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CISSOID announces 3-Phase SiC MOSFET Intelligent Power Module for E-mobility

Posted on 10 March, 2020 by mixos

CISSOID, the leader in high temperature semiconductors for the most demanding markets, announces today a new 3-Phase SiC MOSFET Intelligent Power Module (IPM) platform for E-mobility. This new IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers.

Co-optimizing the electrical, mechanical and thermal design of the power module and its proximity control, this new scalable platform will improve time-to-market for Electric Car OEMs and electric motor manufacturers willing to rapidly adopt SiC-based inverters for more efficient and compact motor drives. With this SiC-based IPM solution, CISSOID maintains its focus on addressing challenges for automotive and industrial markets.

The first product out of this scalable platform, a 3-Phase 1200V/450A SiC MOSFET IPM, features low conduction losses, with 3.25mOhms On resistance, and low switching losses, with respectively 8.3mJ turn-on and 11.2mJ turn-off energies at 600V/300A. It reduces losses by at least a factor 3 with respect to state-of-the-art IGBT power modules. The new module is water-cooled through a lightweight AlSiC pin-fin baseplate for a junction-to-fluid thermal resistance of 0.15°C/W. The power module is rated for junction temperature up to 175°C. The IPM withstands isolation voltages up to 3600V (50Hz, 1min).

The built-in gate driver includes three on-board isolated power supplies (one per phase) delivering each up to 5W allowing to easily drive the power module up to 25KHz and at ambient temperatures up to 125°C. Peak gate current up to 10A and immunity to high dV/dt (>50KV/µs) enable fast switching of the power module and low switching losses. Protection functions such as Undervoltage Lockout (UVLO), Active Miller Clamping (AMC), Desaturation Detection and Soft-Shut-Down (SSD) ensure the safe drive and reliable operation of the power module in case of fault events.

“Developing and optimizing fast-switching SiC Power Modules and driving them reliably remains a challenge” says Dave Hutton, CEO at CISSOID. “With this new SiC Intelligent Power Modules, which is the outcome of years of experience in the development of power modules and gate drivers for extreme temperature and voltage environments, we are happy to deliver our first IPM samples to early SiC adopters and to support the automotive industry in its transition towards highly efficient E-mobility solutions.”

For more information, visit http://www.cissoid.com/new-products/

FWS-2275: Solution for Secure Industrial Networks

Posted on 10 March, 2020 by mixos

AAEON, an industry leader in hardware solutions, announces their latest network appliance, the FWS-2275. Built rugged and designed to power a range of network applications, the FWS-2275 brings vital functions and security to industrial networks.

As more and more industries move towards connecting sites and devices through edge computing and Industrial IoT (IIoT) environments, network security is becoming more important than ever. Recent activity by hackers have shown a shift in focus towards attacking connected infrastructure. Industrial networks are often less developed and less secure than central servers, leaving a glaring weak spot as many companies begin to adopt Industry 4.0 solutions.

AAEON has introduced the FWS-2275 as a hardware solution to help solve the issues of network security in industrial environments. The FWS-2275 is powered by the Intel® Celeron® N3350 processor (formerly Apollo Lake) with built-in Intel® AES-NI, providing data encryption that is secure with faster processing than standard AES. The FWS-2275 is designed to power network solutions such as UTM, firewall, and SD-WAN. The FWS-2275 also includes on-board Wi-Fi, USB mini Console, and SIM card slot. The FWS-2275 can also be deployed as an Industrial IoT (IIoT) gateway or edge computing device.

The FWS-2275 is built tough to operate on-site in industrial environments. In addition to an aluminum chassis, it has a fanless design and wide operating temperature range of 0°C to 50°C. The FWS-2275 also includes wide voltage input of 9V to 24V, as well as Digital IO and COM ports to integrate with existing industrial infrastructure.

The FWS-2275 is designed to provide a reliable and secure hardware solution for industries. It can be deployed in various roles, as an Edge or IoT gateway, or as vCPE for an SD-WAN network. AAEON manufacturer and OEM/ODM services also provide help with configuration or customization for systems integrators and independent developers.

“The FWS-2275 draws upon our expertise in designing rugged systems to bring a secure networking and SD-WAN hardware solution to industries,” said Caridee Hung, Project Manager with AAEON’s Network Security Division. “As well as including industrial standard IO ports like COM and DIO, the FWS-2275 is a competitively priced network device built to meet the requirements of industrial networks.”

for more visit www.aaeon.com

36V, 600mA DC-DC Converters with Integrated Inductors

Posted on 9 March, 20209 March, 2020 by mixos

Torex Semiconductor Ltd. has launched the XCL230/XCL231 as a new series of low supply current, 36V, 600mA step-down dc-dc converters with integrated inductors. Integrating the coil makes for easier circuit board layout and minimizes malfunction and noise from the component and wiring layout.

The input voltage range is 3.0- to 36-V, the switching frequency is 1.2MHz, and a synchronous rectification circuit is used to achieve a stable power supply at high efficiency. The DFN3030-10B (3.0×3.0, h=1.6mm) package is used for a small package size.

The XCL230 Series fixes the operation frequency using pwm control to suppress output ripple voltage. The XCL231 Series automatically switches between pwm and pfm control to reduce loss by lowering the operation frequency during low loads to achieve high efficiency across the entire range from low to high loads. A 0.75V standard voltage supply is built in, and the output voltage can be set to 1.0V to 5.0V using an external resistance.

The “cool post type” package used in XCL230/XCL231 series allows the upper coil to be connect to the PCB with low resistance in both electricity and heat by penetrating the Cu post inside. Low resistance and high heat dissipation can be realized.

The soft start time is internally set to 2.0ms, and a time that is longer than the internal soft-start can be freely set depending on the resistance and capacity connected to the EN/SS pin. An overcurrent protection function and thermal shutdown function are built in as protective functions to ensure safe use in the event of a short circuit.

On The Web: Torex Semiconductor

Bringing Low Power Machine Learning to Endpoint IoT Devices

Posted on 9 March, 2020 by mixos

QuickLogic Corporation and Antmicro jointly-announced QuickFeather™, a small form factor development board designed to enable the next generation of low-power Machine Learning (ML) capable IoT devices. On top of the open source hardware design, available on GitHub today, Antmicro has also added support for the QuickFeather board in the Zephyr Real Time Operating System (RTOS) as well as in its open source Renode simulation framework.

The QuickFeather board is powered by QuickLogic’s EOS™ S3, the first FPGA-enabled SoC to be fully supported in the Zephyr RTOS, with flexible eFPGA logic integrated with an Arm Cortex®-M4F MCU and functionality such as:

16-Mbit of flash memory
MC3635 accelerometer
Infineon DPS310 pressure sensor
Infineon IM69D130 PDM digital microphone
User button and RGB LED
Powered from USB or a single Li-Po battery
Integrated battery charger
USB data signals tied to programmable logic

The QuickFeather development board was created to give developers a powerful and effective way to explore the functionality of the EOS S3 platform and enable compatibility with extensions available for the Feather PCB format from Adafruit, recently also added as a Zephyr Project member.

As announced in late 2019, the EOS S3 is supported in Antmicro’s Renode open source simulation framework for rapid prototyping, development and testing of multi-node systems, offering a more efficient hardware/software co-design approach. Utilizing Renode gives developers the flexibility and functionality to fully evaluate the QuickFeather development board across a number of deployment and configuration scenarios with or without access to hardware.

“An open hardware development board for a cost effective, FPGA-enabled SoC platform coupled with useful sensors, supported in a mainstream open source RTOS and the open source Renode simulation framework, QuickFeather is ideally positioned for use in tiny ML applications such as SensiML’s AI Software Platform and Google’s TensorFlow Lite,” said Michael Gielda, vice president of business development at Antmicro. “We are proud to be helping QuickLogic build an open hardware and software ecosystem that can serve as a model for the entire industry.”

“Machine learning applications are being deployed at an amazing rate and the new QuickFeather board will further accelerate that trend,” said Brian Faith, president and chief executive officer of QuickLogic. “Developers love the fact that it and its associated Renode simulation framework are open source, making it even more attractive for implementing ML algorithms on endpoint IoT applications.”

Availability

The QuickFeather board with integrated EOS S3 voice and sensor processing SoC, and the Renode simulation environment are all sampling now and will be available in early Q2.

On The Web: QuickLogic Corporation , Antmicro

ON Semiconductor NFAQ1060L36T Intelligent Power Module (IPM)

Posted on 9 March, 2020 by mixos

NFAQ1060L36T – Three-phase 10 A / 600 V IGBT module with integrated drivers using DBC substrate.

The NFAQ1060L36T is a fully-integrated inverter power stage consisting of a high-voltage driver, six IGBT’s and a thermistor, suitable for driving permanent magnet synchronous (PMSM) motors, brushless-DC (BLDC) motors and AC asynchronous motors. The IGBT’s are configured in a 3-phase bridge with separate emitter connections for the lower legs for maximum flexibility in the choice of the control algorithm.

The power stage has a full range of protection functions including cross-conduction protection, external shutdown, and under-voltage lockout functions. An internal comparator and reference connected to the over-current protection circuit allow the designer to set the over-current protection level.

Features

Three-phase 10 A / 600 V IGBT module with integrated drivers using DBC substrate
Typical values: VCE(sat) = 1.9V, VF = 2.4V, ESW = 400 µJ at 10 A
Compact 29.6 mm x 18.2 mm dual in-line package
Adjustable over-current protection level
Integrated bootstrap diodes and resistors
Thermistor
Short lead length (3.4mm, module bottom to pin end)

Benefits

Good heat dissipation with DBC (low thermal resistance)
Using the latest tech to optimize loss, good EMI
PCB size reduce with compact sized packaged
Adjustable OCP level
Multi function integrated for compact design, cost optimization
More accurate module temperature measurement by embedded NTC
Module assembly to PCB more closely to reduce stress from vibration

more information: www.onsemi.com

Free Elektor Article: Current Transformer for Oscilloscopes

Posted on 9 March, 2020 by mixos

Commercial current clamp devices certainly are able to measure current by potential-free means but they are not suitable for capturing rapid alterations in current over time. In addition, many low-cost examples of these do not provide an output for connecting to an oscilloscope. Here now comes a DIY alternative.

Original publication: Elektor Magazine 2/2018 (March & April) on page116
Author: Karsten Böhme
Free download expires: Friday 13 March 2020
Original article production number: 150170
Software, Bare PCB available, see PRODUCTS below

Like what you’re seeing? Then go to the article page and download a pdf copy of the full, original article. Downloading is free from Friday 6 March to Friday 13 March 2020.

EBC3A1-1G Y0: the Optimum Embedded Board for ATM Kiosks and Vending Machines

Posted on 9 March, 2020 by mixos

EMBUX introduces its newest ARM embedded board, the EBC3A1-1G Y0, particularly intended for machine manufacturers and system integrators. The embedded board is selectively based on the NXP ARM Cortex-A9 i.MX6 processor to ensure high performance at a lower cost. With multiple, distinct I/Os, the sky’s the limit as to how to connect the EBC3A1-1G Y0 with different interfaces in ATM kiosks, vending machines, and industrial gateways/controllers.

ARM yourself with the best processor for automated uses

ARM processors are typically used for site-specific devices, like automated vending and ATM machines and other embedded systems, due to its low power consumption and smaller size. However, EMBUX embraces the advantages in cost/performance ratio and size with our meticulous selection of the ARM Cortex-A9 i.MX6 processor for our scalable embedded system solution, saving you space and energy. The 10.8 to 26.4 VDC wide input voltage range also allows the device to have versatility in usage environments.

Rich I/O selection makes this your flexible friend

As a compact 3.5” board, the EBC3A1-1G Y0 integrates easily with ATMs, in addition to vending, parking, and other automated machines. The assortment of I/Os gives the computer flexibility in connectivity options. Multiple USB and RS-232 ports are available to link to site-specific devices, while the CAN bus makes the board suitable for transportation vehicle uses. Additionally, having both HDMI and LVDS connectors allows flexibility in taking advantage of the graphics support. Lastly, the EBC3A1-1G Y0 offers mini-PCIe expansion sockets for additional needs or extra ports.

Main Features

ARM Cortex-A9 i.MX6 DualLite 1.0 GHz
Onboard DDR3 1GB, 4GB eMMC Flash
HDMI, 18/24-bit LVDS output
6 x RS-232, 2 x RS-485, 2 x CAN, 4 x USB 2.0
Dual mini-PCIe for Wi-Fi/3G support
10.8~26.4 VDC wide power input
Diversified OS support for Yocto/Android/WEC7 (OEM)

Ordering Information

EBC3A1-1G Y0 (P/N: 10E0003A106X4)

3.5″ SBC, i.MX6DL 1GHz, DDR3 1GB, 2 x mini-PCIe, with Yocto OS, HDMI/LAN/4GB, eMMC/4 x USB/6 x RS 232/2 x RS, 485/2 x CAN/10.8V 26.4V

The EBC3A1-1G Y0 appears to be available now at an undisclosed price. More information may be found in Nexcom’s announcement, as well as Nexcom’s EBC3A1-1G Y0 product page and Embux’s EBC 3A1-1G product page.

DIY 18650 Powerwall with onboard BMS

Posted on 9 March, 2020 by mixos

peter6960 shared a new project. It’ s about a 18650 cells power brick with onboard battery management system. He writes:

While I cannot afford a Tesla PowerWall, I’ve spent some time drawing up a PCB to house 7x 18650 cells in series. Each board has onboard Battery Management:

Overvoltage Protection (per cell)
Undervoltage Protection (per cell)
Balance Charging
Overcurrent Protection
Main pack Fuse

Each PCB has pads that allow you to stack them on top of each other with some 25mm Brass spacers, to increase the pack capacity by joining several 7S strings in series (for example stacking 10x PCBs gives you a 7S10P Battery. If you used 2500mAh cells, that would be a 21-29v 25Ah pack!

Costs are looking good, in the region of under $15 per board, keeping in mind it includes the BMS circuitry, that’s pretty cheap!

If you want to order some boards, checkout: https://www.pcbway.com/project/shareproject/18650_PowerWall_with_Onboard_BMS.html

Eagle Files: https://github.com/openhardwarecoza/DiyBMSv418650pack

New ZVS Buck-Boost Regulator operates down to -55°C for application in harsh environments

Posted on 9 March, 2020 by mixos

Vicor has released its PI3740 ZVS buck-boost regulator with an extended operating temperature range of -55 to +115°C and optional Tin-Lead BGA packaging. The PI3740 is a high-density and high-efficiency buck boost regulator with an 8 – 60V input voltage range and supports output voltages from 10 – 50V. The device offers up to 140W in a 10x14mm SiP package and higher power delivery can be achieved with additional devices in parallel. The ZVS switching topology also enables efficiency as high as 96%.

About Vicor Corporation

Vicor Corporation designs, develops, manufactures and markets modular power components and complete power systems based upon a portfolio of patented technologies. Headquartered in Andover, Massachusetts, Vicor sells its products to the power systems market, including enterprise and high performance computing, industrial equipment and automation, telecommunications and network infrastructure, vehicles and transportation, aerospace and defense. www.vicorpower.com

AMD launches two more Ryzen Embedded chips for low-power PCs

Posted on 4 March, 20204 March, 2020 by Emmanuel Odunlade

A few days back, AMD announced the expansion of its Ryzen™ Embedded ecosystem with the addition of two new, low-power, AMD Ryzen™ Embedded R1000 processors designed to provide customers with a low TDP range of between 6 to 10 Watts. The new processors named the R1102G and R1305G, were designed to serve the needs of customers who need a fairly high computing power but can’t afford the power consumption rates of other processors in the ecosystem.

According to the companies, Corporate Vice President and General Manager for Embedded Solutions, Rajneesh Gaur, the new processors highlights AMD’s desire to provide the embedded industry with high-performance computing. In his words, Rajneesh said

“AMD is ushering in a new age of high-performance computing for the embedded industry. We are doing this with cutting-edge technology to display immersive graphics in 4K resolution with AMD Ryzen Embedded processors, and we are now offering access to high performance in power-efficient solutions with these new low-power Ryzen Embedded R1000 processors.”

Being part of the Ryzen R1000 series, the new processors retain the DNA of the Ryzen series as they are also 14nm processors, and are built on the first-gen “Zen” CPU cores with Radeon Vega graphics. They also offer better CPU performance per watt, and better graphics performance compared to the predecessors like the AMD R-Series processors.

The new chips support DDR4-2400 memory and AMD Ryzen 3 graphics, with GPU frequencies of 1 GHz, and CPU base frequencies of 1.5GHz(for R1305G) and 1.2GHz(for R1102G), which puts the processors a bit behind when compared with the previous Ryzen versions in terms of speed. This is however understandable, as it might be a necessary trade-off that needed to be made to reduce power consumption.

Their numbers probably gave this next point away already, but there are significant differences between the two processors, with the R1305G seaming the one with higher performance. Some of the differences between the two processors are highlighted below;

R1305G processor supports up to 3 displays, while the R1102G only supports a max of 2.
The R1102G processor supports single-channel memory (w/ECC), while R1305G supports dual-channel (w/o ECC)
R1102G comes with 4 PCI lanes, While the R1305G processor comes with 8.

A more detailed comparison is provided in the table below;

Processor	TDP (W)	Cores/Threads	CPU Base Freq. (GHz)	1T CPU Boost Freq. (GHz) (up to)³	GPU CU (SIMD)	Max GPU Freq. (GHz)
R1305G	8-10W⁴	2/4	1.5	2.8	3	1.0
R1102G	6W⁵	2/2	1.2	2.6	3	1.0

Source: AMD.com

The Low TDP range of between 6( R1102G) to 10( R1305G) watts at which the processors operate, give customers the ability to reduce system costs with less memory DIMMS and lower power requirements. It also opens up possibilities around the development of fanless systems, creating room for the development of new kinds of solutions.

While the processors were just released, there already exists quite impressive lists of customers who are already building one solution or the other around it. Some of the customers as announced by AMD include Kontron with a scalable mini-ITX platform, and Simply NUC with a new mini PC unit called Red Oak, which offers affordable mainstream performance solutions with a cost-optimized feature set to its lineup of Ryzen Embedded based Mini PCs.

The two new processors are expected to be available for order at the end of March. More information on features and performance of the processors can be obtained from the announcement post on AMD’s Website