Qorvo QPC1006 Single-Pole, Triple–Throw (SP3T) RF GaN Switch

Qorvo QPC1006 Single-Pole, Triple–Throw (SP3T) Switch is fabricated on Qorvo’s QGaN25 0.25um GaN on SiC production process. Operating from 0.15 to 2.8GHz, the QPC1006 typically supports 50W input power handling at control voltages of 0/−40V for CW and pulsed RF operations. This switch maintains a low insertion loss of less than 1.0dB and greater than 30dB isolation, making it ideal for high-power switching applications across defense and commercial platforms. The Qorvo QPC1006 is offered in a 4mm x 4mm plastic overmolded QFN package.

Features

  • SP3T
  • 0.15 to 2.8GHz frequency range
  • 50W input power
  • < 1.0dB insertion loss
  • > 30dB typical isolation
  • 50ns switching speed
  • 0V/−40V control voltages
  • 4mm x 4mm x 0.85mm package dimensions

Block Diagram

more information: https://www.qorvo.com/products/p/QPC1006

Open up new IoT possibilities with Seeed XIAO BLE for TinyML and Seeed Fusion PCBA service

Seeed Studio has just released the highly anticipated addition to the XIAO series, Seeed XIAO BLE – nRF52840, a powerful Bluetooth LE microcontroller supporting multiple protocols including Bluetooth 5.0, NFC and Zigbee.

What’s so special about it?  Seeed XIAO BLE and the advanced version, Seeed XIAO BLE Sense are designed for wearable devices and Internet of Things projects, taking advantage of the Nordic nRF52840 MCU’s Bluetooth capabilities of working at long distances, at low power yet with high performance.

The onboard antenna, small size and surface-mountable design make it highly suitable for connected, wearable designs, Internet of Things projects and the possibilities to run AI using TinyML and TensorFlow™ Lite.

Get inspired! To better support Internet of Things developers and enthusiasts to utilize this tiny yet feature-rich board, and accelerate the implementation of IoT industry, smart wear projects and TinyML, Seeed has launched a sponsorship event, manufacture your Seeed XIAO BLE prototype for free with Seeed Fusion PCBA service.

What is Seeed XIAO BLE?

Seeed XIAO BLE – nRF52840 is a low-power, ultra-small size, super cost-effective Bluetooth development board based on the powerful Bluetooth 5.0 MCU — Nordic nRF52840.

What are the key features of Seeed XIAO BLE?

One look at Seeed XIAO BLE and it’s hard to imagine that this cute board is a powerful wireless development board. Sharing the same form-factor with another Seeed favorite, Seeed XIAO BLE uses the thumb-size, surface-mountable design as other boards in the XIAO family. But on this tiny board is the powerful Bluetooth ARM Cortex®-M4 MCU, Nordic nRF52840 with Bluetooth 5.0 BLE, NFC and Zigbee support, an onboard antenna, battery management chip and 2MB high-speed QSPI flash for MicroPython and CircuitPython programming.

In addition to its small size and battery management, the ultra-low power consumption with a deep sleep current of less than 5μA makes it ideal for battery-powered IoT applications, wearables and small projects. And with the onboard QSPI flash, Seeed XIAO BLE is fully compatible with Arduino IDE & MicroPython/CircuitPython programming languages, and the large comprehensive libraries make it easy to get started with IoT projects.

With new wireless capabilities and as the smallest and most versatile nRF52840 development board available, Seeed XIAO BLE is set to be a gamechanger in the IoT and wearables space.

Get one piece of your Prototype Seeed XIAO BLE design manufactured for free with Seeed Fusion PCBA Service

When the original Seeeduino XIAO was launched, many engineers and makers alike were interested in using XIAO, and we received a lot of positive feedback from our customers in forums and on social media platforms.

Therefore, in order to stimulate enthusiasm and help commercial customers land more productive and valuable landing projects. Seeed are sponsoring Seeed XIAO BLE -nRF52840 designs with the Seeed Fusion PCBA service.

How to apply:

All you need to do is fill in the form and complete your Seeed XIAO BLE design.

Please click the link and fill in the form: https://forms.gle/qKQhz7te5JDPPkdD8

Then add your order to the cart and we will confirm the application and get back to you with a coupon for one free PCBA piece. If you are looking for a powerful Bluetooth LE microcontroller for your next design, don’t miss this opportunity. Committed to providing one-stop electronic hardware services for over a decade, Seeed Fusion has the expertise and engineering insight to deliver streamlined PCB assembly at low costs and is equipped with a wide range of value-added services and capabilities.

Take advantage of the Free Design for Assembly review and Free functional testing with Seeed Fusion PCBA service now. Business users will also be interested in Seeed’s free prototyping sponsorship for business users. When your product reaches the batch production stage, we will deduct all the prototyping costs for that design up to 6% of the batch production value. If you are very interested in our product, but do not want to draw schematic and lay out by yourself for some reason, you are welcome to experience our ODM service. For more information, please contact fusion@seeed.cc for help.

ADLINK releases its first SMARC module based on Qualcomm QRB5165

ADLINK releases its first SMARC module based on Qualcomm QRB5165 enabling high-performance robots and drones at low power Integrated IoT technologies provide on-device AI capabilities at the edge.

ADLINK Technology Inc., a global leader in edge computing, released the LEC-RB5 SMARC module –its first SMARC AI-on-Module based on a Qualcomm Technologies, Inc. processor. The Qualcomm QRB5165 processor is designed for robotics and drones applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.

“This high performing SMARC module is a good option for the next generation of high-compute, low power robots and drones,” said Henri Parmentier, Senior Product Manager, ADLINK. “It empowers customers to do everything they need for complex AI and deep learning workloads at the edge without relying on the cloud.”

“Qualcomm Technologies’ portfolio of leading robotics and drones solutions is driving next-generation use cases including autonomous deliveries, mission critical use cases, commercial and enterprise drone applications and more. The Qualcomm QRB5165 solution supports the development of next generation high-compute, AI-enabled, low power robots and drones for the consumer, enterprise, defense, industrial and professional service sectors that can be connected by 5G. The ADLINK LEC-RB5 SMARC module will support the proliferation of 5G in robotics and intelligent systems,”

said Dev Singh, Senior Director, Business Development and General Manager of Robotics, Drones and Intelligent Machines, Qualcomm Technologies, Inc.

For robotics and autonomous robot solution providers, the LEC-RB5 SMARC module provides the capability to build powerful robots for use in harsh industrial conditions and in temperatures that range from -30° to +85°C. The LEC-RB5 SMARC module features:

  • Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)
  • Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 trillion operations per second (TOPS)
  • Six cameras support: MIPI CSI cameras CSI0 (2 lanes) and CSI1 (4 lanes)
  • Low power consumption: <12W
  • 82 x 50 mm small size form factor

The LEC-RB5 is part of ADLINK’s portfolio of SMARC form factors that support both ARM and x86 designs. ADLINK has worked closely with Qualcomm to design a smart, powerful solution for next generation IoT applications. The module provides enhancements for computer vision (CV) applications with reduced latencies for real time image processing decisions, freeing up capacity for other critical AI applications while delivering mobile-optimized CV experiences. Hardware acceleration for advanced CV applications with on-device AI capable of running complex AI and deep learning workloads with low power makes the LEC-RB5 SMARC module advantageous for a wide variety of industrial and consumer applications.

Visit ADLINK Technology to learn more about the LEC-RB5 SMARC module and development kit.

Universal OPAMP Board for SMD MSOP8 Package

This is easy to build and very useful project for hobbyists and students to learn and create OPAMP-based projects. The project accommodates a single OPAMP in the MSOP8 package. The project provides the user with multiple choices and extensive flexibility for different applications circuits and configurations. It provides the user with many combinations for various circuit types including active filters, differential amplifiers, and external frequency compensation circuits. A few examples of application circuits are given below. OP777 op-amp is the right choice to use or any other MSOP8 op-amp with the same pin configuration as OP777 can be used. It supports dual supply or single supply, Jumper J1 is provided to use this board with a single supply, D1 is the power LED.

Note: Refer to example circuit to test the board, it is a bistable multivibrator, with a single supply and Jumper J1 closed.

Credits: All example schematics are from Analog Devices application notes.

Features

  • Single or Dual Supply User-defined (Jumper)
  • 4 Pin Male Header Connector for inputs
  • 3 Pin Male Header for Supply input (Single or Dual)
  • Jumper J1 Close for single Supply, Open for Dual Supply
  • LED D1 Power LED
  • Any MSOP8 Op-Amp Can be used (Pin configuration compatible OP777)
  • PCB Dimensions 37.31 x 23.50 mm

Similar Universal OPAMP boards

Schematic

Example Application

5Khz Bistable Multivibrator Example Schematic

Parts List

NO.QNTYREF.DESC
11CN14 PIN MALE HEADER PITCH 2.54MM
21CN22 PIN MALE HEADER PITCH 2.54MM
31CN33 PIN MALE HEADER PITCH 2.54MM
426R1,C1,R2,C2,R3,C3,USER DEFINED
,R4,C4,C5,R6,C6,R7,USER DEFINED
R8,C8,R9,R10,R11,R12,USER DEFINED
R13,C13,R14,R15,R16,USER DEFINED
R18,R5,C7,C14,R19,USER DEFINED
52C9,C11CAPACITOR SMD SIZE 1206
62C10,C12CAPACITOR SMD SIZE 0805
71D1LED RED SMD SIZE 0805
81J1PCB SOLDER JUMPER
91R17ALL RESISTORS SIZE 0805
101U1OP-AMP MSOP8 (OP777)
RESISTORS SMD SIZE 0805PCKGE MSOP8EXAMPLE OP777

Example Application Parts List

BISTABLE MULTIVIBRATOR
NO.QNTY.REF.DESC.MANUFACTURERSUPPLIERPART NO
11CN22 PIN MALE HEADER PITCH 2.54MMWURTHDIGIKEY732-5315-ND
21CN33 PIN MALE HEADER PITCH 2.54MMWURTHDIGIKEY732-5316-ND
31C61K PF /50V SMD SIZE 0805MURATA/YAGEO
41C910uF/25V SMD SIZE 1206MURATA/YAGEO
51C100.1uF/50V SMD SIZE 0805MURATA/YAGEO
61D1LED RED SMD SIZE 0805OSRAMDIGIKEY475-1278-1-ND
71J1CLOSED(PCB JUMPER)PCB SOLDER JUMPER
84R1,R3,R7,R16100K 5% SMD SIZE 0805MURATA/YAGEO
92R8,R90E SMD SIZE 0805MURATA/YAGEO
101R171K 5% SMD SIZE 0805MURATA/YAGEO
111U1OP777ANALOGDIGIKEYOP777ARMZ-REELCT-ND

Connections

Example OPAMP Circuits

Gerber View

Photos

Video

OP777 Datasheet

UDOO KEY — A Raspberry Pi RP2040 + ESP32 AI Board Coming Soon For $20

A number of AI boards have reached the hardware market for DIY and makers in the past years but none seem to be as flexible as the UDOO KEY. The UDOO KEY is an UDOO-Italy newest launch created with both Raspberry Pi RP2040 and ESP32 on a single board for flexible AI solutions.

The board is fully programmable to give flexibility of choices, allowing the use of either RP2040, ESP32, or both at the same time for applications. The RP2040 based aspect of the board features dual ARM Cortex-M0 with 64 M-bit external QSPI flash, 246KB SRAM and 133MHz speed while the ESP32 compatible compatible part carries a dual-core Xtensa 32-bit LX6 with 16MB flash, 8MB PSRAM, WiFi, Bluetooth and Bluetooth Low Energy (BLE). The ESP32 module also supports full access to ESP32 firmware for programming on your terms.

The UDOO KEY is built to grant user access to UDOO’s AI platform, Clea, and pre-trained AI models for quick solutions in DIY, IoT analytics, over-the-air updates and AI applications. The UDOO KEY supports an accessory compatible with Raspberry Pi Pico and Olimex UEXT modules – ESP32 support. The board is also equipped with a 9-axis IMU and a microphone for high-end sensing functionalities as well as several inputs and output interfaces for large expandability.

The UDOO KEY also supports serial communication via a serial port and can be programmed through a USB-C port. The UDOO KEY is promoted as an open-source and open-hardware device and UDOO promises to release its BOM and Schematics as soon as shipping begins.

Key Features and Specifications Include:

  • ESP32-WROVER MCU — 8MB PSRAM, 16MB flash
  • RP2040 MCU — 246KB SRAM, 64M-bit QSPI flash
  • Wi-Fi, Bluetooth and BLE
  • 9-AXIS IMU motion sensor and Omnidirectional digital microphone
  • 5V DC via USB-C
  • ESP32-WROVER-E — UEXT connector (I2C, SPI, UART)
  • RP2040 — 26 GPIO pins (with 3 analog inputs), 2 x UART, 2 x SPI controllers, 2 x I2C controllers, 16 x PWM channels, 8 programmable I/O
  • Dimension: 130 mm x 40 mm

As for the software, both the pico and ESP32 MCU support TinyML, TensorFlow Lite, MicroPython, C/C++ programming environment, Arduino IDE, and a fully open-source free RTOS firmware. It also supports some common and ready-to-use SDKs and Clea. Clea is an AI and IoT platform based on Astarte and Edgehog open-source projects. While Astarte allows management and processing of IoT data with ESP32 SDK of ESP-IDF, Edgehog allows fleet management and over-the-air updates.

The UDOO KEY supports applications like predictive maintenance, sound recognition, keyword recognition, object detection, gesture recognition, and face recognition.

As of this writing, the campaign for UDOO KEY just ended on Kickstarter under 12 rewards between $4  and $382 with estimated delivery in January 2022 (worldwide). Its sales are expected to commence soon, but you can keep in touch with UDOO by signing up with your email to know when the UDOO KEY is available.

Other useful details on the board can be found on the company’s website and on the Kickstarter page.

Geniatech’s XPI-S905X2/X3/X4 SBC sells for $35 and up with a choice of three processors and a wireless module

Geniatech, a leading OEM/ODM company specialized in providing open android based hardware and software platforms has returned with an android-supported XPI-S905X2/X3/X4 SBC built with a choice of three quad-core Amlogic SoCs: the Cortex-A53 based S905X2 and the Cortex-A55 based S905X3 and S905X4.

The Amlogic’s quad -A53 S905X2 SoC is an updated version of the S905X that was used in the XPI-S905X board while the 12nm fabricated, quad -A55 Amlogic S905X3 is a modest -A55 based update of the S905X2 with the addition of an optional 1.2-TOPS NPU and Cortex-M MCUs. The S905X4 on the other hand appears to be almost identical to the S905X3, just that there is additional support for the new AV1 codec at up to 4K@120fps. The S905X4 is also primarily aimed at the Android set-top market, which is the company’s specialty.

Geniatech’s XPI-S905X2/X3/X4 SBC can be has described as a Raspberry Pi 3 lookalike with features like 2GB RAM, 8GB eMMC, GbE, HDMI, 4x USB, 40-pin GPIO, an optional WiFi/BT, and a 85 mm x 56mm footprint.

Key Features and Specifications of the XPI-S905X2/X3/X4 SBC include:

  • CPU: Amlogic S905X2 (4x Cortex-A53), or S905X3/S905X4 (4x Cortex-A55)
  • GPU: Mali-G31 @ up to 650MHz
  • 2GB RAM (1GB optional)
  • 8GB eMMC (16GB or 32GB optional)
  • MicroSD slot for up to 64GB
  • 1x Gigabit Ethernet port
  • Optional dual-band 802.11b/g with Bluetooth 4.0
  • HDMI 2.0 port
  • USB 3.0 host port
  • 3x USB 2.0 host ports
  • Micro-USB port for power input
  • Serial debug connector
  • 40-pin GPIO header (28x GPIO with support for UART, I2C, SPI, PWM GPIO, etc.)
  • Update key and optional cooling pad
  • 5V power supply via micro-USB; optional adapter
  • Dimensions: 85 mm x 56 mm
  • OS: Android 9.0 but there’s a possibility that it is compatible with Linux

The XPI-S905X2/X3/X4 SBC also referred to as the 4K Single Board ARM PC is designed for a number of applications in fields like education, industrial control, etc.

Compared with other open-spec boards that are almost similarly configured, like the Banana Pi BPI-M2 Pro and the slightly more feature-rich Odroid-C4, the XPI-S905X2/X3/X4 appears to be less expensive but proprietary and without much in public documentation.

The XPI-S905X2 and XPI-S905X3 are currently available and are sold for $35 and $42 respectively, while the XPI-S905X4 seems not to be available yet. The board comes with an optional wireless module that is also available and sold for an additional $5.

Other useful details on the SBCs as well as where to purchase them may be found on the product page.

Orange Pi R1 Plus LTS — A Low-cost Version of the Orange Pi R1 Plus SBC with YT8531C Ethernet transceiver

Just about a year ago, Shenzhen Xunlong Software updated its Orange Pi range of boards with an Orange Pi R1 Plus SBC powered by a Rockchip RK3328 quad-core Cortex-A53 processor running @ 1.5 GHz, coupled with 1GB RAM, dual Gigabit Ethernet ports, and one USB port for router applications. Now, the company has added to this line of the board a new Orange Pi R1 Plus LTS, which is exactly like Orange Pi R1 Plus SBC except that it replaced the Realtek RTL8211E PHY with a YT8531C Ethernet PHY and comes at a lower price.

Since the new Orange Pi R1 Plus LTS is quite similar to the older version, it means it can still be used for headless operations. Use cases include building a soft router, a computer, a wireless server, a speaker, and many more because it is open-source.

The new SBC is also powered by a Rockchip RK3328 processor, coupled with 1GB RAM, 2x GbE, and a single USB 2.0 port. The two boards are said to be with the same performance configuration.

Other Features and Specifications of the Orange Pi R1 Plus LTS SBC include:

  • Rockchip RK3328 quad-core Cortex-A53 @ 1.5 GHz with Arm Mali-450MP2
  • 1GB LPDDR3 RAM
  • MicroSD card slot
  • 16 MB SPI flash
  • 2x Gigabit Ethernet via YT8531C Ethernet PHY and RTL8153B USB 3.0 to Ethernet chip
  • 1x USB 2.0 port
  • 1x USB-C OTG port
  • Unpopulated 13-pin header with earphone, 1x GPIO, TV out, UART, I2C, and IR receiver signals
  • 3-pin header for serial console, fan header
  • Recovery key
  • WAN & LAN LEDs on board
  • Status LED.
  • Power Supply: 5V/2A via USB-C port or 2-pin header; RK805 PMU
  • Dimensions: 57 mm x 56 mm
  • Weight: 29.5 g
  • Supported Operating System: Android 9, Ubuntu, Debian, and OpenWrt

Apart from the difference in Ethernet PHY and the difference in system memory (LPDDR3 RAM instead of DDR4), and of course the fact that the YT8531C Ethernet transceiver would require a different driver, the company also mentioned that the firmware images are different.

The Orange Pi R1 Plus LTS SBC is currently sold on Orange Pi R1 Plus LTS SBC is currently sold on AliExpress for $27.99 but is yet to be available on Amazon. The board is definitely a lot cheaper than the Orange Pi R1 Plus board which is being sold by some AliExpress sellers for over $50 which is being sold by some AliExpress sellers for over $50. The company however mentioned that a kit with the Orange Pi R1 Plus LTS SBC and a metal case/enclosure which they are currently working on would be available in a few weeks for about $32.9 and above.

$2 Development Board Based On WinnerMicro W806 32-bit, 240MHz MCU

Shenzhen Hilink Electronics has released an inexpensive development board that utilizes the powers of the W806 MCU, a controllable IoT chip that offers high integration, low-power consumption, and low cost. The HLK-W806 development board which just hit the hardware market is based on the WinnerMicro W806 32-bit XT804 processor with 240MHz, inbuilt 1MB flash, and 288KB RAM. The board is equipped with an RST reset button, USB2.0 port, touch, UART, PWM, GPIO, SPI, I2S, ADC, and LCD interfaces. It is targeted to help IoT solution developers to evaluate W806 chips, realize more functions and build prototypes faster. The W806-based board is only debugged via the Ck-Link emulator since its MCU features Pingtou’s CDK development environment. Although not showing features of wired or wireless communication means, Hilink still promotes HLK-W806 as IoT MC.

As for the W806 MCU, Reddit says it is a RISC-V MCU using T-Head’s XuanTie E804 IP, but a user argues that XuanTie E804 is C-SKY ISA and not RISC-V. Another user also confirms that the MCU is not RISC-V and with that, it will likely be a C-SKY ISA. The reason is that C-SKY is mentioned in RISCV as a member of the RISC-V foundation with CPU architecture for low-power SoCs. And that the company does plumb C-SKY support into Linux/open-sources protocols and other toolchains.

Key Features and Specifications of HLK-W806 and W806 MCU:

HLK-W806 Specification:

  • MCU: WinnerMicro W806 32-bit XT804 microcontroller @ 240 MHz, 1MB Flash, 288KB RAM, support FPU, DSP, crypto engine
  • 5V power supply via micro USB port
  • Integrated PSRAM interface, supporting up to 64MB external PSRAM memory
  • Support 6-way UART, support 5-8 bit, configurable parity
  • Integrate a master/slave SPI interface ( for master support)
  • Support one I2C interface @ 100kHz ~ 400kHz
  • 4-channel 16 bit ADC @ 1kHz
  • Supports up to 44x GPIO
  • 5-channel PWM interfaces @ 3hz-160khz, maximum duty cycle
  • Up to 15 touch sensors
  • ISO/IEC 7816 smart card interface
  • Reset, Wakeup, 3.3V, and GND signals
  • Debugging: CH340 (via micro USB port)
  • Reset button
  • Boot button
  • Dimensions: 65 mm x 26 mm

W806 MCU Specification:

  • Processor: 32-bit XT804, @ 240MHz, built-in DSP, 1MB Flash, 288KB RAM
  • PSRAM interface (support up to 64MB)
  • 1x 6-channel UART interface
  • 1x 4-channel 16-bit ADC @ 1KHz
  • 1x SPI interface (slave interface) @ 50MHz
  • 1x master/slave SPI interface
  • 1x SDIO_ HOST interface, support SDIO2.0, SDHC, MMC4.2
  • 1 x SDIO_ DEVICE, support SDIO2.0 @ 200Mbps
  • 1 x I2C controller
  • GPIO controller @ 44 GPIO
  • 5-channel PWM interface
  • 1 channel Duplex I2S controller
  • LCD controller @ 4×32 interface

Documents on W806 MCU chip specification (although not in English), application manual (.zip), hardware information (.zip), SDK (.rar), and W800 serial burning tool (.rar) can be found on HLK-W806 details.

For ordering and shipping, the HLK-W806 is available for purchase for under $2.00 on AliExpress.

onsemi NCP51100A Low-Side Gate Driver

onsemi NCP51100A Low-Side Gate Driver is a 700V high side and low side driver with a 3.5A source and 3A sink current drive capability. The NCP51530 offers propagation delay, low quiescent current, and low switching current at high frequencies of operation. This device is tailored for highly efficient power supplies operating at high frequencies. The device is offered in two versions, NCP51530A or NCP51530B. NCP51530A has a typical 60ns propagation delay, while NCP51530B has a typical propagation delay of 25ns. NCP51530 comes in SOIC8 and DFN10 packages.

Features

  • High voltage range up to 700V
  • NCP51530A typical 60ns propagation delay
  • NCP51530B typical 25ns propagation delay
  • Low quiescent and operating currents
  • 15ns max rise and fall time
  • 3.5A source/3A sink currents
  • Under-voltage lockout for both channels
  • 3.3V and 5V input logic compatible
  • High dv/dt immunity up to 50V/ns
  • Pin-to-Pin is compatible with industry-standard half-bridge ICs
  • Matched propagation delay (7ns max)
  • High negative transient immunity on bridge pin
  • DFN10 package offers both improved creepage and exposed pad

Application Diagram

more information: https://www.onsemi.com

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