Ventana GW5910 Single Board Computer

A small 70x100mm SBC designed for IoT Gateway applications with two Mini-PCIe sockets, GbE, WiFi, Bluetooth and Sub-1GHz wireless

The GW5910 is a member of the Gateworks Ventana family of single board computers and is targeted for low cost, high performance Internet of Things (IoT) Gateway Appliances. The GW5910 features the NXP i.MX6 Dual Core ARM® Cortex™-A9 SoC processor operating at 800MHz, 512MB of DDR DRAM and 256MB of System Flash. Two Mini-PCIe sockets provide expansion for various off the shelf Mini-PCIe peripherals such as LTE/CATM1 cellular modems, satellite modems and other industrial I/O interfaces. One Mini-PCIe socket supports both PCIe and USB signaling and the other socket supports USB signaling with a Nano-SIM socket mapped to it for cellular modem support. The board also features the Gateworks System Controller (GSC) which provides embedded features such as a real time clock, voltage and temperature monitor, serial EEPROM, programmable pushbutton switch, tamper switch, full power on/off watchdog and advanced power management with programmable board shut-down and wake-up for remote sensing applications. The GW5910 features an onboard Laird Sterling 802.11b/g/n WiFi/Bluetooth module and an optional Ti CC1352P Dual-Band Wireless MCU supporting Sub-1GHz and 2.4GHz RF. An optional on-board u-blox GPS module is also available. Board power can be applied through a barrel jack or over Ethernet with support for both passive and 802.3af PoE. OpenWrt and Ubuntu BSPs are supported.

Features

  • Processor — NXP i.MX6 Dual (2x ARM Cortex-A9 cores @ 800MHz); Vivante GPU
  • Memory/storage:
    • 512MB DDR3-800 RAM (up to 2GB with volume customization)
    • 256MB flash (up to 2GB with volume customization)
    • MicroSD slot
  • Networking:
    • Gigabit Ethernet port with Passive or 802.3af (36-60VDC) PoE
    • 802.11b/g/n and Bluetooth 4.2 LE (Laird Sterling) with ant. connector
    • Optional Ti CC1352P module with dual-band sub-1GHz (+20dBm TX Power) and 2.4GHz RF, supporting 802.15.4g protocols like 6LoWPAN, Thread, Zigbee, Wi-Sun, BLE 5
    • Optional u-blox ZOE-M8 GNSS Receiver with GPS/Galileo/GLONASS/BeiDou (72-ch., -167dBm)
  • Other I/O:
    • 2x serial interfaces
    • DIO and SPI connectors
    • JTAG interface
  • Expansion:
    • 2x mini-PCIe Gen 2 slots (1x with PCIe/USB 2.0 and mSATA, 1x USB 2.0) with 16W power
    • Nano-SIM slot with LTE and CATM1 support
  • Other features:
    • 3-axis accelerometer/magnetometer
    • Gateworks System Controller with watchdog, etc.
    • RTC with coin cell battery holder
    • Optional dev kit with PoE injector, power adapter, JTAG-USB programmer, pre-loaded BSP, and Ventana Wire Terminal Breakout Adapter
  • Power — 8-60VDC; 3W (0.125A@24VDC) typical consumption; reverse voltage and transient protection
  • Operating temperature — -40 to 85°C; humidity resistance (20% to 90% non-condensing)
  • Dimensions — 100 x 70 x 21mm
  • Operating system — OpenWrt and Ubuntu BSPs with U-boot

Block Diagram

Ventana GW5910 Single Board Computer Block Diagram

Further information

The Ventana GW5910 appears to be available now at an undisclosed price. More information may be found on Gateworks’ Ventana GW5910 product page.

ioNode – The Dooba development board

A microcontroller development board for all your needs

Whether you’re just playing around on a breadboard or actively designing an end-user product, the ioNode makes building digital circuits a breeze.

With its very small footprint, it can be used to build applications of any size with ease.

Featuring the powerful ATMEGA1284P AVR microcontroller, you’ll have enough Flash, RAM and I/O to do virtually anything!

The ioNode also features a USB port and a USB-UART. In other words, it can talk to your computer over USB! We even provide a tutorial for USB communication.

Specs

Core

  • CPU Clock: 10MHz
  • Flash: 128 Kb
  • RAM: 16 Kb

I/O: 29 (30 in total but one is hardwired to onboard LED)

  • 21 Digital-only I/O
  • 8 Digital/Analog I/O
  • 7 PWM outputs (8 in total but one is hardwired to onboard LED)

Interfaces

  • USB
  • UART
  • I2C
  • SPI

You can find more details in the official documentation.

Benchmarking the Raspberry Pi 4

Gareth Halfacree @ medium.com writes:

Last year’s release of the Raspberry Pi 3 Model A+ marked the end of an era: the next board, Raspberry Pi Foundation co-founder Eben Upton promised at the time, would be something dramatically different.

Now, a surprisingly short time later, Upton’s promise has been delivered: the Raspberry Pi 4 is a departure from the norm, and the first of a new generation of Raspberry Pi single-board computers. Gone is the old bottleneck of a single shared USB lane for everything connected to the SoC; gone too is the layout which has been with the boards since the Raspberry Pi Model B+.

Although appearing similar at first glance, the new board is slightly larger thanks to ports extending further from the PCB for improved case compatibility, the Ethernet and USB ports have been switched around, the power input is now a USB Type-C connector, and the full-size HDMI output has been swapped out for not one but two micro-HDMI connectors.

Benchmarking the Raspberry Pi 4- [Link]

GW-01 LoRaWAN gateway offers a choice of Orange Pi, Raspberry Pi, or i.MX6 ULL options

M2M IOT has launched a GW-01 LoRaWAN gateway based on an Orange Pi Zero H2+ SBC which supports outdoors installations. The GW-01 integrates the Zero H2+ with an 8-channel LoRaWAN board based on Semtech’s SX1301 LoRa concentrator. The $120 “GW-01” LoRaWAN gateway runs Linux on an Orange Pi Zero H2+ SBC as well as an 8-channel LoRaWAN board. The GW-01 is a modified version of the GW-01 RPI add-on for the Raspberry Pi, and also the all-in-one GW-01 PoE gateway that features Power-over-Ethernet support that runs on i.MX6 ULL. The three products ship out with an open-source Linux stack, with LoRa gateway and packet-forwarder software pre-installed on the board. The GW-01 gateway clocks in at 868MHz or 915MHz LoRa frequencies, and has -139 dBm sensitivity. It has a 2.5 km range when obstructed by buildings, or up to 10 Km in an open space. The GW-01 measures at 80 х 50 х 20mm minus the supplied antenna and has a 0 to 70°C temperature.

The GW-01 runs OpenWrt, or Armbian on the Orange Pi Zero H2+, and features an Allwinner H2+. The H2+ SoC enables 4x Cortex-A7 cores @ 1.2GHz and a Mali-400 MP2 GPU. The Zero H2+ offers a meager 256MB DDR3 RAM, and the available display interface is an AV-out header. Available also is a single USB 2.0 host, micro-USB OTG with 5V power input, and 10/100 Ethernet ports. The board also has a microSD slot, WiFi, and a 26-pin header that supports early Raspberry Pi boards.

GW-01 RPI

The Zero H2+ board on the GW-01 has 8MB serial flash instead of the 2MB. The reason for the increment is to incorporate the 4.5MB OpenWrt image. One thing I see that stands out about the SBC is that it has lower power consumption and a lower price ( $8.50) than any of the latest RPI boards. For prototyping purposes, M2M IOT recommends TheThingsNetwork or its own cloud.m2m-tele server. The GW-01 RPI and GW-01 PoE have similar specs with the GW-01, with the exception of the PoE model having a wider -35 to 70°C range. The GW-01 RPI can operate with any Raspberry Pi 2 or 3 board.

GW-01 PoE

The RPI and PoE models have an 80 x 50mm footprint like the GW-01, and the SBC on the PoE model also adds 20mm on the vertical, and they both ship with antennas. The PoE model also runs on OpenWrt like the GW-01, while the RPI shield runs Raspbian. The GW-01 PoE is a standalone product which integrates a homegrown SBC based on NXP’s power-sipping, single Cortex-A7 based i.MX6 ULL SoC. It features an Ethernet port with 48V PoE support for easier installation.

The GW-01 is available for $120, the RPI model is $95, and the PoE model is $245. More information may be found on the M2M IOT website and GitHub page, and also the shopping pages for the GW-01, GW-01 RPI, and GW-01 PoE.

Tiny compute modules features Snapdragon 845 and Snapdragon 660

– Inforce 6701

A production ready micro SoM based on Snapdragon™ 845 SoC architected for Artificial Intelligence and Immersion

The compact sized Inforce 67X1 SOM’s multiple MIPI-CSI interfaces and on-device artificial intelligence (AI) allows users to capture cinema-grade videos and blur the lines between physical and virtual worlds. The product’s enhanced hardware and software capabilities bring high-performance, true-to-life cinematic video capture, with 64x more high-dynamic range color information for video capture and playback on Ultra HD Premium displays, compared to the previous generation. This massive boost in color information includes 10-bit color depth for over one billion shades of colors that can be displayed to the wide Rec. 2020 gamut for brilliant 4K/Ultra HD @60 fps videos. The Adreno GPU enables room-scale 6 degrees of freedom (6DoF) with simultaneous localization and mapping (SLAM)—for features such as wall-collision detection. Snapdragon 845 also introduces “Adreno foveation,” which substantially reduces power consumption, improves visual quality and boosts XR application performance, as compared to the previous generation. All these features make it ideal for manufacturers to develop SWaP constrained devices in the immersive multimedia space, wearables, portable healthcare and connected cameras’ domain.

The Snapdragon 845 platform has processor advancements that offer an improved user experience

  • Qualcomm Kryo 385 CPU: Manufactured in 2nd gen 10nm LPP, optimized across 4 performance and 4 efficiency cores for higher performance.
  • Hexagon™ 685 DSP: Designed to support supports sophisticated, on-device AI processing, delivering richer camera, voice, XR and gaming experiences.
  • Adreno™ 630 VPS: Featuring room-scale 6DoF with SLAM, Adreno Foveation, and significantly improved graphics rendering and video processing, the Visual Processing Subsystem(VPS) comprising the GPU, VPU and DPU provides a larger-than-life immersive experience. It includes support for Vulkan 2/OpenGL ES 3.2/OpenCL.
  • Dual 14-bit Spectra™ 280 ISPs support up to 16MP each for simultaneous concurrent cameras
  • Qualcomm® AI Engine: The 3rd generation AI Platform enables on-device intelligence and simplifies how you take pictures and videos. It also enables enhanced features like camera bokeh, more true to life XR, gaming, and long lasting battery life. The Snapdragon core hardware architectures are engineered to run AI applications quickly and efficiently.

Specifications

Based on the Snapdragon™ 845 processor (SDA845) manufactured in 10nm FinFET process technology

  • Customized Kryo™ ARMv8 compliant 64-bit Octa-core CPUs arranged in two dual-clusters, running at 2.8GHz (Gold) and 1.8GHz (Silver) each
  • Adreno™ 630 VPS with 64 bit addressing and designed for significantly improved graphics and efficient rendering as compared to the previous generation
  • Hexagon™ 685 DSP with dual-Hexagon vector processor designed for on-device AI processing, low-power audio, XR/gaming and computer vision processing
  • Spectra™ 280 camera (dual) Image Signal Processors (ISPs) to support up to 24MP single or 16MP@60 fps dual cameras

PROCESSING POWER, MEMORY, AND STORAGE

  • Qualcomm® Snapdragon™ 845 (SDA845 SoC) processor
  • 4GB on-board LPDDR4X RAM
  • 64GB UFS ROM
  • 1x µSD card v3.0 interface
  • USB-C on USB 3.1/gen1 + USB-SS
  • Intelligent scalable power management for superior energy efficiencies through PMIC

AUDIO, VIDEO, INTERFACE, AND CONNECTIVITY

  • Audio Lineout; Mic-In
  • UltraHD (4K) display on USB-C
  • H.265 (HEVC)/H.264 (AVC)/VP9 playback & capture @4K60 fps
  • Concurrent 4K60 10b encode + 4K60 10b decode
  • Dual MIPI-CSI cameras up to 16MP@60fps
  • 4-lane MIPI-DSI capability
  • Multiple BLSPs for UART/I2C/SPI/GPIOs
  • 802.11n/ac 2X2 MU-MIMO 2.4GHz/5GHz WiFi & BT/LE 5.x via WCN3990
  • GPS/GLONASS via SDR660G
  • 1x 1-lane PCIe Gen 2 and 1x 1-lane PCIe Gen 3
  • Audio Lineouts, HPH and Mic-In from integrated PMIC codec

POWER, MECHANICAL, AND ENVIRONMENTAL

  • Power: +3.8V/6A Input
  • Dimensions: 50mm x 28mm
  • Operating Temp: -20C to +85 C (Extended Temp SKU)
  • Storage Temp: -20 to 85 C
  • Relative Humidity: 5 to 95% non-condensing
  • RoHS and WEEE compliant

 

– Inforce 6502

A production ready micro SoM based on Snapdragon™ 660 SoC with stereoscopic depth sensing and deep Learning capabilities

The compact sized Inforce 6502 SOM offers multiple MIPI-CSI interfaces with which depth perception use-cases like proximity detection, semantic segmentation, autonomous driving and facial recognition can be enabled with ease on a system built with this product. The product’s enhanced hardware and software capabilities for on-camera deep learning and video analytics, 4K HEVC video encoding and advanced features for robust hardware-based security make it ideal for manufacturers to develop SWaP constrained devices in the wearables, portable healthcare and connected cameras’ domain including bodycams and IP security cameras.

The Snapdragon 660 platform has processor advancements that offer an improved user experience

  • Qualcomm Kryo 260 CPU: Higher performance with independent efficiency and power clusters, each designed to optimize for a unique UX
  • Hexagon™ 680 DSP: Vector eXtensions (HVX) designed to support Caffe2 and Tensorflow for machine learning and image processing
  • Adreno™ 512 GPU: Vulkan/OpenGL ES 3.2/OpenCL support and lifelike visuals coupled with efficient rendering of advanced 3D graphics
  • Dual 14-bit Spectra™ 160 ISPs support up to 16MP each for simultaneous concurrent cameras
  • Qualcomm® AI Engine: The Snapdragon core hardware architectures are engineered to run AI applications quickly and efficiently.

Specifications

Based on the Snapdragon™ 660 processor (SDA660) manufactured in 14nm FinFET process technology

  • Customized Kryo™ ARMv8 compliant 64-bit Octa-core CPUs arranged in two dual-clusters, running at 2.2GHz (Gold) and 1.8GHz (Silver) each
  • Adreno™ 512 GPU with 64 bit addressing and designed for upto 30% better graphics and efficient rendering as compared to Adreno 506
  • Hexagon™ 680 DSP with dual-Hexagon vector processor (HVX-512) designed for 787MHz for low-power audio and computer vision processing
  • Spectra™ 160 camera (dual) Image Signal Processors (ISPs) to support up to 24MP single or 16MP dual cameras

PROCESSING POWER, MEMORY, AND STORAGE

  • Qualcomm® Snapdragon™ 660 (SDA660 SoC) processor
  • 3GB on-board LPDDR4 RAM
  • 32GB eMMC ROM
  • 1x µSD card v3.0 interface
  • USB-C on USB 3.1/gen1 + USB-HS
  • Intelligent scalable power management for superior energy efficiencies through PMIC

AUDIO, VIDEO, INTERFACE, AND CONNECTIVITY

  • UltraHD (4K) display on USB-C
  • H.265 (HEVC)/H.264 (AVC)/VP9 playback & capture @4K30
  • Dual MIPI-CSI cameras up to 16MP
  • 4-lane MIPI-DSI with FullHD+ capability
  • Multiple BLSPs for UART/I2C/SPI/GPIOs
  • 802.11n/ac 2X2 MU-MIMO 2.4GHz/5GHz WiFi & BT/LE 5.x via WCN3990
  • GPS/GLONASS via SDR660G
  • Audio Lineouts, HPH and Mic-In from integrated PMIC codec

POWER, MECHANICAL, AND ENVIRONMENTAL

  • Power: +3.3V/6A Input
  • Dimensions: 50mm x 28mm
  • Operating Temp: -20C to +85 C (Extended Temp SKU)
  • Storage Temp: -20 to 85 C
  • Relative Humidity: 5 to 95% non-condensing
  • RoHS and WEEE compliant

More information

The Inforce 6701 and Inforce 6502 modules are available now. The Inforce 6701 sells for $285 or $300 (extended temp) and the Inforce 6502 lists only the $208 commercial temp SKU, both in single quantities. The SoM +ACC-1C20 Carrier is available as the IFC6701-00-P1 (6701) and IFC6502-00-P1 (6502) Reference Designs and sell for $600 and $500, respectively. It’s unclear what the prices are for the other Inforce 6502 carrier boards.

More information may be found in the Inforce 6701 product and shopping pages, as well as the Inforce 6502 product and shopping pages.

OurPCB Published a Guide on ‘Bluetooth Circuit Board-How To Count As a High-Quality Bluetooth Board’

OurPCB, a reliable PCB & PCBA service manufacturer and provider, today published a ‘Bluetooth Circuit Board-How To Count As a High-Quality Bluetooth Board’

SHIJIAZHUANG, China, July 9, 2019 (Newswire.com) –OurPCB, a multi-national PCB Manufacturing and PCB Assembly company, today published a Guide on ‘Bluetooth Circuit Board-How To Count As a High-Quality Bluetooth Board

It has six chapters that cover every detail about Bluetooth Circuit Board.

The publication is available on the https://www.ourpcb.com/bluetooth-circuit-board.html section of the company’s website for free. It is a simple guide authored by the OurPCB technical team to help both beginners and professionals have a better understanding of Bluetooth Circuit Board.

“OurPCB is always working on creating and publishing articles and topics that are truly valuable to the customers that can help customers solve problems. The articles and bits of knowledge which can solve customers’ problems and needs when designing and manufacturing PCBs or seeking PCBA services; this is the value of company’s existence,” said Mr.Hommer, OurPCB General manager.

Among the key subjects on Bluetooth Circuit Board include:

  1. Bluetooth Circuit Board: This section gives a brief overview of the definition of Bluetooth and the principles of Bluetooth technology, and introduces information about the components of the Bluetooth board.
  2. Types of Applications of Bluetooth: This section details some typical applications of Bluetooth boards, including Wireless Headsets and Earphones, Cordless Keyboards and Mouse.
  3. Bluetooth Module: This section provides an overview of the advantages of the Bluetooth Module and introduces a common Bluetooth module type: the HC05 Bluetooth Serial Port Protocol (SPP) module. Also presents the application range of the Bluetooth module.
  4. Bluetooth Speaker Circuit Board: This section details the Bluetooth Speaker Circuit Board information.
  5. Bluetooth Transmitter Circuit Board: This section focuses on the Bluetooth transmitter board with three critical components – regulation voltage, sensor data and wireless transmission and related information.
  6. Bluetooth Receiver Board: This section briefly describes the role of the Bluetooth Receiver and Bluetooth Receiver Board.

Finally, the focus of this article is to let you know that you have to maintain professional standards while assembling a Bluetooth circuit board; otherwise, the functionalities, range and other features will suffer. If you have any needs or questions, feel free to contact us. There is a lot of knowledge about PCB on the website to help you know more about what you want when purchasing PCB and PCBA services.

About OurPCB

OurPCB is a multi-national PCB Manufacturing and PCB Assembly company that provides Global service and support while utilising its Chinese manufacturing capabilities.

Our Assembly factory has received ISO9001 certification. For bare PCB manufacturing, we also received ISO and UL certifications.

  • Media Contact: Contact Person: Hommer Zhao (General Manager)
  • Email: sales@ourpcb.com
  • Tel: +86-311-85981900
  • Website: https://www.ourpcb.com
  • Source: OurPCB Tech. Ltd.

New Kontron SMARC-sXAL4 (E2) Module with up to 8 GByte LPDDR4 Memory Down

Kontron, a leading global provider in IoT/Embedded Computer Technology (ECT), has introduced the new SMARC-sXAL4 module. The module is available with either Intel Atom®, Intel® Pentium® or Intel® Celeron® processors of the latest generation. With dimensions of only 82mm x 50mm, it can be used flexibly, and the E2 version is designed for use in an extended temperature range from -40°C to +85°C. Thanks to its large number of interfaces, significantly improved computing power and excellent performance-per-watt ratio, the SMARC-sXAL4 is ideally suited for use in industrial IoT and Industry 4.0 systems. 

The SMARC-sXAL4 will be available in five versions: either with DualCore or QuadCore processors. Together with the SMARC-sXAL (E2), which supports DDR3 ECC memory, Kontron now offers customized modules for every purpose based on all current IoT-enabled embedded processors from Intel®. The SMARC-sXAL4 has up to eight GB LPDDR4 memory down RAM, up to two 1000 MBit/s Ethernet, up to four PCIe x1 and four USB 2.0 ports (alternatively: one USB OTG), as well as two USB 3.0 ports. Up to 128 Mbytes of eMMC (MLC) onboard memory serve as mass storage. The new module also has a SATA 6 GB/s and four serial interfaces (two RX and TX ports each), one HD Audio and one I2S, five I2C, two SPI, two MIPI CSI and twelve GPIO, one HDMI, one DP++ and one Dual Channel LVDS interface (on request also for eDP displays). Users also benefit from the high graphics performance of Intel® HD Gfx Gen9. Up to three 4K displays can be controlled independently.

The SMARC-sXAL4 uses the operating systems Windows® 10, Enterprise, Windows 10 IoT, Linux and VxWorks. The VCC voltage of the module is 5V; a wide-range voltage input has been omitted

The new Kontron SMARC-sXAL4 (E2) supports the Kontron APPROTECT security solution based on Wibu-Systems CodeMeter®. Kontron APPROTECT Licensing also enables new business models such as ‘pay-per-use’ and time-based trial versions.

The SMARC-sXAL4 is available in the following standard variants:

  • SMARC-sXAL4 N4200 4G/8S SMARC with Intel® Pentium® N4200, 4GB LPDDR4 memory down, 8GB eMMC pSLC, commercial temperature
  • SMARC-sXAL4 N3350 2G/4S SMARC with Intel® Celeron® N3350, 2GB LP-DDR4 memory down, 4GB eMMC pSLC, commercial temperature
  • SMARC-sXAL4 E3930 4G/8S SMARC with Intel Atom® x7 E3930, 4GB LPDDR4 memory down, 8 GB eMMC pSLC, industrial temperature
  • SMARC-sXAL4 E3940 4G/16S SMARC with Intel Atom® x7 E3940, 4GB LPDDR4 memory down, 16 GB eMMC pSLC, industrial temperature
  • SMARC-sXAL4 E3950 8G/32S SMARC with Intel Atom® x7 E3950, 8GB LPDDR4 memory down, 32 GB eMMC pSLC, industrial temperature

For more information please visit: https://www.kontron.com/products/boards-and-standard-form-factors/smarc/smarc-sxal-e2-.html

Pico datalogging software for Raspberry Pi

Pico Technology has announced what the company believes to be the first ever fully supported software package for the popular and inexpensive Raspberry Pi single-board computer.

Optimized and tested on the new Raspberry Pi 4, and the current 3B and 3B+ on Raspbian Stretch, the PicoLog 6 data logging software package provides a visual, easy-to-use interface allowing engineers to quickly set up simple or complex acquisitions and record, view and analyze data. It’s the same fully functioning software that runs on Windows, macOS and Linux.

Coupled with a Raspberry Pi, this new PicoLog 6 package expands the flexibility and opens the door for Pico’s data loggers to be used in new and different ways. Users c an now connect the logger to the Pi and remove the keyboard, mouse and video to make an inexpensive stand-alone logger storing its captured data locally on a Pi SD-Card. Connecting the board by WiFi or Ethernet, one can internet-enable the Pico logger which can then be accessed remotely using an open-source VNC server and viewer freely available. Using the Power over Ethernet (PoE) capability on the Raspberry Pi 3B+ paired with the PoE PiHAT not only eliminates the need for an external power supply and powered USB hub, it also internet-enables the logger at the same time.

Pico Technology – www.picotech.com

New Keyence VHX-7000 4K Microscope enhances view, capture and measure tasks

The VHX-7000 digital microscope, which is now available in the UK and Ireland, offers high magnification and accuracy, and is both versatile and easy to use. With a wide array of functions and features, the VHX-7000 is the best way to future-proof microscopy requirements for years to come.

Using the Keyence VHX-7000, both 2D and 3D measurements can be performed with ease. Just one microscope is required to take roughness, contamination, grain size and a host of other measurements. Observation is provided with an optimal balance of brightness and clarity. Moreover, images can be easily saved on the 1 TB hard drive (enough capacity for millions of images) and shared over LAN or USB. Similarly, reports can be automatically created and shared.

Features such as ‘Optical Shadow Effect Mode’ make subtle contours stand out (in colour) and enhance uneven surfaces and stains at the push of a button. By combining a 4K CMOS image sensor with a new multi-directional lighting variation technique, the VHX-7000 can deliver images that rival an SEM (scanning electron microscope).

Even novice users can easily capture high-resolution images. The operator simply places the target on the stage, and everything else – including alignment and focus adjustment – is fully automatic. A handheld controller puts functions such as magnification switching at the fingertips of the user.

Among major features is high-speed image stitching, which occurs automatically upon command. In addition, by capturing multiple images while the stage is moving, 3D data capture and stitching can take place simultaneously, which makes it possible to view and analyse the overall contours of the target.

In terms of 3D measurement, even when the target has an uneven surface, a fully-focused image is obtained instantly, composed from multiple images with varying focus positions. The new fully integrated head offers the highest picture quality in the VHX series. What’s more, observation using the VHX-7100 fully integrated head can be carried out automatically at magnifications from 20x to 6000x without manually changing the lens.

A combination of optics, digital camera, electronics, software, and a wide choice of motorised XYZ and rotary stages, means users can perform complete inspection and analysis using a single system. As a result, applications traditionally performed on stereoscopic, metallurgical, measuring and even SEM microscopes can easily be transferred to the VHX-7000.

For automotive and other metal-based industries, on-machine automated contamination and cleanliness analysis compliant with ISO 16232 standards is made possible for large area measurement. Higher magnification and high-resolution imaging combine with one-click auto measurement for quality inspection in semiconductor and electronics industries, while automatic area measurement with object counting can be deployed for grain structure analysis in pharmaceuticals, metallurgy or other demanding sectors.

Ultimately, the new VHX-7000 all-in-one digital microscope will streamline and simplify quality inspection across all industries, while simultaneously providing outstanding image results. Keyence is currently offering a no-obligation, on-site demonstration of the system.

A detailed brochure on the full range of functions, features and options available is available at: www.keyence.co.uk/vhx7000launch

Compact DIN-Rail Fanless Embedded Box PC for Intelligent Manufacturing and Outdoor Applications

Advantech, a global leading provider of intelligent IoT systems and embedded platforms, is pleased to announce the latest addition to its ARK-1000 series: the ARK-1220, a compact DIN-Rail fanless embedded box PC for industrial and/or outdoor environments. The ARK-1220 adopts Intel Atom® E3940 QC processors with front accessible I/O ports on single bezel—targeting applications such as machine automation, intelligent factories, in-cabinet equipment integration, and IoT gateways. To enable effective device management, the ARK-1220 comes pre-loaded with Advantech’s new IoT device management App: WISE-PaaS/DeviceOn. This App includes hardware security certification and parameter settings required by the relevant application domain to help simplify the initial deployment phase and subsequent management.

Intelligent Management and Security Support for Industrial Environments

WISE-PaaS/DeviceOn was the first to adopt the zero–touch technology connection for software and hardware integration, allowing users to monitor real-time health status and send software and firmware updates over-the-air (OTA) on-site. For system security, the ARK-1220 utilizes the Trusted Platform Module (TPM) 2.0 function by request and supports BitLocker under Windows 10 IoT. Moreover, McAfee and Acronis are integrated into WISE-PaaS/DeviceOn for anti-virus protection and invaluable data recovery and backup. Our hardware and software solutions help users simplify equipment management via an easy, efficient, and secure systematic method that fits different industrial and/or outdoor environments.

Ruggedized and Compact DIN-Rail Fanless Design

The ARK-1220 is powered by Intel Atom® E3940 Quad Core SoC, with up to 1.8 GHz with turbo burst on. The dual channel memory sockets support a maximum of up to 8GB DDR3L 1866 MHz SO-DIMM. Designed for rugged environments, the ARK-1220 supports a -30 ~70°C operating temperature range with 0.7 m/s air flow that is ideal for working outdoors. Its wide ranging power input of 12V – 28V DC-in is suitable for use in environments with fluctuating or unstable power supply. The ARK-1220 supports an array of functional I/O ports, including 4x USB 3.0, 2x LAN, and 2x COM ports placed on front panel. Its compact dimensions are appropriate for applications installed in limited space but requiring I/O flexibility and enhanced performance.

Dual 4K Display with Immersive Graphics and Media Performance

ARK-1220 offers dual 4K ultra HD independent displays with a resolution of up to 3840 x 2160 pixels at 30 Hz. The Gen9 graphics engine runs on low power while enhancing media processing capability with video encoding and playback performance that offers a 40% improvement compared to the previous generation. The ARK-1220 empowers manufacturers to access clearer analysis and management via panel displays or interactive displays in intelligent factories and machine automation processes. For more information, visit the Advantech website or contact your local sales office.

ARK-1220
Watch Video

˙ Intel Atom® E3940 Quad Core SoC turbo burst up to 1.8 GHz
˙ DIN-rail system with essential I/O ports on front-side bezel
˙ Dual HDMI display up to 4K ultra HD resolution
˙ Compact design of (W x H x D) 53.5 x 158 x 114 mm (2.11″ x 6.22″ x 4.49″)
˙ 1 x full-size mPCIe with SIM holder and 1 x M.2 2230 for WIFI
˙ 12V ~ 28V wide range power input
˙ -30 ~ 70°C extended operating temperature
˙ Advantech WISE-PaaS/DeviceOn support

more information: www.advantech.eu

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