Ganymede MEMS Speakers can be retrofitted into standard enclosures

USound GmbH’s Ganymede Achelous and Adap MEMS speakers with their compact size of 4.7 mm x 6.7 mm x 1.6 mm are ideal for in-ear headphone designs and wearables such as true-wireless headsets. The perfect addition to traditional speakers, they can be easily retrofitted into standard enclosures to improve treble or implement 3D audio systems.

Achelous is a MEMS speaker designed for occluded-ear headphones. It can also be used as a micro-tweeter for wearables and array applications. This speaker provides higher excursion and more damping ideal for in-ear designs. In free-field, the resonance is lower than Adap, which allows a lower crossover frequency.

Adap is a MEMS-based micro-speaker for occluded-ear headphones and can also be used as micro-tweeter for wearables and array applications. It is optimized as a tweeter with high SPL above resonance. The Adap has a higher resonance frequency.

Features

  • Small form factor
  • High flexibility for acoustic system integration
  • Low heat generation
  • No magnetic field
  • High input impedance suitable for thin wires or PCB traces
  • Efficient MEMS actuator
    • High force and displacement
    • High signal-to-noise ratio (SNR)
    • Low power consumption compared to conventional speaker systems
    • Creates a clear and crisp sound for a vivid audio experience
  • High integratability
    • Easy integration with MEMS microphones
    • Capable of operating as a piezo microphone
    • The compact size enables array/matrix configurations and audio functionalities, such as ultrasonic applications and beam-forming
  • Noise cancellation
    • Ideal speaker technology for active noise cancellation applications
    • Perfect for 3D audio applications for augmented and virtual reality

Video

Availability

GEN2 650V SiC Schottky Diodes Offer Improved Efficiency, Reliability and Thermal Management

Power Semiconductor sic schottky LSIC2SD065DxxA LSIC2SD065ExxCCA group image

Littelfuse, Inc. today introduced two second-generation series of 650V, AEC-Q101-qualified silicon carbide (SiC) Schottky Diodes. The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are available with a choice of current ratings (6A, 8A, 10A, 16A or 20A). They offer power electronics system designers a variety of performance advantages, including negligible reverse recovery current, high surge capability, and a maximum operating junction temperature of 175°C, so they are ideal for applications that require enhanced efficiency, reliability, and thermal management.

When compared to standard silicon PN-junction diodes, the 650V Series SiC Schottky Diodes support dramatic reductions in switching losses and substantial increases in the efficiency and robustness of a power electronics system. Because they dissipate less energy and can operate at higher junction temperatures than Si-based solutions, they allow for smaller heat sinks and a smaller system footprint. This provides end-users with all the advantages of more compact, energy-efficient systems and the potential for a lower total cost of ownership.

Typical applications for 650V Series SiC Schottky Diodes include:

  • power factor correction (PFC),
  • buck/boost stages in DC-DC converters,
  • free-wheeling diodes in inverter stages,
  • high-frequency output rectification and
  • electric vehicle (EV) applications.

These new series are our first 650V SiC Schottky Diode offerings; all our previous releases were 1200V-rated devices, so we can now address a wider range of applications and further complement the Littelfuse SiC MOSFET portfolio,” said Christophe Warin, Silicon Carbide Product Marketing Manager, Semiconductor Business Unit at Littelfuse. “Their AEC-Q101 qualification puts these diodes in a higher class than similar devices in terms of quality and reliability.

The 650V Series SiC Schottky Diodes offer these key benefits:

  • AEC-Q101-qualified diodes exhibit exceptional performance in demanding applications.
  • Far lower switching losses than silicon bipolar diodes and fast, temperature-independent switching behavior make these devices suitable for high-frequency power switching.
  • The positive temperature coefficient enables safe operation and ease of paralleling.
  • The 175°C maximum operating junction temperature provides a larger design margin and relaxed thermal management requirements.

Availability
LSIC2SD065CxxA Series SiC Schottky Diodes are available in TO-252-2L (DPAK) packages, in tape and reel format, with a minimum order quantity of 2,500 devices. LSIC2SD065AxxA Series SiC Schottky Diodes are available in TO-220-2L packages, with 50 devices packed in a tube, with a minimum order quantity of 1,000 pieces. Sample requests may be placed through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit Littelfuse.com.

For More Information
Additional information is available on the LSIC2SD065CxxA Series SiC Schottky Diodes product page and LSIC2SD065AxxA Series SiC Schottky Diodes product page. For technical questions, please contact: Christophe Warin, Silicon Carbide Product Marketing Manager, Semiconductor Business Unit at Littelfuse, cwarin@littelfuse.com

Win a TE AmbiMate MS4 Dev Kit!

Here’s your chance to win a TE AmbiMate MS4 Sensor Module Dev Kit, together with an Arduino MKR1000! TE AmbiMate MS4 development kits enable you to build prototypes and evaluation boards for systems incorporating TE’s state-of-the-art AmbiMate MS4 Series sensor modules.

To enter the giveaway, you must subscribe or be a current subscriber to our newsletters covering the newest products and latest applications. But hurry, the giveaway ends April 30th, 2019.

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SiFive Launches the World’s Smallest Commercial 64-bit Embedded Core

RISC-V Leader brings unmatched advanced 64-bit Core IP capability to embedded space.

SiFive, the leading provider of commercial RISC-V processor IP, yesterday announced the launch of the S2 Core IP Series at the Linley Spring Processor Conference in Santa Clara. The S2 Core IP Series is a 64-bit addition to SiFive’s 2 Series Core IP and brings advanced features to SiFive’s smallest microcontrollers. The S2 Series further adds to SiFive’s extensive, vastly customizable, optimized, silicon-proven, embedded core IP portfolio, which comprises the 2, 3, 5, and 7 Core IP Series in E (32-bit) and S (64-bit) variants.

Edge SoCs face the diverse requirements of real-time latency, deterministic capability and stringent power constraints. The S2 enables SoCs to have an always-on low power CPU that can be combined with high-performance CPUs that switch on only when applications demand performance, such as in voice-activated smart devices. The 2 Series can be configured to be as small as just 13,500 gates (in RV32E form). The S2 is just half the size of a similarly configured S5 core. Security is enhanced by separation between secure and non-secure domains. This degree of flexibility is what is needed to meet the constraints in terms of power, area and real-time demands as well as the requirements in terms of performance of modern edge workloads and applications. The S2 Series will be available as a customizable Core IP Series as well as in the form of standard cores via SiFive’s Core Designer.

SiFive’s 64-bit S Cores bring their hallmark efficiency, configurability and silicon-proven Core IP expertise to 64-bit embedded architectures,

said Ted Speers, head of product architecture and planning at Microchip Technology’s Microsemi subsidiary and RISC-V Foundation board member.

The S Cores will enable innovation for the next generation of embedded compute.

The ever-growing number of connected devices with artificial intelligence, machine learning, IoT, and real-time workloads have generated a massive demand for greatly enhanced embedded intelligence in compute at the edge. Legacy architectures have long ignored the need for small, efficient, 64-bit, real-time embedded processors. SiFive has secured more than 25 design wins for the 2 Series Core IP alone since its launch at DAC in June 2018 and is now launching the S2 Series for power- and area-constrained, high performance 64-bit embedded applications. The S2 has no direct competitive equivalent in the market in terms of offering 64-bit capabilities or advanced features within the footprint of a SiFive 2 Series Core IP. The 64-bit capability of the S2 allows for far easier integration than 32-bit physical addressing and provides the benefit of fast and efficient access to slow or far-away memories via flexible memory maps and micro instruction caches. SiFive is the sole RISC-V Core IP provider to offer 64-bit fully coherent heterogenous compute all the way up to nine cores per cluster where high-throughput processing is needed. Existing and new features are shared across E and S variants of the 2 Series, which include enhanced debug and trace.

To achieve SiFive’s mission to democratize silicon and compute, we must rapidly enable embedded intelligence where data touches the real world,

said Yunsup Lee, CTO and co-founder, SiFive.

SiFive recognized a deep need for a full 64-bit embedded solution. We leveraged our unique methodology to rapidly innovate and architect 64-bit, fully heterogenous and coherent, real-time core capability. Our S2 Core IP Series is silicon proven and brings efficiency, performance, and security to enable greater innovation at the edge.

About SiFive

SiFive is the leading provider of market-ready processor core IP, development tools and silicon solutions based on the free and open RISC-V instruction set architecture. Led by a team of seasoned silicon executives and the RISC-V inventors, SiFive helps SoC designers reduce time-to-market and realize cost savings with customized, open-architecture processor cores, and democratizes access to optimized silicon by enabling system designers in all market verticals to build customized RISC-V based semiconductors. Located in Silicon Valley, SiFive has backing from Sutter Hill Ventures, Spark Capital, Osage University Partners, Chengwei, Huami, SK Hynix, Intel Capital, and Western Digital. For more information, visit www.sifive.com.

NexDock 2 Transforms Your Smartphone Into a Laptop

These days smartphones devices have tremendous computing power, and can do virtually everything an actual computer can do. When we are at work, we mostly use our laptops and desktops, but outside the work environment, we mostly our smartphones. However, due to the fact that our smartphones have small screens and lack of keyboard, we still stick so much to our laptops and desktops. There has been various attempts to make lapdocks and laptop shells over the years, with varying degrees of success. However, the team behind 2016’s NexDock is back with a sequel on Kickstarter, called the NexDock 2.

The new NexDock 2 offers you a large screen, and a keyboard which turns your smartphone into a laptop. Launched recently on Kickstarter, the NexDock 2 has already reached nearly triple its funding goal. The NexDock 2 is designed like an ultra-portable laptop, but without a processor, RAM, or hard drive. It comprises of just a screen, keyboard, and battery housed within the laptop. When a smartphone is plugged into the NexDock 2, the laptop utilizes the processor of the smartphone for all of the computing work. For now, the NexDock 2 can only work with smartphones that have a “Desktop Mode,” which is only available on Samsung and Huawei devices, but we hope to see this feature implemented by other smartphones manufacturers in the future.

NexDock 2 is not only compatible with smartphones, but also with single-board computers like the Raspberry Pi. There are plans also, to potentially develop “Compute Sticks” that turn the NexDock 2 into a laptop. The 13.3 screen of the NexDock 2 is a IPS LCD with a full-HD resolution of 1920×1080. The keyboard has a full QWERTY layout, with a multi-touch trackpad. For audio output feature, there are four 1W speakers. Available also are the standard USB, HDMI, and headphone jacks. The first NexDock, on the other hand, delivered a 768p TN panel, a mini-HDMI port, and full-sized USB ports only. The NexDock 2 comes with a 38 Wh battery, but the battery life span isn’t specified. It weighs 1420g, and 15.9mm in thickness.

The Kickstarter campaign for the NexDock2 will run until April 20th. The NexDock 2 is available for $199 for early birds, and it is expected to retail for $279. Backers should be delivered their Rewards in September.

ON Semiconductor continues to make battery-less IoT a reality with Bluetooth® Low Energy

ON Semiconductor, driving energy efficient innovations, continues to enable battery-less and maintenance-free IoT with the introduction of its RSL10 Multi-Sensor Platform powered solely with a solar cell. This complete solution supports the development of IoT sensors using continuous solar energy harvesting to gather and communicate data through Bluetooth® Low Energy, without the need for batteries or other forms of non-renewable energy.

The powerful combination of ultra-low-power wireless communications, small form-factor solar cell and low duty cycle sensing applications makes it possible to develop and deploy totally maintenance-free IoT sensor nodes. The RSL10 Solar Cell Multi-Sensor Platform is enabled by the RSL10 SIP, a complete System-in-Package (SiP) solution featuring the RSL10 radio, integrated antenna and all passive components.

The platform combines the RSL10 with a solar cell and a host of low power sensors from Bosch Sensortec, including the BME280 all-in-one environmental sensor (pressure, temperature, humidity) and the BMA400 ultra-low-power 3-axis accelerometer. Together, they will allow developers and manufacturers to create complete IoT nodes that are entirely powered through renewable energy or energy harvested from the sensor’s surroundings.

After the success of the RSL10 Sensor Development Kit, we are thrilled to work with ON Semiconductor on a new cutting-edge sensor development platform that is entirely solar powered,” said Dr. Peter Weigand, Vice President of Marketing, Bosch Sensortec. “The BMA400 is the first real ultra-low-power accelerometer that doesn’t compromise on performance. Combined with the BME280 integrated environmental sensor, this provides a comprehensive sensing solution for IoT applications such as climate control, intrusion detection and asset tracking.

Commenting on the release of the RSL10 Solar Cell Multi-Sensor Platform, Wiren Perera, who heads IoT at ON Semiconductor, said:

To support the growth of IoT, manufacturers are actively investigating alternative sources of energy to power their designs, helping to reduce environmental impact and lower manufacturing and maintenance costs. With this solution, established on the RSL10 Bluetooth Low Energy radio, we are proving that a battery-free and maintenance-free approach to smart sensor development is not only possible but can help manufacturers improve their designs.

There are a growing number of IoT sensor applications where the duty cycle is low enough to support intermittent communications, allowing the energy needed to support operation to be harvested using renewable sources. The energy efficiency of the RSL10 is augmented by the highly efficient power management system and the ultra-low-power sensors implemented in the platform. Applications are expected to include smart home and building automation such as HVAC control, window/door sensors and air quality monitoring. Asset tracking including package open/close detection, shock monitoring, and temperature and humidity data logging are also possible applications.

Features

  • Provides continuous sensor technology with no battery required
  • Provides industry’s lowest power Bluetooth® Low Energy technology enabled by the RSL10 SIP
  • 55 nw in Standby Mode , 10 mW in Rx, and Tx at 0 dbm
  • Supports Beacon and telemetry transmission
  • Fully re-programmable with SEGGER J-Link with Arm® Cortex® Debug connector (10-pin) adapter.
  • Ultra-low leakage
  • Adaptive duty cycle (self-detection of energy availability for transmission)
  • Dual solar cell interface (Through-holes wire soldering or ZIF interface )
  • Ultra-low-power smart sensors
  • Low voltage, high accuracy temperature sensor with wide temperature range (- 40 to 125C ) (NCT203)
  • Combined digital humidity, pressure and temperature sensor (BME280)
  • Smart 3-axes ultra-low power accelerometer (BMA400) with integrated wake up and sleep function
  • Pre-flashed with interweaving Beacon firmware:
  • Eddystone TLM Beacon
  • Broadcasts storage capacitor voltage level, temperature, time since power-up and advertisement packets since power-up
  • Compatible with BLE Scanner applications (iOS® or Android™).
  • Custom Environmental Service Beacon
  • Broadcasts temperature, humidity and pressure
  • Software libraries and examples are available in the B-IDK CMSIS-Pack
  • Supports a wide range of lighting conditions (Artificial or solar light, as low as 180 lux)

For easy development, the platform is supplied with all design files (Gerber, schematic and BoM) and customisable source code as part of a CMSIS software package. The RSL10 Solar Cell Multi-Sensor Platform is available now from ON Semiconductor alongside a number of other energy-efficient rapid prototyping platforms for IoT, including the Energy Harvesting Bluetooth Low Energy Switch which just was just named 2018 China’s Most Competitive IoT Solution by China Electronic Magazine.

Hephaestus – a fully DIY 3D printer

Frank documented a 3D printer build, called Hephaestus:

I finally did it, I designed and built my own 3D printer. This is in no way “the best 3D printer”. Instead, this was an epic and nightmare project that exercised my ability to engineer and build my own CNC machine. Along the way, I figured out what I did well and what I did badly, mistakes were made and sometimes fixed, even ignored.

Hephaestus – a fully DIY 3D printer – [Link]

BreadShield – Bridging Arduino to breadboard with no jumper wires

BreadShield is a shield that maps Arduino pins to breadboard ties without jumper wires. It inserts into both of them, bridging them together mechanically, electrically, and firmly.

Using jumper wires gets messy and tedious

Many projects start with connecting an Arduino and a breadboard using jumper wires. But jumper wires can easily become too many to manage. They clutter easily. It’s tedious to connect, trace, or debug them. Connections can easily come loose by your clumsy fingers, transportation bumps, or your pets. Plus, the breadboard and the Arduino cannot be quickly unhooked and rehooked.

BreadShield makes bridging Arduino to breadboards easy

Replace your mess of jumper wires with one shield. BreadShield maps standard Arduino Uno R3 pins to one row of pins, which can be inserted into a breadboard. Enjoy having all Arduino pins on your breadboard instantly, or swapping with a different breadboard swiftly. And never worry about if the connections got messed up with the swap! Signal names are labeled along the edge of the BreadShield, so you don’t have to track back-and-forth between Arduino and the breadboard.

Eliminate excess jumper wires

For example, it takes 11 jumper wires to connect Arduino with an HD44780 display. Ten of them, or over 90% of them, are eliminated when using BreadShield.

The project will launch soon on Crowdsupply.com. You can sign up on the pre-launch page to be notified when the project launches.

(update 23/05/2019) The campaign is launched on CrowdSupply.com

10 x 1W White LED Shield For Arduino Uno

This project includes 10 LEDs of 1W each, and provides high intensity lighting that can be used in various applications. The board is made in Arduino shield form and can be used with Arduino Uno or Mega. Each LED can be controlled individually connected to digital pins D2-D11 of Arduino. Circuit requires 9-12V supply, it can work with lower supply by changing current resistor across LEDs. Applications include: Large size Bar-graph monitor, led sequencer, strobe, LED light effects are possible applications with this board. CN3 provided to interface PYRO sensor or any sensor to create interactive light effects.

10 x 1W White LED Shield For Arduino Uno – [Link]

10 x 1W White LED Shield For Arduino Uno

This project includes 10 LEDs of 1W each, and provides high intensity lighting that can be used in various applications. The board is made in Arduino shield form and can be used with Arduino Uno or Mega. Each LED can be controlled individually connected to digital pins D2-D11 of Arduino. Circuit requires 9-12V supply, it can work with lower supply by changing current resistor across LEDs. Applications include: Large size Bar-graph monitor, led sequencer, strobe, LED light effects are possible applications with this board. CN3 provided to interface PYRO sensor or any sensor to create interactive light effects.

Features

  • Supply 9-12V DC
  • Maximum Load on each channel 200mA (Total 2Amps)
  • LED 1-10 Connected to D2,D3,D4,D5,D6,D7,D8,D9,D10,D11 of Arduino
  • CN2 Power Input
  • CN3 Sensor Interface
  • PCB dimensions: 87,79 x 51.17mm

Schematic

Parts List

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