Getting Started with Espressif’s ESP32-C3-DevKITM-1 on Arduino IDE

ESP32-C3-DevKITM-1 on Arduino IDE

Espressif Systems ESP32-C3-DevKit M-1 is an extremely powerful board for your IoT applications. Driven by the ESP32-C3FN4 chip, this low-power, low-cost, Wifi-Bluetooth-enabled board has its own unique place in the ESP32 board line-up.

You can program your ESP32-C3-DevKITM-1 module in four ways:

  • ESP-IDF
  • Arduino IDE
  • Eclipse Plugin
  • VS Code Extension

Interfacing the ESP32-C3-DevKITM-1 on Arduino IDE provides us with the flexibility, compatibility, and reliability of a much simpler and easy-to-use UI also boosting the programming speed. In this article, we focus on the programming of ESP32-C3 with Arduino IDE.

Getting Started with Arduino IDE

Arduino IDE being highly popular and convenient to most programmers also has support for ESP boards. For that, you need to add the board’s Github repository to the IDE which can be found here.

For the ESP32-C3-DevKITM-1 board, you need to use the development release link:

https://raw.githubusercontent.com/espressif/arduino-esp32/gh-pages/package_esp32_dev_index.json

First, make sure that you have the latest version of the Arduino IDE installed on your computer. Here are the steps to interface ESP32-C3-DevKITM-1 on Arduino IDE.

Step1: In your Arduino IDE window, go to File menu -> Preferences

Preferences Menu on Arduino IDE

Step2: Once the preferences menu is open, Enter https://raw.githubusercontent.com/espressif/arduino-esp32/gh-pages/package_esp32_dev_index.json in the Additional Boards Manager URLs field and hit OK.

Additional Boards Manager

Step3: Now go to the Boards Manager from the Tools menu.

Boards Manager on Arduino IDE

Step4: In the Boards Manager, search esp32 by Espressif Systems. Install the latest 2.0.0 version.

Installing Latest 2.0.0 Version

Now, once the installation is complete, you can see the ESP32C3 Dev Module in the boards’ section of the Tools menu. Select it.

ESP32C3 Dev Module

Now, under the File menu, in the examples section, you can see some inbuilt examples.

Port For the Development Board

Select a proper port for your board with preferred settings. The port number of the board can be found using Device Manager on your PC.

Port COM4 for ESP32-C3-DevKITM-1

Here, we executed an ESP32-> Time-> SimpleTime example which connects your board to a WiFi network to obtain and display the current date and time on the serial monitor. Enter your network’s SSID and password in the code. Just compile the sketch and then upload it to the board. Also, open the Arduino IDE’s Serial Monitor at a baud rate of 115200 to view the result.

Serial Monitor of ESP32-C3-DevKITM-1

Before uploading, put the ESP32C3 board in programming mode by long-pressing the boot button and simultaneously pressing the reset button once, and then releasing the boot button.

You can now build your own ESP32 C3 projects on Arduino IDE.

SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment

SK hynix Inc. announced that it has started this month mass production of the 8 Gigabit (Gb) *LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology.

* LPDDR4 (Low Power Double Data Rate 4): Low power DRAM for mobile devices. DDR refers to DRAM with the specifications that JEDEC standardized and the generation has advanced from one to four.

As the semiconductor industry classifies the 10nm DRAM products, naming them after the alphabets, the 1a technology is the fourth generation, following the first three generations of the 1x, 1y, and 1z. SK hynix plans to provide the latest mobile DRAM products to smartphone manufacturers from the second half of 2021.

This is the first time that SK hynix adopted the *EUV equipment for mass production after proving the stability of the cutting edge lithography technology through partial adoption for its 1ynm DRAM production.

* EUV (Extreme Ultraviolet): lithography technology that uses extreme ultraviolet

As technology migration continues to ultra-micro levels, an increasing number of semiconductor companies are adopting the EUV equipment for the photo process where circuit patterns are drawn on the wafer surfaces. Industry experts believe that a semiconductor company’s leadership in technology will depend on how it can fully take advantage of the EUV equipment. SK hynix plans to use the EUV technology for production of all its 1anm DRAM products going forward as it has proved the stability of the process.

SK hynix expects the new technology to bring an improvement in productivity, and further boost cost competitiveness. The company expects the 1anm technology to lead to a 25% increase in the number of DRAM chips produced from the same size of a wafer, compared with the previous 1znm node. SK hynix anticipates that the 1anm DRAM will also likely help alleviate the supply and demand conditions of the global markets following an increase in DRAM demand globally.

The new product stably runs 4266Mbps, the fastest transfer rate in a standard LPDDR4 mobile DRAM specification, and has reduced power consumption by 20%. It is a meaningful accomplishment for SK hynix as it aims to reduce carbon dioxide emission as part of its commitment to the environmental, social and governance (ESG) management.

SK hynix will apply its 1anm technology to its DDR5 products, the world’s first next-generation DRAM launched in October 2020, from early next year.

Cho Youngmann, Vice President at SK hynix, said that

“With improved productivity and cost competitiveness, the latest 1anm DRAM will not only help secure high profitability, but also solidify SK hynix’s status as a leading technology company with early adoption of the EUV lithography technology for mass production.”

more information: www.skhynix.com

Renesas IPS2200 inductive position sensor IC is capable of providing the absolute rotor position

The IPS2200 is an industrial qualified, inductive position sensor IC capable of providing the absolute rotor position as sine and cosine

The IPS2200 is an industrial qualified, inductive position sensor IC capable of providing the absolute rotor position as sine and cosine. This IC uses the physical principle of Eddy currents to detect the position of a simple metallic target moving above a set of coils, consisting of one TX and two RX. The IPS2200 can be used for high-speed motor commutation up to 250krpm electrical, in industrial, medical, robotic, and consumer applications. Stray filed immunity, lower weight, smaller size, and substantial BOM optimization, make the IPS2200 an ideal alternative for resolver replacement.

Key features

  • Design flexibility: through-shaft, side-shaft and end of the shaft variants are possible
  • High accuracy: customizable sensor pattern design to match the number of motor pole pairs
  • No tight mechanical tolerances: stable performance over all mechanical displacements
  • Temperature range: -40 °C to 125 °C ambient and voltage supply: 3.3 V ±10% or 5.0 V ±10%

Additional features

  • Interface: Sin/Cos single-ended or differential
  • Qualified for the industrial market
  • Temperature range: -40 °C to 125 °C ambient
  • Voltage supply: 3.3 V ±10% or 5.0 V ±10%
  • Rotational speed: up to 250.000 RPM (electrical)
  • Propagation delay: programmable, less than 10 µs
  • Sin/Cos gain mismatch and offset compensation
  • Overvoltage, reverse polarity, short-circuit protected
  • Digital programming interface: I²C or SPI
  • AB incremental pulse outputs
  • 16-TSSOP package

more information: https://www.renesas.com/us/en/products/sensor-products/position-sensors/ips2200-inductive-position-sensor-high-speed-motor-commutation

ON Semiconductor NCP1342 is a highly integrated quasi-resonant flyback controller

The NCP1342 is a highly integrated quasi-resonant flyback controller suitable for designing high-performance off-line power converters

The NCP1342 is a highly integrated quasi-resonant flyback controller suitable for designing high-performance off-line power converters. The integrated X2 capacitor-discharge feature enables the NCP1342 to achieve no-load power consumption below 30 mW.

The controller features proprietary valley-lockout circuitry, ensuring stable valley switching, and includes key protection features for AC-DC power supply applications.

Key features

  • QR frequency jittering for optimized EMI behavior
  • Quiet-Skip technology to ensure operation outside the audible range
  • Frequency foldback with 25 kHz min frequency clamp for the highest light load efficiency
  • Integrated HV Startup with brownout protection

Additional features

  • Valley switching operation with valley lockout
  • Integrated X2 capacitor-discharge capability
  • NTC-compatible fault pin
  • High drive capability: -500 mA/+800 mA
  • Latch input for OVP and OTP implementation

Applications

  • Medium or high power AC-DC adapters
  • Ultra-high-density AC-DC adapters
  • Low/medium power USB PD adapters
  • Notebook computer adapters

more information: https://www.onsemi.com/ncp1342

Qorvo QPL1818 75Ω CATV Amplifier featuring 15dB of gain

Qorvo QPL1818 75Ω CATV Amplifier is a GaAs (Gallium Arsenide) pHEMT (Pseudomorphic High-Electron-Mobility Transistor) single-ended MMIC RF amplifier featuring 15dB of gain. The QPL1818 offers a 50MHz to 1800MHz frequency range providing an ideal solution for a wide range of  DOCSIS 4.0 amplifiers and nodes as well as home gateways and cable modems.

The Qorvo QPL1818 75Ω CATV Amplifier is Available in a compact 3.0mm x 3.0mm QFN16 package well-suited for space-constrained designs.

Features

  • 50MHz to 1800MHz frequency range
  • 5V single power supply
  • 100mA typical current
  • 15dB gain (typical)
  • 2dB noise figure (typical)
  • MER <42dB @ 55dBmV TCP
  • Adjustable bias using external resistors
  • 3.0mm x 3.0mm QFN16 package
  • -40°C to +100°C operating temperature range
  • Lead-free, halogen-free, and RoHS compliant

more information: https://www.qorvo.com/products/p/QPL1818 </a

DFRobot DFR0756 DC-DC Fast Charge Module

DFRobot DFR0756 DC-DC Fast Charge Module integrates the most common 5V charging-recognition function and provides compatibility for more than 99% of mobile phones on the market. The charging current at the peak of this module can be triggered by the charging protocol, which greatly saves charging time. This fast-charging module is capable of providing steady output and thereby works for a long time without voltage shift. Typical applications include projects like mobile phone fast charging, car charging retrofit, solar charger, and DIY power sources.

Features

  • Compact size
  • 5V charging recognition function
  • Support multiple fast-charging protocols
  • USB output
  • Can be used as a charging module or power supply

Specifications

  • Output voltage:
    • 3V to 12V auto-adjust based on the fast-charging protocol
    • Default output 5V, the input should be 2V higher than the output
  • 0-3A output current
  • Supported Fast Charging Protocol:
    • DCP protocol, BC1.2, Apple, Samsung
    • Huawei fast charging protocol FCP/SCP
    • Supports Spreadtrum Fast Charge Protocol (SFCP)
    • Qualcomm QC 2.0 and 3.0
    • MTKPE1.1/PE2.0
  • 6V to 32V input voltage range
  • Chip protections:
    • Input overvoltage
    • Under-voltage protection
    • Input overcurrent protection
    • Output overcurrent protection
    • Short circuit protection
    • Machine over-temperature protection

more information: https://www.dfrobot.com/product-2163.html

u-blox’s SARA-R5 LTE-M/NB-IoT Modules are secure cloud LTE solutions

u-blox’s modules offer security-based features and services like zero-touch provisioning and secure chip-to-chip communication

u-blox’s SARA-R5 series modules are secure cloud LTE Cat M1/LTE Cat NB2 solutions based on the UBX-R5 cellular chipset and the M8 GNSS receiver chip. With this combination, u-blox can offer long-term device availability and provide lifetime support of the entire platform, down to the chipset level. The SARA-R5 series also offers security-based features and services like local data protection, zero-touch provisioning, anti-cloning, and secure chip-to-chip communication.

The LTE-M and NB-IoT modules support a comprehensive set of 3GPP Rel. 14 features that are relevant for IoT applications, like improvements to power consumption, coverage, data rate, mobility, and positioning. They are 5G-ready, meaning customers will be able to upgrade the software of their deployed devices once 5G LTE has been rolled out by mobile operators, greatly improving product scalability and lifetime.

The SARA-R5 series includes three secure Cloud variants that support u-blox IoT-Security-as-a-Service, making these the ideal choice for devices that transmit critical and confidential information. The SARA-R500S secure Cloud module is the cost-effective solution, the SARA-R510S secure Cloud module is optimized for extremely low power consumption in deep-sleep PSM, and the SARA-R510M8S secure Cloud module has an integrated u-blox M8 GNSS receiver chip and a separate GNSS antenna interface. In addition, the SARA-R510M8S module offers unique hybrid positioning, in which the GNSS position is enhanced with u-blox CellLocate® data, providing location always and everywhere.

SARA-R5 series modules are form-factor compatible with the u-blox LISA, LARA and TOBY cellular module families and they are pin-to-pin compatible with the u-blox SARA-R4, SARA-N2, SARA-N3, SARA-N4, SARA-G3, SARA-G4, and SARA-U2 cellular modules families.

Features

  • Built-in secure cloud functionality with hardware-based root-of-trust inside a discrete secure element
  • IoT security-as-a-service with foundation, design, end-to-end security, and access control
  • Optimized ultra-low power consumption: less than 1 µA of current in power saving mode (PSM)
  • Data communications up to 1,200 kbits/s
  • Extended operating temperature range: -40°C to +85°C
  • Critical firmware updates delivered and services enabled via uFOTA
  • Accurate and reliable positioning with u-blox M8 GNSS receiver (SARA-R510M8S)
  • -00B version: LTE-M only for US and EU + global roaming
    • Security-based features:
      • Key management system
      • Zero-touch provisioning
      • Local data protection
      • Local chip-to-chip security
      • Local data protection
  • -01B version:
    • -00B features plus:
      • NB-IoT for EU, Taiwan, and Australia
      • E2E data integrity
  • Thingstream anywhere

more information: https://www.u-blox.com/en/product/sara-r5-series

ICP-10111 Barometric Pressure Sensor consumes only 1.3 µA @ 1Hz

TDK Invensense’s ICP-10111 is ideal for mobile phones, wearable fitness monitoring, drones, and battery-powered IoT

TDK Invensense’s ICP-10111 barometric pressure sensor is based on MEMS capacitive technology, which provides ultra-low noise at the lowest power, enabling excellent relative accuracy, sensor throughput, and temperature stability. The pressure sensor can measure pressure differences with an accuracy of ±1 Pa, an accuracy enabling altitude measurement differentials as small as 5 cm, less than the height of a single stair step.

Consuming only 1.3 µA at 1 Hz, available in a small footprint 2.0 mm × 2.5 mm × 0.92 mm 8-pin LGA package, the ICP-10111 is ideally suited for mobile phones, wearable fitness monitoring, drones, and battery-powered IoT.

The ICP-10111 offers a temperature coefficient offset of ±0.5 Pa/°C. The combination of high accuracy, low power, and temperature stability in a small footprint enables higher performance barometric pressure sensing for sports activity identification, mobile indoor/outdoor navigation, and altitude-hold in drones.

Features

  • Pressure operating range: 30 kPa to 110 kPa
  • Noise and current consumption:
    • 0.4 Pa at 10.4 µA (ULN mode)
    • 0.8 Pa at 5.2 µA (LN mode)
    • 3.2 Pa at 1.3 µA (LP mode)
  • Pressure sensor relative accuracy: ±1 Pa for any 10 hPa change over 950 hPa to 1050 hPa at +25°C
  • Pressure sensor absolute accuracy: ±1 hPa over 950 hPa to 1050 hPa, 0°C to +65°C
  • Pressure sensor temperature coefficient offset: ±0.5 Pa/°C over +25°C to +45°C at 100 kPa
  • Temperature sensor absolute accuracy: ±0.4°C
  • Temperature operating range: -40°C to +85°C
  • Host interface: I2C at up to 400 kHz
  • Single supply voltage: 1.8 V ±5%
  • Small footprint of 2.0 mm × 2.5 mm × 0.92 mm
  • 8-pin LGA package
  • RoHS and green compliant

more information: https://invensense.tdk.com/products/1-axis/icp-101xx/icp-10111/

IRR1-SOL Solar Irradiance Meter helps troubleshooting of photovoltaic installations

Fluke’s IRR1-SOL solar irradiance meter is designed to simplify the installation and troubleshooting of photovoltaic arrays in a single handheld tool

Solar energy converts the sun’s energy into electricity; solar technology is improving with costs of going solar decreasing rapidly. Fluke’s IRR1-SOL solar irradiance meter provides industrial, residential and commercial installation and maintenance professionals with a single handheld tool designed to simplify the installation, commissioning, and troubleshooting of photovoltaic arrays, measuring irradiance, temperature, inclination, and direction of the solar array.

The simple user interface, instantaneous solar irradiation measurements, and built-in temperature sensor make it easy to meet the IEC62446-1 requirements for testing, documenting, and maintaining photovoltaic systems.

The meter can measure irradiance by simply placing the meter directly onto the PV panel. The integrated compass and inclination sensor also allows quick measurement and documentation of roof and site orientation, pitch, and panel tilt, while surveying, installing, or adjusting an installation.

  • Optimizes placement on solar power systems and verifies window efficiency
  • Measures solar output used to calculate overall energy efficiency and placement of solar systems

Features

  • Measure solar irradiance, ambient and PV module temperature, array orientation, and tilt angles
  • Make instantaneous measurements to determine the watts per square meter solar irradiation required by IEC 62446-1 standard
  • High contrast LCD with large numbers for easy readability in direct

more information: https://www.fluke.com/en-us/product/electrical-testing/best-solar-energy-industry-tools/flk-irr1-sol

LE-37O – 3.5 inch Miniboard Intel® Tiger Lake UP3 Processor

Taiwan Commate Computer Inc.(COMMELL), the worldwide leader of Industrial Single Board Computers, unveiled LE-37O 3.5 inch Miniboard embedded system board based on Intel® Tiger Lake UP3 processors.

The LE-37O 3.5 inch Miniboard platform is designed for Intel® Tiger Lake UP3-series processors in the FCBGA1449 sockets. support DDR4 memory (One DDR4 SO-DIMM 3200 MHz up to 32GB).

The platform is based on Intel® UHD Graphics, this GPU offers 24 execution units (EUs) clocked at up to 1150Mhz(depending on the CPU model), The revised video engine now decodes H.265/HEVC completely in hardware and thereby much more efficiently than before. Displays can be connected via1 VGA, 1 LVDS,1 HDMI and one DP port up to four displays can be controlled simultaneously. LE-37O offers lots of features including high-speed data transfer interfaces such as 4 x USB3.2 Gen2 and 2 x SATA3, equipped with dual Gigabit Ethernet, and comes with PS/2 port, 2 x RS232 and 2 x RS232/422/485, 2 x USB2.0, Intel® High Definition Audio, and 1 MiniPCIe socket(Supports mSATA), 1 M.2 (Key E 2230), 1 M.2 (Key M 2280) for NVMe.

Key Features:

  • CPU: Intel® Tiger Lake UP3 Processor in the FCBGA1449 sockets.
  • Memory: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory.
  • Integrated Graphics: Intel® Iris® Xe Graphics.
  • LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply
  • Display port interface: Onboard Display port connector.
  • HDMI interface: Onboard HDMI connector.
  • VGA interface: Onboard VGA connector.
  • LAN Interface: 1 x Intel® i219-LM Gigabit PHY LAN(Support iAMT 15.0), 1 x Intel® i225-LM Gigabit LAN (up to 2.5GbE).
  • Serial ATA: Support 2 x SATA3.
  • Audio: Realtek ALC262 High Definition Audio.
  • Internal I/O: 2 x SATA3, 2 x RS232,  2 x RS232/422/485, 2 x USB2.0, 1 x LVDS, 1 x LCD inverter conector, 1 x GPIO, 1 x Audio, 1 x PS/2, 1 x SMBus.
  • Rear I/O: 1 x DisplayPort, 1 x HDMI, 1 x VGA, 4 x USB3.2 Gen2, 2 x LAN.
  • Extended interface: One PCIE Mini card (Support mSATA), one M.2 (Key E 2230) for Wi-Fi and Bluetooth, one M.2 (Key M 2280) for NVMe.
  • GPIO interface: Onboard programmable 8-bit Digital I/O interface.
  • Power requirement: DC input 9~35V.

more information: http://www.commell.com.tw/Product/SBC/LE-37O.HTM

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