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Arduino Nano 33 BLE Sense

Posted on by mixos

Arduino Nano 33 BLE Sense is one of the newest Arduino boards and packs many features and sensors. It’s Small, powerful, BT connected and with all the sensors you may need to design innovative applications.

It’s a compact and reliable Nano board that is built around the NINA B306 module for BLE and Bluetooth 5 communication; the module is based on Nordic nRF 52840 processor that contains a powerful Cortex M4F and the board has a rich set of sensors that allow the creation of innovative and highly interactive designs.

Its architecture, fully compatible with Arduino IDE Online and Offline, has a 9 axis Inertial Measurement Unit (IMU), temperature, pressure, humidity, light, color and even gestures sensors and a microphone that are managed through specialized libraries. Its reduced power consumption, compared to other same size boards, together with the Nano form factor opens up a wide range of applications.

This board is based on the nRF52480 microcontroller.

Specifications

  • Clock: 64MHz
  • Flash: 1MB
  • RAM: 256KB

The Bluetooth is managed by a NINA B306 module.

  • The IMU is a LSM9DS1 and it is managed through I2C.
  • The LPS22HB reads barometric pressure and environmental temperature.
  • The HTS221 senses relative humidity.
  • The APDS-9960 is a digital proximity, ambient light, RGB and gesture sensor.
  • The MP34DT05 is the digital microphone
  • The board has a two 15 pins connectors – one on each side -,  pin to pin compatible with the original Arduino Nano.

The Arduino Nano 33 BLE Sense is open-source hardware! You can build your own board using the following files:

USB-PD Stand-alone Adapter Board from Oxplot

Posted on by Tope Oluyemi

Modern devices are quickly switching to USB-C power adapters, gradually fading out USB-A, and USB-B adapters. USB’s Power Delivery (USB-PD) protocol enables the supplies to be  flexible enough to handle charging (or powering) devices ranging from mobile phones to laptops. There are many high quality 90-100 Watt USB-C power adapters available. But unfortunately, there are many devices that rely on legacy power bricks, that cannot function with those. Oxplot‘s USB PD standalone controller bridges the gap. A STUSB4500 from STMicroelectronics handles the USB-PD protocol.

Ever thought of (re-)using your USB-C charger (like Macbook’s) to power other devices? If so, this is the board for you. You can configure the chip once with your voltage/current needs and it will automatically request that voltage/current from an upstream USB-C charger. This is completely stand-alone and requires no external microcontroller.

The STUSB4500 has memory for 3 Power Delivery Output (PDO) configurations, with each specifying an accepted voltage range and maximum current requirement. For example, one PDO can specify 13.2v±5% and max. current of 2.1A. Once configured, the chip will compute the list of available outputs upon cable attachment, and will match the requirements against it. If a match is available, it will configure the upstream to enable that power option. By virtue of the board featuring a MOSFET on the VBUS controlled by STUSB4500, it is possible to configure it to only pass through the power if the requirements are met (instead of fall back to another PDO or 5v). With the datasheet, the official GUI config tool exposes all the configuration in a simple to understand manner.

Features:

  • STUSB4500 chip capabale of negotiating from 5-20V in 50mV increments and up to 5A.
  • an LDO MOSFET power path that is switched on only when the charger meets the voltage/current requirements programmed.
  • a discharge path to safely discharge the VBUS line when a lower voltage is configured or when the cable is detached.
  • ESD protection diodes on VBUS and USB-C pins.
  • Grounded M3 mounting holes.
  • Optional header pins and screw terminal (requires soldering)
  • Manufactured and assembled in USA

STUSB4500 features some simple but useful connectivity via open-drain IO pins, in addition to the I2C. Two of its 3 PDOs have dedicated pins that are pulled low when that PDO is selected. These can be connected to LEDs to indicate which voltage is selected. In addition, attachment and the side of the attached USB-C cable are indicated with dedicated pins. One GPIO pin can also be configured to indicate other conditions. Oxplot‘s breakout board enables either screw terminals or soldering wires directly to the board. Available also are ESD diodes on the USB side for protection. The board also utilizes a pass-transistor to ensure the DC port is powered until the STUSB4500 identifies a valid power configuration.

Flashing utility and other details regarding the board are available in the github repo. The design isn’t fully published yet, due to the fact that it needs some clean up. There was also an issue with reading registers above address 0x7F, but switching to software I2C fixed the issue. Oxplot offers kits through their Tindie store for $25.

Acrosser ACM-XD15MT COM Express Type 7 Module is Released

Posted on by mixos

Acrosser ACM-XD15MT COM Express Type 7 module is based on the Intel® Xeon® processor D family, and available in 8 core versions for scalable computing performance. The ACM-XD15MT is perfect for space-constrained systems requiring increased density and reduced power consumption such as virtualization, edge computing or other industrial applications.

The ACM-XD15MT is an Intel® Xeon® D processor-based mezzanine module designed in COM Express® Basic form factor (95 mm x 125 mm), and the first Acrosser product to be designed based on COM Express® Type 7 standard.

The new COM Express® Type 7 standard deviates from the established Type 6 pinout, which focuses on audio and visual capabilities, by eliminating graphics support to allow the inclusion of 10 Gigabit Ethernet, an NC-SI interface, and additional eight (total of 32) PCI Express lanes.

The ACM-XD15MT, a Type 7 COM Express basic module embedded with Intel® Xeon® processor D-1548 accommodates up to 32 GB DDR4-2400 ECC SDRAM in two channels to support memory intensive applications. ACM-XD15MT also hosts numerous I/O ports and interfaces, including 10 GbE Ethernet, Gigabit Ethernet, PCI Express 3.0, PCI Express 2.0, SATA, USB 3.0, COM Port, GPIO and Intel HD audio channel.

ACM-XD15MT
ACM-XD15MT

Examples of target applications for the new product, ACM-XD15MT, are industrial automation, storage and networking appliances such as cloud servers for IoT and Industry 4.0 applications.

Acrosser ACM-XD15MT features:

  • Intel® Xeon® processor D-1548 series
  • Support DDR4 ECC/non-ECC SDRAM on three SODIMM sockets, up to 32GB
  • Support two 10GbE and one GbE interfaces
  • Support 4x USB 3.0, 8x USB 2.0, 2x SATA III, 7x PCIe x1 Gen2, 1x PCIe x16 Gen3, 1x PCIe x8 Gen3
  • Support wide operating temperature range of 0°C to 60°C

No pricing or availability information was provided for the ACM-XD15MT. More information may be found in Acrosser’s announcement and product page.

Isabellenhütte introduces new range of 1 – 6mΩ resistors in smallest chip sizes available on the market

Posted on by mixos
Image caption: An FMx shunt under construction: The resistance material, e.g. NOVENTIN®, is made of a robust full metal plate which is directly soldered with its underside. Very low-ohmic resistances are achievable thanks to the large cross-sectional areas.

Isabellenhütte has developed a new range of precision resistors in standard sizes with resistances ranging from 1 to 6 mOhm for applications which require small and low-ohmic shunts. In terms of their construction, the components are also less complex than the current ISA-PLAN®resistance families. And yet, they offer the same performance quality: very good long-term stability, a low temperature coefficient, and low thermoelectric voltages.

With the FMx shunt family, Isabellenhütte has now plugged a gap in the standard size range for precision resistances. It has not been possible with the previous product ranges to realize the usual S (2512), P (2010) and K (1206) standard sizes in the resistance range from 5 to 1 mOhm. The impetus for this new development was provided by increasing demand for these resistances as well from a wide range of industries, including the automotive sector (for in-car chargers and assistance systems) and industry (for BLDC drive units), but also from the consumer market (e.g. for white goods).

The development approach

The large cross-sectional areas required for low-ohmic components have been achieved by a change in construction, and the production process has also been significantly simplified. A further milestone for the FMx shunts has been the development of the NOVENTIN® resistance alloy to make it possible to realize these low-ohmic values in defined sizes. Until now, the ISA-PLAN® resistances (SMx, VMx and CMx) have followed a sandwich construction, consisting of a substrate – usually copper – an adhesive and a resistance film made out of the ZERANIN® and MANGANIN® resistance alloys developed in-house by Isabellenhütte. The FM in the title of the new range stands for “Full Metal”, i.e. the components are fashioned in the corresponding thickness out of a full metal plate made of the resistance material in question and directly soldered onto the underside. These variant is very low-ohmic due to the large cross-sectional areas. 1 mOhm is realized with the ZERANIN® alloy, 2 mOhm with MANGANIN®, and, for the first time, NOVENTIN® is being used in ISA-PLAN® products for the resistance range from 3 to 6 mOhm. The new design has given rise to a particularly robust construction which also makes it possible to leave out some work stages and reduce costs. An important point for the automotive industry is this: The components form a soldering point meniscus to guarantee the possibility of automated inspection of the soldering points.

Less complex with the same quality parameters

Despite the reduction in complexity, the FMx range still offers the same high performance quality as the existing high-ohmic product family. This is ensured by the high-class, massive resistance material, the very good long-term stability, a low temperature coefficient and low thermoelectric voltages. These aspects give rise to good measurement resistance.

Start of production in the last quarter of 2020

Beta samples of the FMx range are currently in production. Qualification in accordance with the AEC-Q200 standard in the automotive sector is planned for the second quarter of 2020, with the start of production scheduled for the fourth quarter of the same year.

www.isabellenhuette.de/en/

Digital RGB / Ambient Light, Proximity and Photoplethysmography Sensor

Posted on by mixos

Integrated Device Technology (IDT), a wholly owned subsidiary of Renesas Electronics Corporation introduced the OB1203, a fully integrated all-in-one biosensor module for mobile and wearable devices. The OB1203 is the smallest sensor of its kind.

In addition to non-invasive measurement of heart rate and blood oxygen levels, the OB1203 module integrates additional sensors needed in the latest generation mobile devices, including an ambient light sensor (ALS), an RGB color sensor, a proximity sensor, and a pulse oximeter biosensor. This module comes in a tiny, optically-enhanced package at only 4.2 mm × 2 mm × 1.2 mm, and includes two LEDs, drivers, the sensors and a signal conditioning chip that outputs all sensor data on an I2C bus.

A key feature of the OB1203 is its antiallergenic glass cover, which allows it to be used in applications requiring direct skin contact. An additional advantage of the OB1203 is the ability to operate when covered with IR-inked glass, allowing product designers to almost entirely conceal the OB1203 for a cleaner, more aesthetically pleasing product design.

The OB1203 comes with clinical-grade heart rate (HR) and Sp02 algorithms, an easily customized Android app, and only requires power and three data lines to operate.

Features

  • Biosensor:
    • SpO2 measurement behind IR transmissive, but visibly dark ink
    • Industry’s smallest package: 4.2mm × 2mm × 1.2mm
    • Fully integrated and trimmed module including two LEDs, 250mA max drive current and photo detectors
    • High SNR and Crosstalk cancelation (analog and digital)
  • Ambient Light / Color Sensor:
    • High lux accuracy across various light sources
    • Absolute sensitivity: 0.06 lx to > 150,000 lx
    • Output resolution LS/CS: 13 to 20 bits
    • Four LS/CS gain modes: x1 to x6
    • Highly linear output, 50Hz/60Hz light and fluorescent light flicker immunity
  • Proximity Sensor:
    • Integrated and trimmed LED source, driver (250mA) and photodetector
    • High resolution (12 to 16 bits)
    • Object movement detection (in/out)
    • Ambient light suppression > 100 klx sun light

OB1203 samples and evaluation kits with Bluetooth® or USB data connectivity are available online by request.

www.idt.com

New 200MHz DS1202Z-E to RIGOL’s Popular DS1000Z Series Oscilloscopes

Posted on by mixos

1GSa/sec sampling and 24Mpts memory depth make this economical 2-channel scope stand out from the crowd.

Saelig Company, Inc. has introduced the Rigol Technologies DS1202Z-E 200MHz Two-channel Oscilloscope, an important expansion of their oscilloscope portfolio. The DS1202Z-E comes standard with 24Mpts of waveform memory, a 60,000 frame-segmented record mode, standard serial decode and triggering capability, high resolution FFT, 15 trigger types and 37 integrated measurements. These features make the DS1202Z-E a powerful, capable, and affordable debug and analysis tool for design engineers.   With 200MHz Bandwidth and a 1.75 nanosecond risetime, the DS1202Z-E provides the performance needed to visualize signal artifacts on higher speed signals.

The DS1000Z family of digital oscilloscopes has long been a favorite of educators, entrepreneurs, hobbyists, and embedded engineers.  Its combination of performance, capabilities, quality and price made the DS1000Z family the world’s most popular oscilloscope.  The new DS1202Z-E builds on that legacy by delivering a powerful 200MHz version for just $369.

Specifications:

  • Analog channel bandwidth: 200 MHz
  • 2 analog channels
  • Real-time sample rate up to 1 GSa/s
  • Memory depth up to 24 Mpts
  • Up to 30,000 wfms/s waveform capture rate
  • Up to 60,000 frames hardware real-time waveform recording and playback functions
  • Innovative “UltraVision” technology
  • Various trigger and bus decoding functions
  • Low noise floor, vertical scale range: 1 mV/div to 10 V/div
  • Various interfaces: USB Host&Device, LAN (LXI), AUX
  • Compact size, light weight, easy to use
  • 7 inch WVGA (800×480) TFT LCD, intensity graded color display

DS1000Z-E series is a high-performance and economic digital oscilloscope designed for the designing, debugging and educational requirements of the mainstream digital oscilloscope market.  Made by Rigol Technologies Inc., a leading manufacturer of precision electronic instrumentation for test and measurement, the DS1202Z-E 200MHz Two-channel Oscilloscope is available now from Saelig Company, Inc., their USA technical distributor.

ON Semiconductor ARX3A0 CMOS image sensor ultra fast rolling shutter

Posted on by mixos

The ARX3A0 is designed to be ultra-miniature (1/10th-inch optical format) and ultra-low-power image sensor, bringing new options to IoT devices, drones, and robotics

The ARX3A0 is designed to be ultra-miniature (1/10th-inch optical format) and ultra-low-power image sensor, bringing new options to IoT devices, drones, and robotics. The product has an innovative super low power mode which draws only 3.2 mW while active and can detect motion or changes in lighting conditions and wake the rest of the system up. With its high frame rate of 360 frames per second (fps), the ARX3A0 can behave like a global shutter sensor in many circumstances, while still having all the benefits of power, size and performance of a 2.2 µm rolling shutter pixel.

Key features

  • Ultra Small 1/10th-inch Optical Format
  • Super-Low Power Mode and Motion Detection Function with Smart Wake
  • High Frame Rate (360 FPS)
  • Ultra-Fast Electronic Rolling Shutter

Additional features

  • Small Die Size 3.35 mm x 3.40 mm
  • 560 (H) x 560 (V) [1:1] VGA resolution in a square at 360 frames per second
  • 2.2 µm BSI non-stacked pixel
  • Monochrome with NIR+ implementation
  • Superior Low-light Performance
  • Ultra-Low Power consumption:
    • less than 19 mW at 30 FPS
    • less than 82 mW at 120 FPS
    • less than 140 mW at 360 FPS
    • less than 3.2 mW standby
  • Smart wake motion detection function

www.onsemi.com

AMS AG TCS3701 color and proximity sensor

Posted on by mixos

The TCS3701 is a very-high sensitivity light-to-digital converter

The TCS3701 is a very-high sensitivity light-to-digital converter that features ambient light and color (RGB) sensing in parallel with IR proximity detection. The Ambient light and color sensing function provides five concurrent ambient light sensing channels: Red, Green, Blue, Clear, and Wideband.

Features

  • Ultra-high ALS and color sensitivity
  • 1024X dynamic range
  • 0.18µm process technology with 1.8V I²C
  • High proximity crosstalk compensation
  • Companion non-predictive asynchronous algorithm

Other Features

  • 0.18 µm process technology with 1.8 V I²C
  • Companion non-predictive asynchronous algorithm

Benefits

  • Enables maximum design flexibility for operation behind Organic LED displays or dark inked glass
  • Enables dark room to sunlight operation
  • Reduces power consumption
  • When combined with a VCSEL emitter enables operation behind OLED
  • Enables ambient light measurement during display blanking periods

https://ams.com/tcs3701

Enjoy Superior Graphic Output and Low Power Usage with Enhanced EBC 357X 3.5” Boards

Posted on by mixos

NEXCOM is thrilled to reintroduce the SBC EBC 357X series with a revamped design that withstands adverse temperatures and economizes space with its upside-down CPU. The boards save costs by utilizing world-class Intel Atom® E39xx processors, which function as beautifully as i3s without sacrificing speed. Intended for those that desire simple and compact HMIs, the EBC 357X series is suitable for a variety of uses, such as industrial automation, building management systems, outdoor retail, and public infrastructure.

Industrial and outdoor environments are subject to unpredictable and variable temperatures, requiring versatile and durable equipment. Wide-temperature embedded systems endure rigorous testing to ensure responsiveness regardless of operational conditions. The attractiveness of the EBC 357X series is that our systems consume low power while operating at a greater range of temperatures than competitors (-20°C~60°C fanless, -20°C~70°C with fan), making it a value-driven choice for disparate environments, including traffic control units, bus stop displays, machine vision systems, and industrial panel PCs.

The carefully selected Intel Atom® processors use low-power architecture to support immersive graphics and media. Capitalizing on these abilities, the EBC 357X series includes three different display outputs, allowing flexibility of presentation without sacrificing visual power. Up to 16GB of dual DDR3L/SO-DIMM memory also assists with quicker Ultra HD 4k video display while allowing simultaneous operation of multiple applications, which can be embedded. The SBCs are beneficial in controlling and monitoring manufacturing equipment as well as providing real-time information for transportation facilities.

NEXCOM has moved all I/O components to the top side of the EBC 357X series, creating a compact and thinner design that avoids the need for cooling fans, perfect for HMI panels and battery-powered portable devices. The EBC 357X is the solution for those that desire a small yet powerful 3.5” computer, complete with two ports for M.2 B key and SATA storage, an expansion slot that supports both PCIe and SATA interfaces, and 2 x USB 3.0 slots for faster speeds, complemented by 4 x USB 2.0 slots for extra needs.

Main Features

  • Onboard Intel Atom® processor E39xx processor family
  • CPU upside down design
  • 2 x 204-pin SO-DIMM DDR3L
  • Triplex display: HDMI/VGA/LVDS
  • 1 x M.2 (2242) B key
  • 2 x Intel® i210-IT PCI express Gigabit Ethernet
  • 1 x SATA 2.0
  • 2 x USB 3.0, 4 x USB 2.0, 4-in/4-out GPIO, Mic-in, Speak-out
  • Serial port: 1 x RS232, 1 x RS232/422/485 port
  • Support AT/ATX mode and single +12VDC input

Ordering Information

EBC 357X-E3950 (P/N: 10E00035700X0) RoHS Compliant

Low power embedded board with Intel Atom® processor E3950 and extended -40˚C~85˚C, with HDMI/VGA/LVDS, 2 x USB 3.0, 4 x USB 2.0, 2 x COMs, 1 x M.2 B key, 2 x Gigabit LAN, 1 x SATA

EBC 357X-E3930 (P/N: 10E00035701X0) RoHS Compliant

Low power embedded board with Intel Atom® processor E3930 and extended -40˚C~85˚C, with HDMI/VGA/LVDS, 2 x USB 3.0, 4 x USB 2.0, 2 x COMs, 1 x M.2 B key, 2 x Gigabit LAN, 1 x SATA

The revised EBC 357X appears to be available now at an undisclosed price. More information may be found in Nexcom’s announcement and product page.

Dialog Semiconductor launches new BLE module for smartphone and medical applications

Posted on by mixos

Dialog Semiconductor has announced both the DA14531, Bluetooth 5.1 SoC, and the DA14531 module, to simplify Bluetooth product development and enable wider adoption. 

The chip, also known as SmartBond Tiny, is specifically designed to lower the costs of incorporating BLE functionality in an application, joining the industry’s desire to propel IoT towards a positive future. This arrives at the appropriate time as the popularity of wireless connectivity grows by the day: costs are expanding as a result, and Dialog’s technology intends to address these concerns.

The DA14531, for example, makes it possible to extend wireless connectivity to applications where it would have previously been prohibitive, in terms of size, power or cost, especially those within the growing connected medical field. SmartBond Tiny will help facilitate connectivity for inhalers, medicine dispensers, weight scales, thermometers, glucose meters and more.

SmartBond Tiny and the module use just half of the energy of their predecessors, the DA14580 and DA14580-based module, as well as all other offerings currently on the market. Tiny’s power consumption ensures a long operating and shelf life, even with the smallest of batteries. The DA14531’s integrated DC-DC converter enables a wide operating voltage (1.1 to 3.3V) and can derive power directly from environmentally-friendly, disposable silver oxide, zinc air or printable batteries required for high-volume applications, such as connected injectors, glucose monitors and smart patches.

For more information on the latest device, please visit: https://www.dialog-semiconductor.com/products/DA14531

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