Glasgow Interface Explorer Offers flexible open source multitool for digital electronics

1BitSquared has launched on Crowdsupply it’s Glasgow Interface Explorer. The board is said to be designed for hardware designers, reverse engineers, digital archivists, electronics hobbyists, and anyone else who wants to communicate with a wide selection of digital devices with minimum hassle. The board is designed to be attached to the majority of devices without additional active or passive components, and it enables extensive protection from unexpected conditions and operator error. There have been other boards for hardware hackers and engineers recently, like the Ollieand Tigard USB debug boards. Glasgow is the latest of these sets of boards. The Glasgow hardware offers support for many digital interfaces thanks to its reconfigurable logic. Instead of offering just a small selection of standard hardware supported interfaces, it uses an FPGA to adapt — on the fly — to the task at hand without compromising performance or reliability, even for unusual, custom, or obsolete interfaces.

 

The Glasgow software features a set of building blocks designed to eliminate system complexity. Each of these protocols is placed into a self-contained applet that can be used directly from the command line or integrated into a more complex system. The Glasgow software is easy to use, it does not require any programming knowledge, although you can do much more with it if you know a bit of Python. Glasgow can function as a USB-to-serial adapter, and unlike traditional serial adapters, it can auto-detect the target voltage and “mirror” it. It goes further by auto-detecting the baud rate of the target and follow it on the fly. Glasgow can also directly interface to inverted signal UART interfaces, which would conventionally require additional debugging components, like buffer transistors. Glasgow also features built-in support for InfluxDB. This enables any applet that reads out sensors to directly log the data and you can visualize them in Grafanawith with very minimal effort.

Talking about the versatility of the Glasgow, they say:

“Today there are a lot of different LED display technologies available. Like “intelligent” RGB LEDs with built in PWM controllers, for example WS2812 or APA102. There are LED matrix display panels with myriad of shift register based interfaces like HUB75, HUB75e, HUB8, HUB12 and many more. All of them use fairly nonstandard protocols. From timing-driven one-wire interfaces, through fairly normal SPI interfaces to multichannel parallel shift register interfaces. Typical protocol adapters only provide a specific subset of hardware supported interfaces. Everything beyond that has to be implemented with so called bit-banging. Bit-banging means that the processor or the PC has to control I/O step from software, in some cases even through USB. This is cumbersome if not impossible due to the timing constraint and USB speed. In the case of Glasgow, that can be easily reconfigured. It is possible to experiment and prototype with these devices quickly and with minimal hassle. Just a few lines of nMigen and Python and you are ready to go.”

The company also designed a beautiful CNC-milled aluminum case to keep the Glasgow safe from damage. However, it’s available as an option. You can find more information about Glasgow Interface Explorer on Crowd Supply, and you can pledge $139 to get the latest RevC revision of the board as well as a full set of flywire, sync, and USB-C cables. Available also is an optional CNC-milled and anodized aluminum case that selling for $50. Shipping will be free to the US, and the shipping fee will depend on weight and destination for other countries. Shipping is scheduled for May 31, 2021.

Bosch’s BHI260AP self-learning AI smart sensor for fitness tracking

BHI260AP Sensor

Athletes have started relying on fitness trackers to monitor their daily exercise and to improve their performance. After a series of developments in smart trackers for athletes, Bosch has now released its new self-learning AI smart sensor BHI260AP specially designed for fitness tracking, navigation, machine learning analytics, and orientation estimation.

“The self-learning AI sensor will change how users interact with their fitness devices from a mere one-way approach to an interactive way of training”, says Dr. Stefan Finkbeiner, CEO at Bosch Sensortec. “This new sensor combines Bosch Sensortec’s long-term experience in smart motion sensors with its strong competence in innovative software development.”

The company uses the term “One piece of software – four features” indicating that it is a self-learning sensor that can be personalized and features auto-tracking with enhanced ability. Auto-track is the automatic tracking of fitness activities without user intervention. This comes with self-learning AI software that is provided with more than fifteen pre-learned fitness activities.

BHI260AP

The AI sensor is based around Synopsys’s popular ultra-low-power DesignWare ARC EM4 processors with ARCv2 16/32-bit instruction set clocked up to 3.6 CoreMark/MHz. The EM4 processor supports the floating-point unit and comes along with the memory protection unit. BHI260AP has an integrated 16-bit 3-axis accelerometer and gyroscope sensors.

The manufacturer offers a wide range of software support for self-learning AI sensors. This means that the manufacturer of a wearable device can easily load the required software onto the sensor for those targeted applications or specific use cases including orientation tracking, position tracking (PDR), and swimming.

BHI260AP AI sensor

“Since the BHI260AP is a fully programmable sensor, manufacturers can build their own customized software to be embedded in the BHI260AP or upload customized solutions depending on the users’ context. To protect these customized solutions from unauthorized use, the smart programmable sensor offers a digital signature.”

To make development easier for AI-based wearable solutions, the manufacturer provides an application board along with a BHI260AP shuttle board that can be connected over Bluetooth Low Energy (BLE) to smartphones.

The BHI260AP self-learning AI sensor is available via Bosch Sensortec’s distributors along with the software packages that are available for download on the Bosch Sensortec website.

Vecow Launched DVC-1000 Industrial-Grade 3D Vision Camera

Vecow Co., Ltd., a team of global embedded experts, announced a new product portfolio for Embedded Vision Camera with an Industrial-grade 3D Vision Camera, DVC-1000. It is powered by Intel® RealSense™ technology to deliver intuitive, natural interaction and immersion with advanced stereo image sensing technologies for vision-based applications. Vecow DVC-1000 features an IP67-rated enclosure, fanless design and supports 0°C to 40°C operating temperature to allow industrial application deployments in harsh environments. Featuring depth resolution up to 720P, frame rate up to 60fps, along with a global shutter sensor, Vecow DVC-1000 is a well fit solution for Robot Vision, Autonomous Mobile Robot, Object Dimensioning and Intelligent Surveillance applications.

Vecow DVC-1000 is an industrial-grade 3D vision camera and is based on a global shutter sensor. Therefore, it is perfectly used for capturing images of objects, with a working distance of up to 10M at a rapid movement sequence. The product is powered by an Arm-based processor and is capable of supporting edge computing at the edge.

This compact camera measures 112.6mm x 106.6mm x 43.0mm. The small footprint design makes it ideally suited for space constrained applications like robot vision and AMR. Moreover, DVC-1000 offers the flexible choice of either 12V DC-in or electric power through PoE via a single cable. By doing so, the system helps simplify solution deployment and system installation. Moreover, DVC-1000 is compatible with Intel® RealSense™ SDK 2.0 for users to deploy depth applications with less effort.

“Vecow DVC-1000 is designed for both indoor and outdoor environments and allows for faster, simple and accurate object recognition,”said Kev Wang, Applied Software Product Manager of Vecow. “Aimed at industrial applications, the DVC-1000 comes in a rugged enclosure with an IP67 rating. More importantly, it supports M12 power connector and a waterproof PoE cable, enhancing not only longer length connectivity compared to USB cable but also system reliability.”

“We are thrilled to introduce the product portfolio for the Industrial-grade 3D Vision Camera to our partners and for those who are involved in vision-based applications,” said Joseph Huang, Sales Manager, Sales & Marketing Division at Vecow. “By integrating Vecow embedded systems, DVC-1000 delivers an easy-to-use and flexible solution that can be used for vision applications deployments such as Robot Vision, AMR and intelligent surveillance with less effort and fast-time-to market.”

Powered by Intel® RealSense™ and designed with rugged IP67 protection for 3D images, Vecow DVC-1000 is a flexible and suitable solution for Robot Vision, Autonomous Mobile Robot, Object Dimensioning and Intelligent Surveillance.

To learn more about Vecow Embedded Vision Camera, please visit the DVC-1000 product page or www.vecow.com for more details.

Microscanner mirrors replace human vision

A MEMS mirror from Fraunhofer IPMS.

In autonomous vehicles, it is advanced technology that takes the wheel, allowing passengers to sit back and enjoy the ride. Yet such systems have to meet stringent safety standards. For example, an autonomous vehicle must be able to recognize obstacles and other hazards – and apply the brakes in an emergency. Such a vehicle could be equipped with a new microscanner mirror from the Fraunhofer Institute for Photonic Microsystems IPMS. This performs a 3D scan of the vehicle surroundings to a range of over 200 meters. When integrated within a LiDAR system, it can obviate the need for human vision and thereby make a key contribution to the safety of autonomous driving.

Today’s vehicles already feature a variety of advanced driver-assistance systems. In coming years, it will become compulsory to install emergency systems such as evasive steering support in new vehicles, thus paving the way for the advent of autonomous driving. Yet even in coming vehicle generations, humans will still be expected to keep an eye on their surroundings and react in dangerous situations. This could well change, however, with the introduction of LiDAR (light detection and ranging) systems, which measure the distance between the vehicle and other objects. Such systems are able to scan the surrounding area for potential hazards and thereby replace the human eye. As such, they mark a decisive step on the way towards safe autonomous driving.

A team of researchers at Fraunhofer IPMS in Dresden has now developed a new type of microscanner mirror, which forms a key element of LiDAR systems that are capable of 3D digital vision. This component is used to steer the laser that generates a 3D scan of the surrounding area. AEye, a specialist for LiDAR systems in autonomous vehicles, is already using the microscanner mirror in its 4Sight LiDAR sensor. “With our technology platform, we’re able to meet design specifications for new microscanners suitable for use with LiDAR,” explains Dr. Jan Grahmann, research associate at Fraunhofer IPMS. “LiDAR systems are able to scan the surrounding area in three dimensions and therefore detect pedestrians, cyclists or other vehicles. Our MEMS mirror splits the laser beam in two dimensions and focuses the light on the object that is being measured. By measuring the time of flight of the reflected light, it is also possible to determine the distance to the object as a third dimension.”

In detail, the process is as follows: light from a laser diode or other laser source is directed at a microscanner mirror installed in the transmitter of the LiDAR system. The mirror scans the surrounding area in two dimensions. To determine the third dimension, the light reflected from the object is captured by a LiDAR sensor. Here, the following applies: the more light captured by the sensor, the more accurately the distance to the object can be determined. This is a task performed by an evaluation algorithm. The distance to each scanned position in the vehicle surroundings generates a 3D point cloud that represents the LiDAR field of vision.

When integrated in a LiDAR sensor, the MEMS mirror from Fraunhofer IPMS will equip vehicles with 3D vision of their surroundings.

Robust, proof against material fatigue, resistant to temperature and shock

The MEMS scanner is made of monocrystalline silicon, a material with several advantages: it is not only robust and proof against material fatigue but it has a high temperature and shock resistance. The silicon has a reflective coating that intensifies the reflection of the light. Thanks to positioning technology integrated in the chip, it is possible to continuously track where the mirror steers the laser beam and which position is being measured. This in turn enables correction to the point of operation. In the vehicle, the LiDAR sensor is generally mounted behind the rear-view mirror, from where it directly scans the surrounding area though the windshield. This system can be used to perform a 3D scan in the infrared range, thereby supplementing the vision of the driver or passengers.

“Our MEMS mirrors are typically up to 5 millimeters in size,” says Grahmann. “For spe-cialized applications, larger mirrors are an option; but with increasing size, you lose the benefits of MEMS. Alongside the microscanner mirrors, we also supply the requisite packaging and the drive electronics. All components can be designed to customer specifications, thereby guaranteeing that they can be integrated in different LiDAR systems. We also develop, for example, MEMS scanners for head-mounted displays and industrial robots.”

The microscanner mirrors from Fraunhofer IPMS function, for example, at wavelengths typical for LiDAR applications – 905 to 1,550 nanometers. The size of aperture has a major impact on operating range. With the smart LiDAR sensors from AEye, operating ranges of over 200 meters are possible. AEye has successfully completed testing of the MEMS scanners from Fraunhofer IPMS, which are used in its LiDAR system.

“At present, advanced driver-assistance systems featuring LiDAR technology are still about providing greater comfort and enhanced safety. There are five levels of autono-mous driving, each of which involves a different degree of driver invention. Now, there’s still some way to go before fully autonomous driving becomes a reality, but our technology will help advance this process,” says Grahmann.

The next step will be to produce the microscanner mirrors in larger volumes and to prepare the technology for mass production.

more information: https://www.fraunhofer.de

10 Gigabit Ethernet Support on iWave’s Zynq UltraScale+ MPSoC SOM

By: Tawfeeq Ahmad @ www.digikey.com

The act of processing the communication protocol stack on a 10 GbE system taxes modern FPGAs that cater to high-speed network applications. Engineers who’re designing the solutions around 10 GbE got a helping hand from the introduction of the Xilinx Zynq UltraScale+ MPSoC. This device family features many Quad A53 Core options, Dual R5 Core options, and GPU support. In addition, this device features Programmable Logic Cells (192K to 1153K LEs) with High-Speed transceivers (16.3 Gbps) in a single chip and rated for the industrial temperature range needed for deployed applications.

10 Gigabit Ethernet Support on iWave’s Zynq UltraScale+ MPSoC SOM – [Link]

Graphene energy harvesting chips closer to availability

Nanotechnology company NTS Innovations says it has achieved a major milestone in its development of a graphene energy harvesting (GEH) clean energy source that can operate in any environment.

GEH is the act of harvesting energy at the nanoscale level from the naturally occurring oscillations in graphene. Freestanding graphene converts ambient energy into mechanical energy in the form of ripple fluctuations, much like waves on the ocean, says the company. Now, in partnership with the University of Arkansas, the company says it has completed the development of its energy harvesting circuit on a silicon wafer.

“GEH is a nanoscale device on a semiconductor wafer,” says Preston Carter, Chief Technology Officer at NTS Innovations. “The technology itself varies slightly with temperature but is otherwise robust in all environments. GEH can generate power in outer space and aerospace environments, GEH will work anywhere on Earth, and will continue to work deep in the ocean. The only environmental limitations to GEH will be the packaging used to contain it.”

With the development of an energy harvesting circuit complete, the company says it is now moving on to prototypes and optimization for commercial applications. GEH chips are made with common semiconductor manufacturing techniques, making them cost-effective, scalable, and easy to mass produce. The first generation GEH chip is targeted for 10 mW (milliwatts) with a chip size of 12 x 12 x 3 mm.

The first generation GEH chip, says the company, will enable sensors and small electronics to become self-powered, without the need to recharge or replace batteries. Future releases of the GEH chip will increase in power density, holding promise for applications ranging from cell phones, tablets, appliances, and cars.

“We are very excited to introduce this game-changing technology,” says said Don Meyer, Founder and CEO of NTS Innovations. “An enormous amount of work has gone into the development of Graphene Energy Harvesting. We are extremely thankful for the NTS Innovations team taking this from its discovery to a proven concept, and now chip production. This ‘World Changing Technology’ can bring power to every corner of the globe. Something as simple as a small light can change lives.”

The technology will be packaged in a commercial chip and available for purchase through a global network of electronics distributors in 2021.

NTS Innovations

EL30000 Series Bench DC Electronic Loads

Minimises test bench space for measuring voltage, current and power to ensure constant energy output and handling sudden electrical changes

To offer a compact bench form factor with a built-in data logger for delivering immediate, real-time decision insights and minimising the need for additional instruments with an accurate system that measures voltage, current and calculates power, the new EL30000 series bench DC electronic load has been launched.

An electronic load is an instrument that tests sources by presenting various resistances and measuring the response. Device manufacturers and design engineers use electronic loads to test power devices such as power supplies, batteries, battery modules, solar panels, fuel cells, LED drivers and power converters.

The EL30000 enables customers to test a wide range of power sources, perform both static and dynamic tests to ensure devices can output constant energy, as well as handle a sudden increase or decrease in demand. Multiple ranges allow accurate measurements for small and large devices from zero to 150V. A built-in measurement system eliminates the need for an external digital multimeter, shunts and associated wiring.

The new Keysight EL30000 Series electronic load systems enable device manufacturers and design engineers to:

  • Measure voltage and current accurately with a fully integrated voltmeter and ammeter that simultaneously measures the device under test (DUT) voltage and current.
  • Capture measurements over time with the built-in data logger that continuously logs voltage, current and power to a data file.
  • Create, capture and display fast transients with a dynamic load profile and built-in scope mode that digitises the voltage and current and shows the results, reducing measurement set up complexity.
  • Simplify tests with standard operating modes: constant voltage (CV), constant current (CC), constant resistance (CR) and constant power (CP).
  • Connect with USB, LAN (LXI Core) and optional general-purpose interface bus (GPIB) to easily measure, capture and display results.

The EL30000 Series bench DC electronic loads are available now from Keysight Technologies.

SLN-VIZNAS-IOT Secure Facial Recognition Solution

NXP’s MCU-based facial recognition solution helps deliver access control capabilities to smart home, smart building, and smart industrial applications

NXP’s SLN-VIZNAS-IOT MCU-based solution for secure facial recognition, with liveness detection for anti-spoofing, leverages the i.MX RT106F crossover MCU. It enables developers to quickly and easily add low-cost, secure facial recognition capabilities to access-control products. This ultra-small form-factor reference design comes with fully integrated software running on FreeRTOS for quick out-of-the-box evaluation and proof-of-concept development. The SLN-VIZNAS-IOT development kit implements this solution and begins trying to recognize faces immediately after power-up. It does facial recognition entirely offline, without the need for cloud connectivity, reducing total cost of ownership and design complexity. New faces can be registered both on the i.MX RT106F and also remotely on mobile and PC platforms, enabling face models to be conveniently created at a distance and downloaded to i.MX RT106F-based access devices over Wi-Fi or BLE connections. This turnkey solution minimizes time-to-market, risk, and development effort, enabling OEMs to easily add secure facial recognition. It also delivers access-control capabilities to smart home, smart building, and smart industrial applications, including smart locks for residential and hospitality use cases. All processing of facial recognition and face model creation is done at the network edge, without the need for cloud connectivity, addressing the privacy concerns that many consumers have.

Features

  • Camera drivers, image capturing, and pre-processing
  • Face detection, tracking, alignment, and recognition with quantified results and confidence measure
  • Liveness detection for anti-spoofing
  • Connectivity (optional)
    • MQTT, lwIP, and TLS
    • Discovery and onboarding
    • All drivers, including Wi-Fi and Bluetooth™
  • Emotion recognition
  • Built-in security, bootloader, and application validation
  • RTOS OTW/OTA client with signing scripts, rollback, and image redundancy
  • USB mass storage device updates
  • Factory automation scripts
  • Supported by MCUXpresso SDK, IDE, and config tools

Block Diagram

more information: https://www.nxp.com

THB001P Series Thumbstick Switch features dual axis Mini-joystick

C&K’s miniature thumbstick switch features a versatile, high-quality dual-axis lever with an integrated center select switch

C&K’s THB001P miniature thumbstick switch features a versatile, high-quality dual-axis lever with integrated center select switch. It meets the reliability requirements demanded by premium controller products including high-end drones, gaming peripherals, and industrial controllers. Featuring a high activation force and a small form factor, the THB series combines a small package with improved ergonomics, providing premium performance to its users and accommodates a wide range of customers.

Features

  • 2 axis, multi-direction operation
  • 2,000,000 life cycle for toggle
  • Center select momentary switch
  • Small package size

Applications

  • Gaming peripherals
  • Remote control vehicles
  • Mini-joystick
  • Thumb control
  • Navigation control
  • Industrial control
  • Heavy equipment

Video

more information: https://www.ckswitches.com

Sterling LWB5+ Wi-Fi® + Bluetooth® Modules

Laird Connectivity’s Wi-Fi + Bluetooth 5 for next-generation industrial IoT

Laird Connectivity’s users across multiple industries have a diverse set of requirements and specific needs. They asked for a truly robust industrial IoT module: one that is rugged, small, simplifies their BOM, is globally certified, has reliable connectivity, and is easy to integrate. Laird Connectivity’s Sterling-LWB5+ answers that call for next-gen wireless IoT. Powered by Infineon’s CYW4373E silicon, the Sterling-LWB5+ is purpose-built for industrial IoT connectivity through a secure, reliable, and robust feature set. It is IoT from the start: fully certified, easy to integrate, and is the fastest route to the market for IoT.

Features

  • Reliable connectivity
    • 802.11ac Wi-Fi with integrated PA and LNA combined with antenna diversity add up to a reliable module for harsh RF conditions
  • Software flexibility and speed to market
    • Open sourced software and Linux backports ensure compatibility with a wide variety of Linux kernels
  • Industrial operating range
    • Designed to the industrial temperature range of -40ºC to +85ºC for every component utilized
  • Global approvals
    • Carries several modular FCC, IC, CE, RCM, Giteki, and Bluetooth SIG approvals (all pending)
  • Personal support from design to manufacture
    • Laird Connectivity’s industry-renowned support is passionate about helping users speed their design to market

more information: https://www.lairdconnect.com

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