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DesignCore Carrier Board for NVIDIA Jetson Xavier NX Module Provides 12 Camera/Sensor Inputs to Enable Complex Edge AI Systems

Posted on 16 April, 202016 April, 2020 by mixos

Features High-Speed SerDes Input, Power-Over-Coax, On-Board FPGA for Hardware-Level Synchronization, On-Board Peripherals, and Expansion Connectors.

D3 Engineering today announced its new DesignCore® Carrier Board, which allows engineers to quickly connect multiple cameras or sensors with the recently launched NVIDIA Jetson Xavier NX module to enable AI at the edge.

“The new DesignCore Carrier Board allows our customers to take advantage of the incredible compute power of the Jetson Xavier NX by connecting up to 12 streams of input data,” said Jason Enslin, Product Line Manager for Embedded Vision at D3 Engineering. “This enables the development of advanced AI robotics and autonomous applications for manufacturing, delivery, retail, agriculture, and more–in a power-efficient and compact form factor.”

Sensor data is delivered via a serial link and is deserialized into MIPI CSI-2 data for consumption on the Jetson Xavier NX module. This allows the sensors to be placed up to 15 meters away from the processing unit. An on-board FPGA provides hardware-level synchronization capability.

For additional specifications and drawings download the DesignCore NVIDIA Jetson Xavier NX 12-Camera Carrier Board Data Sheet.

Customers can purchase the DesignCore Carrier Board for development, or in quantity for ODM production. D3 Engineering provides cameras, radar sensors, and software design examples for use with the carrier board. The company also offers engineering design services to interface other sensors or create new NVIDIA Jetson Xavier NX-based designs to meet customers’ unique requirements.

“With D3 Engineering’s new multi-camera-enabled baseboard and expertise in embedded vision, customers can take advanced products to market more quickly using the Jetson Xavier NX module,” said Murali Gopalakrishna, Head of Product Management, Autonomous Machines at NVIDIA.

D3 Engineering is a Jetson Preferred Partner for camera development within the NVIDIA Preferred Partner Network. This gives D3 Engineering access to the Jetson camera toolchain, enabling the company to deliver high-performance, cost-optimized embedded vision systems based on the Jetson platform.

Availability

The new DesignCore Carrier Board for NVIDIA Jetson Xavier NX is available for pre-order now. Contact sales@d3engineering.com for more information.

Connect Tech Announces Carrier Board and System Level Support for NVIDIA Jetson Xavier NX.

Posted on 16 April, 202016 April, 2020 by mixos

Connect Tech announces new embedded platforms for the NVIDIA Jetson Xavier NX Supercomputer on Module.

Connect Tech, now an NVIDIA Elite Partner, today releases the Quark Carrier and Rudi-NX for the recently announced NVIDIA Jetson Xavier NX module. The Jetson Xavier NX delivers up to 21 TOPS at just 15W, and is capable of running multiple neural networks in parallel and processing data from multiple high-resolution sensors simultaneously.

“Connect Tech continues to the lead the way in providing readily available Jetson platforms and confirms its continued support of the Jetson Community with these latest product releases.” said Michele Kasza, vice president sales and marketing at Connect Tech.

Features:

Smaller than the Dev Kit: 82.6mm x 58.8mm
1x USB 3.1, 2x GbE,
2x 2-lane MIPI CSI-2, 1x USB OTG
1x SD card slot, 3x 3.3V UART, 2 x I2C, 1x CAN 2.0b, and 1x SPI
+5V DC Input

The Quark Carrier is an ultra-small form factor carrier board, just slightly larger than the Xavier NX module measuring 82.6mm x 58.8mm. This carrier has a feature rich I/O set including 1x USB 3.1, 2x GbE, 2x 2-lane MIPI CSI-2, 1x USB OTG, 1x SD card slot, 3x 3.3V UART, 2 x I2C, 1x CAN 2.0b, and 1x SPI as well as positive locking IO connectors optimized for rugged environments. The Quark carrier will also support the NVIDIA Jetson Nano module.

Rudi-NX is a small edge computer powered by the Jetson Xavier NX. At just 135mm x 50mm x 105mm Rudi-NX delivers dual GbE, 4x USB 3.0, 1x USB OTG, SD card, 4x GMSL camera inputs (MIPI CSI-2), storage or video capture expansion via NVMe, wireless expansion, miscellaneous I/O including I2C, TTL, RS-485, SPI, PWM, GPIO, CAN and wide input power range of 9-36V DC.

Visit Quark Product Page

PMP30473 – Lowest noise auxiliary dual output (+5 V and -5 V) power supply reference design

Posted on 16 April, 202016 April, 2020 by mixos

This reference design is a 2 x 1-W inverting buck-boost converter. The two output voltages (+5 V and -5 V) are produced from one single buck silicon (TPS57160). Post regulators (and post-filters) ensure ripple-free output voltages. The input voltage range covers automotive and industrial applications.

Features

Input filter ensures lowest reflected ripple
Power stage withstands surge voltages up to 42 V
Circuit tolerates cranking down to 4 V
Temperature rise is less than 20 K at full load and with nominal automotive input voltage

more information: www.ti.com

DA14531 SmartBond TINY™ Module is the Bluetooth® low energy solution that will power the next 1 billion IoT devices through ease of use

Posted on 15 April, 202015 April, 2020 by mixos

Dialog Semiconductor plc, a leading provider of power management, charging, AC/DC power conversion, BLE, low power Wi-Fi and Industrial ICs, today announced the availability of the DA14531 SmartBond TINY module, empowering customers to build the next generation of connected devices.

The SmartBond TINY module was specifically optimized to significantly reduce the cost of adding Bluetooth low energy functionality to an IoT system. Its easy-to-use design and software allow developers to quickly and intuitively develop highly functional connected devices, targeting the next generation of connected consumer, connected medical, smart home and smart appliance applications. The module incorporates two unique software features designed to eliminate the complexity often associated with traditional Bluetooth low energy development and empowers customers to develop robust IoT products regardless of their software coding capabilities.

The first is the configurable Dialog Serial Port Service (DSPS) software, which emulates a universal asynchronous receiver-transmitter (UART) serial port over BLE, removing the need to write Bluetooth software for “BLE Pipe” applications when connecting the module to a host MCU’s serial port. The second feature, Dialog’s new Codeless software, takes this concept even further by replacing complex code with a simple series of human readable ASCII commands that can be used to generate customer applications. Codeless uses the industry standard Hayes AT-style command set to configure and operate the module.

“The launch of the SmartBond TINY DA14531 SoC in 2019 set a new industry benchmark for BLE SoC pricing, at less than 50 cents. The DA14531 module further leverages the capabilities of the SoC, including an integrated antenna and all required components, to add BLE functionality to an IoT system in high volumes at a cost of under $1. That price point for BLE functionality, performance and quality is unmatched by competitors,” said Sean McGrath, Senior VP, Connectivity and Audio BG, Dialog Semiconductor. “Not only is this module breaking barriers in terms of cost and power, it is extremely easy for both beginners and experts to use, ensuring that all customers can benefit from its high level of integration and programmable ease of use.”

The hand solderable stamp type module offers 9 GPIO’s and measures 12.5 x 14.5mm in size. All external components, including passives, XTAL, antenna and FLASH memory, are integrated into the SmartBond TINY module, so that customers don’t need to source individual components separately.

Features

Bluetooth 5.1 core qualified
Integrated antenna
Worldwide certification
Cortex-M0+ @16MHz
IoTMark™-BLE score of 18300
23.75uA/MHz MCU current
Memory: 48kB RAM, 32kB OTP &1Mb FLASH
1.8-3.3V Supply Range
+2.2dBM max output power
-93dBm sensitivity
Rx current 2mA at 3V
Tx current 4mA at 3V at 0dBm
Interfaces: 2xUART, SPI, I2C
4-channel 10-bit ADC
8 GPIO
Built-in temperature sensor
Operating temperature: -40°C to +85°C
Dimensions: 12.5×14.5×2.8 mm

The SmartBond TINY module is fully certified for worldwide operation, with FCC certification for the Americas and CE certification for Europe, so customers don’t need to certify platforms themselves, further reducing development time, effort and cost. The module is also effectively futureproofed, thanks to a combination of Bluetooth 5.1 compliance and support for over-the-air software updates.

Dialog’s DA14531 SoC and module are sampling now and available via DigiKey. More information on the module, SoC and ordering details can be found here: https://www.dialog-semiconductor.com/products/bluetooth-module-da14531-smartbond-tiny

Implanted retina gives sight to the blind

Posted on 15 April, 202015 April, 2020 by mixos

The first two patients to receive the NR600 retinal implant from Nano Retina Ltd. (Herzliya, Israel) have reported their first results. by Peter Clarke @ eenewsanalog.com

The NR600 attaches to the back of the eye and includes an array of 26 by 26 silicon needles that connect to the photoreceptors. Retinal implant is stimulated by wireless, rechargeable eye glasses that provide the implant with power and send captured scene information to the implant. They also allow the patient to fine-tune different light settings.

The NR600 mimics the physiological processes of the human eye and restores functional vision to persons blinded by retinal degenerative diseases, including age-related macular degeneration and retinitis pigmentosa.

These are the first-in-human retinal implant results for the NR600.

The two patients are part of a European clinical trial for the purpose of obtaining CE approval for the NR600. They were both blinded by retinitis pigmentosa and have had the NR600 implanted by Professor Peter Stalmans, one of Europe’s leading retina specialists with the operations performed at the Department of Ophthalmology of the University Hospital Leuven, Belgium.

The Nano Retina implant is inserted into the eye in a minimally invasive surgical procedure under local anesthetic with no need for hospitalization. The estimated procedure duration is less than 1 hour. After implantation the stimulation parameters are calibrated and optimized to the patient’s individual needs.

Both patients reported visual effects as soon as the devices were switched on.

In the case of the second patient Professor Stalmans said:

“The device was activated for the first time, and the result was amazing: this patient has been completely in the dark for 5 years now, and she immediately reported seeing an image in the center of her visual field when the device was activated, and could show with her hands the size of the image that she saw.”

more information: www.nano-retina.com

ADLINK and Intel create Vizi-AI devkit for Machine Vision AI

Posted on 15 April, 202015 April, 2020 by mixos

ADLINK and Intel have worked together to develop Vizi-AI, a devkit for industrial machine vision AI, which will be distributed exclusively by Arrow.

Vizi-AI™ combines plug and play hardware and software enabling a faster, easier and scalable starting point for machine vision AI deployments at the edge. This can then be scaled for industrial requirements using the same software but deployed on more powerful hardware as needed. Vizi-AI includes a range of pre-built OpenVINO compatible machine learning models that can be used straight out of the box.

The Vizi-AI devkit includes:

Ιntel Atom based SMARC computer module with Intel Movidius Myriad X VPU and 40 pin connector.
Intel Distribution of OpenVINO toolkit, which optimizes deep learning workloads across Intel architecture−including accelerators−and streamlines deployments from the edge to the cloud.
ADLINK Edge software provides enhanced functionality of OpenVINO through the ADLINK Data River which enables data to flow freely and securely.
ADLINK Edge Profile builder which provides a simple, intuitive user experience to manage devices and applications.
ADLINK Edge Model Manager which enables users to add their own models to a pre-loaded selection for easy deployment.

Vizi-AI can easily be connected to different image capture devices. Then machine learning models are deployed and improved to gain insight from vision data. Vizi-AI has a range of pre-built OpenVINO compatible machine learning models that can be used straight out of the box.

More information: https://www.arrow.com/en/products/vizi-ai-lec-al-e3940-ai-4g-32gus/adlink-technology-inc

Community: www.goto50.ai

Elektor Article: Artificial Intelligence for Beginners (Part 1)

Posted on 15 April, 2020 by mixos

This time we have the perfect, hands-on entry to Artificial Intelligence. Using the €30 (!) Maixduino board with its fitted camera, LCD panel and… Arduino IDE (!) we present a flying start into AI with demos including one that can recognize 1000 different objects.

The use of artificial intelligence is on the increase in many areas, and it is finding its way into many types of device and application. This year it is estimated that worldwide business applications in the field of artificial intelligence will generate revenues of some $4.8bn, and that figure is predicted to rise to over $30bn by 2025. Anyone with knowledge of the subject area can look forward to enhanced employment prospects as expertise in artificial intelligence is urgently sought after. It is therefore worthwhile to take a little time to get to grips with the topic and the new worlds of possible applications that it opens up. And last but not least, it’s a lot of fun!

The article is released for direct viewing in your web browser here.

IR domed LEDs deliver up to 5.0A pulsed radiant power over 50°

Posted on 14 April, 202014 April, 2020 by mixos

Lumileds has added news LEDs to its Luxeon IR Domed Line with a significant increase in both DC and pulse drive current–up to 1.5A and 5.0A, respectively.

The new emitters deliver radiant power of 1350mW at 850nm wavelength (slightly visible) or 1450mW at 940nm (invisible or covert IR). These new IR LEDs are engineered to withstand higher power so that clearer 3D imaging is possible using fewer LEDs in critical infrared (IR) applications. Drop-in replacement for existing designs is a snap with the standard 3.7 by 3.7mm footprint. In addition to high drive capability, a new 50° emitter is now a part of the portfolio. Along with the 60°, 90°and 150° emitters, these IR LEDs will serve high punch, long range or wide scanning applications, including face recognition for security and access controls. Lumileds low resistivity package (2.5 W/°C) removes heat more efficiently from the emitter, enabling even more compact camera designs and higher reliability than its competitors.

“Smaller, higher resolution surveillance cameras have smaller lens apertures and smaller pixel size on the image sensors. These systems need more light to function properly. The high drive capable LUXEON IR Domed Line LEDs significantly increases light output for a wide variety of IR applications,” said Alvin Yeoh, Senior Product Marketing Manager at Lumileds. “Drop-in replacement for existing designs is a snap with the standard 3.7 by 3.7mm footprint. Applications such as biometric identification, virtual reality/augmented reality headsets, machine vision and surveillance cameras will benefit immediately from the power boost.”

In addition to high drive capability, a new 50° emitter is now a part of the portfolio. Along with the 60°, 90°and 150° emitters, these IR LEDs will serve high punch, long range or wide scanning applications, including face recognition for security and access controls. Lumileds low resistivity package (2.5 W/°C) removes heat more efficiently from the emitter, enabling even more compact camera designs and higher reliability than its competitors.

For more information on LUXEON IR Domed Line, see www.lumileds.com/products/infrared-emitters/luxeon-ir-domed-line.

Liquid Flow Sensors Offer High-Accuracy, Low-Maintenance Replacement for Mechanical Turbine Devices

Posted on 14 April, 2020 by mixos

Cost-Effective MEMS Sensors Deliver Increased Performance and Reliability, Even in Unstable Pulsatile Flow and Low-Flow Conditions

Posifa Technologies introduced its new PLF2000 series of liquid flow sensors. Designed to replace mechanical turbine flow sensors, the cost-effective devices deliver increased accuracy and reliability, even in unstable pulsatile flow and low-flow conditions. Factory calibrated for water to a minimum 5 % and typical 3 % accuracy for volume calculation, the PLF2000 series’ dual digital I²C and voltage output provides high performance, flexibility, and scalability in a compact package.

The PLF2000 series features Posifa’s third-generation thermal flow die, which uses a pair of thermopiles to detect changes in temperature gradient caused by mass flow. The result is an excellent signal-to-noise ratio and repeatability of 0.5 % F.S. The solid-state thermal isolation structure on the sensor die eliminates the need for a surface cavity or fragile membrane used in competing technologies, allowing it to be placed directly in the liquid flow path with minimal packaging for higher sensitivity. In addition, the sensor die does not obstruct the flow path, allowing for minimal flow resistance and making it possible to circulate liquid via gravity, a boiler, or a low-power pump. With no moving parts, the sensor does not get stuck, suffer mechanical breakdowns, or require disassembly for cleaning and maintenance.

Key Specifications and Benefits:

Dual digital I²C and analog output
Compact, robust package
Solid-state sensing core – no moving parts
Feature Posifa’s third-generation thermal flow die
Measure flow rates up to 0.7 l/min (PLF2105) and 10 l/min (PLF2135)
Extremely fast response times of 5 ms typical
Excellent signal-to-noise ratio and repeatability of 0.5 % F.S.
Operating temperature range of +5 °C to +75 °C
Comply with NSF/ANSI 61: Drinking Water System Components — Health Effects

Target Applications:

Coffee and espresso machines
Water dispensers, purifiers, and filtration systems
Beverage vending machines
Detergent vending machines
Cleaning chemical mixing systems
Liquid cooling systems

Measuring flow rates up to 700 ml/min (PLF2105) and 10 l/min (PLF2135), the devices offer extremely fast response times of 5 ms typical and operate over a +5 °C to +75 °C temperature range. The sensors comply with NSF/ANSI 61: Drinking Water System Components — Health Effects and can be used safely in water and beverage appliances. Posifa has the scalability and production capacity to meet any high-volume application, making the PLF2000 series one of the most cost-effective solutions on the market. Customers may contact the company to discuss options for customizing the sensors’ specifications.

Samples and production quantities of the PLF2000 series liquid flow sensors are available now.

… more: posifatech.com

New Yorker Electronics unveils new Cornell Dubilier Ultra-Thin 1mm Polymer Aluminum Electrolytic Capacitor Series

Posted on 14 April, 2020 by mixos

New Yorker Electronics has announced the release of a new ultra-thin polymer electrolytic capacitor that represents a totally new capacitor form factor. The Cornell Dubilier Electronics’ new PPC Series, designed specifically for applications requiring high ripple current and the thinnest profile possibilities, opens up entirely new product design options. In addition to being just 1 mm thin, the PPC uses versatile packaging technology that makes it possible for capacitors to be formed into custom shapes and sizes to accommodate available space.

Rated for 125°C, PPC combines the advantages of aluminum electrolytic and aluminum polymer technology. These capacitors have the ultralow ESR characteristics of conductive aluminum polymer capacitors in a 1mm thin package. With high capacitance and high ripple current per volume, applications for 125°C polymer capacitors include DC/DC converters, tablets, telecommunications, thin displays, and variety of industrial power conversion.

A single PPC capacitor can handle ripple currents equivalent to dozens of SMT capacitors or a bulky cylindrical device. In fact, CDE has stated that a single PPC capacitor is equivalent to a parallel bank of 50 or more polymer tantalum capacitors – at one fourth the height. Using a single unit means PPC capacitor solutions are lighter in weight and can improve overall circuit reliability.

Features & Benefits:

Only 1mm thin
Temperature: -55ºC to +125ºC
Capacitance: 8,000µF to 20,000µF
Voltage: 6.3Vdc to 24Vdc
2,000 Hrs @ Rated Temperature, Voltage and Ripple Current
Custom Values, Sizes and Shapes
Low Leakage Current
Very Low ESR
High Ripple Current
54 Arms @ 20kHz
10g Pk Vibration
Altitude: 10,000 Ft.

Applications:

Compact DC/DC Converters
Thin Displays
Compact Industrial Power Conversion Equipment
Welding

Data Sheets:

Type PPC Series

Custom values are available within a capacitance range of 8,000µF to 20,000µF, with working voltages ranging from 6.3 to 24 WVDC. Cornell Dubilier plans to extend the series to higher operating voltages later in the year. Operating life is 2,000 hours @ 125°C.

The PPC is rated for 10 g peak for vibration and withstands shocks up to 100 g’s (MIL-STD-202, Method 213, Condition I). With flat tin-plated copper terminations, it is possible to mount the device off-board or directly to a PCB. Mounting is by means of 3M double-sided VHB tapeTM, to ensure that the entire capacitor surface is kept rigid.