common use cases for Bluetooth indoor positioning and direction include tracking assets in industrial settings such as in warehouses as well as people and things in hospitals, retail environments, or museums. Additionally, access control systems deployed in connected buildings can use angle detection to determine which side of a door users are located on.

Actively engaged with the technological ecosystem

To determine the angle of arrival of incoming signals for direction finding, the ANT-B10 board concurrently processes them on all eight patch antennas. Because implementing multiple RF paths connected to multiple RF switches unnecessarily increases power demand and introduces errors, the ANT-B10 board uses an industry-leading single RF switch component from u-blox partner CoreHW that cycles through the eight antennas at a microsecond timescale.

“We are excited to be part of such a great all-round indoor positioning solution. u-blox has really demonstrated its commitment to bringing down the barriers to entry for Bluetooth indoor positioning solutions and popularizing the technology,” says Mika Jäsberg, VP Components at CoreHW.

“With the introduction of ANT-B10 and the XPLR-AOA-3 kit, we are excited to offer a complete u-blox RF-to-cloud solution for Bluetooth-based indoor positioning and direction finding. The solution lets developers benefit from our in-house expertise in angle calculation and multipath suppression, saving development costs and shortening time to market,” says Giorgos Marakis, Product Strategy, Short Range Radio, at u-blox.

The ANT-B10 boards are available today – sampling of ANT-B10 to customers has already begun.

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