Neural computing kit combines Atomic Pi SBC with Intel’s NCS2

Following the success of their last product; the Atomic Pi SBC which sold for only $34 and sold out multiple times, Team IoT, has returned with another successful Kickstarter project for a Neural Computing Development Kit that combines the Intel Cherry Trail-based Atomic Pi SBC with a 2GB RAM and 16GB eMMC, with Intel’s Neural Compute Stick 2 AI accelerator (NCS2).

The kit which comes with Ubuntu and intel’s OpenVINO preloaded on the Atomic Pi SBC to save users some startup time, also ships with an unnamed machine vision camera, a small breakout board, cables, and a 5V 5A power supply, making the kit all users need to develop AI-based solutions, out of the box, especially with the fact that the preloadedOpenVINO deep learning toolkit already comes with patches and code samples with pre-downloaded and pre-optimized models.

The Atomic Pi SBC around which the kit is based is an impressive SBC especially considering the $33 price which makes it surprisingly cheap for an Intel processor-based SBC. While there have been several reports about few issues around the board in the past, most of those issues seemingly stemmed from users loading a Windows 10 on the board instead of Linux, and this makes good guessing ground for the reasons behind the board being preloaded with Ubuntu (on a lighter note).

The embarrassing situations aside, the Atomic Pi is a rugged SBC, built around the Intel Atom x5-Z8350 Cherry Trail generation SoC, with 4x 14nm-fabricated cores clocked at 1.91GHz, which might be considered a “sell-off” product by many as Intel made a lot of them for an x86 smartphone wave that never hit and is the same SoC was used on Aaeon’s original, $99 UP board and DFRobot’s original $119 LattePanda SBC. The Pi maintains a 130 x 100 x 50mm form factor with a high profile that is a result of the huge heat sink slapped on top of the board. It is equipped with a gigabit Ethernet Port, WiFi-ac, Bluetooth 4.0, USB 2.0, micro-USB 3.0 OTG, and an HD-only HDMI port with audio output.  It also comes with a useful debug interface and a 9-axis IMU which might come in handy for certain projects.

Intel Neural Compute Module Stick 2

Apart from the Atomic Pi, the other key element in the Kit is the intel Neural Compute stick 2 for which Intel is assisting the team with support. The compute stick 2 which was released on December 2018 is an impressive upgrade to the Stick 1. it features the latest, 1TOP (trillion operations per second) Myriad X VPU which offers up to 10-times the performance of the Myriad 2 VPU and according to Intel, is designed “for applications requiring multiple neural networks running simultaneously”.  The 72.5 x 27 x 14mm form factor NCS2 typically pairs with intel’s OpenVINO toolkit, offloading video processing for deep learning and freeing up the CPU for other tasks. It is connected to the Atomic Pi via the onboard USB 3.0 port.

Starting at $99 (for early bird), the team is set to begin shipping the complete kit by late October/November.

More information on price, Kit specifications, and shipping timelines can be found on the project’s Kickstarter page.

UDOO X86 II SBC Combines Intel Braswell SoC with Microchip ATMega32U4 “Arduino” MCU

SECO, the company behind the brilliant UDOO X86, recently announced the release of another version of the board which is being called the UDOO X86 II SBC. While the UDOO x86 development board which was introduced in a crowdfunding campaign has grown in leaps and bounds with several accessories developed for it, It is falling into the same continuity predicament with several boards running an Intel Curie based processors due to the announcement by Intel to discontinue the production of the processors.

UDOO-x86-II

The Intel Currie processors were part of intel’s big bet on the x86 Smartphone wave which din’t quite pay off and it being discontinued by Intel meant the end to production for the UDOO x86. To mitigate this and give users continued access to the incredible power and performance provided by the UDOO x86 boards, SECO decided to branch off into another version of the board, offering the same features but replacing the Intel Curie module with the Atmega32u4 microcontroller which is the same Microcontroller on the Arduino  Leonardo.

According to SECA which referred to it as “the most powerful x86 maker board ever”, the UDOO x86 11 SBC combines Quad Core 64-bit new-generation x86 processors made and designed for the PC domain by Intel® with the Atmega2u4 microcontroller to deliver a board that can run all the software available for the PC world, from gaming and video streaming, to graphical editors and professional development platforms, while also giving users access to all the pecs of the Arduino™ Leonardo world, including the ability to build projects using the Leonardo compatible sketches, libraries and the official Arduino™ Leonardo IDE.

The new board’s line up comprises of two models;

  • The UDOO X86 11 Ultra
  • The UDOO X86 11 Advanced Plus

The difference between the two boards is in the SOC that was used on them and the features defined by it. The UDOO X86 11 Ultra runs on the Intel Pentium N3710 quad-core Braswell processor with up to 2.56 GHz speed, 8 GB DDR3L(dual channel), and an Intel HD Graphics 405 up to 700 MHz; 14nm process, 6W TDP. The Advanced Plus model, on the other hand, runs on an Intel Celeron N3160 quad-core Braswell processor with up to 2.24 GHz speed, 4 GB DDR3L (dual channel), and the Intel HD Graphics 400 up to 640 MHz; 14nm process, 6W TDP.

On the ATmega32U4 side, the boards feature the standard, Arduino Leonardo compatible pinouts with up to 12 analog input pins and 23 Digital I/Os which include 7 pwm enabled pins along with’ 1x UART, 1x I2C, and 1x SPI ports with the communication between the Braswell SOC and the ATmega32U4 Microcontroller done over an internal USB interface, just the same way Arduino Leonardo boards are connected to external PCs.

A summary of the features of the board is provided below.

  • SoC
    UDOO X86 II Ultra – Intel Pentium N3710 quad-core Braswell processor @ up to 2.56 GHz, Intel HD Graphics 405 up to 700 MHz; 14nm process, 6W TDP
    UDOO X86 II Advanced Plus – Intel Celeron N3160 quad-core Braswell processor @ up to 2.24 GHz, Intel HD Graphics 400 up to 640 MHz; 14nm process, 6W TDP
  • System Memory
    Ultra – 8 GB DDR3L dual-channel (soldered)
    Advanced Plus – 4 GB DDR3L dual-channel (soldered)
  • 32GB eMMC flash, standard SATA connector, M.2 Key B SSD slot, MicroSD card slot
  • 1x HDMI 1.4 port up to 4K @ 30 Hz, 2x miniDP++ connectors
  • Microphone + Headphone combo connector, speaker internal header, S/PDIF output
  •  Supports H.265/HEVC, H264, MPEG2, MVC, VC-1, WMV9, JPEG, VP8 Video Decoding
  • Supports  H.264, MVC, JPEG
  • Gigabit Ethernet, M.2 Key E slot for optional Wireless modules
  • USB 3.0 type-A sockets (x3)
  •  UART ports (x2)
  • LPC, 2x I2C, GPIOs
  • Touch Screen Management signals on expansion connector
  • Up to 20 extended GPIOs, multiplexed with other interfaces
  • MCU – Microchip ATmega32U4 8-bit AVR MCU @ 16 MHz with 2.5 KB SRAM, 32 KB flash, and 1 KB EEPROM
  • Arduino Leonardo-Compatible and compatible with most Arduino Shields 5V compliant.
  • Up to 23x digital I/O including; 7x PWM, 1x UART, 1xI2C, and 1xSPI
  •   12x analog Inputs
  • IR interface
  • Onboard RTC with Battery
  • 12V/3A via power barrel jack for Power Supply.

Both models of the board can run any of Windows 10, 8.1, 7,  Android x86 and any Linux distribution for x86 64-bit. Both models of the board are now available for sale on UDOO shop with the Ultra going for as much as $267 and the advanced plus at $164.

More information on the boards can be found on the product page on UDOO Shop and on the Product Documentation page.

Intelligent mmWave sensor antenna-on-package evaluation module

The IWR6843 antenna-on-package (AoP) evaluation module (EVM) is an easy-to-use mmWave sensor EVM with integrated, short-range, wide field-of-view (FoV) AoP technology, which enables direct connectivity to the mmWave sensors carrier card platform (MMWAVEICBOOST) and allows for stand-alone use.

IWR6843AOPEVM enables access to point-cloud data through a USB interface and raw analog-to-digital converter (ADC) data through a 60-pin high-speed connector.

This kit is supported by standard mmWave tools and software, including mmWave studio (MMWAVE-STUDIO) and the mmWave software development kit (MMWAVE-SDK). IWR6843AOPEVM with MMWAVEICBOOST can interface with the TI MCU LaunchPad ecosystem.

Features

  • 60-GHz to 64-GHz mmWave sensor
  • Integrated on-package 4RX/3TX antenna with 130º azimuth FoV and 130º elevation FoV
  • Supports 60-pin high-speed interface for host-controlling interface
  • Stand-alone mode for form-factor deployment and testing
  • Single USB cable for power and data

A 5-V 2.5-A supply brick with a 2.1-mm barrel plug (center positive), which is required for operation with MMWAVEICBOOST, is not included. TI recommends purchasing an external power supply that complies with applicable regional safety standards. This is not required for stand-alone operation.

To learn more, click here.

Compact AMD Ryzen™ SBC Featuring Four Independent 4K Displays

IBASE Technology Inc. (TPEx: 8050), a world leading provider of industrial computers and embedded computing solutions, releases the IB918 3.5-inch Disk-Size SBC based on the AMD Ryzen™ Embedded V1000/R1000 SoC. The IB918 allows system designers to create feature rich systems targeting panel PC, kiosk, POS, medical display and industrial applications.

Generating stunning 4K Ultra High-Definition resolution for sharper images provided by the integrated Vega GPU, IB918 can drive up to four independent displays via two HDMI (2.0a), a 24-bit dual channel LVDS and an eDP graphics output. It has two SO-DIMM sockets supporting fast data transfers with up to 32GB DDR4-2400 memory and ECC for data integrity. Flexible I/O connectivity and expansion ports come in the form of one USB 2.0, four USB 3.1, one SATA III, four COM, a 12V~24V DC input and two M.2 sockets (M/E Key).

The compact IB918 board comes with low power consumption AMD Ryzen™ APUs, namely the 64-bit quad-core V1605B (IB918F-1605) and the dual-core V1202B (IB918F-1202), R1606G (IB918F-1606G) and R1505G (IB918F-1505G). The models are equipped with an advanced TPM 2.0 chip, a high level of hardware-based security that enables cryptographic operations for access control and authentication to prevent phishing attacks and authorization value guesses on devices. Measuring 102 x 147mm, the SBC provides an optimal fan and heatsink cooling solution and supports an operating temperature range of 0°C to 60°C. The board supports both Windows 10 and Linux Ubuntu operating systems.

IB918 FEATURES:

  • AMD Ryzen™ Embedded V1000/R1000 SoC
  • 2x DDR4 SO-DIMM, Max. 32GB
  • 2x PCI-E Gigabit LAN
  • 2x HDMI, 1x eDP, 1x 24-bit LVDS dual-channel
  • 1x USB 2.0, 4x USB 3.1, 1x SATA III, 4x COM
  • 2x M.2 sockets (M/E key)

The IB918 is available now at an undisclosed price. More information may be found in Ibase’s IB918 announcement and product page.

STMicroelectronics BlueNRG-M0 Bluetooth module

The BlueNRG-M0 is a very low power network processor module for Bluetooth® low energy v4.2.

The BlueNRG-M0 is an easy to use Bluetooth® low energy master/slave network processor module, compliant with Bluetooth v4.2. The BlueNRG-M0 module supports multiple roles simultaneously, and can act at the same time as Bluetooth low energy sensor and hub device.

The entire Bluetooth low energy stack and protocols are embedded into BlueNRG-M0 module. The external host application processor, where the application resides, is connected to the BlueNRG-M0 module through a standard SPI interface.

The BlueNRG-M0 module provides a complete RF platform in a tiny form factor. Radio, antenna, high frequency and LPO oscillators are integrated to offer a certified solution to optimize the time-to-market of the final applications.

The BlueNRG-M0 can be powered directly with a standard 3 V coin cell battery, a pair of AAA batteries or any power source from 1.7 to 3.6 V.

Key features

  • Bluetooth v4.2 compliant
    • Supports master and slave modes
    • Multiple roles supported simultaneously
  • Embedded Bluetooth low energy protocol stack
    • GAP, GATT, SM, L2CAP, LL, RFPHY
  • Bluetooth low energy profiles provided separately
  • Embedded ST BlueNRG-MS network processor
    • Up to +8 dBm available output power
    • Down to -88 dBm Rx sensitivity
    • Up to 96 dB link budget with excellent link reliability
  • Host interface
    • SPI, IRQ, and RESET
    • On-field stack upgrading available via SPI
  • AES security co-processor
  • Certification
    • CE qualified
    • FCC, IC modular approval certified
    • TYPE qualified
    • BQE qualified
  • On-board chip antenna
  • Operating supply voltage: from 1.7 to 3.6 V
  • Operating temperature range: -40 °C to 85 °C

more information: www.st.com

Laptop Bench Power Supply with FAN controller

Zak Kemble build another great project. This time it’s a bench power supply with a laptop brick input. The power supply needed sufficient cooling so he added a small Fan and a controller a the edge of the board. He writes:

Many years ago (September 2009) I made a simple bench power supply using an LT1083 7.5A linear regulator with adjustable output voltage designed to be used with a 19.5V 3.42A laptop power supply. It still works fine after years of abuse, but my choice of output power connectors was poor (3 pin headers, the sort used for PC fans), it’s made on strip board and cooling was sometimes a problem, so time for an upgrade!

Laptop Bench Power Supply with FAN controller – [Link]

How to Design a Lithium Battery Pack

Adam Bender writes:

Designing a custom lithium battery pack is a fun way to learn about electricity and engineering. Lithium batteries can be used for countless applications including electric bikes, scooters, vehicles, backup power suppliers, off the grid solutions, and much more.

  1. How Lithium Battery Cells Work
  2. Basic Electricity Fundamentals
  3. How Many Cells to Put in a Battery Pack
  4. How to Join Cells Together 5. BMS, Charging, and Circuit Diagram

How to Design a Lithium Battery Pack – [Part1] [Part2]

Tesmo – The Invisible & Portable Adhesive Laptop Stand quick review

Tesmo Kickstand weighs only 17g yet able to hold up to 17.6lbs, and the reusable design gives you the mobile convenience than ever.

Tesmo Kickstand is a great little accessory for your laptop, but not limited. It can easily be used on tablets and mobile phones as well. It’s a lightweight and foldable stand that help you use your laptop in an easy and convenient way by adjusting it’s positioning.

Tesmo Kickstand close-up

With only 0.6 oz(17g), Tesmo Kickstand is the world’s smallest invisible laptop stand. Tesmo Kickstand is strong and durable that can hold up to 17.6lbs of weight. Attaching and removing are both incredibly easy, and it won’t leave any residue on the surface, making it easily the world’ best invisible Laptop Stand.

Thanks to Tesmo Kickstand’s special glue, it’s not only durable and strong, you can  also detach and leave no residue on the surface, and re-attach Tesmo Kickstand with the same strong effectiveness.

Usage Video

The Tesmo Kickstand is live on Kickstarter, already funded and has 9 days to go. Pledges start from 15 USD for 1 pair of Tesmo.

CORRECTION 6/10/2019: The pads of Tesmo should be folded to the rear of laptop as shown on the image below to achieve maximum stability. Video shows this the wrong way.

TechNexion XORE is a tiny NXP i.MX 8M Mini LGA System-on-Module

There are several ways to design a system-on-module to carrier board interface, one method is to design an LGA (Land Grid Array) module, which have to be soldered straight unto the carrier board, and enables much more compact system-on-modules, and that’s exacty what TechNexion has done with their XORE family of LGA system-on-module currently powered by the 14-nm NXP i.MX 8M Mini processor.

TechNexion XORE module specifications:

    • SoC (one of the other)
      • NXP i.MX8M Mini Solo single Arm Cortex-A53  @ 1.8 GHz + M4 processor, Vivante GC7000Lite 3D GPU
      • NXP i.MX8M Mini Dual 2x Arm Cortex-A53 @ 1.8 GHz + M4 processor, Vivante GC7000Lite 3D GPU
      • NXP i.MX8M Mini Quad 4x Arm Cortex-A53 @ 1.8 GHz + M4 processor, Vivante GC7000Lite 3D GPU
    • System Memory + storage – Up to 4GB LPDDR4 and 16 GB eMMC flash (default) in single package (MCP)
  • Video – Decode: 1080p60 H.264; encode: 1080p120 H.264
  • LGA package
    • 4-lane MIPI CSI
    • MIPI DSI
    • RGMII (Gigabit Ethernet)
    • PCIe
    • USB, USB OTG
    • I²S
    • SDIO
    • UART, SPI, I²C, PWM, GPIO
  • Power Supply – 5V DC; ROHM BD71847 PMIC
  • Dimensions – 30 x 30 mm
  • Weight – 5 grams
  • Temperature Range – Commercial: 0° to +60° C; extended: -20° to +70° C; industrial: -40° to +85° C
  • Relative Humidity – 10 to 90 %
  • MTBF – >100 000 Hours
  • Shock – 15G half-sine 11 ms duration
  • Vibration – 1 Grms random 5-500Hz hr/axis
  • Certifications – CE / FCC / RoHS / REACH

The company provides support for Linux, Yocto, Ubuntu and Android for the module.

XCORE-WIZARD-IMX8M-Mini Development Board

There’s also a development board based on the XORE-IMX8M Mini LGA SoM, but at the time of writing there’s no product page, and instead, we can learn more about it in the video embedded further below.

Key features:

  • SoM – XORE-IMX8M Mini Module soldered on board
  • Display – MIPI DSI connector with optional adapters
  • Camera – MIPI CSI connector for optional 5MP autofocus module
  • Audio – 3.5mm audio jack
  • Connectivity
    • Pre-certified 802.11ac WiFi 5 & Bluetooth 5 module
    • 2x SIM card slots
  • USB – 1x micro USB, 2x USB 2.0 ports, 1x USB type-C port
  • Expansion
    • Raspberry Pi expansion header for HAT add-on boards
    • 2x Click slots
    • mPCIe slot
    • M.2 slot
  • Debugging – Serial to USB cable
  • Misc – Reset button
  • Power Supply – Power barrel jack

You may find more details on the product page. Price starts at $75 per unit for a quad-core module with 2GB RAM and 16GB eMMC flash. While the modules are listed in the company’s online shop, the video above says the module is still under development, and the shop mentions a 16-week lead time if there is no stock.  No availability nor price information have been made public for the development kit.

via www.cnx-software.com

Mesh networking modules ease IoT device design

Silicon Labs has introduced a new range of integrated, secure Wireless Gecko modules which make it easier to add robust mesh networking connectivity. By Ally Winning @ eenewsembedded.com

MGM210x and BGM210x Series 2 modules support Zigbee, Thread, Bluetooth mesh, Bluetooth Low Energy and multiprotocol connectivity. The xGM210x modules are pre-certified for North America, Europe, Korea and Japan, minimizing the time, cost and risk factors when designing a product for global wireless certifications.

The modules are based on Silicon Labs’ Wireless Gecko Series 2 platform. The platform offers industry-leading RF performance, an Arm Cortex-M33 processor, best-in-class software stacks, a dedicated security core and up to +125 oC operating temperatures. They also feature an integrated RF power amplifier.

There and two initial families in the Series 2 module portfolio. The first is optimised for LED light bulbs and the second is a versatile PCB form-factor module for a broad range of miniature IoT designs.

xGM210L modules feature a custom form factor for mounting inside LED bulb housings, PCB trace antenna to maximise wireless range, high temperature ratings, extensive global regulatory certifications and low active power consumption.

xGM210P modules come in a PCB form factor and offer an integrated chip antenna and minimal clearance areas for mechanics.

For security, xGM210x modules provide secure boot with root of trust and secure loader (RTSL) technology helps prevent malware injection and rollback for authentic firmware execution and OTA updates. A dedicated security core is available to isolate the application processor and deliver quick, cryptographic operations with differential power analysis (DPA) countermeasures. It also has a true random number generator (TRNG) that is compliant to NIST SP800-90 and AIS-31. A secure debug interface with lock/unlock allows authenticated access for enhanced failure analysis. The module’s Arm Cortex-M33 core integrates TrustZone technology.

Silicon Labs’ Simplicity Studio IDE has comprehensive software stacks, application demos and mobile apps to speed up development. A network analyzer and energy profiler help optimise wireless performance and energy consumption.

More information: www.silabs.com/series-2-modules

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