VxWorks on Zynq UltraScale+ MPSoC

iWave Systems is pleased to inform about the VxWorks BSP release for its XILINX UltraScale+ MPSoC System on Modules. VxWorks 21.03 has now been ported on the iW-RainboW-G30M system on module, which is powered by the ZU 4/5/7 MPSoC.

VxWorks is Industry’s leading real-time operating system for building embedded devices& systems.

The ZU 4/5/7 System on module, integrated with high-speed interfaces when built with VxWorks BSP, ensures the scalability, safety, and reliability required for mission critical applications.

The Zynq® UltraScale+™ MPSoC series provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. These Adaptive SoCs complement the decade long availability of soft-core CPU’s and other soft IP for building system on FPGAs. Adaptive SoCs then are particularly useful when high performance is required for a portion of an algorithm that can be implemented in hardware using parallel or pipelined (or a combination) techniques.

Why VxWorks on Zynq UltraScale+ MPSoC

The combination of VxWorks on the Zynq UltraScale+ MPSoC provides the foundation for secure high-speed high-performance computing application. Highlighted below are the key features of VxWorks and UltraScale+ MPSoC, together which power devices across verticals.

VxWorks is ideal for hard real-time embedded applications because it is a deterministic, priority based, pre-emptive RTOS with low latency and minimal jitter, with a few feature highlights as below:

  • Rich connectivity and communications: VxWorks has robust IPv4 and IPv6 stacks that are also time-sensitive networking (TSN) capable, guaranteeing real-time communications and packet delivery within a bounded time or latency on a switched Ethernet network
  • Modularity and Robustness: easy to choose and adapt capabilities as required, changing the modules only as needed.
  • Fault-tolerant file system: VxWorks supports the Wind River Highly Reliable File System (HRFS) for fault tolerance and recovery of operations in case of system error and shutdown, as well as a FAT-compatible dosFS file system.
  • Mixed OS support: VxWorks supports communicating with other operating systems in a mixed environment using OpenAMP, allowing developers to build interactive functionality across VxWorks real-time and other non–real-time environments.
  • Multimedia: VxWorks offers support for many standard graphic libraries, such as OpenGL, OpenGL ES, OpenCV, and Vulkan, and libraries that handle JPEG and PNG images
  • Security: VxWorks integrates an extensive and continuously evolving set of security capabilities that allows developers to meet rigorous security requirements and address security threats—from boot-up operation to power down. A few secure capabilities include kernel hardening, cryptography, firewall, TPM 2.0, secure data and configuration.

The true value of Zynq UltraScale+ MPSoC architecture lies in the tight integration of its programmable logic with the processing system, with a few highlights listed below:

  • Heterogenous Processing: Multiple processing engines enable the optimization of functions across an entire application, with programmable hardware providing further performance and safety handling
  • Integrated H.264/H.265 Video Codec: Zynq UltraScale+ EV devices include a video codec capable of low latency simultaneous encode and decode up to 4K resolution at 60 frames per second
  • Increased safety and multiple levels of security
  • Superior processing, I/O and memory bandwidth

Potential application of VxWorks on Zynq UltraScale+ MPSoC

With Zynq UltraScale+ MPSoC finding a fit in Industrial networking (time sensitive networking), high precision test and measurement equipment, medical imaging and avionics, VxWorks BSP helps strengthen the safety, security, and modularity on the device.

Safety-critical applications like automotive, industrial motor control, avionics, and many others need to have high reliability and required Safety Integrity Levels (ASILs), for which it is necessary to mitigate soft errors and implement redundancy to have better hard fault toleration, where the combination of VxWorks and UltraScale+ MPSoC is an ideal fit.

VxWorks finds a great fit in embedded applications that require real time, deterministic performance which require safety and security certification in industries such as medical, aerospace, robotics, and network infrastructure.

Scalability across the XILINX UltraScale+ MPSoC

The SOM approach for the FPGA SoCs further allows greater scalability for the end applications in terms of logic density, FPGA IOs and number of transceiver lanes. For example, a well-designed carrier board design architecture can cover system IO ports for multiple end products ranging from the Xilinx Zynq MPSoC UltraScale+ ZU4 with 192K logic cells to ZU19 with 1.1M logic cells. Also, the SOM approach allows migrating new generation SoC solution without changing the product mechanical architecture.

You can find more information on our XILINX System on Modules here.

For further information or enquiries, you can reach us at mktg@iwavesystems.com

Rohde & Schwarz demonstrates the all-new R&S RTO6 oscilloscope at DesignCon 2021

Silicon Valley’s premier event for chip, board, and systems design engineers – DesignCon – returns in 2021 to San Jose, CA. Rohde & Schwarz, industry-leading T&M specialist, will be an exhibitor in person this year with its extensive and innovative product and solutions portfolio. As this year’s highlight, Rohde & Schwarz will be demonstrating live the all-new R&S RTO6 oscilloscope.

The R&S RTO6 delivers instant insight thanks to enhanced usability and performance. Featuring a fresh new user interface on a larger, 15.6-inch Full HD touchscreen and straightforward workflows, the new oscilloscope speeds up daily measurement tasks. The R&S RTO6 delivers deep insights into designs on the engineer’s workbench with state-of-the-art specifications such as an outstanding 9.4 ENOB, an unparalleled update rate of one million waveforms per second as well as a comprehensive toolset of analysis functions.

Rohde & Schwarz will also demonstrate for show attendees the R&S ZNA high-end vector network analyzer (VNA) which now features models with 50 GHz and 67 GHz maximum frequencies. This opens up the VNA’s outstanding RF performance, unique hardware concept and innovative touch operation to new areas of application. Signal integrity measurements as well as A&D and 5G component and module characterization are main applications for the new analyzer models.

Rohde & Schwarz will be exhibiting at DesignCon in booth 607 at San Jose McEnery Convention Center on August 17 and 18, 2021. Starting August 17, Rohde & Schwarz is sponsoring a day of complimentary technical seminars, beginning at 8 a.m. in room 210F, covering topics such as power integrity measurement fundamentals and mastering phase noise/jitter measurements. For those unable to attend the seminars in person, Rohde & Schwarz offers on-demand recordings of the seminars after the show. Click here to be notified, once available.

Computer-on-Modules target IoT gateway, AI edge computing

congatec – a leading vendor of embedded and edge computing technology – introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.

Built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU and platform controller hub (PCH) the new flagship COM-HPC Client and COM Express Type 6 modules impress with a new bandwidth benchmark of up to 20 PCIe Gen 4.0 lanes for massive connected real-time IIoT gateway and intelligent edge computing workloads. To process such massive workloads, the new modules boast up to 128 GB DDR4 SO‑DIMM RAM, integrated AI accelerators and up to 8 high-performance CPU cores that achieve up to 65% gain [1] in multi-thread performance and up to 32% gain [2] in single-thread performance. Moreover, visualization, auditory and graphics intensive workloads are enabled with a boost of up to 70% compared to predecessors [3], enhancing performance for these immersive experiences even more.

Flagship applications that directly benefit from these GPU enhancements can be found in surgery, medical imaging and e-health edge applications as congatec’s new platform supports 8K HDR videos for optimum diagnostics. Combined with the platform’s AI capabilities and the comprehensive Intel OpenVINO toolkit, doctors can gain easy access and insights into deep learning based diagnostic data. But this is just one benefit of the integrated Intel UHD graphics, which also supports up to four 4K displays in parallel. In addition, it can process and analyze up to 40 HD 1080p/30fps video streams in parallel for 360 degree views in all directions. These AI infused massive vision capabilities are also important for many other markets, including factory automation, machine vision for quality inspection in manufacturing, safe spaces & cities, as well as collaborative robotics and autonomous vehicles in logistics, agriculture, construction, and public transport, to name just a few.

AI and deep learning inference algorithms can seamlessly run either massively parallel on the integrated GPU, or on the CPU with built-in Intel Deep Learning Boost that combines three instructions into one, accelerating inference processing and situational awareness.

The new COM-HPC Client and COM Express Type 6 platforms have integrated safety functions that are important for the fail-safe operation of many mobile vehicles and robots, as well as stationary machinery. As real-time support is mandatory for such applications, the congatec modules can run RTOSes such as Real Time Linux and Wind River VxWorks, and provide native support from Real-Time Systems’ hypervisor technology, which is also officially supported by Intel. The result for customers is a truly rounded ecosystem package with the most comprehensive support possible. Further real-time capabilities include Intel Time Coordinated Computing (Intel TCC) and Time Sensitive Networking (TSN) for real-time connected IIoT/industry 4.0 gateways and edge computing devices. Enhanced security features that help to protect systems against attacks make these platforms ideal candidates for all types of critical customer applications in factories and utilities.

The feature set in detail

The conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm) will be available with new scalable 11th Gen Intel Core, Xeon and Celeron processors, with selected variants even for extreme temperatures ranging from -40 to +85°C. Both form factors support up to 128 GB DDR4 SO-DIMM memory with 3200 MT/s and optional ECC. To connect peripherals with massive bandwidth the COM-HPC modules support 20 PCIe Gen 4 lanes (x16 and x4), and the COM Express versions support 16 PCIe lanes. In addition, designers can leverage 20 PCIe Gen 3 lanes with COM-HPC, and 8 PCIe Gen 3 lanes on COM Express.

To support ultra-fast NVMe SSD, the COM-HPC module provides 1x PCIe x4 interface to the carrier board. The COM Express board has NVMe SSD even onboard for optimum utilization of all native Gen 4 lanes supported by the new processor. Further storage media can be connected via 2x SATA Gen 3 on COM-HPC, and 4x SATA on COM Express.

Where the COM-HPC module offers latest 2x USB 4.0, 2x USB 3.2 Gen 2, and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification. For networking, the COM-HPC module offers 2x 2.5 GbE, whereas the COM Express module executes 1x GbE, with both supporting TSN. Sound is provided via I2S and SoundWire in the COM-HPC version, and HDA on the COM Express modules. Comprehensive board support packages are provided for all leading RTOSes, including hypervisor support from Real-Time Systems as well as Linux, Windows and Android.

Vecow Launches Compact Integrated Solution with Intel Atom® x6000 Series Processor

Vecow Co., Ltd., a team of global embedded experts, announced Compact Integrated Solution with Intel Atom® x6000 Series processor. The solution comprises SPC-6000 and PBC-1000 Ultra-compact Fanless Embedded Box PC, and EPBC-1000 2.5″ Single Board Computer. Powered by Intel Atom® x6000 Series processor, Vecow compact integrated solution brings power-efficient, enhanced graphics performance and flexibility capabilities to empower the edge applications such as Intelligent Control, Energy Management, M2M, In-Vehicle Infotainment, factory Automation, and any AIoT/Industry 4.0 applications.

Vecow SPC-6000 and PBC-1000 are ultra-compact fanless embedded with energy-efficient innovations in a small form factor. Based on Intel Atom® x6000 Series Processor, Vecow brand-new ultra-compact fanless embedded Box PC delivers up to 40% faster computing and two times improved 3D graphics performance than the former generation solution. Equipped with max. dual display with 4K resolution, 32GB of DDR4-3200MHz SO-DIMM memory, M.2 slot for expansions and SATA storage, Vecow SPC-6000 and PBC-1000 provide an uncompromised visual experience, enhanced I/O and storage options for AIoT applications. Furthermore, these systems are optimized to run VHub one-stop AIoT Solution Service that supports OpenVINO based AI accelerators and advanced Edge AI applications for faster time to market for any AI-vision applications.

Vecow EPBC-1000 is a 2.5″ Pico-ITX SBC based on Intel Atom® x6211E processor and allows low-power consumption with up to TDP 6W. With a variety of functionalities in a small form factor (measuring only 100mm x 72mm), EPBC-1000 includes 2 GigE LAN, 2 USB, 2 COM, 1 DisplayPort, and 1 SIM card socket for 5G/WiFi/4G/LTE/GPRS/UMTS. In addition, EPBC-1000 supports -40°C to 70°C operating temperature and 12V DC-in, providing trusted reliability for multiple embedded use cases.

“Vecow Compact Integrated Solution is powered by Intel Atom® x6000 Series processor,” said Judy Hu, Product Manager, Embedded Systems & Platform Division at Vecow. ”The solution features a low-power CPU and compact designs, giving industrial users flexibility and performance they need for a wide range of IoT use cases.”

“With demands for smaller architecture, flexible and lower power consumption for diverse industrial environments, Vecow launched SPC-6000, PBC-1000 and EPBC-1000, namely, the compact integrated solution.” said Joseph Huang, Sales Manager, Sales & Marketing Division at Vecow. “They feature the ultra-compact design, along with form factor options with Intel Elkhart Lake platform that gives our customers the balance of power, performance and capabilities for modern AIoT applications.”

Powered by Intel Atom® x6000 Processor, Vecow compact integrated solution delivers improved computing capability and graphics performance for enhanced AIoT deployment. Featuring a fanless design, -40°C to 70°C operating temperature, 12V DC-in, Vecow SPC-6000, PBC-1000 and EPBC-1000 are ideally suited for intelligent Control, Energy Management, M2M, In-Vehicle Infotainment, factory Automation, and any AIoT/Industry 4.0 applications.

SPC-6000 Ultra-compact Fanless System

Intel Atom® x6425RE Processor (Elkhart Lake) Ultra-Compact Fanless Embedded Box PC, 1 GigE LAN, 2.5G LAN, 4 USB, 4 COM, 1 SIM, 12V DC-in, Fanless -40°C to 70°C extended temperature

PBC-1000 Ultra-compact Fanless System

Intel Atom® x6211E Processor (Elkhart Lake) Ultra-compact Fanless Embedded Box PC, 2 GigE LAN, 2 USB, 2 COM, 2 M.2, 1 SIM Socket, 12V DC-in, -40°C to 70°C Extended Temperature

EPBC-1000 Industrial Motherboards

Intel Atom® x6211E Processor (Elkhart Lake) 2.5″ Pico-ITX Embedded Single Board Computer

To know more about Vecow Ultra-compact Fanless System and Industrial Motherboards, please visit the product page or www.vecow.com for details.

ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors

The Express-TL module with 11th Generation Intel processors is ideal for performance-demanding applications in embedded and industrial conditions

ADLINK Technology Inc., a global leader in edge computing, today introduces its new Express-TL COM Express Type 6 module with Intel® Core™, Xeon® W and Celeron® 6000 processors and octa-core (8-core) performance. Intel® UHD Graphics and Intel® AVX-512 VNNI provide superior artificial intelligence (AI) inferencing performance. The Express-TL is well-suited for image processing and analysis, high speed video encoding and streaming, medical ultrasound, predictive traffic analysis and other demanding applications.

“The Express-TL with Intel’s 11th Generation processors is a big boost for high-performance computing,” said Alex Wang, COM Express Product Manager ADLINK. “The integration results in a product that delivers uncompromised system performance and responsiveness – ideal for high-computing and heavy use settings.”

Key features include:

  • Intel® UHD® Graphics core support for one 8K or four 4K independent displays, including High-Definition Multimedia Interface (HDMI), DisplayPort (DP), LVDS, Embedded DisplayPort (eDP) and legacy VGA displays.
  • The Express-TL module provides 2.5 GbE Ethernet and 4 USB 3.2 Gen 2 ports, allowing 10+ Gb/s transfer rates.
  • Intel Time Coordinated Computing (TCC) combined with Time-Sensitive Networking (TSN) Ethernet controller allows Industry 4.0 factories to be smart, agile, and increasingly autonomous while maintaining robustness and reliability.
  • Additional 8C at 25 Watt TDP with ECC memory feature and on-board NVMe storage make it suitable for space constrained applications

AI, machine learning and internet of things (IoT) devices increase demand for real-time processing—from the edge to the cloud. The Express-TL module offers advanced tuning controls, immersive graphics, and unmatched connectivity, which allows new possibilities for AI, workload consolidation, and other intensive computing demands.

ADLINK’s Express-TL COM Express Type 6 module is a result of its close partnership with Intel.  With vibration resistance, wide operating temperature range and reliable system performance, the module helps shorten development cycles and reduce costs. Industrial system integrators, distributors, engineers, and others creating industrial applications will find that the Express-TL delivers impressive performance for power-constrained applications.

ADLINK plays a critical role as a key driving force in developing open standards such as the COM Express® specification. ADLINK has held leadership positions in the PCI Industrial Computer Manufacturers Group (PICMG); PICMG is responsible for many widely accepted standard form factors in the embedded industry. ADLINK’s leadership, authority and technical expertise gives customers the tools they need to develop their carrier boards.

For more information, visit here.

The RTC-710RK: The Better Performing, Longer Lasting Rugged 7” Tablet

The RTC-710RK brings flexibility to rugged mobile computing with brighter screen, longer battery life, and better performance.

AAEON, a leading manufacturer of rugged mobile solutions, announces the latest addition to their lineup of rugged mobile tablet PCs, the RTC-710RK. This tough 7-inch tablet offers users better performance and longer-lasting battery compared to previous generations, as well as brighter screen and more flexible options. The RTC-710RK is built to bring rugged mobile computing to a wider range of applications.

The RTC-710RK is designed to bring better performance, powered by the 6-core Rockchip RK3399 ARM processor, offering stable and efficient operation thanks to its RISC based construction. The RTC-710RK pairs this innovative processor with up to 4 GB of memory and up to 128 GB of storage to power a range of applications. The RTC-710RK utilizes the Android 8.1 (Oreo) operating system, which can be easily customized for a user’s specific needs.

The RTC-710RK is built to work where you need it, for as long as you need it. The RTC-710RK is built to the standard as all of AAEON’s rugged tablets, with MIL-STD-810G and IP65 certifications for vibration testing, drop testing, water and dust proofing. The RTC-710RK also boasts longer battery life thanks to a larger internal battery and hot-swappable battery pack that allows the rugged tablet to keep working without having to stop for a recharge. The RTC-710RK also features a high brightness screen (approx. 700 nits), as well as physical function keys which can be programmed by users.

Flexibility is a feature with the RTC-710RK, with a great standard I/O layout, which can be easily customized for the user’s applications. Users can also opt for add-on modules including a RJ45 and UART port module, or 2D barcode scanner. AAEON also offers a selection of ergonomic accessories to make all-day use easier, including a hand strap, carry bag, and shoulder belt.

AAEON provides industry-leading support for RTC-710RK to ensure reliable, long-lasting operation. AAEON also provides OEM/ODM manufacturer services for customers needing more extensive customization, and to ensure the RTC-710RK can meet the demands of a wide range of industrial applications.

“From site management and field inspection to inventory and vehicle tracking, the RTC-710RK offers a great value for its performance,” said Peter Yang, Manager with AAEON’s Rugged Mobile Division. “Users can enjoy improved performance, brighter screen, and longer lasting battery life, along with our customization services, all for the same price, or even less, than previous generations of 7” tablets.”

more information: https://www.aaeon.com/en/p/rugged-tablet-computers-rtc-710rk

CATL Releasing their Fast-charging First Generation of Sodium-ion Batteries

(CATL) successfully held its first online launch event “Tech Zone” on July 29. Dr. Robin Zeng, chairman of CATL, unveiled the company’s first-generation sodium-ion battery, together with its AB battery pack solution – which is able to integrate sodium-ion cells and lithium-ion cells into one pack – at the event. As another milestone of CATL in the exploration of basic science and technology, sodium-ion batteries will provide a new solution for the use of clean energy and transportation electrification, thus promoting the early realization of the goal of carbon neutrality.

Breaking through the bottleneck of sodium-ion battery technology

As carbon neutrality has become a global consensus, the new energy industry has entered a complex and diversified development stage. The increasingly segmented markets have raised differentiated requirements for batteries. At the same time, the worldwide research and development of basic materials for batteries is accelerating, which opens a two-way window for the industrialization of sodium-ion batteries.

The sodium-ion battery has a similar working principle to the lithium-ion battery. Sodium ions also shuttle between the cathode and anode. However, compared with lithium ions, sodium ions have a larger volume and higher requirements regarding structural stability and the kinetic properties of materials. This has become a bottleneck for the industrialization of sodium-ion batteries.

CATL has been dedicated to the research and development of sodium-ion battery electrode materials for many years. In terms of cathode materials, CATL has applied Prussian white material with a higher specific capacity and redesigned the bulk structure of the material by rearranging the electrons, which solved the worldwide problem of rapid capacity fading upon material cycling. In terms of anode materials, CATL has developed a hard carbon material that features a unique porous structure, which enables the abundant storage and fast movement of sodium ions, and also an outstanding cycle performance.

Based on a series of innovations in the chemistry system, CATL’s first generation of sodium-ion batteries has the advantages of high-energy density, fast-charging capability, excellent thermal stability, great low-temperature performance and high-integration efficiency, among others. The energy density of CATL’s sodium-ion battery cell can achieve up to 160Wh/kg, and the battery can charge in 15 minutes to 80% SOC at room temperature. Moreover, in a low-temperature environment of -20°C, the sodium-ion battery has a capacity retention rate of more than 90%, and its system integration efficiency can reach more than 80%. The sodium-ion batteries’ thermal stability exceeds the national safety requirements for traction batteries. The first generation of sodium-ion batteries can be used in various transportation electrification scenarios, especially in regions with extremely low temperatures, where its outstanding advantages become obvious. Also, it can be flexibly adapted to the application needs of all scenarios in the energy storage field.

Four-pillar innovation system in support of three strategic development directions

CATL has always been committed to being a global premier innovative technology corporation and delivering excellent contributions to the green energy resolution for mankind as its vision. To achieve its vision, CATL is making unremitting efforts in three strategic development directions. The first development direction is to replace stationary fossil energy with renewable energy generation and energy storage; the second is to replace mobile fossil energy by using EV batteries to accelerate the development of E-mobility; the third is to promote the integration innovation of market applications leveraging electrification plus intelligence to accelerate the drive towards new energy applications in different fields. To support sustainable development in these three development directions, CATL has established a four-pillar innovation system, namely in the chemistry system, structure system, manufacturing system and business models, to build a rapid transformation capability from fundamental research to industrial application, and then to large-scale commercialization.

The fundamental research of material and the chemistry system is of great importance. Dr. Robin Zeng, chairman of CATL, has said that some people believe that the battery chemistry system will hardly see any more breakthroughs, and that only improvements can be made in the physical structure system. But we believe that the world of electrochemistry is like the Energy Cube, where there are still a lot of unknowns for us to discover. We never get tired of exploring its mysteries. By using a high-throughput calculation platform and simulation technology, based on our deep understanding of principles combined with the application of advanced algorithms and computing capacity, we engage in an in-depth exploration to develop a chemistry system that is most suitable for sodium-ion batteries, enable them to enter the fast track to industrialization, and continuously evolve. The next generation of sodium-ion batteries’ energy density development target is to exceed 200Wh/kg.

In terms of battery system innovation, CATL has made another breakthrough in battery system integration and developed an AB battery system solution, which is to mix and match sodium-ion batteries and lithium-ion batteries in a certain proportion and integrate them into one battery system, and control the different battery systems through the BMS precision algorithm. The AB battery system solution can compensate for the current energy-density shortage of the sodium-ion battery, and also expand its advantages of high power and performance in low temperatures. Thanks to this innovative structure system, application scenarios for the lithium-sodium battery system are expanded.

Video

Multi-dimensional deployment to promote the industrialization of sodium-ion batteries

At the event, Dr. Qisen Huang, deputy dean of the CATL Research Institute, said that sodium-ion battery manufacturing is perfectly compatible with the lithium-ion battery production equipment and processes, and the production lines can be rapidly switched to achieve a high-production capacity. As of now, CATL has started its industrial deployment of sodium-ion batteries, and plans to form a basic industrial chain by 2023. CATL invites upstream suppliers and downstream customers, as well as research institutions to jointly accelerate the promotion and development of sodium-ion batteries.

Dr. Robin Zeng said that carbon neutrality has spawned a demand for TWh-scale batteries and has promoted the vigorous development of the new energy industry. The continued emergence of application demands has given an opportunity to showcase the capabilities of different technologies. Diversified technical routes will also assure the stability of the industry’s long-term development.

more information: https://www.catl.com

Kendryte K510 is Tri-core RISC-V Processor for Edge AI applications

We have come across multiple hardware development boards and MCUs that employ Edge AI for processing and computing. On the other hand, cloud computing was traditionally preferred as an alternative for implementation due to its scalability and easier to develop applications on the cloud platform. However, it comes at the expense of data transmission latency and security problems. As the system is vulnerable to network attacks.

Edge AI focuses on processing ML algorithms locally on the hardware for a quick and safe system. This form of local computing reduces the network delay for data transfer and solves the security issues as everything happens on the device. Canaan, a leading provider of high-performance computing systems, has developed the Kendryte K510, a RISC-V-based processor built particularly for edge AI applications.

We previously saw the Kendryte K210 AI accelerator processor featuring a dual-core 400MHz 64-bit RISC-V processor with a 0.5 TOPS performance and a custom neural-network acceleration. Everything from Raspberry Pi add-ons to binocular computer vision boards, IoT development kits, and robots rely on K210.

The new self-developed Edge AI chip comes with upgraded machine vision and improved programming flexibility with three times the performance of K210. Thus, the Kendryte K510 can better address the demands of mid-to-high-end applications at the edge. According to Cannan, the K510 specializes in UAV high-definition aerial photography, panoramic video conferencing, robotics, STEAM education, driver assistance scenarios, and industrial and professional cameras.

Block Diagram of Kendryte K510 Processor

Block Diagram of Kendryte K510 Processor

The compact Kendryte K510 AI processor features a 64-bit tri-core RISC-V processor with FPUs. It is divided into a dual-core block that operates at 800MHz and a single-core block that serves as a digital signal processor (DSP).

The main highlight of K510 is that it can triple its computing power while reducing power consumption by adopting unique computing data flow and multiplexing technology. Thus, the chip can perform 3 TOPs (Tera Operations Per Second) for applications requiring faster time responses.

The new K510 also features USB 2.0 OTG compatibility, MIPI CSI, and DVP camera interfaces, gigabit Ethernet, an H.264 video processing unit that is capable of 1080p60 along with MIPI DSI, and BT1120 display choices. It also offers various peripherals, including four UARTs, AUDIF, three SPI buses, three SDIO buses, etc. Additionally, the SHA and AES accelerator provide on-chip security.

All these pairs with K510’s on-chip 1.5MB SRAM split into 1MB and 512kB blocks with LPDDR3/LPDDR4 support for system RAM. The chip integrates a next-generation image processor with 2D/3D noise reduction, WDR (Wide Dynamic Range), fisheye correction, and hardware 3A capabilities.

The K510 is highly configurable, thanks to its RISC-V open-source architecture, and capable of empowering developers when it comes to scenario-based programming. For more information visit the company’s official website.

EZ-PD PMG1: A Portfolio of High-voltage MCUs with USB-C Power Delivery

Infineon Technologies has launched the industry’s first 28V high-voltage microcontroller with USB Power Delivery (USB PD) 3.1 support.

The EZ-PD PMG1 (Power Delivery Microcontroller Gen1) supports any embedded system that provides or consumes power up to 28 V and 140 W in consumer, industrial and communications markets for applications such as smart speakers, routers, power and garden tools.

This follows the latest update to the USB PD standard to support higher voltages and power levels.

The PMG1 family supports higher power capabilities defined in the USB PD 3.1 specification and uses the MCU to provide additional control capability. It integrates an established USB PD stack to enable reliable performance and interoperability, supported by an ARM Cortex-M0+ controller core with up to 256 KB Flash memory and 32 KB SRAM. It also has a USB full-speed interface, programmable general purpose input/output (GPIO) pins, gate drivers, low drop out (LDO) regulators and high-voltage protection circuits.

The MCU also provides hardware and firmware protection, including over-voltage and over-current protection, short circuit and reverse current protection, secure firmware boot and signed firmware update.

To increase ease-of-use for designers, the new devices include programmable analogue and digital blocks to easily customize and integrate intelligent analogue sensors into the application. The PMG1 MCU is also field programmable to allow signed firmware updates for improved efficiency.

Programming is supported by the ModusToolbox integrated development environment with the PMG1 software development kit along with prototyping kits and quick start guide. They make the firmware development and testing simple and easy to further reduce the overall development time and time-to-market.

“As a leader in power semiconductors, we are excited to bring the new PMG1 family to market. It will enable OEMs to further differentiate their consumer, industrial and commercial applications,” said Ajay Srikrishna, Senior Vice President of the Wired Connectivity Solutions Product Line at Infineon. “Following our mission, this MCU is enabling our customers to bring new products to market that will help making consumers’ everyday lives easier, safer and greener.”

The USB PD microcontroller family PMG 1 can be ordered now.

www.cypress.com/products/ez-pd-pmg1-portfolio-high-voltage-mcus-usb-c-power-delivery

SparkFun QuickLogic Thing Plus featuring EOS S3 MCU and eFPGA is now available at $45.95

SparkFun QuickLogic Thing Plus

SparkFun QuickLogic Thing Plus was originally crowdfunded on CrowdSupply that raised around $4500. If you did not back the product back then, no worries, you can buy it now on the SparkFun product page. SparkFun QuickLogic Thing Plus is a powerful FPGA board that comes with a Feather-footprint. The product from the collaboration of SparkFun and QuickLogic makes it a rapid prototyping open-source hardware with ultra-low power SoC for power-sensitive applications.

This FPGA board is built around QuickLogic’s EOS S3 MCU + eFPGA SoC featuring embedded FPGA (eFPGA) technology with 2,400 effective logic cells. The Arm Cortex-M4F MCU provides 512 KB of RAM. One of the important features to note is the out of the box support for machine learning algorithms with TensorFlow Lite and SensiML. However, since it has eFPGA, the software support in that regard is SymbiFlow and Renode.

SparkFun QuickLogic Thing Plus Top View

Specification of SparkFun QuickLogic Thing Plus:

  • CPU: QuickLogic EOS S3 MCU + eFPGA SoC featuring Arm Cortex-M4F MCU running at up to 80 MHz
  • Form factor: Breadboard-compatible 0.1″ (2.54 mm) pitch headers – all headers are pre-soldered
  • Dimensions: 2.75″ x 0.9″ (70 mm x 22.9 mm) footprint
  • Storage: 16 Mbit SPI NOR flash
  • Sensors: Accelerometer, Digital pulse density modulation (PDM) microphone
  • Interfaces: SWD programming connector, UART, I²C, I²S, SPI
  • Power supply: USB Type-C connector or via Li-Po battery

As mentioned earlier, the QuickLogic EOS S3 SoC is an ultra-low-power chip, so the board can be powered using a Li-Po battery as well with onboard charging circuitry using the Microchip MCP73831/2 and has a standard Li-Po JST connector. When it comes to ML applications, it is always an added advantage when there are sensors onboard. So, to solve this the designer has provided the board with an accelerometer with STMicro LIS2DH12TR and digital pulse density modulation (PDM) microphone with Wake-on-Sound (WoS) feature through the Vesper VM3011-U1.

With open-source hardware comes a wide range of real-time operating systems support, including Zephyr RTOS and FreeRTOS. The hardware is ideal for IoT, TinyML and traditional MCU applications. For more information on the specification, head to the product page where it is priced at $45.95. If you plan to purchase the SparkFun QuickLogic Thing Plus board, there is a hookup guide available that will help you get started.

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