The popular UGOOS brand has announced the launch of a TV Box powered by Amlogic S922X SoC called UGOOS AM6. Ugoos AM6, in contrast with older model, will include a fan for active cooling, providing optimal performance for the new Amlogic processor. While there are no available photos of the enclosure so far, Ugoos share some pictures of the board and specifications. UGOOS AM6 will run Android 9.0 just like Beelink GT-K, and other TV Boxes that will use the S922X SoC. AM6 TV Box will be available in the default version with 2GB of RAM and 16GB eMMC.
Ugoos AM6 specifications:
SoC – Amlogic S922X hexa-core big.LITTLE processor with 4x Arm Cortex A73 cores, 2x Arm Cortex A53 cores, Arm Mali-G52 MP6 GPU; 12nm manufacturing process
HDMI 2.1 up to 4K @ 75 Hz with CEC, HDCP 2.2, HDR support
3.5mm AV port for composite video (and stereo audio)
Video – 4K UHD H.265/VP9/AVS2 video decoding up to 60 fps
Audio – Digital audio via HDMI, analog stereo audio via AV port, S/PDIF port
Connectivity – Gigabit Ethernet, dual band 802.11 b/g/n/ac WiFi 5 MIMO RSDB, Bluetooth 5.0 via Ampak AP6398S module
USB – 1x USB 3.0 OTG/Host port, 3x USB 2.0 ports
Misc – IR receiver, IR output port, battery header (for RTC?), LED header, 12-pin I/O header, Wake on LAN function
Power Supply – 12V/2A via DC power barrel jack
Dimensions – TBC
UGOOS AM6
Other significant differences against Beelink GT1-K are that Ugoos AM6 should cost less since the default option has less memory (2GB) and storage (16GB). WiFi performance is expected to be good thanks to AP6398S module with MIMO and RSDB (Real Simultaneous Dual Band ) support.
The company did not provide any pricing or launch date.
Aaeon has recently announced specifications for a Linux-ready “UP Xtreme” SBC with a 15W TDP, 8th Gen Intel Whiskey Lake-U CPU, up to 16GB DDR4 RAM and 128GB eMMC, 2x GbE, 6x USB, SATA, and optional AI Core X modules via M.2 and mini-PCIe. Aaeon first launched their UP board family back in 2015 with the original board featuring an Atom X5 Cherry Trail processor. Aaeon’s UP project is completely community-backed and open spec. The UP Xtreme hacker board built around Intel’s 8th Gen Whiskey Lake U-series Core processors, so, this is likely the fastest open-spec, community-backed SBC around.
Aaeon seems to support all five Core i7/i5/i3 models. All of them are dual-threaded, except only one. The models range from the 1.8GHz (4.6GHz in Turbo mode) quad-core Core i7-8565U to the 1.8GHz (3.9GHz Turbo) dual-core Core i3-8145U. Congatec, another SBC manufacturer, clocks the latter’s base speed at up to 2.1GHz, but Aaeon lists only 1.8GHz base frequency for all the UP Xtreme models.
At 120 x 120mm dimension, this is the largest UP board yet. The UP Xtreme SBC supports up to 16GB DDR4 RAM and up to 128GB eMMC storage. In addition to a powered SATA interface, there’s a SATA option on the M.2 “B/M” key slot, and mSATA is available via the similarly multi-purpose mini-PCIe slot, along with a SIM slot. An M.2 Key E slot is also onboard.
The UP Xtreme is further equipped with 2x GbE (Gigabit Ethernet) and 4x USB 3.0 ports, plus additional USB and RS232/422/485 headers. There’s also a pair of STM32 I/O headers, which may offer GPIO related to the STM32 MCU. Like other UP boards, further expansion is available via a 40-pin “HAT” GPIO connector, which implies the UP Xtreme can run some Raspberry Pi HATs.
The important features are:
Processor:
Intel 8th Gen “Whiskey Lake” U-series – 2x or 4x Whiskey Lake @ 1.8GHz (up to 3.9GHz or 4.6GHz Turbo) with Intel Gen9 UHD Graphics 620 (24 EU) at the 300MHz base and 1GHz max dynamic
Intel 300 series chipset
Memory: up to 16GB of DDR4 via dual sockets
Storage:
16GB to 128GB eMMC 5.1
SATA with SATA power
M.2 Key B/M with support for 2x SATA, and mini-PCIe with support for mSATA (see expansion below)
Networking: 2x Gigabit Ethernet ports (Intel i210/i211 and 1219LM)
AAEON, a leading developer in AI and Industry 4.0 solutions, announces the BOXER-8130AI, the newest product in our line of compact, fanless embedded Edge AI systems. Powered by NVidia Jetson TX2, the BOXER-8130AI is perfect for machine vision and AIoT gateway applications.
The BOXER-8130AI features the powerful NVidia Jetson TX2 CPU paired with 8GB LPDDR4 memory and 32GB eMMC storage onboard. With two processors onboard, the Dual Denver 2 and Quad ARM 57 processors, the NVidia Jetson TX2 is capable of supporting up to 256 CUDA cores and supports AI frameworks such as TensorFlow and Caffe. The BOXER-8130AI can even be configured to support a customer’s own AI interface software.
The BOXER-8130AI is built to easily integrate into any environment. Featuring six MIPI CSI-2 interfaces, the BOXER-8130AI can support up to six MIPI cameras. The BOXER-8130AI is also built for easy maintenance, with an SD Card slot, USB OTG, remote ON/OFF and almost all of its I/O ports together on one side. The BOXER-8130AI also features two antenna ports, perfect for mobile or AIoT gateway applications.
The BOXER-8130AI keeps the built tough design that the AAEON BOXER family is built on. It is capable of operating in temperature ranges from –20°C to 55°C and features a wide input voltage range of 9~24 VDC. Its fanless design also keeps dust and other contaminants from affecting operation, perfect for the harsh requirements of industrial embedded applications.
Speaking on the BOXER-8130AI, AAEON Product Manager Ken Pan said,
This is the perfect system for customers who are looking for a compact and rugged embedded AI Edge solution.
More information about the product can be found here.
The TVC series is a fully compensated harsh media pressure sensor from Merit SensorTM designed to handle today’s toughest pressure sensing environments. This pressure sensor series offers a pressure range from 15psi to 300psi, over a broad temperature range of −40°C to +150°C, with an accuracy of ±2.5%. The only requirement to operate the TVC series is a single 5VDC supply, and no external components required for operation. The unique pressure port isolates on board electronics, and the three wetted materials of silicon, glass and ceramic. The TVC series is able to withstand a variety of harsh media, such as fuel and are able to measure fuel vapour at low pressures or refrigerant gas at high pressure.
Features
Fully compensated harsh media pressure sensor
Pressure ranges available from 15 psi up to 300 psi
Absolute and gauge options available
Operating temperature −40°C to +150°C
Accuracy of ±2.5%
Output current of 2.5 mA
Operates on a single 5VDC supply
Suitable for air, liquid and gas with harsh media compatibility
No external components required for operation
For further information on the Merit SensorTM TVC series, please click here
The kit is available for ESP32 modules to offer developers cost-effective data transmission via sound waves.
Chirp, the pioneers in data-over-sound technology today announced the launch of its new SDK for Arduino, providing developers with audio-based data transmission capabilities to enhance projects created on the platform.
Now supporting ESP32 development boards, Chirp’s SDK for Arduino is available to use instantly and can be accessed directly from the Arduino library manager. Combined with the ESP32’s built-in Wi-Fi module, the SDK offers a cost-effective send and receive solution that is highly suited to IoT projects.
To use the SDK for ESP32 modules, developers will be required to install the platform on Arduino IDE and also register for Chirp credentials at developers.chirp.io. Developers must then configure the SDK, set the callbacks and also set the I2S audio driver to receive audio data from the digital MEMS microphone.
Developers utilising the SDK for Arduino can leverage Chirp’s machine-to-machine communications software to send data seamlessly and securely over inaudible sound waves. Offering a robust solution which can work in loud and extreme conditions, the solution can enable a frictionless connection experience for a broad range of projects whilst adding value to existing hardware.
Commenting on the launch, Joe Todd, Head of Engineering at Chirp said:
As developers ourselves, we are always excited to find new ways to share our technology with the community and play a part in the innovative projects of other like-minded enthusiasts. With our latest Arduino SDK, we look forward to offering the unique capabilities of data-over-sound to embedded developers and continue showcasing the value and accessibility of Chirp’s technology in the IoT space and beyond.
600V intelligent power modules (IPMs) from Infineon make up the CIPOSMicro IPMs. They are qualified for harsh humid environments, passing 1000 hours of high voltage, high temperature and high humidity reverse bias (HV H3TRB) stress testing.
This makes the energy-efficient IPM suitable for power appliance motor drives particularly in circulator hydronic pumps, drain pumps for washing machines, dishwashers, and kitchen hoods. They can also be used in air conditioning fans, refrigerator compressors, and motorised blinds.
The CIPOS Micro IM231 series features the latest motor drive TrenchStop6 IGBT and optimised switching characteristics for higher efficiency and low EMI. At 2kV, the CIPOS Micro IPMs offer the highest UL1557-certified isolation voltage in its class, claims Infineon.
The series comprises 4A (IM231-M6S1B, IM231-M6T2B) and 6 A (IM231-L6S1B, IM231-L6T2B) models. The CIPOS Micro IM231 is offered in both, through-hole and surface mount form factors. For a smarter design, says Infineon, there is a built-in UL certified NTC thermistor, anti-shoot through and over-current protection and fault reporting. The IPM can be implemented in applications with or without heatsink, pushing power up to 450W.
The anti shoot-through prevents spurious simultaneous turn on of high and low side IGBTs caused by malfunction of the microcontroller or external noise, explains Infineon. In addition, the integrated current protection has a high accuracy of +/-5 per cent. Above that, multiple markets ranging from 100 to 230V AC can be addressed with the same IPM package and an identical PCB design for an easy design-in and fast time to market.
Geniatech has posted about the launch of their DB3399 and DB3399 Pro SBCs equipped with the RK3399 and RK3399Pro SoCs, and their specifications. The Android 8.0-powered DB3399 Pro SBC runs the new AI-enhanced RK3399Pro version of the hexacore SoC. A similar DB3399 SBC is also launched with the standard RK3399 SoC, as well as a smaller, RK3399-based Developer Board 9 (DB9) SBC.
The DB3399 Pro is quite powerful as it’s based on the RK3399Pro SoCs – the same SoC that also drives Vamrs’ Toybrick RK3399Pro, as well as the upcoming, crowdfunded Khadas Edge-1S SBC from Shenzhen Wesion’s Khadas project. The RK3399Pro is the same as the original RK3399 SoC with 2x 1.8GHz Cortex-A72, 4x 1.4GHz -A53, and a Mali-T860 GPU, except for the addition of an up to 3.0-TOPS performing Neural Network Processing Unit (NPU). The NPU supports Tensorflow, Tensorflow Lite, Caffe, and other deep learning models.
DB3399 SBC
The DB3399 Pro is powered by Android 8.0 and is equipped with 3GB to 6GB LPDDR3 and 8GB to 32GB eMMC. The similar DB3399 board is a lower-spec version of the Pro one. It’s listed with Android 7.1 and offers 2GB to 6GB LPDDR4. The DB3399 defaults to 16GB eMMC, although you can purchase it with 8GB or 32GB. It lacks the Pro model’s RS232 and SATA ports, as well as its GPS, UART, and reset button. There are 5x USB 2.0 interfaces instead of six. A GbE port with Power-over-Ethernet (PoE) is available along with WiFi-ac and Bluetooth 4.2.
Media features include HDMI in and out ports, eDP, and MIPI-DSI interfaces, and a USB Type-C port with DisplayPort support. You also get 2x MIPI-CSI for attaching camera modules, plus SPDIF, a speaker, and several analog audio jacks.
DB3399 – 2GB to 6GB LPDDR4; 8GB to 32GB eMMC (16GB default)
MicroSD slot
SATA (Pro only)
Wireless:
Dual-band 802.11 a/b/g/n/ac
Bluetooth 4.2
GPS on Pro only
Networking: GbE port with PoE
Media I/O:
HDMI out port @ up to 4K@60fps
HDMI in port
eDP 1.3
DP available on USB Type-C
MIPI-DSI
2x MIPI-CSI
Analog mic, headphone, line-out jacks
Speaker
SPDIF
Other I/O:
USB 3.0 host port
USB Type-C port with DP support
6x USB 2.0 (5x on DB3399) — mostly internal I/O
RS232 and UART (Pro only)
SPI, I2C, GPIO
Expansion: Mini-PCIe slot
Other features:
RTC; watchdog
IR receiver
Reset (DB3399Pro only)
Power: 12V/2A input
Operatingtemperature: -10 to 60°C
Dimensions: 155 x 105mm
Operating system: Android 7.1 (DB3399) or Android 8.0 (DB3399Pro)
The other 3 boards Geniatech has announced are Developer Board 9, DB3288, and Developer Board 5.
Developer Board 9
DB9 ships with 2GB DDR RAM and 8-32GB eMMC, and offers a microSD slot and a GbE port. The SBC provides 2.4GHz WiFi (802.11 b/g/n) and Bluetooth 4.1, with optional dual-band WiFi-ac. It ships with the standard RK3399 without the NPU. This SBC features an HDMI port, dual audio jacks, a 2.5W speaker, and a camera interface for a 2-5-megapixel camera. It also has a USB 2.0 host and micro-USB OTG ports and a 12V/3A DC input. There also appears to be a 40-pin GPIO connector.
Developer Board 9 SBC
DB3288
The DB3288 is powered by a quad -A17, up to 1.8GHz Rockchip RK3288. This SBC runs much older Android 5.1. The DB3288 has the same 155 x 105mm dimensions of the DB3399 boards. The board ships with 2GB DDR3 RAM and 8-32GB eMMC and offers a microSD slot. The SBC provides 2.4GHz WiFi (802.11 b/g/n) and Bluetooth 4.1, with optional dual-band WiFi-ac.
DB3288 SBC
The DB3288 features HDMI in and 2x HDMI out ports, a DisplayPort, eDP, and MIPI-DSI interfaces, 2x MIPI-CSI, and a separate camera interface. There’s also an audio header, 2x USB 2.0 host ports, and a micro-USB OTG. Other features include I2C, SPI, I2S, RS232, and a 12V/3A input.
Developer Board 5
Just like the DB3288, the DB5 also runs Android 5.1 on a quad -A17, up to 1.8GHz Rockchip RK3288. The 155 x 105mm board has the same memory, wireless, and Ethernet support as the DB3288. The DB5 is equipped with an HDMI port plus LVDS and DVP interfaces, dual audio jacks, a 2.5W speaker, and an interface for a 2-5-megapixel camera.
Developer Board 5 SBC
Pricing, availability, and other relevant information for the DB3399 Pro, DB3399, DB9, DB3288, and DB5 SBCs can be found on Geniatech’s product page.
Rocketscream.com released their all-in-one Arduino compatible reflow controller powered by ATmega328P with OLED screen and built-in USB port. This reflow controller replaces the beloved “Tiny Reflow Controller V1” which had a character LCD display. Let’s see what’s new on this board.
First, it has the tiniest form factor they have ever made and now it comes with an OLED LCD display to plot the reflow curve along with current temperature value. On top of that, they have added a USB-serial interface chip to remove the necessity of an external USB-serial adapter.
Tiny Reflow controller V2 is powered by the ATmega328P coupled with the latest thermocouple sensor interface IC MAX31856 from Maxim, they also managed to remove the need of an Arduino board and reduce the overall cost. All components run on 3.3V to further simplify the design. All you need to build your own reflow controller is an external Solid State Relay (SSR) (rated accordingly to your oven), K type thermocouple (we recommend those with fiber glass or steel jacket), and an oven of course!
You can now select to run a lead-free profile or leaded profile from the selection switch. The example code running the reflow process utilized a PID control provided by the awesome PID library written by Brett Beauregard.
Features:
Powered by ATmega328P
3.3V at 8 MHz
Arduino Pro / Pro Mini 3.3V 8MHz compatible
MAX31856 thermocouple interface
0.96″ 128×64 OLED LCD yellow and blue color
2 push button:
1 to start and stop the reflow process
1 to select the reflow profile (lead-free or leaded) and stored on the non-volatile EEPROM
1 red LED for status indication
1 terminal block for thermocouple type K
1 terminal block for driving SSR (through an NPN transistor, 5mA @ 5V output) to control heating element/oven
1 terminal block for driving SSR (through an NPN transistor, 5mA @ 5V output) to control fan
1 buzzer with transistor for loud and annoying sound
1 reset button
ISP pins breakout
Built-in USB-serial interface for firmware upload and serial interface
Unit is powered through a microUSB connector with 500 mA resettable fuse
Comes with extra 4 pieces of M2*5mm spacer (male-female) and 4 pieces of M2*5mm screws if you decided to mount it on the oven’s front panel
Dimension – 27.94 mm x 50.80 mm
FR4 TG140 PCB with immersion gold (ENIG) finish
RoHS compliant – Yes
Schematic
All design files are available on githiub.com and you can buy an assembled and tested unit on www.rocketscream.com for only 29.90 USD.
Linaro announces 96Boards System-on-Module (SOM) Specification and Rockchip powered compute SOM design.
At the first day of Linaro Connect Bangkok 2019, 96Boards SoM specifications have been announced, together with the introduction of Rockchip RK3399Pro powered TB-96AI and Rockchip RK1808 based TB-96AIoT, which are the first 96Boards compliant SoMs, along with 96Boards SoM Carrier Board.
96Boards System-on-Module Specifications
Two form factors are defined as SOM-CA and SOM-CB with a maximum of four 100 pin Connectors. The X1 connector is mandatory on all SOMs. The defined interfaces are shown in the table below.
List of signals associated to each connectors:
X1 – SoM managements, 1x UART, 2x I2C, 1x SD, 2x SPI, 1x CAN, 1x multiplexed DSI/eDP/LVDS, 2x USB 2.0 OTG/Host, 1x USB 2.0/3.0 host
X2 – 1x I2S, 1x multiplexed I2S/PCIe, 6x multiplexed GPIO/analog audio, 1x multiplexed MIPI CSI/DSI/Audio, 1x Ethernet, 1x PCIe 4x, 1x USB 2.0 OTG/Host, 1x USB 2.0/3.0 device, 1x smartcard/muxed with PCIe, 1x SATA
X3 – 7x GPIO, 4x MIPI CSI inc. 1x multiplexed with MIPI DSI, 1x MIPI DSI multiplexed with MIPI CSI, 1x Ethernet, 1x HDMI
X4 – 2x UART, 2x I2C, 1x I2S mux with SATA, 7x GPIO mux with ADC/SPI, 1x SD. 2x SPI, 2x CAN (1x mux), 1x PCIe x4, 1x USB 2.0 OTG/Host, 1x USB 2.0/3.0 host, 1x SATA mux with I2S
That’s plenty of multiplexed signals which at first sight open the door for potential incompatibilities between modules.
The 96boards Wireless specification defines wireless modules with 802.15.4, BLE, WiFi, LoRa, NB-IoT, LTE-M, and future wireless standards. Again two form factors are specified with SOM-WA and SOM-WB and 20-pin are defined with GPIO, PWM, UART, SD, SPI, I2C, ADC, USB, SWD, and VDD/ground.
TB-96AI SOM
The TB-96AI , equipped with RK3399Pro, has an integrated neural network processor NPU, computing power of up to 3.0 Tops, and offers compatibility across a variety of AI architectures. It can be combined with the backplane to form a complete industry application motherboard, and be applied to various embedded artificial intelligence fields.
TB-96AIoT SOM
Equipped with the RK1808 AIoT chip, 22nm process, ultra low power consumption with Independent NPU and AI computing power of up to 3.0Tops, the TB-96AIoT also provides rich interfaces and strong scalability.
96Boards SOM Carrier Board
The 96Boards SOM Carrier Board is compatible with both the TB-96AI and TB-96AIoT. It is designed to suit different markets and demonstrates how easy it is to support multiple different SOMs.
Type 1LV is a small and high performance module based on Cypress CYW43012 combo chipset which supports WiFi 802.11a/b/g/n + Bluetooth 5.0 BR/EDR/LE up to 72.2Mbps PHY data rate on Wifi and 3Mbps PHY data rate on Bluetooth. 2Mbps LE PHY is also supported. The WLAN section supports SDIO v2.0 SDR25 interface and the Bluetooth section supports high-speed 4-wire UART interface and PCM for audio data.
In IEEE 802.11ac-friendly mode, the WLAN operation supports MCS8 (256 QAM) in 20MHz channel for data rate up to 78Mbps.
The CYW43012 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorighms, which ensure that WLAN and Bluetooth collaboration is optimized for maximum performance.
Teaming with Cypress allows us to leverage our combined expertise in delivering breakthrough solutions that are game-changers for the market,” says Mehul Udani, Director, Connectivity Solutions for Murata Americas. “Using our proprietary packaging and miniaturization technologies, Murata leads in developing turnkey, transformational tools that ease integration and enable connectivity to help bring IoT to fruition. With this lowest power Wi-Fi module, we now enable a new class of products that were previously designated for Bluetooth.
Embedded IPv6 network stack for use with WICED SDK and TCP keepalive is handled internally, so that host processor can keep sleeping.
In addition to Bluetooth 5.0 2Mbps PHY support, all of optional Bluetooth 4.2 features, LE Secure Connections, LE Privacy 1.2 and LE Data Packet Length Extension, are supported.
Type 1LV module is packaged in an impressively small shielded form factor that facilitates integration into size- and power-sensitive applications such as IoT applications, handheld wireless system, gateway and more.
Shielded Ultra Small Dual Band WiFi 11a/b/g/n+Bluetooth 5.0 Module
2.4GHz & 5 GHz WiFi+Bluetooth Module
Network Topology: AP and STA dual mode
Chipset: Cypress (CYW43012)
Processor: No
Modulation: DSSS / CCK / OFDM
High Performance Capabilities for Internet of Things
For Industrial IoT, Smart Home, Sensor Network, Gateway
802.11 a/b/g/n 78Mbps
NXP i.MX Linux, Cypress WICED
he Type 1LV module is now in mass production and you can find more information on wireless.murata.com
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