Banana Pi Unveils New SBC with RK3588 and Dual 2.5GbE Ethernet

Banana Pi a well-known manufacturer of SBCs recently announced their new embedded product the Banana Pi BPI-M7. This compact device is powered by the Rockchip RK3588 CPU, which features an Arm Mali-G610 GPU and a 6TOPS Neural Processor Unit.

The Rockchip RK3588 is a High-performance CPU with a total of eight cores: four Cortex-A76 cores (up to 2.4 GHz) for demanding tasks and four Cortex-A55 cores (up to 1.8 GHz) for energy efficiency. It also features an Arm Mali-G610 MP4 GPU and a 6TOPS NPU.

This chip excels in multimedia processing, handling various video formats like H.265, H.264, VP9, AV1, and AVS2. It can decode videos up to 8K@60 FPS and encode 8K@ 30 FPS in H.264 and H.265 formats. This board also features various display options, including HDMI 2.1 for 8K output at 60FPS, a USB-C DP port supporting 8K at 30FPS, and MIPI DSI for 4K at 60fps, offering users a range of high-quality video output choices.

The Banana Pi board comes in three RAM options: 8GB, 16GB, and 32GB, and offers up to 128GB of eMMC storage for data. According to the RK3588 datasheet, its Neural Processing Unit (NPU) supports deep learning frameworks like TensorFlow and PyTorch, further enhancing its capabilities in advanced AI tasks.

The development board also features an AP6275S module, providing Wi-Fi 6 and Bluetooth 5.2 for wireless connections. Additionally, it includes a PCIe slot on its underside, supporting NVMe SSD storage options.

The product announcement indicates that the Banana Pi BPI-M7 board will support Debian Buster, Android 12, and Linux Kernel 5.10.

Specifications listed for Banana Pi BPI-M7 include:

  • Memory & Storage: Includes up to 32GB LPDDR4X RAM, 128GB eMMC, and a microSD card slot.
  • Network: Features two 2.5GbE ports and a Wi-Fi/Bluetooth module (AP6275S).
  • Display Outputs: Comes with HDMI 2.1, USB-C with DisplayPort, and MIPI DSI.
  • Expansion Options: Provides an M.2 KEY M interface.
  • Camera Support: Equipped with two MIPI CSI interfaces.
  • General I/O: Offers a 40-pin GPIO header.
  • Additional Elements: Contains RTC battery, power/reset/MaskROM buttons, and a fan connector.
  • USB Ports: Includes two USB 3.0 and two USB Type-C ports.
  • Dimensions: Measures 92 x 62mm, adhering to the Pico ITX form factor.

The pricing and availability of the Banana Pi BPI-M7 board have not been announced yet by Banana Pi. You can visit the official Banana Pi website for further details.

Arduino’s Portenta HAT Carrier Now Supports Driving Raspberry Pi Modules

Arduino’s new Portenta HAT Carrier is designed to connect the Portenta X8 board to Raspberry Pi HAT add-ons, expanding its capabilities.

Launched last year, the board is equipped with an NXP i.MX 8M Mini Arm Cortex-A53 quad-core processor runs a Linux distribution compliant with Arm SystemReady IR standards, using Yocto. It also features an STM32H7 microcontroller for seamless Arduino programming and integration with Arduino Cloud. To enhance its utility in prototyping and designing products like IoT gateways, the company has introduced the Portenta HAT Carrier. This addition lets you connect most Raspberry Pi hats to the Arduino ecosystem.

Portenta Hat Carrier specifications:

  • Compatible with Portenta X8 and future models.
  • MicroSD slot for storage.
  • MIPI CSI camera connector; Raspberry Pi camera compatibility not confirmed.
  • Gigabit Ethernet RJ45 and USB Type-A ports.
  • Expansion headers: 40-pin (Raspberry Pi HAT compatible) and 16-pin (various I/O pins).
  • JTAG connector for debugging.
  • CAN FD, PWM fan connector.
  • Power options: 5V via USB-C or 40-pin header, 7-32V DC input.
  • Size: 85 x 56 mm.
  • Temperature range: -40°C to +85°C.

The Arduino Portenta HAT Carrier board costs $45, and adding the Portenta X8 increases the price to $284. More details are available on the product’s page.

EasyEnclosure: Advanced 3D Modeling Software Specializing in Enclosure Design

3D printing is everywhere, from complex prototypes to simple DIY projects. To meet your design and prototyping needs, you need good 3D design software and the skills to use it. However, the challenge is that even with a design idea, you might struggle to create it due to the difficulty of using the design software. This is where EasyEnclosure becomes useful.

EasyEnclosure is an open-source 3D modeling software tailored specifically for designing 3D-printable enclosures. It aims to provide an intuitive interface and a set of user-friendly controls that allow even those with little or no 3D modeling experience to create custom enclosures for their electronic projects, prototypes, or DIY gadgets

EasyEnclosure offers an array of customization options, including basic square enclosures, configurable dimensions, wall thickness, rounded corners, and much more. It even includes options for waterproof seals and PCB mounts, ensuring a comprehensive solution for various project needs.

Built on a robust technology stack including TypeScript, React, and JSCAD, EasyEnclosure combines performance with reliability. The tool is hosted on GitHub. Its ability to export designs in STL format makes it compatible with a broad range of 3D printers.

As an open-source project, EasyEnclosure encourages community participation. Users can support the project through donations or by contributing to its development via pull requests. The team also welcomes users to test prints with different settings and report any issues, aiding in the software’s continuous improvement.

The roadmap for EasyEnclosure includes exciting upcoming features such as predefined templates for common devices like Raspberry Pi and Arduino, DIN rail mounts, and the ability to export each entity separately. The extended list of upcoming features can be found on the EasyEnclosure GitHub repository.

Key Features of EasyEnclosed Includes:

  • User-Friendly Interface: It provides an intuitive platform suitable for users with varying levels of 3D modeling skills.
  • Real-Time 3D Preview: This feature enables users to visualize their designs in real-time, enhancing the design process.
  • Export to STL Format: Designs can be exported in STL format, making them compatible with a wide range of 3D printers.

In essence, EasyEnclosure is a cutting-edge tool that simplifies the process of designing custom 3D-printed enclosures, making them accessible and efficient for a broad audience.

Sipeed Launches Tang Primer 25K: A Compact FPGA Module with Dock Carrier Board

Sipeed’s new Tang Primer 25K FPGA, utilizing the Gowin Semi GW5A-LV25MG121, offers 23,040 LUTs, ample SRAM, multipliers, PLLs, and 64Mb NOR flash memory. Available at $19 for just the module, $29 with a carrier board, and an additional $10 for an optional SDRAM module, it’s suitable for USB applications and retro gaming.

The Sipeed Tang Primer 25K features the GW5A-LV25MG121 FPGA, equipped with 23,040 LUT4s and the same number of flip-flops for advanced digital operations. It includes 180K bits of S-SRAM and 1008K bits of B-SRAM, complemented by 56 B-SRAM blocks. Additionally, it offers 28 18×18 multipliers, 6 Phase-Locked Loops (PLLs), and 8 I/O banks for enhanced functionality. The board also integrates a 64Mbit SPI Flash chip and a DC-DC power supply, making it a highly capable tool for FPGA development.

The Sipeed page on AliExpress offered a detailed pinout diagram, which is extremely useful for anyone working with the FPGA board.

Sipeed also provides us with a list of supported modules that work with their system, including a camera, SDRAM, display, joystick, HUB75E, a 64×64 LED matrix, and others.

On their Aliexpress store, Sipeed mentions that it can be used for retro gaming, operating a DVP camera, and additionally, driving an LED matrix.

On Sipeed’s GitHub, you can find various sample projects for this item, and it’s important to use the Gowin IDE version 1.9.9 with it. For more in-depth info, the Tang Primer 25K Wiki pages are a good resource.

The Key Features of Sipeed Tang Primer 25K:

  • Memory/Storage: 60Mbit QSPI Flash
  • I/O Interfaces: 3 PMODs, a 40-pin header, and 3 buttons
  • USB Ports: One USB Type-C (BL616) and one USB-A
  • Additional Features: 3 LEDs, a JTAG debugger, and a 50MHz crystal oscillator
  • Power Supply: 5V DC
  • Size: The core module measures 23 x 17.8mm; the Dock is 64 x 40mm.

You can purchase Sipeed’s board from their AliExpress store, priced at $19 for just the module and $29 if bundled with the carrier board. An optional SDRAM module costs an extra $10. For further details, visit the Sipeed Wiki.

Radxa’s Latest Zero 3W & 3E Boards Boast Enhanced AI Features

After the success of the Raspberry Pi Zero 2W and Orange Pi Zero 2W, the Radxa Zero 3W & 3E stand out as powerful alternatives with a Rockchip RK3566 processor, up to 8GB RAM, and a 64GB eMMC storage option. Starting at just $15, they can be deemed as the most powerful Arm Linux SBCs in Raspberry Pi Zero 2W form factor.

The CPU, a Rockchip RK3566, clocks at 1.6GHz, and is paired with an Arm Mali G52-2EE graphics processor. This combination supports 4K@60FPS decoding and 1080P encoding. The board also includes an NPU with 0.8 TOPS processing power.

The board is equipped with LPDDR4 memory and offers configurations from 1 GB to 8 GB. Storage options include built-in eMMC 5.1 flash, ranging from 8GB to 64GB, alongside a microSD slot for additional storage.

For connectivity, Radxa Zero boards include a micro-HDMI port, a MIPI camera connector, and two USB Type-C ports—one for power and USB 2.0 OTG, and the other for USB 3.0. They also feature Bluetooth 5.0, Wi-Fi 4, and an option for a wired Ethernet connection with PoE support on the 3E model.

When it comes to software and support the Radxa offers Debian and Ubuntu OS images, along with a Linux library for hardware access and control. All the documentation and get started guide are available on their website. You need a 5V/2A power supply and a microSD card to get started. If you are doing a non-headless setup, you will need a micro HDMI to HDMI cable along with a display device and a USB keyboard and mouse (via a USB Type-C dock or hub). Optionally, you might also need a USB to serial debug board a MIPI CSI for debugging, and a camera interface.

Radxa Zero 3W & 3E Board Specifications

  • SoC: Rockchip RK3566
  • CPU: Quad-core Arm Cortex-A55 @ 1.6 GHz
  • GPU: Arm Mali G52-2EE, supports OpenGL ES, Vulkan, OpenCL
  • NPU: 0.8 TOPS AI accelerator
  • VPU: Supports 4Kp60 and 1080p100f video decoding/encoding
  • Memory: 1GB, 2GB, 4GB, 8GB LPDDR4 options
  • Storage: Optional 8GB, 16GB, 32GB, 64GB eMMC 5.1; MicroSD slot
  • Video Output: Micro HDMI port up to 1080p60
  • Camera Interface: MIPI CSI for Raspberry Pi Camera V1.3 and V2
  • Wireless: WiFi 4, Bluetooth 5.0; possible WiFi 6 update
  • USB Ports: 1 USB 3.0 Type-C (host), 1 USB 2.0 Type-C (OTG)
  • Expansion: 40-pin GPIO header
  • Other Features: MaskROM button
  • Power Supply: 5V/1A via USB-C OTG port
  • Dimensions: 65 x 30mm

Later we found out that the Radxa Zero 3E is still in development and yet to be finalized. But it’s drawing attention because of its good price and performance. Many forums suggest that the Zero 2, was never released due to MIPI CSI driver issues, and many other software compatibility issues. Some say the board was primarily built to run Android but it’s now benign developed to run Linux. It’s speculated that the CPU was underclocked from 1.8 GHz to 1.6 GHz, possibly due to cooling challenges on the small PCB.

At the time of writing this article, we don’t have much information about the board, but at $15 for the basic model with 1GB of RAM, it’s a really good deal and could be a strong competitor for similar products. When we checked the base variant of the Radxa Zero 3W is listed on AllNet China starting at $15 and the price goes up to $66 with the 8GB RAM variant.

Eiger Design Releases EPickNPlace, a Free Software for PCB Assembly

Eiger Design has recently introduced EPickNPlace, an open-source software designed to improve manual pick and place operations in PCB assembly. Compatible with Windows 10 and 11, it’s freely available under the GNU General Public License.

This open-source software tool was originally designed for internal use to enhance manual pick and place operations. But Eiger Design open-sourced it, and now it is freely available in the general marketplace. Based on SMTAssistant by ALCIOM, EPickNPlace assists in locating parts on a printed circuit board using a bitmap image of the PCB and a Pick&Place file.

The company said this software is an advanced version of the original SmtAssistant, and it has been designed to ease the prototypes and customized cards for Eiger’s J-Testr NextGen systems. However, you can also do PCB inspection and board repair work.

This newly designed software can comfortably run on Windows 10 and 11 and is developed using Visual Studio 2022 C#; EPickNPlace is licensed under the GNU General Public License, ensuring free use for both commercial and non-commercial purposes. Though Eiger Design offers no official support for this free software, they welcome user feedback and improvement suggestions.

Key improvements include a new project mode for saving configurations and images. It also features an advanced menu system with multiple preferences that help to improve the calibration process. The software also features graphical markers and various new improved viewing options for tracking placed, skipped, and calibration points.

Despite these advancements, EPickNPlace currently lacks some features available in SMTAssistant, such as Board Qty and Pick List Generator, which Eiger plans to implement in the future.

Key Features and Improvements:

  • Project Mode: Allows users to save their configurations and images, enhancing workflow efficiency.
  • Enhanced User Interface: A menu with multiple preferences, including added fields for part number and description.
  • Simplified File Format: A simpler CSV file format is used for easier data management.
  • Improved Calibration Process: Includes features like dropdown component IDs, markers, and micro nudging for precision.
  • Graphical Markers: Visual indicators for placed, skipped, and calibration points.
  • Alternative ImageView: Offers different views for pictures or instructions to aid operators.
  • Component Counters: Tracks components that are placed, skipped, or unplaced.
  • Layer Flexibility: Supports separate calibration for the bottom and top layers, maintaining calibration when switching between them.

The software, available for download as ‘epicknplace_v1_6_2.zip‘, can be installed from the Eiger Design website. Eiger also plans to release training videos to guide new users.

Sipeed MaixBox-M4N is A High-Performance AI Computing Powerhouse

Sipeed’s MaixBox-M4N is a computing module specifically designed for high-performance edge computing. It is powered by Aixin Yuanzhi’s AX650N, known for its exceptional AI capabilities, and is capable of streaming 8K video at 30FPS.

The MaixBox-M4N is built by combining the Maix-IV M4N system-on-module(SOM) with the M4N-Dock carrier board. Powering the SOM is Axera’s AX650N chip, which is equipped with eight Arm Cortex-A55 cores, a neural processing unit (NPU), and an image signal processor (ISP) supporting 8k30 resolution.

The AX650N features robust AI computing capabilities, with its neural processing unit (NPU) that supports various precision levels including INT4, INT8, INT16, FP16, and FP32. This NPU delivers up to 43.2 TOPS of computing power at INT4 precision and 10.8 TOPS at INT8 precision, making it highly suitable for edge AI workloads.

MaixBox-M4N features H.264 and H.265 codecs that are capable of decoding video up to 8K resolution at 60 FPS and encoding video up to 8K at 30 FPS. Additionally, it features dual HDMI 2.0A outputs, each capable of delivering 4K resolution at 60 FPS. It also includes two 4-lane MIPI CSI connectors for camera integration. For connectivity, it has two Gigabit Ethernet ports, a PCIe 2.0 slot, and three SATA 3.0 ports for SSDs and HDDs. It also includes various I/O interfaces like RS 485 and RS432 and is equipped with one USB 3.2 Gen1 and three USB 3.0 ports for efficient data transfer and peripheral connections. Notably, the device does not include GPIO pins.

The Speed M4N-Dock features:

  • CPU: 8-core A55 (1.7GHz) with FPU & NEON support.
  • NPU: Up to 43.2 TOPS at INT4 precision.
  • ISP: Supports up to 8192 x 4320@30fps and 16384 x16384 resolution with AI ISP.
  • DSP: Dual-core, 800MHz.
  • Memory: Max 8GB LPDDR4x; Storage: Max 32GB eMMC 5.1.
  • Display: Dual HDMI 2.0a for 4K@60fps.
  • Camera: Two 4-lane MIPI CSI.
  • Connectivity: Two Gigabit Ethernet ports.
  • Expansion: One PCIe 2.0 slot and three SATA 3.0 ports.
  • I/O: RS 485 and RS432 interfaces.
  • USB: One USB 3.2 Gen1 and three USB 3.0 ports.
  • Power Supply: 12V/2A DC.
  • Size: 121 x 100 x 46mm.

For developers and tech enthusiasts, Speed provides comprehensive technical documentation for the M4N Dock on their Wiki page. Additionally, practical working examples and resources can be found in their GitHub Repository, enhancing usability and accessibility for users.

Sipeed’s M4N Dock is available for $230, including a power adapter and accessories. A variant with acrylic cover plates is priced at $240. there is also a standalone variant that will cost you $155, and a bundle with the module, dock, heatsink, and fan will cost you $230. Additionally, the MaixBox-M4N bundle with a rugged aluminum case costs $248. These products are available on Sipeed’s AliExpress store.

Sound from Ultrasound: Audio Pioneer xMEMS’ New Silicon Speaker Reinvents How Humans Experience Sound

The new Cypress MEMS speaker achieves 40X louder bass response and will be demonstrated at CES 2024 by appointment only. Mass production late 2024.

An industry-first, Cypress achieves >140dB low frequency sound pressure level (SPL), enabling a no-compromise replacement for legacy, century-old coil speakers in noise canceling earbuds.

xMEMS Labs, pioneers in solid-state, all-silicon micro speakers, today announced a revolutionary breakthrough in sound reproduction, changing the way mass-market, true wireless stereo (TWS) earbuds create ultra high-quality, high-resolution sound experiences across all audio frequencies.

With the introduction of its groundbreaking new Cypress solid-state MEMS speaker, xMEMS engineers have replaced legacy push-air sound reproduction with the company’s ultrasonic amplitude modulation transduction principle. Ultrasonic modulation turns ultrasonic air pulses into rich, detailed, bass-heavy, high-fidelity sound, representing the first no-compromise alternative to the moving-coil concept for high-volume consumer active noise canceling (ANC) earbud micro speakers.

“By shifting to a sound from ultrasound principle, the xMEMS Cypress micro speaker can now officially replace traditional coil-and-magnet speakers in active noise canceling earbuds,” said Mike Housholder, Vice President, Marketing & Business Development for xMEMS. “Cypress maintains all of the benefits of xMEMS’ existing speakers, while being 40x louder in low frequencies, achieving a key requirement for ANC earbuds.”

How Cypress Creates the World’s Best Audio Experience

Legacy coil speakers generate sound in the audible band, which is intrinsically inefficient. Cypress takes advantage of the characteristics unique to MEMS—speed, precision, and uniformity—to produce high-resolution audio more efficiently.

Sound from ultrasound has been a research topic since the 1960s but has never achieved the acoustic performance required for broad commercial appeal, until xMEMS’ Cypress.

As an air pulse generator, Cypress comprises: a modulator to generate an amplitude-modulated ultrasonic wave (carrier) that faithfully follows the amplitude of the intended audio signal; and a demodulator to synchronously demodulate the ultrasonic wave, transferring the acoustic energy down to the baseband, producing the intended audible sound as a result.

The sound envelope of ultrasonic pulses is an exact acoustic copy of the source signal, meaning across all frequencies, Cypress is more faithful to the original recording than current speaker technologies. As a result of its superior resolution in the time domain, Cypress can more accurately reproduce today’s advanced sound formats, including high-resolution and spatial audio.

“Cypress not only revolutionizes how sound can be reproduced from an electric signal, but it also redefines how it should be reproduced,” said Jemm Liang, xMEMS CTO.

Based on Proven Innovation in MEMS Design

Cypress leverages the same production-proven MEMS platform used for all existing xMEMS products and exploits all the benefits of xMEMS’ established solid-state speaker designs when compared to legacy coil architectures, including:

  • Faster mechanical response for unrivaled detail, clarity, and separation
  • Near-zero phase shift for the most accurate, unaltered sound reproduction
  • Superior part-to-part phase consistency for unparalleled spatial imaging accuracy
  • Rigid silicon diaphragms eliminate speaker breakup for unmatched mid/treble clarity
  • Non-magnetic, for lower weight and reduced electromagnetic interference
  • Superior quality, reliability and part-to-part uniformity from the solid-state semiconductor process

Now Cypress, in a 6.3 x 6.5 x 1.65mm package (9mm-diagonal), brings the added and significant benefit of being 40x louder in low frequencies compared to xMEMS’ prior generation speakers, providing stronger, deeper bass that is consistent with the best 10-12mm legacy coil speakers, including sound pressure levels (SPL) greater than 140dB as low as 20Hz*.

MEMS and Ultrasonic Modulation Ideal for ANC Performance

This additional low-frequency SPL is most critical for ANC earbuds. With Cypress, xMEMS brings unique advantages over legacy coil to further improve ANC applications. Cypress’ faster electrical-to-acoustic conversion can contribute to wider ANC bandwidth (i.e., extension of ANC to cancel higher frequency noise sources, like a crying baby). Plus, Cypress’ near-constant electrical-to-acoustic conversion time (group delay), can reduce DSP filter complexity which, in turn, leads to shorter DSP latency, rounding errors, and power consumption when processing ANC.

Availability

Full-function Cypress prototype silicon is now sampling to select early customers. Production-candidate samples of Cypress and the companion Alta controller/amplifier ASIC will sample in June 2024. Mass production is planned for late-2024.

xMEMS will demonstrate Cypress by appointment only January 9-12 at CES 2024 in Las Vegas, NV.

For more information about xMEMS and its solid-state fidelity solutions, visit www.xmems.com

The GENE-RAP6 – A 3.5” Board with 13th Gen Intel Core Processing, 8K Displays, and Iris Xe Graphics

Multiple high-resolution displays, comprehensive connectivity, and the latest in Intel technology make the GENE-RAP6 the centerpiece of a new era in computing.

AAEON, a global leader in embedded computing, has introduced the GENE-RAP6, the company’s first single-board computer featuring embedded 13th Generation Intel® Core™ processors.

At a glance:

  • Two 8K displays, or four 4K displays (HDMI, DP, eDP/LVDS)
  • Intel Iris Xe Graphics
  • Raptor Lake CPUs from U-series through to i7 processor options
  • Expansion for 5G, Wi-Fi, and NVMe via M.2 keys and FPC connector
  • 64GB DDR5 (4800MHz) via SODIMM slots

Available with Intel® Core™ i7, i5, i3, and Intel® Processor U-series CPUs, the GENE-RAP6 takes advantage of the 13th Generation platform’s performance hybrid architecture, which offers up to 6 performance cores, 8 efficient cores, and 20 threads with targeted workload management through integrated Intel® Thread Director technology. Additionally, the board contains flexible system memory options, supporting up to 64GB of dual-channel DDR5 running at 4800MHz via two SODIMM slots.

The first notable feature of the GENE-RAP6 is its variety and quality of display interfaces, which include physical HDMI 2.1 and DP 1.4 ports, both offering 8K resolution at 60Hz, along with internal connectors for LVDS and optional eDP 1.4 providing resolutions of 1920 x 1080 and 4K, respectively. Notably, the board’s HDMI port can drive two 4K displays at 120Hz, enabling support for up to four simultaneous 4K displays. This output, paired with the board’s Intel® Iris® Xe Graphics eligibility, is one reason AAEON noted its potential for use in healthcare imaging applications.

Similar synergy can be seen with the pairing of the board’s dense I/O and its high-bandwidth DDR5 memory. The GENE-RAP6 hosts an external I/O made up of 2.5GbE and 1GbE LAN ports, along with four USB 3.2 Gen 2 ports (Type-A x 3, Type-C x 1), in addition to four internal COM headers for RS-232/422/485, as well as GPIO and SMBus. Containing such a combination of speed and flexibility in its connectivity, it is easy to see how the GENE-RAP6’s layout lends itself to human-machine interfaces and panel PC solutions.

The GENE-RAP6 is equipped with a number of storage options that can be utilized according to the needs of different applications, including a standard SATA drive, an M.2 2280 M-Key for NVMe, and an FPC connector supporting four PCIe 4.0 lanes. Functional expansion is also available, with 5G, Wi-Fi, and Bluetooth modules supported via an M.2 3052/3042/2242 B-Key and M.2 2230 E-Key.

AAEON has noted that these expansion options, alongside the board’s Ethernet ports, COM headers, SMBus, and GPIO connectors, provide the necessary connectivity capability to handle process control systems, data analysis, and virtualized monitoring when deployed in industrial automation applications. It is also worth noting that the GENE-RAP6 has the option of TPM 2.0, with the purpose of bolstering data security for such tasks.

The GENE-RAP6 is now in mass production and available on the eShop, with further information available through AAEON’s contact form.

For more information about the GENE-RAP6, please visit its product page.

MYIR Launched ARM SoM based on Renesas RZ/G2UL Processor

MYIR has launched a new embedded SoM MYC-YG2UL CPU Module based on Renesas RZ/G2ULprocessor with 1GHz ARM Cortex-A55 and 200MHz real-time Cortex-M33 cores. The processor supports 2 Gigabit Ethernet, 2 CAN FD, 2 USB2.0, up to 7 UART, RGB display interface, and MIPI-CSI camera interface. These features make this module suitable for entry-class industrial gateway control and embedded devices with simple GUI capabilities as entry-level industrial HMI, medical devices, PLC controllers, charging piles, energy storage systems, and more.

The MYC-YG2UL CPU Module measures only 37mm by 39mm. It has integrated CPU, DDR3L, eMMC, EEPROM, and power management IC (PMIC) to provide a minimum system for your next embedded design through 1.0 mm pitch 140-pin Castellated-Hole and 50-pin LGA expansion interfaces. It is capable of running Linux and provides software resources including kernel and driver source code, together with detailed user manuals and documents to help customer start their development rapidly.

Features Of MYC-YG2UL CPU Module

  • Dimensions: 39mm x 37mm
  • PCB Layers: 10-layer design
  • Power supply: 5V/1A
  • Working temperature: -40~85 Celsius (industrial grade)
  • Linux OS
  • RENESAS RZ/G2UL processor (Type-I)
  • 512MB DDR3L
  • 4GB eMMC
  • 4KB EEPROM
  • Power Management IC
  • 1.0mm pitch 140-pin Castellated-Hole and 50-pin LGA expansion interfaces
  • * 2 x RGMII
  • * 2 x USB 2.0
  • * 5 x SCIF
  • * 2 x SCI
  • * 2 x CAN FD
  • * 4 x I2C
  • * 3 x SPI
  • * 2 x ADC
  • * 1 x RGB
  • * 1 x MIPI CSI
  • * 4 x SSI
  • * Up to 82 GPIOs

Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and CPU Module pin-out description file.

MYC-YG2UL CPU Module Function Block Diagram

The MYD-YG2UL Development Board is a complete evaluation platform built around the MYC-YG2UL CPU Module. It has brought out a rich set of peripherals and interfaces including RS232, RS485, dual Gigabit Ethernet, dual USB 2.0 HOST, USB 2.0 OTG, CAN, Micro SD card slot, M.2 Socket for USB based 4G/5G LTE Module with dual SIM card holders and USB based WiFi module. It also has LCD interface to support RGB display and MIPI-CSI interface to support camera input as well as Audio input and output interface. MYIR offers 7-inch LCD module, MIPI camera module and RPI module (RS232/RS485/CAN) as optional functional modules to work with the board. It is a solid reference design for solutions based on RZ/G2UL.

MYD-YG2UL Development Board (Top-view)
MYD-YG2UL Development Board (Bottom-view)
MYD-YG2UL Development Board Function Block Diagram

The MYC-YG2UL CPU Module is provided with standard configuration of 512MB DDR3L and 4GB eMMC (MYC-YG2UL-4E512D-100-I), pricing at only US$22 per piece. Discount is to be offered for volume quantities. The RAM and Flash can also be customized. MYIR provides OEM/ODM services to help customers accelerate their time to market and save cost.

More information about above new products can be found at: https://www.myirtech.com/list.asp?id=736

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