Mitsubishi Electric to Launch MelDIR Thermal Diode Infrared Sensor

Accurately detects heat to identify types of heat sources and specific human behavior

Mitsubishi Electric Corporation announced that it will launch the Mitsubishi Electric Diode InfraRed sensor (MelDIR), a thermal sensor for applications in the fields of security, heating, ventilation and air conditioning (HVAC) and smart buildings, on November 1. MelDIR accurately distinguishes between humans and other heat sources and enables the identification of specific human behavior, such as walking, running or raising hands. It delivers high-pixel, high-thermal-resolution images using thermal diode infrared sensor technology that Mitsubishi Electric developed for the Advanced Land Observing Satellite-2 “DAICHI-2” (ALOS-2).

Features

1) High-pixel, high-thermal-resolution images

  • 10 times higher pixel resolution (80×32 pixels) and five times higher thermal resolution of 100 mK, or 0.1 degree Celsius, compared to 16×16 pixel thermopile sensors now sold in the market, using thermal diode infrared sensor technology installed in the Compact InfraRed Camera (CIRC) for observing the earth with the ALOS-2, which Mitsubishi Electric delivered to the Japan Aerospace Exploration Agency in 2014 and is now in operation.
  • Supporting legs, made extra thin thanks to microfabrication technique, convey energy efficiently without releasing heat, enabling more (smaller) pixels to be used for increased resolution.
  • Electrical noise minimized by mounting thermal diode and high-spec amplifier close to each other on same chip, helping to maintain accuracy and achieve high thermal resolution.
  • Enables highly detailed thermal images for distinguishing between humans and other heat sources and for identifying specific human behavior, such as walking, running or raising hands.

2) Compact, space-saving sensor developed with proprietary chip-scale vacuum-sealing technology

  • Package is 80 percent smaller than that of existing sensors thanks to new packaging technology.
  • Proprietary chip-scale packaging technology and vacuum-sealing technology enable sensor to be vacuum sealed (without using conventional ceramic package) to avoid heat radiation and achieve high thermal resolution.

more information: www.mitsubishielectric.com

Microchip’s SAM R30 Sub-GHz Module for Ultra-Low-Power WPAN Designs

Mouser Electronics is now stocking the SAM R30 sub-GHz module from Microchip Technology. The industry’s smallest IEEE 802.15.4-compliant module, the SAM R30 combines an ultra-low-power microcontroller with a sub-GHZ radio in a 12.7 × 11 mm package, enabling long-lasting battery life in space-constrained designs like wireless-networked sensors and controls in home automation, smart city, and industrial applications.

The Microchip SAM R30 module, available from Mouser Electronics, is based on a Microchip SAMR30E18A system-in-package (SiP) with 32-bit Arm® Cortex®-M0+ core and up to 256 Kbytes of flash and 40 Kbytes of RAM. Designed for use in unlicensed sub-1GHz frequency bands worldwide — such as 780 MHz (China), 868 MHz (Europe), and 915 MHz (North America) — the module delivers receive (RX) sensitivity up to -105 dBm and transmit (TX) output power up to +8.7 dBm.

The module offers twice the connectivity range and better communication through walls and floors than similarly powered devices using the 2.4 GHz frequency band. Featuring an ultra-low-power sleep mode of under 800 nA, the SAM R30 module is ideal for Internet of Things (IoT) sensor applications that require long battery life. Further, developers can implement propriety point-to-point, star, or self-healing mesh networks with Microchip’s MiWi™ protocol stack.

Features

  • Compact 802.15.4 Sub-1GHz module
  • ATSAMR30E18A SiP with ARM Cortex-M0+ MCU and Sub-1GHz transceiver
  • Integrated Ultra Low Power Transceiver for 700/800/900MHz ISM band
  • 256KB Flash
  • 16 Input/Output pins
  • Maximum operating frequency 48MHz
  • 128-bit Advanced Encryption Standard (AES) crypto engine
  • 32-bit Medium Access Control (MAC) symbol counter
  • Automatic retransmission modes
  • Single 1.8-3.6V supply
  • FCC / ETSI compliant RF front end with a harmonic filter
  • Two Serial Communication interface (SERCOM) units left for external applications
  • High precision 16MHz crystal oscillator
  • 12-bit, 350ksps Analog-to-Digital Converter (ADC)
  • I2C up to 3.4MHz
  • Full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface
  • 16 External General Purpose Input/Output (GPIO) lines

Mouser also stocks the SAM R30M Xplained Pro Evaluation Kit, which includes an onboard embedded debugger, QTouch® button, two Xplained Pro extension headers, and embedded current measurement circuitry. The board features both a chip antenna and an SMA connector for an external antenna, a digital temperature sensor, and USB-UART/I2C convertor. The board is supported by the Atmel Studio integrated development platform, which provides predefined application examples.

Both the module and the evaluation kit are certified with the Federal Communications Commission (FCC), Industry Canada (IC), and Radio Equipment Directive (RED), allowing designers to focus on time-to-market instead of RF testing certification costs.

For more information on the SAM R30 module, visit www.mouser.com/microchip-atsamr30m18a-modules.

AI Compute Acceleration Startup Builds the Largest Chip Ever For Deep Learning Applications

To meet the ever-increasing computational demands of AI, California based AI startup, Cerebras Systems, just recently unveiled its very first announced element claimed to be the most massive AI chip ever made. With an astounding measurement of 46,225 mm2 (up to 56.7 times more than the largest graphics processing unit) and more than 1.2 trillion transistors, the Wafer-Scale Engine from Cerebras Systems is the largest semiconductor ever built for deep learning applications.

The Wafer-Scale Engine contains about 400,000 high performance, AI optimized Sparse Linear Algebra cores. This local memory fed cores are linked together by a fine-grained, high bandwidth, all-hardware, low latency mesh communication network at an interconnect speed of 100,000 Pb/s. Unlike other processors and GPUs that are produced on silicon wafers, Cerebras’ WSE is a single chip interconnected in a single wafer designed to handle all its transistors. The WSE also houses on-chip of 18Gb superfast and distributed SRAM memory among the cores in a single-level hierarchy. By way of comparison, the WSE has 3000 more on-chip memory and more than 10,000 times the memory bandwidth.

Designed for accelerating AI work, the company claims that its Wafer-Scale Engine can scale down the time it takes to process complex data from months to minutes.

“Every architectural decision was made to optimize performance for AI work. Designed from the ground up for AI work, the Cerebras WSE contains fundamental innovations that advance the state-of-the-art by solving decades-old technical challenges that limited chip size such as cross – reticle connectivity, yield, power delivery and packaging. The result is that the Cerebras WSE delivers, depending on workload, hundreds or thousands of times the performance of existing solutions at a tiny fraction of the power draw and space,”

says, CEO and Founder of Cerebras Systems, Andrew Feldman.

According to the company, bigger is better; the larger the chips, the less time it takes to process information and produce answers. The performance gain of the Wafer Scale Engine is largely due to its size. With a chip as big as the size of an iPad, the WSE is able to process information more quickly in less time, thus facilitating several AI paradigms like reducing the “time-to-insight” or “training time” within neural network loops. The speed at which a neural network loop is able to learn or train depends on the speed with which inputs move through the loop as such, the faster the inputs are processed through the feedback loop, the more inputs the loop receives per unit time and the faster the loop trains.

Due to its large silicon area, the WSE is able to provide more cores, more memory close to the cores that ensures that the cores are always occupied doing calculations, and more latency bandwidth between the cores for maximum efficiency. The programmable SLA cores are designed fundamentally to handle core neural network workload like TensorFlow, Pytorch and more.

In recent years, we have seen Artificial Intelligence rise from a state of obscurity to top-of-the-mind awareness because of the advances in deep learning. With WSE that help to train models in less time and with less energy, deep learning researchers should be able to explore more ideas, test hypothesis more quickly, use more data and solve new problems.

New Kontron COMe-m4AL10 (E2) Module

The COMe-m4AL10 (E2) is ideally suited for use in industrial IoT and Industry 4.0 applications

Kontron has introduced its new COMe-m4AL10 (E2) module. The module is available with either Intel Atom®, Intel® Pentium® or Intel® Celeron® processors of the latest 5th generation. With dimensions of only 84 mm x 55 mm, it is an ideal solution for space-limited applications; furthermore the E2 version is designed for use in the industrial temperature range from -40°C to +85°C. Thanks to its large number of interfaces, significantly improved computing power and excellent performance-per-watt ratio, the COMe-m4AL10 (E2) is ideally suited for use in industrial IoT and Industry 4.0 applications. Medical imaging, autonomous vehicles, surveillance and security devices benefit as well from the powerful, yet extremely small modules. Thanks to the industrial-grade-by-design versions – specified for industrial temperature operation – and the long term availability, the new COMe-m4AL10 (E2) meets the special requirements of applications in transportation as well as defence markets.

The COMe-m4AL10 (E2) will be available in five different processor versions, as DualCore or QuadCore processors. Together with the COMe-mAL10 (E2), which supports DDR3L ECC memory, Kontron now offers a broad range of module solutions for every possible customer requirement.

The COMe-m4AL10 (E2) supports up to 16 GB LPDDR4 memory down and two independent displays: 1x DP++ (DP/HDMI/DVI) 4096×2160@60Hz and 1x Single Channel LVDS with DPtoLVDS (eDP on request) 3840×2160@30Hz. The module comes with storage options for two SATA II 300 Mbps interfaces and on request with additional eMMC memory (up to 128 GB MLC). In addition to having two serial ports, it provides two superfast USB 3.0 interfaces, up to eight USB 2.0, Gigabit Ethernet, as well as four PCI-Express® Gen2 lanes for customer specific expansions.

Specifications

  • Low-Power – Performance / Watt optimized small form factor solution
  • COMe-mAL10 (E2): up to 8 GByte DDR3L memory down (ECC / non ECC)
  • COMe-m4AL10 (E2): up to 16 GByte LPDDR4 memory down (non ECC)
  • 2x USB 3.0/2.0, 6x USB 2.0, 2x SATA, eMMC Flash
  • Industrial grade temperature
  • Support of Kontron’s Embedded Security Solution – APPROTECT (optional)

As an optional feature the new Kontron COMe-m4AL10 (E2) supports the Kontron APPROTECT security solution based on Wibu-Systems CodeMeter®. Kontron APPROTECT Licensing also enables new business models such as ‘pay-per-use’ and time-based trial versions.

Kontron offers BSPs (Board Support Packages) for the following operating systems: Windows® 10, Enterprise, Windows® 10 IoT, Linux and VxWorks 7.

For more information please visit: www.kontron.com

Lumileds LUXEON MultiColor Module 2.5W

LUXEON MultiColor Module 2.5W – RGBW 4-in-1 package with leading performance

The LUXEON MultiColor Module 2.5W is a 4-in-1 package that makes color tuning easier. Each channel is individually addressable, enabling a large color gamut while simplifying the ability of getting just the right color point.

The white LED source is located in a separate cavity to eliminate potential crosstalk with the blue LED and insure true color point. Offering superior lumen maintenance in a 5050 package, the LUXEON MultiColor Module is also very easy to assemble thank to a simplified solder pad layout. For all these reasons the LUXEON MultiColor Module is the product of choice for many architectural applications.

Features & benefits

  • RGBW 4-in-1 module
  • 5mm x 5mm
  • Individually control each channel
  • High color fidelity due to separate cavity for white
  • Easier color mixing thanks to even dies spacing

more information: www.lumileds.com

Say “Hello” The New Feather-Compactible OrangeCrab Board

Owing to the trend that is driving the success of the Feather form factor for boards is the change in the methodology and languages in which boards are now being programmed. It is quite certain that the maker market is in its transition state and it is hard to tell what the next interesting thing disrupting the board ecosystem is, but with the availability of open-source toolchains for FPGA chips, the age of FPGA has come to stay with a number of FPGA boards starting to appear. So, if you are thinking of getting started with using an FPGA board, this could be a good entry point.

Among the new range of FPGA boards beginning to penetrate the maker market is the new OrangeCrab board from Greg Davill. The feather-compatible board modeled and developed by Davill is capable of running a soft RISC-V Core and has a fully open-source toolchain and according to the tweet by Davil, “

…the USB lines re hooked directly to the ECP5. So it should be possible to port [the CircuitPython] implementation done on Fomu over to this board”.

It is based on a Lattice Semi ECP5 FPGA, with 118 available I/O pins and up to about 8Gbit of DDR3 memory that takes more than 50 pins on the boards but still leaves enough for the board to be pin-compatible with the feather.

The board supports a LiPo battery connector, 128Mbit of QSPI Flash memory, a micro USB connector that allows for a direct UBS connection to the FPGA at full speed as well as a micro SD card socket.

The OrangeCrab board is not available for sale yet and of course without any pricing information, but more about its schematics and Gerber files can be found in the project’s GitHub repository.

You can follow Davill’s Twitter thread for some detailed tweets about the evolution of the board and exceptionally good images.

3x 4K Fanless Digital Signage Player Powered by AMD Ryzen Embedded R1000 SoC

IBASE Technology Inc. (TPEx: 8050), a world leading provider of digital signage players and embedded systems, rolls out its SI-323-N triple-HDMI digital signage player based on the AMD Ryzen™ Embedded R1000 SoC with AMD Radeon™ Vega 3 Graphics that enables unparalleled graphics performance and optimal power efficiency. The compact and fanless player is designed with hardware acceleration to support 4K @60Hz resolution for each independent display and suitable for space-constraint deployment in airports, shopping malls, restaurants and other commercial establishments.

“The SI-323-N is the latest IBASE digital signage system built with AMD Ryzen™ Embedded R1000 family that brings together the powerful performance of the pioneering “Zen” CPU and “Vega” GPU architectures. We are pleased to adopt AMD technologies in our digital signage solutions to provide multi-display support, platform scalability and software compatibility”, said Archer Chien, Director of Solution Product Planning Dept. at IBASE. “AMD’s Eyefinity technology helps eliminate the complexity of programming multi-screen signage for our customers to enable them to project different display configurations according to their needs.”

The SI-323-N features energy-saving and remote monitoring technologies with IBASE iCONTROL for power-on/off scheduling, automatic power recovery and low temperature boot protection, as well as hardware EDID (Extended Display Identification Data) that prevents display problems caused by disconnection of cables, unrecognized displays or power interruption. Furthermore, the new built-in display monitoring function helps monitor display status from the field sites continuously. It comes with 8GB of DDR4 system memory, two Gigabit Ethernet, and expansion interface such as Mini PCIe, M.2 E-Key for wireless functions, and M.2 M-Key for storage. The SI-323-N works with both Windows 10 IoT Enterprise and Linux Ubuntu operating systems.

SI-323-N FEATURES:

  • iCONTROL intelligent energy-saving & Observer remote monitoring technologies
  • AMD Ryzen™ Embedded R1000 SoC
  • 3x HDMI 2.0 with independent audio output support
  • Built-in hardware EDID emulation & display status monitoring functions
  • 2x DDR4-2400 SO-DIMM, dual channel, Max. 32GB
  • 1x Mini PCI-E (full-size) for Wi-Fi, Bluetooth, 4G LTE or capture card options
  • 1x M.2 E-Key (2230) for Wi-Fi, Bluetooth options
  • 1x M.2 M-Key (2280) for storage
  • Compact and fanless design

Contact Information:

IBASE Technology Inc.
11F, No. 3-1, Yuan Qu St., Nankang, Taipei, Taiwan, R.O.C. (Nankang Software Park)
Tel: 886-2-26557588
Email: sales@ibase.com.tw
www.ibase.com.tw

Waterproof digital sensor measures air and water pressure

Alps Alpine has started mass-producing the HSPPAD143A waterproof digital pressure sensor for wide-ranging applications in wearable devices and IoT equipment such as flow meters for essential utilities.

The sensor offers an expanded pressure measurement range of 300 to 2100hPa from a water-resistant design. This means it works in both low-pressure environments at altitudes up to 9,000 meters and high-pressure conditions down to 10 meters underwater, allowing measurement in both open air and water with a single sensor. The HSPPAD143A also houses a dedicated, fully customized application-specific integrated circuit (ASIC), drawing only 1.8µA in low power mode.

Alps Alpine – www.alpsalpine.com

Fuel gauges offer highest level of battery protection

Maxim’s MAX17301 and the MAX17311 1-cell fuel gauge devices allow fine tuning of voltage and current thresholds based on various temperature zones with a low quiescent current of 24μA

Maxim Integrated Products has developed a 1-cell battery fuel gauge that can provide counterfeit and cloning protection with low quiescent current.

The configurable setting in the MAX17301 and the MAX17311 allow fine tuning of voltage and current thresholds based on various temperature zones. These ICs also offer a first-of-its-kind secondary protection scheme in case the primary protection fails. This secondary protection scheme permanently disables the battery by overriding a secondary protector or blowing a fuse in severe fault conditions.

All the devices in the fuel gauge family are equipped with Maxim’s patented ModelGauge m5 EZ algorithm that delivers highest state-of-charge (SOC) accuracy that eliminates the need for battery characterization. These fuel gauges also have a quiescent current (IQ) of 24μA with the FETs enabled and 18µA in hibernate, up to 80 percent lower than the nearest competitor,

The devices also include SHA-256 authentication to safeguard the systems from counterfeit batteries.

Conventional battery protectors monitor voltage and current, and in some cases include temperature monitoring. These options make the system vulnerable to unexpected crashes because battery state-of-charge (SOC) isn’t factored in when triggering an undervoltage cut-off decision. There is a need for a simple, compact solution that protects from unsafe charging conditions that can lead to extensive battery damage including over-voltage, short circuit, over/under temperature and more.

While system and battery designers continue to push the limits of capacity-constrained batteries in order to provide the longest possible run-time without damaging the cell, there are few highly-configurable solutions that are still simple to implement. Designers are also looking for a way to protect the system by ensuring that only genuine batteries are used, which can eliminate unexpected shutdowns and crashes caused by potentially unsafe, counterfeit batteries.

The MAX17301 and MAX17311 1-cell fuel gauges offer 2-level Li-ion protection, providing an additional layer of security in case the primary protector fails and help system makers meet product safety standards such as IEC 62368-1/UL 62368-1.

Getting started with the new ATtiny chips

David Johnson-Davies introduces us to the new ATtiny series microcontrollers and shows us how to program then with Arduino IDE. He writes:

In 2016 Microchip/Atmel announced a completely new range of chips designed to replace their older ATmega and ATtiny ranges. The new ATtiny chips started with the 1-series ATtiny417 and ATtiny817, followed in 2018 by a lower cost series called the 0-series. The range now consists of a total of 25 parts.

Until recently these new chips were not accessible to users of the Arduino IDE, because no Arduino core existed for them, and you couldn’t program them using the existing ISP programmers. That changed a couple of months ago when Spence Konde released a megaTinyCore [1] for the new range, taking advantage of the work that Arduino have done to support their new ATmega4809-based boards.

This article gives an introduction to the new ATtiny parts, and explains how you can now program them from the Arduino IDE.

Getting started with the new ATtiny chips – [Link]

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