Bürklin stocking new hand-held enclosures from Hammond Electronics

Bürklin Electronics, a distributor specialized in high quality electronic components, announced the availability of the new 1552 family of hand-held enclosures from Hammond Electronics. Initially available in six sizes, the IP54 rated UL94-V0 flame-retardant ABS enclosure features an ergonomic design that fits comfortably into the hand, enabling it to be used for long period in applications such as a machine controller or an electric hoist control.

The end panels are removable for easy modification, and for use with flying cables, an alternative end panel with an integral rubberised cord protector and a strain relief bracket is available. An optional wall mounted holder allows the unit to be stored in a convenient location when not in use. The 1552 can also be used as a desktop enclosure. All the launch sizes are 50mm wide and either 22 or 30mm high, with both heights available in lengths of 70, 110 and 150mm. All sizes are available as standard in black and grey with a satin texture.

A recess for a membrane keyboard or a display is moulded in the top face and PCB standoffs are moulded in the base section. The top is secured to the base with four self-tapping colour-coded screws; snap closures are fitted to the centre of the longer units to prevent bowing.

The new 1552 family of hand-held enclosures by Hammond Electronics are available directly from Bürklin by visiting www.bürklin.com. As part of its wide product portfolio Bürklin is also stocking the 1557 series from Hammond Electronics. Bürklin is offering more than 1.8 million products from over 500 reputable and established OEMs; more than 75,000 of these products are permanently stocked at the company’s warehouse and headquarters in Oberhaching near Munich, Germany.

BMR481 48 V-to-Load Direct Conversion DC/DC Converters

Flex Power Modules’ converters are first generation direct conversion products

Flex Power Modules’ BMR481 DC/DC converter addresses the growing need for higher energy efficiency levels in datacenters and cloud computing infrastructures. This converter offers an input range of 40 V to 60 V targeting 48 V to 54 V nominal supplies and a programmable 0.5 V to 1.35 V output. The 12 mm x 27.7 mm footprint of the main module provides a maximum output current of 70 A and incorporates a digital interface for monitoring, configuration, and control purposes. This main unit can then be supported by up to five additional ‘satellite’ modules resulting in a total current rating that reaches 420 A.

The single-stage BMR481 provides an ideal alternative to the conventional two-stage intermediate bus converter (IBC) and point-of-load (POL) architecture which requires an extra conversion step, taking up more space and impacts operational performance. This groundbreaking direct conversion module presents engineers with a more streamlined and economical solution. The converter can achieve up to 92% efficiency from a 1 V output at 53 VIN which is 2% to 3% higher than what the equivalent IBC-based deployment can deliver. The BMR481 reduces board area by up to 50%. MTBF is more than 8.7 Mhrs for the main module.

Optimized efficiency is achieved by automatic enabling and disabling of phases/satellite modules depending on the required load, along with dynamic voltage adjustment to provide optimum supply rails to the connected ICs. Output ripple and noise is an extremely low 1 mVp-p (typical) due to the zero voltage/zero current switching employed. Load and line regulation are typically kept at 1 mV. At 53 V input and 0.5 V output, the full 70 A output current is available from the main module to over +75°C ambient temperature with 0.5 m/s airflow and over +90°C with 2 m/s airflow. Full digital control is implemented with a PMBus v1.3 interface compliant with PMBus or AVS/SVID. Isolation is rated at 1,500 VDC (functional).

Features

  • 48 V-to-load direct conversion technology addresses demands of data centers
  • Enables more compact, higher-efficiency, and cost-effective power system implementations
  • Compliant with PMBus, AVSBus, and Intel SVID
  • Supporting tools: Flex Power Designer Tool

Applications

  • High-power data centers that operate from a nominal input of 48 V
  • High-current CPUs and GPUs

Contact for company information: Tuuli Waern, Technical Marketing Manager, Flex Power Modules Email: tuuli.waern@flex.com

Scientists Develop Safer Lead-Based Perovskite Solar Cell Structure

Researchers at Northern Illinois University and the U.S. Department of Energy’s (DOE) National Renewable Energy Laboratory (NREL) in Golden, Colorado, reported in the journal Nature on a potential breakthrough in the development of hybrid perovskite solar cells.

Considered rising stars in the field of solar energy, perovskite solar cells convert light into electricity. They’re potentially cheaper and simpler to produce than traditional silicon-based solar cells and, on a small scale in laboratory settings at least, have demonstrated comparable efficiency levels. But key challenges remain before they can become a competitive commercial technology.

One major challenge is the use of lead. Most top-performing hybrid perovskite solar cells contain water-dissolvable lead, raising concerns over potential leakage from damaged cells.

Led by Tao Xu of NIU and Kai Zhu of NREL, a team of scientists has developed a technique to sequester the lead used to make perovskite solar cells and minimize potential toxic leakage by applying lead-absorbing films to the front and back of the solar cell.

“The lead toxicity issue has been one of the most vexing, last-mile challenges in the perovskite solar cell field,” said Xu, an NIU professor of chemistry. “We think we have a highly promising remedy to this problem—and it could be a game-changer.

“In the event of a damaged cell, our device captures the great majority of the lead, preventing it from leaching into groundwater and soils. The films that we use are insoluble in water.”

Under conditions of severe solar cell damage in a lab setting, the lead-absorbing films sequestered 96% of lead leakage, the scientists said. Their experiments further indicate the lead-absorbing layers do not negatively impact cell performance or long-term operation stability.

Perovskite solar cells are so named because they use a class of crystal structures similar to that found in the mineral known as perovskite. The perovskite-structured compound within these solar cells is most commonly a hybrid organic-inorganic lead halide-based material.

Scientists began to study these crystal structures for use in solar cells only about a decade ago and have rapidly increased their solar energy conversion efficiency. Whereas traditional silicon solar cells are produced with precise processes using high temperatures, perovskites can be made using room-temperature chemical solutions.

The newly developed “on-device sequestration approach” can be readily incorporated with current perovskite solar cells configurations, Xu said.

A transparent lead-absorbing film is applied to a conducting glass on the front of the solar cell. The sequestration film contains strong lead-binding phosphonic acid groups but does not hinder cell capture of light. A less expensive polymer film blended with lead-chelating agents is used on the back metal electrode, which has no need for transparency.

“The materials are off-the-shelf, but they were never used for this purpose,” Xu said. “Light must enter the cell to be absorbed by the perovskite layer, and the front-side film actually acts as an anti-reflection agent, improving transparency just a bit.”

Tests for lead leakage included hammering and shattering the front-side glass of 2.5-x-2.5 cm cells, and scratching the backside of the solar cells with a razor blade, before submerging them into water. The films can absorb the vast majority of the lead in severely damaged cells due to water ingress.

“It is worth noting that the demonstrated lead-sequestration approach is also applicable to other perovskite-based technologies such as solid-state lighting, display and sensor applications,” said Zhu, a senior scientist at NREL.

The scientists have applied for a patent for their lead-absorbing films. Other authors on the research study include NIU graduate student Xun Li; Haiying He of Valparaiso University; and Fei Zhang and Joseph Berry of the NREL.

The research was supported by the National Science Foundation and the DOE Solar Energy Technologies Office. The Solar Energy Technologies Office also is providing funding assistance for further development of the lead-sequestration films for hybrid perovskite solar cells.

On The Web: Northern Illinois University , National Renewable Energy Laboratory

Xsens MTi-7 GNSS/INS Module

Xsens MTi-7 Global Navigation Satellite System (GNSS)/Inertial Navigation System (INS) module is a miniature motion tracking module with multiple GNSS receiver support. This module uses advanced sensor fusion algorithms. The MTi-7 GNSS/INS module features a miniature SMD form factor (12.1mm x 12.1mm) and consumes low power. This module is ideal for upcoming technologies including drones, Unmanned Aerial Vehicles (UAVs), smart farming, unmanned control, Internet of (Moving) Things, and robotics.

Features

  • Industry standard Arduino compatible development kit
  • High-performance orientation, velocity, and positioning using advanced sensor fusion algorithms
  • Best-in-class hardware and firmware using same form facto
  • Uniform software/hardware interface over product lifetime (no end of life)

Video

Specifications

  • 2.19V to 3.6V input voltage
  • Footprint compatible SMD package
  • 12.1mm x 12.1mm x 2.55mm
  • 0Hz to 800Hz output data rate
  • ±2000º/s gyroscope full-scale range
  • ±16g accelerometer full-scale range

more information: www.xsens.com

PCBWay.com Manufacturer Review

Printed circuit boards are an important part of electronic products and the ability to get them fabricated in time and at good quality and price, is key to ensuring the product stays on schedule with the time to market plans. The process of getting them done on time, and at the right quality, however, requires a PCB manufacturer with the tools, experience, and support required to deliver as specified. This requirement and the possible impact of failure makes the process of selecting a PCB manufacturing partner a very important and difficult task as there are tonnes of PCB manufacturing companies (including resellers posing as manufacturers) out there and the process of verifying them, can be tedious. To help with this, we review PCB manufacturers from time to time, and today, we will review one of the most formidable names in the PCB manufacturing Industry: PCBWay. We will cover their process, capacity, offerings/packages and every other thing we feel you may need to make decisions about their services.


Located at the heart of the World’s manufacturing capital; Shenzhen, PCBWay has been delivering high-quality complex PCBs using state of the art machines and equipment since its establishment over a decade ago. They have served as a reliable PCB Manufacturing partner for several small or large run projects across diverse sectors, from IoT and Smart devices to medical, Industrial and Open source/DIY communities.

Running one of the most equipped factories in the world, PCBWay makes different types of PCBs ranging from the regular FR4 PCBs to flexible PCBs, SMD stencils, and more advanced, high precision PCBs. They have the capacity to make up to 14 layers PCB (depending on the type of PCB) with different materials from FR4 to Aluminum. More information on their PCB capabilities and equipment specifications can be found on their service description page.

Being a domain leader who understands electronics manufacturing and the headaches involved, PCBWay also runs an In-house PCB Assembly service (PCBA), which ensures the project can be completed under one roof with fewer worries. The PCBA service specializes in prototyping and small-volume production, making them the ideal partner for the R&D stage of product development. The PCBA service also helps eliminate supply chain worries as PCBWay maintains a relationship with suppliers across the world, through which they get access to all types of components including the “hard-to-find” components. More information on the PCB Assembly service is available here.

For placing orders, PCBWay uses a transparent, process-oriented, and easy to follow online ordering platform that is structured in such a way that the customer can track the stage of their PCB manufacturing at every point in time. The process starts with a seamless and fast, Instant quote generator through which users can select the type of PCB they want to make, and upload PCB files, in either Gerber, .pcb, .pcbdoc or .cam formats. Once you submit your files they become available in the “Under Review” tab where a human checks the files and provides a quote.

PCBway – Files submitted for Review

The files are reviewed in a timely manner by PCBWay technicians and an instant quote is generated. PCBWay is quite competitive with pricing and probably offers more value for money compared with most other players in the PCB and PCBA industry. After the quotation is done and payment is received, the design moves to “Production Status” and then the fabricating process is started. When fabrication is done the order is shipped to the customer without any further delay.

PCBway – Files approved and being manufactured

One of the best things about PCBWay, which is particularly beneficial to projects in the R&D stage, is their ability to maintain the shortest possible lead-time. In certain cases depending on location and shipping bottlenecks, customers can receive their boards just 24 hours after ordering.

PCBway – Productions steps

PCB Test Order

To verify their manufacturing capabilities and quality, we send out our own Gerber files of one of our projects. The board submitted was a 2-layer one, measuring 54 x 28mm. For 10x PCBs and 2x solder stencils (top and bottom) the quote was 25 USD + 28 USD DHL Worldwide shipping. So the total amount we paid was $53. Production time was stated at 22-23 days (this is due to the Coronavirus issue, as the factory was working with limited personnel) for the PCB and 1-2 days for the stencils. The actual production of PCBs was less and took ~6 days from start to finish.

PCBway – the PCB submitted for test production

Unboxing Video

The estimated delivery time for this order was 3-5 days and this was close to real waiting time. The PCB arrived and looked like the following photos.

PCBway PCBs arrived
Closeup of bottom layer
Closeup of top layer
Top and Bottom SMT stencils
Closeup of SMT stencil

We can see from the photos above that the quality is good and we can understand this from the fine pitch components. Silkscreen seems almost sharp and surface finish is what we could expect from HASL. The same applies to stencil quality. The openings are sharp and could work as it should be.

Conclusion

In conclusion, from personal interactions with PCBWay, one consistent factor in all services they offer is a deep thoughtfulness and consideration for the customer. The customer support staffs who are assigned to your projects take the project seriously and work to ensure your deadlines and the quality of the PCB you require are met. This is a trait every designer, engineer or innovator should look out for when choosing a PCB Manufacturer for any project. In terms of quality, the outcome was satisfactory and it meets the demands of most users, professionals, and makers. Delivery and production time was reasonable and one point we can comment on is the price tag. It’s may not be the cheapest manufacturer out there but it will for sure meet your expectations without any surprises.

Renata presents: The thinnest battery in the world?

Mobile devices are continuing to get even flatter in the connected world of today and of tomorrow.

Wearables have become an indispensable part of everyday life and their steady growth is far from getting to an end. Small but powerful: reliable and high-quality batteries that keep pace with the continuous miniaturization are indispensable nowadays. Renata is meeting the growing demands by introducing the right source of energy with the newly developed lithium thin-film battery CP042350.

The ultra-thin 3V battery is ideal for the use in flatter electronic devices since the thickness of 0.42mm is much less than those of conventional primary lithium batteries. The CP042350 is flexible and has successfully passed a 1000 times bending test with a bending radius of 25mm. With a capacity of 28mAh and an average weight of 0.86g, this next-generation battery can be used in a wide range of industrial, medical and consumer devices.

more information: www.renatabatteries.us

Melexis introduces high-linearity, low-drift Linear Hall sensor for safety-critical automotive torque-sensing applications

ASIL-ready MLX91377 for steering-torque and general automotive sensing.

Melexis announces the MLX91377 ASIL-ready Hall sensor IC suitable for use in safety-critical automotive systems such as electric power-assisted steering (EPAS).

With an ambient operating temperature up to 160°C and combining high linearity with excellent thermal stability, including low offset and sensitivity drift, the MLX91377 supports accurate, dependable torque sensing in EPAS systems to enable safe control in conventional and autonomous driving.

Developed as a Safety Element Out of Context (SEooC), the MLX91377 complies with the ISO 26262 standard and is qualified to AEC Q-100 Grade 0. Supporting functional safety level ASIL-C in digital (SENT or SPC) mode and ASIL-B in analog mode, the MLX91377 offers a high level of functional safety, per die, and can detect internal failures and enter a safe state to prevent unintended vehicle behavior. The available dual die TSSOP-16 package further expands this by offering two fully redundant dies to enable support for safety critical applications like steering and braking systems.

In addition to functional-safety applications, the MLX91377 satisfies a wide variety of automotive and industrial contactless position-sensing use cases including steering torque sensors, acceleration, brake, or clutch pedal sensors, absolute linear position sensors, float-level sensors, non-contacting potentiometers, small-angle position sensors and small stroke position sensors.

The programmable measurement range and multi-point calibration enhance flexibility for designers, and the variety of output protocols enables one IC to be used in multiple applications reducing requalification efforts and costs. The Short PWM Code (SPC) protocol permits measurements to be taken and transmitted upon detection of a trigger pulse. Thus up to four MLX91377 sensors can be synchronized up to 2 kHz, enabling simultaneous magnetic measurements with deterministic latency to ensure high accuracy. In addition, the low-noise and high refresh rate allow high control-loop speeds enabling systems to deliver fast response times with minimal filtering.

The MLX91377, with its 48-bit programmable identification number, is available in a dual-die fully-redundant TSSOP-16 package.

more information: www.melexis.com

STMicroelectronics STM32H7A3/7B3 lines of microcontrollers include an Arm® Cortex®-M7 core

The STM32H7A3/7B3 lines of microcontrollers include an Arm® Cortex®-M7 core (with double-precision floating point unit) running up to 280 MHz.

The STM32H7A3/7B3 MCU lines provides 1 to 2 Mbytes Flash memory, 1.4 Mbytes of SRAM with the following architecture: 192 Kbytes of TCM RAM (including 64 Kbytes of ITCM RAM and 128 Kbytes of DTCM RAM for time-critical routines and data), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in backup domain to keep data in the lowest power modes and 64- to 225-pin packages in BGA and LQFP profiles.

Performance

  • 280 MHz fCPU/, 1414 CoreMark /599 DMIPS executing from Flash memory, with 0-wait states thanks to its L1 cache.
  • L1 cache (16 Kbytes of I-cache +16 Kbytes of D-cache) boosting execution performance from external memories.

Security

STM32H7B3 MCUs include the following additional security features:

  • Crypto/hash hardware acceleration
  • On-the-fly decryption on Octo-SPI external serial flash memory
  • Secure Firmware Install (SFI) embedded security services to authenticate and protect your software IPs while performing initial programming.
  • Secure Boot Secure Firmware Update (SBSFU)

Power efficiency

  • Dual-power domain architecture enables each power domain to be set in low-power mode to optimize power efficiency
  • Embedded SMPS to scale down the supply voltage. It can also be used to supply external circuitry and can also be combined with the LDO for specific use cases
  • 120 µA/MHz typical @ VDD = 3.3 V and 25 °C in Run mode (peripherals off) and SMPS
  • 32 µA typical in STOP mode (low-power mode)
  • 2.2 µA typical in Standby mode (low-power mode)
  • 0.74 µA typical in VBAT mode with RTC (low-power mode)

Graphics

  • LCD-TFT controller interface with dual-layer support
  • Chrom‑ART Accelerator™ boosts graphical content creation while saving core processing power, thus freeing up the MCU for other application needs
  • Chrom-GRC™ optimizes RAM use
  • JPEG hardware accelerator for fast JPEG encoding and decoding, off-loading the CPU

Embedded peripherals

  • Up to 35 communication interfaces including FD-CAN, USB 2.0 high-speed/full-speed, camera interface, Parallel synchronous data input/output slave interface (PSSI)
  • Easily extendable memory range using the flexible memory controller with a 32-bit parallel interface, or the dual Octo-SPI serial Flash memory interface
  • Analog:  Dual 16-bit ADCs
  • Multiple 16- and 32-bit timers running at up to 280 MHz

more information: www.st.com

BlueNRG-M2 – Very low power application processor module for Bluetooth® low energy v5.0

BlueNRG-M2 – Very low power application processor module for Bluetooth® low energy v5.0

The BlueNRG-M2 is a Bluetooth® low energy system-on-chip application processor certified module, compliant with BT specifications v5.0 and BQE qualified. The BlueNRG-M2 module supports multiple roles simultaneously and can act at the same time as Bluetooth master and slave device. The BlueNRG-M2 is based on the BlueNRG-2 system-on-chip and entire Bluetooth low energy stack and protocols are embedded into module. The BlueNRG-M2 module provides a complete RF platform in a tiny form factor. Radio, embedded antenna and high frequency oscillators are integrated to offer a certified solution to optimize the time-to-market of the final applications. The BlueNRG-M2 can be powered directly with a pair of AAA batteries or any power source from 1.7 to 3.6 V.

Key features

  • Bluetooth v5.0 compliant
    • Supports master and slave modes
    • Multiple roles supported simultaneously
    • LE data packet length extension
  • Embedded ST BlueNRG-2 BLE SoC
    • High performance, ultra-low power Cortex-M0 32-bit based core
    • Programmable embedded 256 kB Flash
    • 24 kB embedded RAM with data retention
    • Up to +8 dBm available output power
    • Down to -88 dBm Rx sensitivity
    • Up to 96 dB link budget with excellent link reliability
  • Embedded BALF-NRG-02D3 integrated matched balun with harmonic filter
  • Interfaces
    • 1 x UART, 1 x I2C, 1xSPI, 14 x GPIO, 2 x multifunction timer, 10-bit ADC, watchdog and RTC, DMA controller, PDM stream processor, SWD debug interface
  • On-board chip antenna (BLUENRG-M2SA) or PCB antenna (BLUENRG-M2SP)
  • Small form factor: 11.5 mm x13.5 mm
  • Complemented with Bluetooth low energy protocol stack library (GAP, GATT,SM, L2CAP, LL)
  • AES security co-processor
  • Bluetooth low energy SDK with a wide range of available profiles
  • Certification
    • CE qualified
    • FCC, IC modular approval certified
    • TYPE qualified
    • BQE qualified
  • Pre-programmed UART bootloader
  • Operating supply voltage: from 1.7 to 3.6 V
  • Operating temperature range: -40 °C to 85 °C

more information: www.st.com

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