3.3V/3A, Wide-Input, Synchronous, Step-Down DC-DC Reference Design

The MAXREFDES1048 synchronous step-down dc-dc converter reference design from Maxim Integrated Products is based on the MAX17504, a high-efficiency, high-voltage, synchronously rectified step-down converter with dual integrated MOSFETs can operate over a 4.5V to 60V input. The MAXREFDES1048 reference design operates over an input voltage range of 18- to 36-Vdc and delivers an output of 3A.

The MAX17504 can deliver up to 3.5A and generates output voltage from 0.9V to 90% VIN. Built-in compensation across the output voltage range eliminates the need for external components. The feedback (FB) regulation is accurate to within ±1.1% over -40°C to +125°C. The devices are available in a compact (5mm x 5mm) TQFN lead (Pb)- free package with an exposed pad. Simulation models are available.

The MAX17504 features a peak-current-mode control architecture with a MODE feature that can be used to operate the device in pulse-width modulation (PWM), pulse-frequency modulation (PFM), or discontinuous mode (DCM) control schemes.

MAXREFDES1048 evaluation board

PWM operation provides constant frequency operation at all loads and is useful in applications sensitive to switching frequency. PFM operation disables negative inductor current and skips pulses at light loads for high efficiency, allowing the DCM to feature constant frequency operation down to lighter loads than PFM mode.

A programmable soft-start feature allows users to reduce input inrush current. The device also incorporates an output enable/ undervoltage lockout pin (EN/UVLO) that allows the user to turn on the part at the desired input voltage level. An open-drain RESET pin provides a delayed power-good signal to the system upon achieving successful regulation of the output voltage.

Key benefits and features of the MAX17504 include the following:

  • Eliminates external components and reduces total cost
  • Reduces number of dc-dc regulators to stock
  • Reduces power dissipation
  • Operates reliably

more: www.maxim-ic.com

FriendlyELEC ZeroPi is a Tiny Allwinner H3 SBC with Gigabit Ethernet, USB, an Optional SPI Flash

FriendlyELEC has recently launched a new family of boards called the “ZeroPi”. While they go by a name similar to that of the Arduino Zero Compatible development kit for robotic motion structure systems, the FriendlyElec ZeroPi boards are tons different as they feature an Allwinner H3 processor, a Gigabit Ethernet and are very similar to the fairly popular NanoPi NEO boards but they do not come with any I/O headers asides from breakout pins for serial communication.

The Zero Pi

The board was designed for users who would be connecting most of their peripherals over USB which explains why it does not come with headers. The board comes with a Micro SD card slot through which the operating system is booted but it also comes with the option to boot from the network (without the need of a microSD card) via the SPI flash.

Some of the ZeroPi specifications are highlighted below:

  • CPU: Allwinner H3, Quad-core Cortex-A7 Up to 1.2GHz
  • DDR3 RAM: 256MB/512MB
  • Connectivity: 10/100/1000Mbps Ethernet
  • USB Host: Type-A x 1
  • MicroSD Slot x 1
  • MicroUSB: for power input only
  • Debug Serial Port: 4Pin, 2.54 mm pitch pin header
  • Power Supply: DC 5V/2A
  • PCB Dimension: 40 x 40 x 1.2mm
  • Working Temperature: -20℃ to 70℃
  • Weight: 15g
  • OS/Software: u-boot, UbuntuCore

The ZeroPi runs the FriendlyElec’s FriendlyCore distro which users will need to download and flash there SD Card with. Since the FriendlyCore is based on the same distro like Debian, Ubuntu, OpenWrt, and DietPi, it comfortably supports any of them and they can all be used as the operating system for the ZeroPi. The compatibility with friendly core also brings support for the features listed below to the ZeroPi:

  • Support LCDs with both capacitive touch and resistive touch
  • Support WiFi (USB WiFi)
  • Support Ethernet
  • Supports Bluetooth
  • Supports audio playing (HDMI Audio)
  • Supports USB cameras and other USB Peripherals
  • Supports Qt 5.10.0 EGLES and OpenGL ES1.1/2.0

The 512Mb RAM version of the board is currently on sale for $12.99 on FriendlyELEC store with a metal or acrylic enclosure add-on for a few extra dollars. More information on the boards can be found on the product page or the ZeroPi wiki page.

Boxer-8110AI is a Compact, rugged industrial AI computer that runs Linux on TX2

Aaeon has announced the release of the Boxer-8110AI embedded computer.  The Compact board which is similar to Aaeon’s Boxer-8120A which was released in May is based on the Nvidia Jetson Tx2 Module and is capable of running Linux distros like Ubuntu.

While it offers a more compact size (110 x 65 x 40mm), just like the Boxer-8120A, the Boxer-8110AI it comes with 8GB of LPDDR4 RAM, 32GB eMMC 5.1, and a MicroSD slot. The board also comes with communication support like the Gigabit Ethernet, HDMI, CAN and Serial Communication.

Designed for industrial applications, to meet the physical requirement of industrial environments, the board comes with anti-vibration features (3 Grms/ 5 ~ 500Hz/ operation – eMMC), supports /tolerate extreme temperature levels between the range of -20 to 50°C with 0.5 m/s AirFlow according to IEC60068-2 for Industrial Device, withstand humidity values up to 95% @ 40°C non-condensing, and comes with CE and FCC Class A certification ensuring it won’t be a source of disruption to other systems.

Some of the critical features of the embedded computer are highlighted below:

  • Based on NVIDIA Jetson TX2
  • HMP Dual Denver 2 + Quad ARM A57 CPU
  • Support Linux Ubuntu 16.04
  • 8GB LPDDR4, 32GB eMMC 5.1
  • HMP Dual Denver 2 + Quad ARM A57
  • HDMI 2.0 x 1, USB3.0 x 2
  • RS-232 x 1, CANBUS x 2 Channel
  • OTG x 1
  • LAN x 1
  • MicroSD x 1

The Nvidia’s Jetson TX2, which the Boxer-8110AI is based, is equipped with an Arm-based Tegra-family SoC with dual Cortex-A72-like “Denver” cores and 4x -A57 cores. The SoC incorporates 256-core Pascal graphics, supported with CUDA libraries for AI, vision processing, GPU-accelerated parallel processing, and deep/machine learning. Its integration on the Boxer-8110AI means it will be bringing all of these features and capabilities to the embedded computer.

Aside from the different range of AI frameworks including Tensorflow, Caffe2, and Mxnet, which are compatible with the Nvidia Jetson, users can also install their own AI inference software on the device making the BOXER-8110AI the perfect embedded computer for industrial edge AI applications.

The BOXER-8110AI’s CANbus and rugged design features (anti-dust measures, aluminum chassis, wide operating temperature range) means it can support industrial automation and in-vehicle applications. With its powerful processor and cost-effective design, this is one AI platform you’ll be able to install anywhere.

The Boxer-8110AI has a 12V DC input via a terminal block through which it is powered and it ships with a wall-mount kit used for mounting it to the wall.

The embedded computer is currently available for $1,033 ($34 cheaper than the Boxer-8120A) on Aaeon’s product and shopping pages.

MIT engineers build advanced microprocessor out of carbon nanotubes

New approach harnesses the same fabrication processes used for silicon chips, offers key advance toward next-generation computers. by Rob Matheson | MIT News Office

After years of tackling numerous design and manufacturing challenges, MIT researchers have built a modern microprocessor from carbon nanotube transistors, which are widely seen as a faster, greener alternative to their traditional silicon counterparts.

The microprocessor, described today in the journal Nature, can be built using traditional silicon-chip fabrication processes, representing a major step toward making carbon nanotube microprocessors more practical.

Silicon transistors — critical microprocessor components that switch between 1 and 0 bits to carry out computations — have carried the computer industry for decades. As predicted by Moore’s Law, industry has been able to shrink down and cram more transistors onto chips every couple of years to help carry out increasingly complex computations. But experts now foresee a time when silicon transistors will stop shrinking, and become increasingly inefficient.

Making carbon nanotube field-effect transistors (CNFET) has become a major goal for building next-generation computers. Research indicates CNFETs have properties that promise around 10 times the energy efficiency and far greater speeds compared to silicon. But when fabricated at scale, the transistors often come with many defects that affect performance, so they remain impractical.

The MIT researchers have invented new techniques to dramatically limit defects and enable full functional control in fabricating CNFETs, using processes in traditional silicon chip foundries. They demonstrated a 16-bit microprocessor with more than 14,000 CNFETs that performs the same tasks as commercial microprocessors. The Nature paper describes the microprocessor design and includes more than 70 pages detailing the manufacturing methodology.

The microprocessor is based on the RISC-V open-source chip architecture that has a set of instructions that a microprocessor can execute. The researchers’ microprocessor was able to execute the full set of instructions accurately. It also executed a modified version of the classic “Hello, World!” program, printing out, “Hello, World! I am RV16XNano, made from CNTs.”

“This is by far the most advanced chip made from any emerging nanotechnology that is promising for high-performance and energy-efficient computing,” says co-author Max M. Shulaker, the Emanuel E Landsman Career Development Assistant Professor of Electrical Engineering and Computer Science (EECS) and a member of the Microsystems Technology Laboratories. “There are limits to silicon. If we want to continue to have gains in computing, carbon nanotubes represent one of the most promising ways to overcome those limits. [The paper] completely re-invents how we build chips with carbon nanotubes.”

Joining Shulaker on the paper are: first author and postdoc Gage Hills, graduate students Christian Lau, Andrew Wright, Mindy D. Bishop, Tathagata Srimani, Pritpal Kanhaiya, Rebecca Ho, and Aya Amer, all of EECS; Arvind, the Johnson Professor of Computer Science and Engineering and a researcher in the Computer Science and Artificial Intelligence Laboratory; Anantha Chandrakasan, the dean of the School of Engineering and the Vannevar Bush Professor of Electrical Engineering and Computer Science; and Samuel Fuller, Yosi Stein, and Denis Murphy, all of Analog Devices.

read more

Compact module taps AMD’s Ryzen Embedded V1000

Arbor Technology recently announced the specifications for a new board, a COM Express Compact Type 6 module called the EmETXe-a10M0. The board which is based on AMD’s Ryzen Embedded V1000 SoC with up to 32GB of memory plus a GBE Controller and triple display support joins several other V1000-based modules that use the 95 x 95mm Compacts Type 6 form factor such as Seco’s COMe-B75-CT6, Ibase’s ET976, and the Kontron’s COMe-cVR6 which is also now available with the scaled-down Ryzen Embedded R1000.

The EmETXe-a10M0 comes Ubuntu ready and can run either of Ubuntu Linux or Windows 10 on your choice of three quad-core V1000 models which have been soldered down to the board to improve general reliability.

The EmETXe-a10M0 is a feature-rich board with a V1807B clocked at 3.35GHz/3.8GHz which has a Vega GPU with 11 compute units, making it 3 compute units better than the ones before him like the V1605B (clocked at 2.0GHz/3.6GHz) and the V1756B (clocked at 3.25GHz/3.6GHz)which both have Vega GPUs with 8 GPU Computeunits.

The module is equipped with up to 32GB DDR4 via dual sockets. It supports triple independent displays by way of 3x DDI interfaces with a choice of 24-bit LVDS or optional DisplayPort. The module also comes with an HD audio codec on board along with a GbE controller (Intel i210IT) and support for 2x SATA III, 8x PCIe x1, and PCIe x8. Additional I/O includes 4x USB 3.1, 8x USB 2.0, 2x UART, 8-bit DIO, LPC, and SPI with a watchdog and optional TPM 2.0.

The board can be powered via it’s 5-20V power input with a power consumption of 2.39A when powered from a 12V power supply unit using the lower end V1605B. Physicall the module supports temperatures between -20 to 70ºC with a 10 ~ 95% @ 70ºC (non-condensing) humidity tolerance.

Some of the features of the board are highlighted below:

  • Soldered onboard AMD V1605B/V1756B/B1807B APU Processor
  • Integrated Gigabit Ethernet
  • Dual Channels 24-bit LVDS, with resolution up to 1920 x 1200 @60Hz with 3 x DDI ports
  • Support 3 independent displays
  • 2 x DDR4 ECC SO-DIMM sockets, supporting up to 32GB SDRAM
  • AMI UEFI BIOS
  • 1~255 levels reset Watchdog timer
  • 12 x USB ports: 8 x USB 2.0 port and 4 x USB 3.1 ports
  • 2 x UART ports (RX/ TX only)
  • 8 x PCIe x1 lanes, 1 x PCIe x8 lane, LPC, SPI Expansion busses
  • 2 x Serial ATA ports with 600MB/s HDD transfer rate
  • HD audio link
  • Windows 10 64-bit or Linux: Ubuntu compatible

Additional accessories that could be ordered along with the boards include a heat spreader, heat sink, cable kit, and an unspecified ATX form-factor carrier board.

While no pricing information has been provided yet for the EmETXe-a10M0, we expect this might change soon and will be updated on the EmETXe-a10M0 product page. More information about the board and its capabilities can also be found on the product page.

Fairphone’s Sustainable and Repairable mobile phone Launches Out Soon

With the latest release from the Dutch social enterprise, the desire for a modular and sustainable smartphone that supports a kinder world can become a reality after all. Built with care for people and for the planet, Fairphone3 has got everything you’d expect from a great phone and even more.

The Fairphone 3

Designed with replaceable parts made from sourced and recyclable materials, the ethical, reliable and sustainable Fairphone 3, features seven module parts in it – the back cover, display, top module (the cameras and sensors), speaker module, battery, bottom module (the USB type- C/microphone) and  the camera module (primary camera), which are all easy to repair and replace. The conflict-free recyclable materials from which it was made is easy to repair and reduces its CO2 emissions thereby reducing its carbon footprint.

 “From the earth to your pocket, a smartphone’s journey is filled with unfair practices. We believe a fairer electronics industry is possible. By making the change from the inside, we’re giving a voice to people who care. This is the phone for all of us who date to care about what kind of a world we’re creating with our purchase decisions. For all of us who want a great phone that is kinder to people and to the earth. For all of us who believe that care for workers and our planet ought to be a natural part of doing business.”

The Fairphone 3 Dismantled.

Asides having an internal storage capacity of 64Gb and an extra storage micro SD card slot of 200Gb, the smartphone also has a 12MP rear camera (f/1.8, Dual Pixel PDAF), an 8MP from the camera (f/2.0) and a 5.65-inch HD touchscreen display (21260 X 1080/427ppi).

Fairphone 3 specifications:

  • Chipset
    • Qualcomm Snapdragon 632
  • Connectivity
    • Wi-Fi
    • Bluetooth 4.2 LE, GPS NFC
  • Display
    • 5.7 inch Full-HD (18:9) Corning Gorilla Glass 5
  • Operating System
    • Android 9 (Pie)
  • SIM slots
    • Dual nano-SIM
  • Camera Modules
    • 12MP/8MP
  • Battery
    • 3000mAh removable, with fast charging
  • Memory
    • 4GB RAM
    • 64GB internal storage
    • Expandable storage via MicroSD slot
  • Modular design
    • 7 modules for easy repair
  • Network
    • 2G, 3G, 4G, VoLT

For the hardware, Fairphone 3 has a Qualcomm Snapdragon 632 with Adreno 506/650 GPU and a 64-bit Kryo 250 octa-core CPU, while on the outer part; the sensor suite (for accelerometer, compass, light, barometer, gyroscope, proximity), the external speaker, the USB Type-C port and a 3.5mm headphone jack. It is also equipped with Bluetooth 5/LE, 2.4 and 5GHz Wi-Fi and NFC for wireless connections alongside 2G, 3G and 4G LTE with Dual-Nano SIM for mobile network connections.

While we await its launch on soon, Fairphone 3 is now available for pre-order at about $495. It ships in with a 2-year warranty, a quick start guide together with a mini-screwdriver that you can use for repairs, a bumper, and an Android Pie.

3.5-inch SBC and embedded PC feature Whiskey Lake-UE

Vecow Co., Ltd., a team of embedded expert, today announced the launch of EMBC-3000 3.5” SBC and SPC-5200 Slim Fanless System. Powered by the 8th Gen Intel® Core U-Series (Whiskey Lake) platform, EMBC-3000 and SPC-5200 feature outstanding performance, compact design, system-oriented integration and industrial-grade reliability, aiming at embedded solutions for Intelligent control, machine vision, In-vehicle computing, factory automation, gaming, AGV/AGR and any Industrial 4.0 and AIoT applications.

Based on the 8th Gen Intel® Core™ U-series processor that delivers power-efficient performance in a 15 Watt and high connectivity, Vecow EMBC-3000 and SPC-5200 offer DDR4 2400MHz SO-DIMM with up to 32GB memory and versatile I/O capabilities including 4 USB 3.1 Gen 2 with 10Gbps data transfer, 4 COM RS-232/422/485, 16 isolated DIO, 1 SIM card socket, 2 Mini PCIe slot (8GT/s) and 2 SATA II (6G) ports. Running on Intel® UHD Graphics 620, Vecow EMBC-3000 supports up to triple independent displays with Displayport, DVI-D and dual channel 24-bit LVDS display interface. Designed for a low profile, with dimensions of 146mm x 102mm, EMBC-3000 offers full functions SUMIT A, B for expansion for 10GigE LAN, GigE LAN and PCIe slot for graphics cards, USB adaptor and video card connectivity.

With AIoT technology becoming widespread, Vecow EMBC-3000 and SPC-5200 support Intel® OpenVINO toolkit to fulfil requirements of AIoT applications. Also, these two products provide TPM 2.0, iAMT 12.0, Wake on LAN, and PXE for smart manageability. Thanks to the compact design, Vecow SPC-5200 offers optional 1U high rackmount, making it is ideal for space-limited applications. It supports 4 GigE LAN with 2 PoE, 9V to 48V power input, remote power switch and ignition control, delivering must-have features for in-vehicle computing applications. Vecow EMBC-3000 and SPC-5200 are designed for used in industrial applications. EMBC-3000 has proven reliable operation at temperature range from -40∘C to 85∘C, fanless, rugged SUMIT connection, EN50155 and EN50121-3-2 compliant.

“We are so proud to bring Vecow EMBC-3000 3.5” SBC, along with SPC-5200 fanless embedded system, to the market.” said Hugh Hsu, Senior Product Manager, Embedded System & Platform Division at Vecow. “Two products are based on quad-core Intel® Whiskey Lake processor and deliver outstanding performance, flexibility and expandable functions. They meet requirements of modern embedded applications that have been revolving diverse and complex.”

“We are excited to introduce these two products to our customers and we will be exhibiting at CIIF 2019/IAS in September from 17 to 21, 2019 in China.” said Johnson Hsu, Great China Sales Director, Sales & Marketing Division at Vecow. “We can’t wait to presents SPC-5200 and EMBC-3000 to our partners and customers.”

Featuring the new 8th Gen Intel® Core™ U-series processor, Vecow SPC-5200 and EMBC-3000 series offer outstanding performance, highly compact design and system-oriented integration. They are ideally suited for intelligent control, machine vision, In-vehicle computing, factory automation, gaming, AGV/AGR and AIoT/ Industrial 4.0 applications.

No pricing or availability information was provided for the EMBC-3000 SBC and SPC-5200 computer. More information may be found in Vecow’s announcement and the
EMBC-3000 and SPC-5200 product pages.

For more Vecow Industrial Motherboards and Ultra-compact Embedded System, please visit EMBC-3000 product page and SPC-5200 product page or www.vecow.com

Samsung announces 5G-capable Exynos processor

Samsung Electronics Co. Ltd. has announced the Exynos 980 processor with an integrated 5G modem capable of download speeds of up to 2.55Gbps. report by Peter Clarke @ eenewsembedded.com

The chip is designed in Samsung’s 8nm manufacturing process technology and the CPU has a six-two split little-big architecture divided between two 2.2GHz Cortex-A77 cores and six 1.8GHz Cortex-A55 cores.

There is a Mali G76 MP5 graphics processor unit so Samsung has stuck with ARM GPU for now (see ARM gets a rival as AMD licenses graphics IP to Samsung) and a dedicated neural processing unit. The integrated modem conforms to 5G New Radio and achieves 2.55Gbps sub-6GHz download and 1.28Gbps upload. The modem also supports LTE at 1Gbps download and 200Mbps upload.

The chip supports an extreme display size of 3360 by 1440 pixels and for video 4K UHD 120fps encoding and decoding with HEVC (H.265), H.264 and VP9 codecs.

Rather than being coupled with a separate 5G modem, the 5G-enabled Exynos 980 not only helps reduce power consumption but also increase the space efficiency within a device.

The neural processing unit (NPU) features elevated performances of up to 2.7 times compared to its predecessor and is built into the Exynos 980 to provide new levels of on-device intelligence.

The modem also supports the incoming Wi-Fi 6 standard, IEEE 802.11ax, that provides faster speed and greater stability for seamless online gaming and smooth high-resolution video streaming over Wi-Fi networks.

“With the introduction of our 5G modem last year, Samsung has been driving in the 5G revolution and paved the way towards the next step in mobility,” said Ben Hur, vice president of System LSI marketing at Samsung Electronics, in a statement. “With the 5G-integrated Exynos 980, Samsung is pushing to make 5G more accessible to a wider range of users and continues to lead innovation in the mobile 5G market.”

The Exynos 980 is expected to begin mass production by the end of 2019.

Related links and articles: www.samsung.com

Riverdi IoT Displays for Next Level IoT Projects

Designed and produced with everything an IoT engineer might need, the python-programmable ESP32– powered IoT display by Riverdi is an expandable, cloud-ready GUI with a sleek design, low power consumption and top of the line graphical capabilities for high-quality IoT projects.

Riverdi Display

The Riverdi IoT displays comes in 3 different versions – 5″ resistive touch panel, 5″ capacitive touch panel, and 5″ Ux touch panel (with a decorative black or white cover glass) – each of which has great features like 800×480 resolution, SPI interface and 510 cd/m2 brightness. Each display can be programmed without any limitation in Python or C/Python with the Integrated Zerynth license onboard. With about 15 lines of codes, you should be able to connect a sensor to the cloud, thanks to the simplicity of Python and the efficiency of Zerynth toolchain. The Zerynth toolchain offers hardware encryption, multi-threaded applications, firmware over the air updates, advanced power management, Blockchain libraries, among many others.

The system architecture is simplified for human-machine interfaces (HMI) by the Bridgetek graphics controller, BT81x (a part of the family of advanced graphics controllers) or EVE3  on the Riverdi IoT display which is responsible for the audio, display and touch functionalities including an object-oriented architectural approach that goes from creating display to rendering graphics.

Back View of the Display

Every IoT display has two Grove connectors and two MicroBUS sockets that offer a simple and easy way to expand the display through many SeedStudio Twigs and MikroElektronical Click Boards. On each click board and Twig, you can choose any functionality that you want to be added to your display: temperature and humidity sensors, text to speech converters, UV sensors, voltage regulators, RF transceivers, buttons, switches, and motor control. In no time, you’d have your customized IoT project in your hands.

Also, the Espressif ESP32, ideal for low power IoT applications and wearable electronics, is located on these IoT display. The ESP32 integrates WiFi and Bluetooth so you can connect your display to the cloud as well as send and receive data via the cloud. The ESP32 combines the WiFi (that ensures your module can directly connect to the internet), the Bluetooth (that allows you to connect a smartphone) and the Bluetooth low energy (to broadcast low energy beacons for detection).

Learn more about the different versions of the displays on Riverdi IoT display category page. In case you are not so skilled with programming in python, visit the Zerynth Academy for its many tutorials and articles on python.

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