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AWS IoT Core solution for ultra-low-power Wi-Fi cloud connectivity

Posted on by mixos

InnoPhase, a fabless semiconductor company specializing in extreme low power wireless IoT solutions, announces the availability of a qualified Amazon Web Services (AWS) Internet of Things (IoT) Core solution for ultra-low power Wi-Fi cloud connectivity. In addition, it unveils a demonstration Smart Home Skill for Amazon Alexa targeted at home automation product designs. The solutions utilize the award-winning Talaria TWO™ multiprotocol wireless modules, offering the industry’s lowest power Wi-Fi solution and BLE5 for provisioning and diagnostics. The platform combines wireless connectivity, an integrated microcontroller, and advanced security elements for edge-of-network IoT devices that require low power consumption and a direct-to-cloud connection such as smart locks, doorbells, security sensors, leak detection sensors, and others.

The pre-packaged Talaria TWO kits are tuned and optimized and include hardware, complete software packages, and reference design files making it simple for manufacturers to add AWS services and Alexa Skills to their products.  For instance, InnoPhase’s newest Sensor-to-Cloud solution includes everything needed for expedited development of a cloud-connected sensor, such as Device Provisioning over BLE, pre-integrated AWS connectivity, and flexible settings to extend battery life.  Future solutions will address a wide range of products for smart home, smart industrial, smart commercial, and smart health applications.

“Cloud-connectivity has become an integral part of all IoT edge devices and our Talaria TWO solutions make connecting to AWS quick and easy,” said Greg Winner, Vice President and General Manager, IoT Business Unit, InnoPhase. “Plus, the exceptionally low power Wi-Fi allows these edge devices to be untethered from power outlets and network cables ushering in the development of a whole new category of innovative products and services.”

Wireless data transfer has historically been a major power-consuming portion of connected IoT designs. InnoPhase’s unique, programmable, digital polar radio architecture, significantly reduces the current consumption of Wi-Fi radios making battery-based IoT products last more than two years.

The Talaria TWO modules and associated development kits are available through our network of worldwide distribution partners.

To learn more about the Talaria TWO modules and solutions, visit innophaseinc.com/talaria-two-modules, view our YouTube channel

Fujitsu Semiconductor FRAM (Ferroelectric Random Access Memory)

Posted on by mixos

Fujitsu Semiconductor FRAM (Ferroelectric Random Access Memory) is a non-volatile memory featuring fast writing speed operation, high read/write endurance and low power consumption. These features make FRAM ideal for applications requiring continuous data logging, real-time recording of three-dimensional position information, and data protection from sudden power outages.

Fujitsu Semiconductor FRAM is offered in serial (SPI and I2C interfaces) and parallel (parallel interface) variants and in a wide range of compact, high-density package types. Memory size options are available from 4Kbit up to 8Mbit.

Features

  • Non-volatile
    • Stored data is not lost at power off
    • No battery is needed for data retention
  • Low power consumption
    • No booster circuit is required for a write operation
    • 92% lower write power consumption than EEPROM
    • No data retention current required to retain data
  • High read/write cycle endurance
    • Guarantees 10 trillion (1013) read/write cycles
    • 10 million times of EEPROM’s endurance
  • Fast write speed
    • Can overwrite data without an erase operation

more information: https://www.fujitsu.com/jp/group/fsm/en/products/fram/

GENIATECH’S “XPI-IMX8MM” SBC RUNS LINUX ON i.MX8M Mini AND SELLS FOR $90

Posted on by Emmanuel Odunlade

Tech Giant, Geniatech, has launched a $90 “XPI-iMX8MM” Single Board Computer! The XPI-iMX8MM runs Linux on an i.MX8M Mini and is equipped with 1GB to 4GB RAM, 8GB to 128GB eMMC, and 40-pin GPIO.

Geniatech’s XPI-iMX8MM is a Raspberry Pi sized SBC that has NXP’s 1.8GHz and quad-A53 i.MX8M Mini. It is the latest release, following the company’s larger APC810 SBC, which is also equipped with the i.Mx8M. The XPI-iMX8MM SBC has the same Raspberry Pi size and layout as the Amlogic S905X powered XPI-S905X, and is closely matched to Avnet/Embest’s Raspberry Pi style Maaxboard Mini, which is sold at $72.50 with 2GB RAM and an empty eMMC slot, except that Geniatech adds an HDMI port to the XPI-iMX8MM.

The XPI-iMX8MM also has a composite A/V port, a wider standard operating range, and a tolerance range of -40 to 105°C. There are also two user buttons, a PMIC, a heatsink, and a WiFi/BT module being the standard model, rather than optional.

If you are looking for larger i.MX8M Mini options with better features, you could consider SolidRun’s Humming board Ripple, priced at $170 dollars but you have to bear in mind that it is limited to only 2x USB 2.0 ports, though it provides M.2, mini-PCIe, sim slots, and a MikroBus interface. Other Mini-based SBCs from manufacturers like Estone and Gateworks exist, but they are not priced publicly.

Key Features and Specifications listed for the XPI-iMX8MM SBC include:

  • Processor: NXP i.MX8M Mini Quad (4x Cortex-A53 @ up to 1.8GHz); Vivante GCNanoUltra (3D) and GC320 (2D) graphics with VPU; Cortex-M4F @ 400MHz
  • Memory/storage: 1GB that is expandable to 4GB LPDDR4 and 8GB that is also expandable to 128GB eMMC
  • 1x MicroSD slot
  • 10/100/1000 Ethernet port
  • 2.4GHz WiFi via 4-pin USB header
  • Optional dual-band 802.11ac with Bluetooth 4.1
  • Media I/O:
    • HDMI 1.4 port at up to 1080p60 decode
    • 2-lane MIPI-DSI at up to 1080p60 decode
    • 2-lane MIPI-CSI at up to 1080p60 encode
    • 4-pole stereo audio and composite video interface
    • I2S, AC97, TDM and S/PDIF audio interfaces
  • Other I/O:
    • 4x USB 2.0 host ports
    • USB Type-C port with 5V power input only
  • Expansion: 40-pin GPIO connector with I2C, SPI, UART, PWM
  • 2x LEDs
  • 5V/3A power supply via USB Type-C
  • Powerand Reset buttons
  • Operating temperature: 0 ~ 95°C or -40 ~ 105°C
  • Board Dimensions: 85 mm x 56mm
  • Operating system: Yocto Linux; FreeRTOS

The XPI-iMX8MM single-board computer is currently available and sells for $90. Further details can also be found on the links below: Geniatech’s shopping and product page.

Automated X-RAY Inspection System by PCBGOGO

Posted on by Emmanuel Odunlade

When you consider the cost, time, and other resources that go into PCB Design and Manufacturing, you will agree that it makes perfect sense to leave no stone unturned in ensuring quality because failure at any point could cost product owners a lot of reputation, money and time, which most companies don’t have, thanks to the strain that comes with manufacturing hardware.

While this ultimately starts from the design process, the final buck usually rests on the PCB manufacturer who takes extra effort to conduct a number of tests and processes that help to implement PCB quality control, one of which is PCB inspection.

PCB inspection is usually done to detect likely defects like foreign matter, copper explosion, scratch, insufficient plating, incorrect silkscreen, uneven solder paste and pads, residual copper, and imaging. Most PCB manufacturers use the traditional naked eye inspection method to achieve this, while some others make use of some visual inspection devices like a magnifying glass, and AOI (Automated Optical Instrument), a solder paste inspection equipment, or an optical video display system that combines both the naked-eye inspection and the AOI methods, just to mention a few.

Some of these methods actually merit more than the others, but when it comes to PCB quality control inspection, the choice of the method depends on the particular inspection test to be carried out.

Automated X-ray inspection

Since many PCBs today now use technologies such as BGA, BGA ICs (integrated circuits), and CSPs (chip-scale packages) where the solder connections are not visible by visual inspection, like naked eye or ordinary optical systems, it is now necessary to carry out checks using X-ray technology.

Automated X-Ray Inspection is one of the most reliable inspection technologies used by PCB manufacturers to further improve manufacturing quality. It is the perfect inspection method for detecting defective solder joints or faulty melting of the solder and it works well for BGA components and other small-footprint devices.

AXI runs on the same principle as the Automated Optical Inspection (AOI) but uses computer vision with x-ray images instead of visible light for detecting defects. With this, the system can inspect and validate all the solder connections that were made on the board after assembly, including those hidden underneath a component.

Working Principle of An Automated X-ray Inspection System

X-rays are high-energy electromagnetic radiation that can penetrate a component to analyze its internal structures such as contacts, displacement, solder bridges, and solder flow-ups. Materials made of lighter elements are more transparent to x-rays while those of heavier elements absorb more rays and are easily imaged.

When an x-ray inspection system is integrated into a production line, it usually takes about 30 seconds for it to check the components on a PCB. When the radiation passes through the component, different densities within the components attenuate different amounts of X-rays. For instance, board defects like porosity and incomplete welding will show as bright spots on the X-ray image while offsets caused by abnormal amounts of solder paste will show as unmatched shadows of the pin and the pad in the inspection image. 

The inspection image can also show you when a single BGA solder joint is not properly soldered or not as thick as it should be. The solder joint will appear brighter and look odd amongst the rest.

 

The x-ray inspection system can also help to:

  • perform a non-destructive inspection
  • locate short circuits on small footprint devices like BGA, CSP, QFN, and flip chip
  • detect voids in solder joints (BGA, CSP, QFN, QFP, and flip chip)
  • detect displacements of components
  • examine semiconductors (wire bonds, die alignment)
  • check switches, relays, and contacts
  • check plug, crimping, and cable connections (automotive)
  • perform a prototype inspection in order to avoid expensive production errors
  • optimize process parameters, and,
  • carry out random sample analyzes

The X-ray inspection of PCBGOGO

For optimal use of the x-ray inspection system, it is important to have trained hands who can help to properly interpret the results from an x-ray inspection system and their relationship to process and component variables. Some defects can be detected easily while others can only be detected by their signatures which are known from experience. Skilled x-ray personnel like those at PCBGOGO make a difference in being able to help you screen for defective products based on your developed acceptance criteria for the defect.

The company provides a complete suite of PCB services, including PCB prototype, PCB assembly, PCB small-batch manufacturing, PCB testing, as well as an extensive line of Add-on services.

“We are proud of providing the best PCB manufacturing service at a competitive price. Our short lead time also can meet various requirements of customers from home and abroad”, they said.

If you would like to have an x-ray inspection done on your circuit boards, the company can test them and send a detailed report on the quality of the product. You can be sure to get the best of service from them.

Other useful details on the Automated X-ray Inspection system can also be found on their official website.

NXP Semiconductors PCF2131 Nano-Power Highly Accurate RTC

Posted on by mixos

NXP Semiconductors PCF2131 Nano-Power Highly Accurate Real-Time Clock (RTC) features an integrated Temperature Compensated Crystal (Xtal) Oscillator (TCXO) and a 32.768kHz quartz crystal. The PCF2131 is optimized for very high accuracy and ultra-low power consumption. The PCF2131 offers a selectable I2C-bus or SPI-bus, a backup battery switch-over circuit, a programmable watchdog function, four timestamps function, and many other features.

The NXP PCF2131 Nano-Power Highly Accurate RTC has an operating temperature range from -40°C to +85°C in an HLSON 16 package.

Features

  • Operating temperature range from -40°C to +85°C
  • Temperature Compensated Crystal Oscillator (TCXO) with trimmed integrated capacitors
  • Ultra-low supply current of typical 64nA at VDD = 3.3V
  • Temperature-compensated RTC, typical accuracy ±3ppm from -40°C to +85°C
  • Integration of a 32.768kHz quartz crystal and oscillator in the same package
  • Provides year, month, day, weekday, hours, minutes, seconds, and 1/100 seconds
  • Provides leap year correction
  • Timestamp function
    • With interrupt capability
    • Detection of four different events on four input pins (for example, for tamper detection)
  • 2-line bidirectional 400kHz Fast-mode I2C-bus interface
  • 4-line SPI-bus with separate data input and output (maximum speed 6.5Mbit/s)
  • Battery backup input pin and switch-over circuitry
  • Battery backed output voltage
  • Battery low detection function
  • Power-On Reset (POR)
  • Power-On Reset Override (PORO) function
  • Software reset function
  • Two interrupt outputs (open-drain)
  • Programmable 1 second or 1-minute interrupt
  • Programmable watchdog timer with interrupt
  • Programmable alarm function with interrupt capability
  • Programmable square output
  • Clock operating voltage of 1.2V to 5.5V

more information: https://www.nxp.com/products/peripherals-and-logic/signal-chain/real-time-clocks/rtcs-with-temperature-compensation/nano-power-highly-accurate-rtc-with-integrated-quartz-crystal:PCF2131

Texas Instruments TCA9416 Ultra-Low Voltage I2C Translator

Posted on by mixos

Texas Instruments TCA9416 Ultra-Low Voltage I2C Translator is a 2-bit bidirectional I2C, SMBus voltage-level translator with an output-enable (OE) input and rising and falling edge accelerators. It is operational from 1.08V to 3.6V on both the A-side and B-side. This feature allows the device to interface between lower and higher logic signal levels at any of the typical 1.2V, 1.8V, 2.5V, and 3.3V supply rails.

The OE input pin is referenced to VCCA, can be tied directly to VCCA, but it is also 3.6V tolerant. The OE pin can also be controlled and set to a logic low to place all the SCL and SDA pins in a high-impedance state, significantly reducing the quiescent current consumption. Under normal I2C and SMBus configurations, the TCA9416 is compatible with standard speeds where the frequency of SCL is 100kHz (Standard-mode), 400kHz (Fast-mode), or 1MHz (Fast-mode Plus).

The Texas Instruments TCA9416 features internal 10kΩ pull-up resistors on SCL_A, SDA_A, SCL_B, and SDA_B. Additional external pull-up resistors can be added to the bus to reduce the total pull-up resistance and speed up rising edges.

Features

  • 2-bit bidirectional translator for SDA and SCL lines in I2C applications
  • Provides bidirectional voltage translation with no direction pin
  • High-impedance output SCL_A, SDA_A, SCL_B, SDA_B pins when OE = 0V or VCC = 0V
  • Internal 10kΩ pull-up resistor on all SDA and SCL pins are enabled based on respective VCC voltage
  • 1.08V to 3.6V on both A and B ports
  • VCC isolation feature: If either VCC input is at GND, both ports are in the high-impedance state (excluding pull-ups)
  • No power-supply sequencing is required: either VCCA or VCCB can be ramped first
  • Low Ioff of 2.5µA when either VCCA or VCCB = 0V
  • OE input can be tied directly to VCCA or controlled by GPIO
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD Protection exceeds JESD 22
    • 2500V Human-body model (A114-B)
    • 1500V Charged-device model (C101)

more information: https://www.ti.com/product/TCA9416

ams NanEyeC Integrated Digital Camera Modules

Posted on by mixos

ams OSRAM NanEyeC Integrated Digital Camera Modules are miniature-sized image sensors for vision applications where size is a critical factor. These modules are designed for the toughest confined space requirements with a small footprint of 1mm2 and 4 compact pads. The NanEyeC miniature camera modules from ams OSRAM achieve a frame rate of 0 to 58fps at 320 x 320 resolution with slave mode operation. These camera modules feature a highly sensitive 2.4-micron rolling shutter pixel and large full well capacitance. The sensor includes a 10-bit ADC and a bit-serial Single-Ended Interface Mode (SEIM) data interface that reduces external electronics for applications with short connections. An additional LVDS interface allows it to drive the signal for longer distances.

The NanEyeC miniature camera modules also feature 102.4kP resolution, 2.4µm x 2.4µm pixel size, and a rolling shutter type in a 2 x 2 SGA package. Combining a wide-angle view with a good depth of focus, the NanEyeC offers the speed and picture quality needed for an emerging set of video applications. These camera modules are ideally used in wearable devices, cameras, medical, and industrial applications.

Features

  • Designed for the toughest confined space requirements
  • Sharp and accurate image
  • Multi-element lens for optimal image quality
  • Footprint of 1mm2 with 4 contact pads
  • 2.4-micron high sensitive pixel with 102.4kp resolution
  • Frame rate of up to 58fps @ 320 x 320 resolution with slave mode operation
  • Digital interface
  • Cost-optimized
  • 2.4µm x 2.4µm pixel size
  • Rolling shutter type
  • High-end optics offering low distortion
  • Possible to switch the serial interface to a single-ended mode for easier connection to ISPs

Block Diagram

more information: https://ams.com/naneyec

Vishay / Sfernice P11H Modular High Torque Panel Potentiometers

Posted on by mixos

Vishay / Sfernice P11H Modular High Torque Panel Potentiometers are designed to keep the setting under high mechanical constraints from vibration, shock, and other factors. Vishay / Sfernice P11H Potentiometers provide high torque (8Ncm) with a smooth feeling during the potentiometer’s entire life. The series offers 12.5mm2 single turn panel control with 6.35mm shaft diameters and operates over a lifespan of 50,000 cycles.

Features

  • Keep the setting under high mechanical constraints (vibration and shock)
  • High torque (8Ncm) with smooth feeling during all potentiometer life
  • Torque stability under high environmental constraints
  • 12.5mm2 single turn panel control with 6.35mm shaft diameters
  • Compact, versatile, modular, and robust
  • Tests according to CECC 41000 or IEC 60393-1

Specifications

  • IP64 sealing level
  • 50,000 cycles lifespan
  • Up to 7 modules

more information: https://www.vishay.com/potentiometers/list/product-51087/

Littelfuse CPC1596 Optically Isolated Load-Biased Gate Driver

Posted on by mixos

Littelfuse, Inc. an industrial technology manufacturing company empowering a sustainable, connected, and safer world, announced the first high-voltage optically-isolated MOSFET gate driver on the market that requires no external power supply, yet can provide fast load turn-on speeds in the order of tens of microseconds. View the video.

The CPC1596 570V Optically Isolated Load-Biased Gate Driver is ideal for use in a wide range of power electronics applications including:

  • Industrial controls,
  • Automatic Test Equipment (ATE),
  • HVAC controls,
  • Medical devices,
  • Internet of Things.

“The CPC1596 570V Load-Biased Opto-Gate Driver addresses a critical market need,” said Steve Andrezyk, Senior Product Marketing Manager at Littelfuse. “Universal AC power line applications now have a custom, higher power optically isolated solid-state relay (SSR) solution without the cost of an auxiliary power supply or additional discrete devices to meet fast start-up speed requirements.”

The CPC1596 offers these key benefits:

  • Boosts external MOSFET start-up speed by using load-biasing.
  • Eliminates the need for an opto-gate driver auxiliary power supply.
  • Supports optically isolated SSR-applications for both AC and DC.
  • Enables using higher power MOSFETs.
  • Can be controlled from a logic port.

How it works

The problem: Standard Photovoltaic (PV) Gate Drivers simplify SSR-design by eliminating the need for auxiliary power supplies. Due to output currents in the µA-range, they get slower with larger gate charges of external MOSFETs, making it difficult to fulfill demanding fast turn-on application requirements.

The solution: The CPC1596 provides fast turn-on switch speed (typically 40µs) enabling designers to create a custom, higher power, optically isolated, DC-only or AC/DC solid-state relay (SSR) with external MOSFET(s). To increase the switching speed, simply utilize the product’s unique load-biasing, on-board circuit. The use of load-biasing eliminates the need for an opto-gate driver auxiliary power supply. An internal regulator circuit regulates the voltage drawn from the load supply (up to 570V) down to 12.2V for internal use. An external storage capacitor  is added to enable constant voltage control for properly driving the MOSFET.

Availability

The CPC1596 is provided in tape and reel format in quantities of 1,000. Sample requests can be placed through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit Littelfuse.com.

For More Information

Additional information is available on the CPC1596 Optically Isolated, Load-Biased MOSFET Gate Driver product page. For technical questions, please contact: Anthony Konopka, Applications Engineer at  AKonopka@Littelfuse.com.

Bürklin Elektronik offers premium miniature fan units from Fischer Elektronik

Posted on by mixos

Leading international distributor Bürklin Elektronik offers a premier range of miniature fan units to meet the increasing demands of small, high-performance electronic components. The LAM K series from Fischer Elektronik comprises miniature fan units to dissipate large amounts of heat in small spaces.

Electronic assemblies are becoming increasingly compact. Combined with high-performance components and high heat generation this can lead to considerable power losses, malfunctions, or even component destruction, without efficient thermal management. Miniature fan units, each with a fan motor, are available in 30×30, 40×40 and 50x50mm dimensions, each equipped with a double ball bearing system adapted to industrial requirements. They are extremely effective for cooling large power losses in small installation spaces.

For larger circuit board dimensions or higher power dissipation, miniature fan coil units are also available in 60.5×30, 80.8×40, and 100.5x50mm dimensions as a double version. The basic structure of these tube profiles consists of a circumferential rectangular base frame with a material thickness of 2.5 to 4.5mm. The respective outer surfaces of the frame with an opposing ribbed structure also serve as semiconductor mounting surfaces with a flatness of 0.1mm. This means they do not have to be additionally face-milled.

The Axial fan motors can be mounted quickly and easily in mounting holes integrated into the profile using screw mounting. A relatively high airflow rate at high dynamic pressure also ensures air transport over longer cooling distances or unit lengths. The technical quality parameter MTBF (Mean Time Between Failures), measured at an ambient temperature of 20°C, is up to 280,000 hours.

The fan motors offer voltages between 5V, 12V and 24V, according to the application. They can also be equipped with an additional pulse output to control an alarm generator circuit when the fan is selected or to monitor the rotor speed. The fan units can be installed directly on the printed circuit board and consist of a tubular aluminum profile with a special internal heat exchange structure.

Fan units can be mounted directly on the components concerned. The miniature fan units of the LAM K series offer two different mounting options for component attachment in conjunction with the matching spring geometry. The semiconductor assembly of the electronic components on the LAM K series can be carried out using several different methods, including classic screw mounting or with the aid of snap-in transistor retaining springs. The retaining springs, adapted for the designs of the LAM K series, can be quickly and easily snapped into the groove geometry of the base profile provided for component fastening.  The contact force achieved by the retaining springs provides an optimal thermal transition from the component to the cooling unit.

Irrespective of the chosen mounting method, the snap-in transistor retaining spring holds firmly in position. The high contact pressure achieved by the retaining spring fixes the transistor optimally on the mounting surface so that there is excellent heat transfer resistance between the component and the cooling element.

The Fischer Elektronik LAM K Series is available to order now from Bürklin Elektronik. Customers can rapidly locate and order through the search function at www.buerklin.com. Comprehensive product datasheets are also available online, with certifications and approvals available on request.

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