Infineon’s Solutions for Pumps and Fans

Fans and pumps can be found in various applications including home appliances and industrial systems. Driven by more stringent regulations and growing awareness around energy efficiency, this segment is increasingly being shaped by rising demand for inverterization, especially in pumps and fans for low-power drives.

Take a look at Infineon’s broad portfolio of solutions with power levels ranging from 60 W to 3 kW in a range of different topologie, like:

  • CIPOS™ Intelligent Power Modules
  • Digital Motor Controllers iMOTIONTM
  • Discrete IGBTs
  • Gate Driver ICs

CIPOS™ Intelligent Power Modules (IPMs)

Depending on the level of integration and power to be handled, Infineon offers a variety of IPMs, with different semiconductors in different packages, voltage and current classes. These IPMs are separated into CIPOS™ Nano, CIPOS™ Micro, CIPOS™ Tiny, CIPOS™ Mini and CIPOS™ MAXI families. For more information on the CIPOS™ families, click here.

Digital Motor Controller (iMOTION™)

The iMOTION™ IMC100 family takes advantage of the latest evolution of Infineon’s field-proven  Motion Control Engine (MCE 2.0) to accomplish high efficiency control of a variable speed drive. For more information about the benefits of Infineon’s Digital Motor Controllers, click here.

Discrete IGBTs

The 650 V TRENCHSTOP™ IGBT 6 generation is optimized to meet the requirements on power electronics for low power motor drives and so for pumps and fans, such as short circuit rating, best thermal performance and lower switching losses especially in systems with switching frequencies up to 30 kHz. click here for more information.

Gate Driver ICs

Infineon’s portfolio of gate driver ICs spans a variety of configurations, voltage classes, isolation levels, protection features and package options. For pumps and fans, Infineon offers 600 V and 1200 V half-bridge gate driver ICs with level-shift SOI technology to control MOSFETs and/or IGBTs. Low-side gate drivers for the PFC supply stage are also available.
For more information about the benefits of Infineon’s Gate Driver ICs, click here.

Rigol 1000Z Series 50 to 100 MHz Oscilloscopes for Basic Visualization

The 1000Z Series is the economic level Digital Oscilloscope platform from Rigol. It offers unprecedented value in customer applications with its innovative technology, industry leading specifications, powerful trigger functions and broad analysis capabilities. The 1000Z Series 4 channel oscilloscopes come in 50, 70, or 100 MHz versions with a 7 inch display and Rigol’s UltraVision technology. The “-S” models include a 2 channel integrated waveform generator and the PLUS models are upgradable to Mixed Signal Oscilloscopes with the purchase of the RPL1116 digital lead kit. All the analysis, decoding, deep memory, and advanced triggering capabilities are now included in this powerful 4 channel scope at an exceptional price.

  • Up to 100MHz Bandwidth, 4 analog channels
  • 16 digital channels for Mixed Signal analysis
  • 1G Sa/s Real-time Sample Rate
  • 24Mpts Memory Depth
  • Innovative “UltraVision” technology
  • Up to 30,000wfms/s Waveform Capture Rate
  • 7 Inch WVGA (800×480), multiple intensity levels waveform display
  • Built in 2 channels 25MHz waveform Generator(MSO1000Z-S)

The following “MSO Ready” or -Plus models are available from a starting price of 399 Euro:

  • DS1074Z –Plus 70MHz, 4-channel oscilloscope
  • DS1074Z (-S) –Plus 70MHz, 4-channel oscilloscope with integrated arbitrary function generator (2 channels, 25 MHz) as S-version)
  • DS1104Z –Plus 100MHz, 4-channel oscilloscope
  • DS1104Z (-S) –Plus 100MHz, 4-channel oscilloscope with integrated arbitrary function generator (2 channels, 25 MHz) as S-version)

MaxLinear PMIC Powers the new Raspberry Pi 4

MaxLinear, Inc. announced that Raspberry Pi has selected the MxL7704 Universal PMIC to power its latest single-board computer, the Raspberry Pi 4. The MxL7704 is a five output universal PMIC optimized for powering low power FPGAs, DSPs, and microprocessors from 5V inputs.

MaxLinear points out that the MxL7704 already powers the popular Raspberry Pi 3 Model B+. The company says that the versatility of this PMIC allowed it to be easily re-programmed to accommodate the new current limit, sequencing, and power specifications of the upgraded SoC and surrounding ICs of the new Raspberry Pi 4.

MxL7704 provides all essential power rails required by the Raspberry Pi 4, including the low noise voltage rail for the audio circuitry.

With its I2C programmability, MaxLinear says it also handles the unique power sequencing requirements of each rail with ease. The MxL7704’s I2C interface communicates with Rasberry Pi 4’s SoC for dynamic voltage scaling, sequencing control, status monitoring, and PGOOD routing. These features enable the Raspberry Pi 4 to dynamically reduce the voltage to the SoC when the system is idle and boost it when the processor is running at maximum speed to save power.

Raspberry Pi 4
Raspberry Pi 4

Four synchronous step-down buck regulators provide system memory, I/O, and core power from 1.5A to 4A. An on-board 100mA LDO delivers clean 1.5V to 3.6V power for analog sub-systems.

Also, an integrated 8-bit ADC with 2 external inputs and temperature sensor provides die temperature monitoring, telemetry, and additional flexibility. The Raspberry Pi 4 uses the MxL7704’s on-board ADC to determine if a high-current delivery USB power supply is connected.

“The MxL7704 provides five rails pre-optimized for ease of use in single-board computer systems,” said James Lougheed, Vice President of Marketing for MaxLinear’s High-Performance Analog Products. “The PMIC includes a host of features that allow monitoring, telemetry and additional flexibility. These unique features provide the Raspberry Pi 4 with knowledge and control of power status and efficiency to ensure peak performance during various operating conditions.”

“After using the MxL7704 very successfully on the Raspberry Pi 3 Model B+, we were very pleased to select it again to power our next generation Raspberry Pi 4 Model B computer,” said James Adams, Chief Operating Officer for Raspberry Pi (Trading) Ltd. “The combination of highly efficient, high current buck supplies in a very cost-effective package which also included I2C control, dynamic voltage scaling, programmable sequencing as well as a low noise LDO and ADC has been key to making sure we have met our design and cost targets for Raspberry Pi 4.”

The 5mm x5mm 32-pin QFN package of the MxL7704 helps the Raspberry Pi preserve its small form factor.

more on the web: MaxLinear Inc.

MEMS-based “sonar on a silicon chip” ultrasonic time-of-flight sensors

TDK Corporation’s announces the immediate worldwide availability of the Chirp CH-101 MEMS-based ultrasonic Time-of-Flight (ToF) sensor. This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view. By calculating the ToF, the sensor can determine the location of an object relative to a device and trigger a programmed behavior.

TDK’s MEMS ultrasonic technology leverages a proprietary ToF sensor in a 3.5 mm x 3.5 mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a custom low-power mixed-signal CMOS ASIC. The sensor handles a variety of ultrasonic signal-processing functions, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence/proximity sensing, object-detection/avoidance, and position-tracking.

CH-101 is the first commercially available MEMS-based ultrasonic ToF sensor intended for consumer electronics, AR/VR, robotics, drones, IoT, automotive, and industrial market segments. TDK’s MEMS ultrasonic product portfolio also includes the CH-201 ultrasonic ToF sensor for room-scale sensing applications, and Chirp SonicTrack™, a complete hardware-software system solution enabling inside-out 6-DoF controller tracking for AR/VR/MR systems.

TDK’s MEMS ultrasonic ToF sensor solutions offer numerous advantages over optical ToF sensors:

  • Accurate range measurement regardless of target size or color; even optically transparent targets are accurately detected
  • Immunity to ambient noise
  • Ability to operate in all lighting conditions — unlike IR sensors, which do not work in direct sunlight
  • Ensures eye-safety — contrasting with laser-based IR ToF sensors – and yet not perceivable by house pets
  • Detects objects over a field-of-view up to 180° — enabling a single sensor to support room-scale sensing

“The CH-101 sensor is the culmination of years of development based on a breakthrough innovation in piezoelectric-MEMS technology and low-power ASIC design, resulting in high-performance, low-power ultrasonic sensing in a tiny package,” said Michelle Kiang, CEO, Chirp Microsystems, a TDK Group Company. “For the first time, product designers have available a new ToF sensor option to enable new functionalities and improve user experience in a broad range of consumer products. CH-101-based Chirp SonicTrack™ provides 6DoF controller tracking in HTC’s new Vive Focus Plus All-in-One VR system, which is in mass production today, and both CH-101 and CH-201 sensors are being designed-in by leading consumer brands in smart speakers, robotic vacuum cleaners, PCs, and many more products. We expect to see several additional product launches powered by TDK’s MEMS ultrasonic products in the next 12 months.”

The CH-101 is in mass production now and Chirp’s CH-201 is currently shipping to select customers. TDK will showcase the Chirp CH-101 and CH-201 products, along with TDK’s comprehensive portfolio of sensors, electronic components and solutions for mobile, wearables, AR/VR, automotive, IoT and industrial applications at the Sensors Expo 2019 in San Jose, California, June 25-27, 2019. Come see us at the San Jose McEnery Convention Center, Booth #416. Please visit: www.chirpmicro.com or contact Chirp Sales at sales@chirpmicro.com for more.

Glossary

  • 6-DoF: 6 Degrees of Freedom
  • 3D: 3 dimensional
  • AR/VR: Augmented Reality / Virtual Reality
  • MR/XR: Mixed Reality / Extended Reality
  • Ultrasonic: Utilizing, produced by, or relating to ultrasonic waves or vibrations.

STMicroelectronics LSM6DSOX inertial measurement unit (IMU), with Machine Learning Core

LSM6DSOX – iNEMO 6DoF inertial measurement unit (IMU), with Machine Learning Core, Finite State Machine and advanced Digital Function. For battery operated IoT, Gaming, Wearable and Consumer Electronics. Ultra-low power and high accuracy

The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DSOX supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).

High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic land grid array (LGA) package.

Key features

  • Power consumption: 0.55 mA in combo high-performance mode
  • “Always-on” experience with low power consumption for both accelerometer and gyroscope
  • Smart FIFO up to 9 kbyte
  • Android compliant
  • ±2/±4/±8/±16 g full scale
  • ±125/±250/±500/±1000/±2000 dps full scale
  • Analog supply voltage: 1.71 V to 3.6 V
  • Independent IO supply (1.62 V)
  • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
  • SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
  • Auxiliary SPI for OIS data output for gyroscope and accelerometer
  • OIS configurable from Aux SPI, primary interface (SPI / I²C & MIPI I3CSM)
  • Advanced pedometer, step detector and step counter
  • Significant Motion Detection, Tilt detection
  • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
  • Programmable finite state machine: accelerometer, gyroscope and external sensors
  • Machine Learning Core
  • S4S data synchronization
  • Embedded temperature sensor
  • ECOPACK®, RoHS and “Green” compliant

Applications

  • Motion tracking and gesture detection
  • Sensor hub
  • Indoor navigation
  • IoT and connected devices
  • Smart power saving for battery-operated devices
  • EIS and OIS for camera applications:
    • Forklift/Robots and machine control
    • Vibration monitoring and compensation

Embedded software: C-Driver MEMES

Platform-independent drivers for STMicroelectronics MEMS motion and environmental sensors, based on standard C programming language, are available in source code in the STMicroelectronics public GitHub repository.

Product evaluation tools

  • STEVAL-MKI197V1 – LSM6DSOX adapter board for a standard DIL24 socket
  • STEVAL-MKI109V3 – ST MEMS adapters motherboard based on the STM32F401VE and compatible with all ST MEMS adapters
  • STEVAL-MKSBOX1V1 – SensorTile.box wireless multi sensor development kit with user friendly app for IoT and wearable sensor applications   –  you can win a free kit!

PCBite System For Precise PCB Probing

This kit holds any size circuit board and features spring-loaded fine tips on stable gooseneck arms for hands-free PCB probing

Saelig Company, Inc. announces the introduction of the Sensepeek PCBite System – a professional yet affordable PCB testing apparatus with a system of repositionable fine-point spring-loaded probes, a large (8.3” x 11.7”) metal baseplate, and four magnetic-base PCB holders for clamping circuit boards in a stable, fixed position.  The probes are attached to a flexible, stable gooseneck arm that has a powerful magnetic base, and the probe’s gold-plated needle tips are replaceable.  An easy electrical connection is made to the probe tip via a standard pair of built-in 0.1”-separated posts, enabling two instruments, such as a multimeter and oscilloscope, to be connected to the test point simultaneously.   The metal base-plate also has a mirror finish, which helps users to view the underside of the board being worked on.

Introduction Video

Probing just got much easier with PCBite, a remarkably stable, hands-free probe system for accurate PCB investigation.  There has previously been no satisfactory solution for continuous probe measurements of diverse component shapes and sizes.  The PCBite’s precision tip probe solves this issue.  The PCBite probe has a “press and forget” function which secures the probe in a firm-contact position.  To stabilize the measuring contact, the user gently compresses the spring-loaded probe tip against the test point to be tested, causing the tip to be in spring-loaded contact. The weight of the head ensures that the compressible needle maintains constant pressure contact at the probing point.   Spring-loading the pin tip ensures that electrical contact is not lost even during mild vibrations or if the base with captured board is moved about.  The rigidity of the probe’s flexible metallic arm is sufficient to hold it in place for making repeatable, reliable measurements.

PCBite is an ideal tool for handling circuit boards during design or repair activities such as soldering, inspection, or test. The neodymium magnet holders feature insulating washers at the gripping point to safely trap a PCB even when powered up without shorting tracks.  These PCB holders can be freely moved to accommodate circuit boards of different shapes and sizes.

The PCBite system is made in Sweden by Sensepeek AB.  It is available now from their from USA technical distributor Saelig.

3 cent PMS150C MCU drive 300 WS2812B LED’s

Driving 300 WS2812B RGB LED’s with “the 3 cent microcontroller” – the Padauk PMS150C.

The 3 cent Padauk PMS150C is.. Interesting to say the least. First of all there’s a lot this little MCU doesn’t do. It doesn’t have a lot of code space (1K Word), it doesn’t have a lot of RAM (64 bytes) and it doesn’t even do hardware multiplication. It doesn’t have an instruction for loading data from ROM either(Though there are ways of getting around this – but that’s a subject for another post). And of course – you can only program it ONCE.

3 cent PMS150C MCU drive 300 WS2812B LED’s – [Link]

Nichia launches a 280 nm Deep UV LED

Nichia Corporation is proud to introduce a new Deep UV LED, Part Number NCSU334A.

Nichia has had significant success over the years with UVA LEDs, specifically in convention resin curing applications. Nichia’s new 280 nm UVC NCSU334A will be able to address mass market goals for water purification and air sterilization using Solid-State Lighting. With its small size (6.8 mm × 6.8 mm) and strong performance (55 mW typical optical power at 350 mA), the NCSU334A allows for system miniaturization and long-life solutions where previous technologies could not.

Conventional UVC LEDs (200-280 nm) have problems with a more complex crystal growth and a shorter life than UVA LEDs (365-405 nm). Through Nichia’s unique crystal growth technology that has been cultivated for many years in UVA LEDs, Nichia takes great pride in successfully developing the world’s highest quality, high radiant flux, long life UVC LED. The NCSU334A achieves a significant lifetime improvement versus conventional UV lamps. Additionally, this LED uses a newly developed hermetically-sealed package, making it a highly reliable product that is not as susceptible to external environmental conditions and can therefore be used in various harsh environments.

Nichia expects this LED to contribute to the complete replacement of mercury lamps, which create environmental issues for the world’s future. Nichia will continue to improve the characteristics of its UVC LED portfolio and aim to create a new Deep UV market leveraging the characteristics of Solid-State Lighting.

Rock Pi S – single-board computer with RK3308 for 9.90 USD

Radxa released info and pictures of a new very small single-board computer called Rock Pi S. The size of Rock Pi S is only 38×38 mm and the price should be 9.90 USD + shipping.

The board contains processor RK3308, 256/512 MB RAM, 100 Mbps ethernet connection, 1x USB 2.0, 1x USB 2.0 Type-C, optional WiFi 802.11b/g/n and BlueTooth 4.0, microSD card slot and 26-pins extension header.

The Rock Pi S is a single-board computer(SBC) that equips an RK3308 Rockchip by Radxa. It is assembled by a 64bits quad-core processor, USB, ethernet and voice detection engine at the size of 1.7 inches. The Rock Pi S is suitable for voice applications and some IoT projects. What ‘s more? The Rock Pi S has a 26-pin expansion header which includes 4 I2C interfaces, 3 PWM interfaces, 2 SPI interfaces, 3 UART interfaces, and one I2SO interface. All these functional interfaces can be embedded into 1.7 inch tinny Pi. This little board is able to support Debian system successfully, and there are wifi and blue tooth module on this board as well. It is a good idea to develop this board into a central controller of the media center with a tiny size and attractive price.

Features

  • Rockchip RK3308 Quad A35 64bit processor with built-in VAD
  • 512 MB RAM
  • USB 2.0 OTG(type-C) + USB 2.0 HOST(type-A)
  • RJ45 10/100Mbit Ethernet
  • 802.11 b/g/n Wifi +bluetooth 4.0 with external antenna connector
  • 26 pin GPIO header
  • 26 pin voice/audio header includes I2C, PCM, TDM, PDM, SPDIF, and HDMI ARC
  • Size 1.7×1.7 inch (~38.1mmx38.1mm)
  • Debian and Buildroot successfully tested
  • Rock Pi S onboard storage version with 4GB NAND flash

The board is not selling in this time, but you can ask for sample for testing

Update 20/9/2019: ROCK Pi S is shipping now. You can buy from Allnet or seeedstudio.com

Ultra-Compact High Accuracy Earthquake Detection Sensor Module

ROHM announces the availability of an ultra-compact high accuracy seismic detection sensor module, BP3901, which is ideal for applications requiring reliable earthquake detection, such as automatic doors, unmanned transport vehicles, and smart meters.

Functions for accurately detecting vibration when an earthquake occurs and for stopping operation of equipment have garnered increased interest to prevent secondary disasters caused by fires and other factors in the aftermath of an earthquake. Similar functions to quickly detect damage conditions and assist with early recovery are also demanded in various infrastructures such as buildings and roads. However, mechanical earthquake detectors can only detect the presence/absence of vibration, and cannot distinguish whether the vibration is due to an actual earthquake or to other external factors, which often results in false positives.

In response, ROHM developed an ultra-compact (11.8 x 8.6 x 2.5 mm) BP3901 that integrates an original earthquake detection algorithm and offers high accuracy. In addition, a false detection prevention function is built in and it is capable of accurately distinguishing between vibration due to earthquakes or other external factors. It also has an angle correction function (±15° allowable mounting angle) that can correct for unintentional tilt of the module, further improving detection accuracy.

ROHM will continue to develop algorithms optimized for different vibration detection and expand its sensor module lineup. We will also offer total solutions for customer applications that contribute to greater safety and convenience by leveraging wireless technologies, such as Wi-SUN that is optimized for smart meter networks.

Key Features

1. Enables high Accuracy Earthquake Detection in a Compact Module Form Factor

The BP3901 incorporates a 3-axis accelerometer (from ROHM Group company Kionix) in a compact 11.8 x 8.6 x 2.5mm module package. ROHM developed a unique algorithm focused on determining SI (Spectrum Intensity) values. This algorithm features a high correlation with measured seismic intensity data used for earthquake damage assessment while it also optimizes the digital signal processing of acceleration data and calculation parameters/sequence through analysis of measured excitation data. This makes it possible to accurately measure the seismic level, enabling more precise earthquake detection compared with conventional mechanical sensors.

ROHM’s sensor adds the following 2 functions that further improve detection accuracy.

  • False detection prevention function distinguishes between seismic and external factors’ vibrations
    In applications requiring earthquake detection, false detection can occur due to various vibrations caused by collisions with external objects. However, by conducting detailed analysis of vibration waveforms and integrating a false detection prevention function, ROHM was able to distinguish between waveforms due to external factors’ vibrations and actual seismic events.
  • Angle compensation function provides a mounting tolerance of ±15°
    Conventional earthquake detectors can encounter problems in detecting earthquakes due to deviations in the internal seismic detection function and inclination that occurs over time. In contrast, the BP3901 achieves angle correction by combining the characteristics of the built-in accelerometer with new angle compensation operation. This allows it to correct for inclination within the vertical planes by up to ±15° (3x that of conventional products) in response to the gravitational acceleration of the Earth.

2.Contributes to longer application operation by reducing standby current consumption

The module is designed to stay in standby mode until a seismic event is detected. Since the device needs to be in standby state for long periods to prolong application operation, it is important to reduce current consumption during standby as much as possible. The BP3901 achieves low standby current consumption (3.5uA) by optimizing arithmetic processing. For example, installing this module in a fan heater exposed to an average of 10 seismic events a month (duration: 180s/time) enables operation for up to 5 years or more on just 2 alkaline AA batteries (in series).

3. Stores seismic data for analysis

The BP3901 saves calculated seismic data in non-volatile memory when the vibration exceeds a certain level. The last 16 seismic events can be stored in order of earthquake magnitude. Analyzing earthquake data collected at various locations will make it possible to predict future earthquakes. In addition, by enabling comparison of past earthquake data with damage conditions and equipment deterioration it is also expected to see use in earthquake recovery work and maintenance prioritization.

Availability: Now (samples), August 2019 (OEM quantities)

Applications

  • Smart meters (power, gas)
  • Unmanned transport vehicles
  • Automatic doors
  • Infrastructure such as roads and buildings
  • Vending machines
  • Household appliances (i.e. fan heaters, lighting)
  • Distribution boards (breakers), AC outlets
  • And more…

*Complies with Japan Electrical Wiring Industries Association standard JWDS 0007 (Appendix 2)

Terminology

SI Value:
Spectrum Intensity value is a subjective measurement of the effects of an earthquake on humans, objects of nature, and man-made structures.

Ga Value:
A unit that represents the amount of earthquake shaking, which is the force that affects people and buildings.

For further information, please contact www.rohm.com/eu

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