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Broadcom AEDR-9930E 3-Ch Reflective Optical Encoder

Posted on by mixos

Broadcom AEDR-9930E 3-Channel Reflective Optical Encoder offers selectable and programmable options of digitally differential A, B, and I outputs. The AEDR-9930E digital encoder mode provides two-channel (AB) quadrature digital outputs and a third-channel digital index output.

The Broadcom AEDR-9930E encoder is TTL compatible with interfaced outputs for most signal processing circuitries. Therefore, the AEDR-9930E enables easy integration and flexible design-in into existing systems.

The device is developed to operate over a -40°C to +115°C temperature range and is ideal for commercial, industrial, and automotive end applications. The encoder encloses an LED light source and photo-detecting circuitry in a 5.00mm × 5.00mm  × 1.05mm (LxWxH) single package. The small size of the AEDR-9930E permits usage in a wide range of miniature commercial applications, where size and space are primary concerns.

Features

  • Digital output option: three-channel differential or TTL compatible; two-channel quadrature (AB) digital outputs for direction sensing and a third channel, index digital output
  • Wide-selection built-in interpolator with 1x to 10x, 12x, 14x, 15x, 16x, 18x, 20x, 25x, 32x, 50x, 64x, 80x, 100x, 128x, 160x, 256x to 512x and other user-programmable interpolation factors
  • SPI programmable interpolator from 1x to 1024x
  • 5.0mm × 5.0mm × 1.05mm (LxWxH) surface-mount leadless package
  • Operating voltage of 3.3V and 5.0V supply
  • Built-in LED current regulation
  • Wide operating temperature range from -40°C to +115°C
  • High encoding resolution of 397LPI (lines per in.) or 15.63LPmm (lines per mm)

more information: https://www.broadcom.com/products/motion-control-encoders/incremental-encoders/reflective-encoders/aedr-9930

Silicon Photomultiplier is utilized for ultra-sensitive precision measurements of single photons

Posted on by mixos

Broadcom AFBR-S4N66P014M NUV-MT Silicon Photomultiplier is utilized for ultra-sensitive precision measurements of single photons. The single-channel SiPM is based on the NUV-MT technology, which integrates improved photo-detection efficiency (PDE) with a decreased dark count rate and crosstalk compared to the NUV-HD technology. The device has a SPAD pitch of 40µm. By tiling multiple Broadcom AFBRS4N66P014M SiPMs, larger areas can be covered.

The Broadcom AFBR-S4N44P044M array encapsulates an epoxy clear mold compound for excellent mechanical stability and robustness. The epoxy is highly transparent down to UV wavelengths, resulting in a broad response in the visible light spectrum with high sensitivity toward the blue and near UV region.

The device is well suited for detecting low-level pulsed light sources, especially Cherenkov or scintillation light from the most common organic (plastic) and inorganic scintillator materials (for example, LSO, LYSO, BGO, NaI, CsI, BaF, or LaBr3).

Features

  • 2×2 SiPM array
  • Array size of 8.26mm × 8.26mm
  • High PDE (63% at 420nm)
  • Excellent SPTR and CRT
  • Excellent uniformity of breakdown voltage
  • Excellent uniformity of gain
  • 4-side tileable, with high fill factors
  • 40μm cell pitch
  • Highly transparent epoxy protection layer
  • Operating temperature range from -20°C to +50°C
  • RoHS, CFM, and REACH compliant

more information: https://www.broadcom.com/products/motion-control-encoders/incremental-encoders/reflective-encoders/aedr-9930

M5Stack CoreS3 ESP32S3 loT Development Kit

Posted on by mixos

M5Stack CoreS3 ESP32S3 loT Development Kit is based on ESP32-S3 solution, dual-core XTensa LX7 processor. This kit features 240MHz frequency, WiFi® at 16M flash, 8M PSRAM, built-in camera, proximity sensor, speaker, power indicator, I2S amplifier, dual microphone, and condenser touch screen. The CoreS3 kit supports OTG, CDC functions, and Arduino and UIFlow programming platforms. Typical applications include Internet of Things (IoT) development, various DIY project development, smart home control system, and industrial automation control system.

Features

  • Developed based on ESP32, supports WiFi® at 16M flash, and 8M PSRAM
  • Built-in camera, proximity sensor, speaker, power indicator, RTC, I2S amplifier, dual microphone, and condenser touchscreen
  • Power button, reset button, and gyroscope
  • TF card slot
  • High-strength glass
  • Support OTG and CDC functions
  • AXP2101 power management and low power design
  • Arduino and UIFlow-supported programming platforms

Specifications

  • 2-inch at 320*240 ILI9342C touch the IPS LCD screen
  • GC0308 at 30 megapixels camera
  • LTR-553ALS-WA proximity sensors
  • 16bits-I2S power amplifier chip AW88298 at 1W
  • ES7210, dual microphone inputs audio decoding chip

more information: https://m5stack.com

Sequans Monarch Go Certified LTE IoT Category M1 Modems

Posted on by mixos

Sequans Monarch Go Certified LTE IoT Category M1 Modems, connected by Verizon, are comprehensive modem components offering a short route to market and a low Total Cost of Ownership (TCO) to develop cellular-IoT connected devices. The Monarch Go Modems avoid costly lab testing while improving time-to-market thanks to a reduced effort for board design. These modems remove the need to design and tune a cellular antenna as it embeds an optimized LTE antenna, saving months of design effort and lab testing. The plug-and-go Monarch Go Modems feature a pre-installed ThingSpace IoT SIM and a default data plan.

The mechanical integration of the Monarch Go LTE-M modem component into IoT devices is extremely simple, requiring only two screws, a single low-profile board-to-board connector, and no soldering. Monarch Go includes an industry-standard UART interface, a set of AT commands, and examples for connecting your device application MCU controller.

Features

  • LTE-M modem component with embedded antenna certified for use on the Verizon network
  • Optional embedded GPS
  • ThingSpace IoT SIM pre-installed
  • ThingSpace online management
  • Easy connection to cloud services from a third party and geolocation
  • Industry-leading network coverage in the USA
  • RoHS compliant

Specifications

  • Modem
    • Sequans Monarch™ LTE-M chip
    • Pre-installed ThingSpace IoT SIM
    • Certified for use on the Verizon network (LTE band 13) with a roadmap for global band support
    • Compatible with Linux, Windows, and a wide range of embedded and real-time operating systems
    • High-speed UART as data and AT command interface
    • Embedded IP stack with support for UDP, TCP, TFTP, FTP, HTTP, HTTPS, MQTT, or MQTTS
    • Location based services
    • SMS send and receive
    • Low power modes PSM, eDRX, and RRC IDLE
    • Support for Verizon FOTA services from the ThingSpace online management platform
    • LTE Cat M1: 375kbps uplink and 300kbps downlink (peak)
  • LTE-M data plan
  • GPS (Monarch Go-GPS)
    • Sensitivity
      • -162dBm tracking
      • -148dBm acquisition
    • Location update rate up to 1Hz
  • Electrical and RF
    • 3.1V to 5.5V regulated supply voltage range
    • Ultra-low power mode (PSM)
      • 1µA without GPS
      • 35µA with GPS
    • 1.8V UART interface
    • Maximum transmit power up to +23dBm, LTE band 13
    • Certified FCC compliant
  • Mechanical
    • 35mm x 50mm x 14.95mm (1.38″ x 1.97″ x 0.59″) in dimension
    • Plastic enclosure fixable with 2 screws
    • Shipped with ThingSpace SIM pre-installed
    • Embedded LTE antenna
    • Low profile 20-pin digital board-to-board connector to connect an application controller through the industry standard UART interface
    • LED for modem activity
    • LED for GPS activity (Monarch Go-GPS only)
    • 16g weight
  • Temperature ranges
    • -40°C to +80°C operating
    • -40°C to +85°C storage

more information: https://sequans.com/products/monarch/

Saelig Introduces Siglent SHA800A Portable Spectrum Range to 7.5GHz

Posted on by mixos

Siglent SHA800A analyzers combine the capabilities of a Spectrum Analyzer, a Vector Network Analyzer, and a Cable/Antenna Tester all in one intuitive handheld package.  With a frequency range up to 7.5 GHz, these analyzers deliver reliable automatic measurements and multiple modes of operation.

Saelig Company, Inc. has introduced the SIGLENT SHA800A series, handheld portable spectrum analyzers which form a powerful, versatile choice for benchtop and field RF measurement applications. SHA800A analyzers combine the capabilities of a Spectrum Analyzer, a Vector Network Analyzer, and a Cable/Antenna Tester all in one intuitive handheld package.    With a frequency range up to 7.5 GHz, these analyzers deliver reliable automatic measurements and multiple modes of operation. The spectrum analyzer includes a built-in amplifier and independent signal source, fast scanning speed, high sensitivity. It can monitor RF broadcasts, perform channel power scanning, power monitoring, wireless interference location, electromagnetic compatibility measurements, and other functions. The cable and antenna testing function includes built-in DC voltage bias, with a 1-path-2-port vector network analysis function. It can measure TDR, VSWR, debug port matching issues, perform insertion loss measurements, tower amplifier debugging, cable fault location, Smith charts, etc.

With two models (SHA851A/SHA852A) the specifications include:

  Spectrum Analyzer:

  • Frequency Range from 9 kHz up to 3.6/7.5 GHz,
  • Displayed Average Noise Level (Typ.), -165 dBm/Hz
  • Offset Phase Noise (1 GHz, Typ.), -104 dBc/Hz.@10 kHz
  • Minimum Resolution Bandwidth (RBW) 1 Hz up to 10 MHz
  • Preamplifier and independent signal source up to 7.5 GHz,
  • GPS positioning and logging

  Cable and Antenna Test

  • Frequency Range from 100 kHz up to 3.6/7.5 GHz,
  • Distance To Fault and Time Domain Analysis
  • Vector Network Analyzer
  • Bias out up to 32VDC
  • Typical working time 4 hours,
  • Weight 7lb
  • 8.4” Multi-Touch Screen, Mouse and Keyboard supported

The explosion of RF Technologies such as 5G and IoT has created a highly complex electronic measurement environment.  Monitoring and debugging these applications are increasingly shifting from laboratories and workstations to on-site and outdoor applications, requiring reliable handheld measurement instruments. Applications for the SHA800A analyzers include communication engineering, telecom operation and maintenance, radio management, factory production, education and teaching, and many others. They provide a capable and more economical alternative to other handheld analyzers. Siglent SHA800A Analyzers are available now from Saelig Company, Inc.

more information: https://www.saelig.com/siglent-spectrum-analyzers/sha852a.htm

MYIR Launched $14 ARM SoM based on Allwinner T113-S3 dual-core Cortex-A7 SoC

Posted on by mixos

MYIR has launched a new SoM MYC-YT113X based on Allwinner SoC after introduced the MYC-YT507H for T507-H last year. The MYC-YT113X CPU Module is powered by Allwinner T113-S3 processor which features up to 1.2 GHz Dual-core ARM Cortex-A7 processor with 128MB DDR3 on-chip memory. Additionally, the MYC-YT113X takes more other advantages of the T113-S3 MPU such as the single-core HiFi4 DSP, Robust Video Engine and extensive connectivity to provide an ideal solution for smart control and HMI applications in the automotive and industrial sectors. MYIR offers two standard configurations for 256MB Nand Flash or 4GB eMMC external memory options. A number of peripheral and IO signals are access through 1.0mm pitch 140-pin stamp-hole (Castellated-Hole) expansion interface.

The MYC-YT113X CPU Module is a highly integrated SoM, measuring only 39mm by 37mm. It is capable of running Linux and provided with software resources including kernel and driver source code, together with detailed user manual and documentations to help customer start their development rapidly.

MYC-YT113X CPU Module Top-view and Bottom-view (delivered with shielding cover by default)

Features Of MYC-YT113X CPU Module

  • Dimensions: 39mm x 37mm
  • PCB Layers: 6-layer design
  • Power supply: 5V/1A
  • Working temperature: -40~85 Celsius (industrial grade)
  • Allwinner T113-S3 processor
    – Up to 1.2GHz Dual-core Arm Cortex-A7 with built-in 128MB DDR3
    – Single-core HiFi4 DSP
    – Supports H.265/H.264 video decoding up to 1080p@60fps and JPEG/MJPEG video encoding up to 1080p@60fps
  • 4GB eMMC or 256MB Nand FLASH
  • 32KB EEPROM
  • 0mm pitch 140-pin stamp hole expansion interface
    – 1 x RGMII/RMII
    – 2 x USB2.0
    – 6 x UART
    – 2 x CAN
    – 4 x TWI
    – 2 x SPI
    – 1 x GPADC and 4 x TRADC
    – 1 x MIPI DSI
    – 1 x Single-channel LVDS and 1 x Dual-channel LVDS or 24-bit RGB (supports up to 1080p@60fps)
    – 1 x RGB
    – 1 x Parallel CSI
    – 2 x I2S
    – Up to 59 GPIOs (Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and CPU Module pin-out description file)
  • Linux OS
MYC-YT113X CPU Module Function Block Diagram

MYIR provides MYD-YT113X Development Board for evaluating the MYC-YT113X CPU Module. It has a versatile base board to facilitate the expansion from the MYC-YT113X through the 140-pin interface, such as serial ports, USB, Ethernet, CAN, WiFi, LVDS, Audio and so on. It is an excellent evaluation platform as well as a solid reference design for customers using the MYC-YT113X CPU Module or solutions based on T113-S3 processors.

MYD-YT113X Development Board Top-view

 

MYD-YT113X Development Board Bottom-view

The MYC-YT113X CPU Module is a high-performance and ultra-low-cost SoM, pricing at only $14/pc for the 256MB Nand Flash version (MYC-YT113S3-256N128D-110-I). Discount is to be offered for volume quantities. MYIR also provides OEM/ODM services to help customers accelerate their time to market and save cost.

MYD-YT113X Development Board Function Block Diagram

More information about above new products can be found at: https://www.myirtech.com/list.asp?id=722

AAEON Deepen Ties with Adaptiv Networks to Expand the US SD-WAN Market

Posted on by mixos

With network security a priority in the hybrid working world, AAEON and Adaptiv lead the way.

The value of the SD-WAN solutions market is projected to hit $13.7 billion worldwide by 2026, with more and more organizations making data security a priority. As one of the leading manufacturers of advanced network computing and security hardware platforms, AAEON seeks to make a big contribution in the attempt to achieve this market growth, with a greater focus on providing versatile and cost-effective networking solutions to the US market.

To do this, AAEON has strengthened ties with Adaptiv Networks, a leading cloud-native SD-WAN-as-a-Service vendor with whom AAEON has had a strong partnership for a number of years. In collaboration with Adaptiv, AAEON will help enterprises to simplify their network infrastructure, increase network performance, and improve security.

With its continuously expanding desktop and rackmount network appliance ranges, AAEON has demonstrated a commitment to innovation by incorporating the newest and most sophisticated Intel® platforms to give network security providers the most effective and market-ready white box solutions. This commitment has paid off in the past, with AAEON being awarded Gold Partner status in 2022’s Intel Network Builders Winners’ Circle Program, in recognition of its successful adoption and commercialization of Intel® architecture in its network platform solutions hardware.

Adaptiv’s SD-WAN solutions are designed to address the growing need for enterprises to securely connect to cloud applications and services. In addition to this, there is a growing emphasis on supporting remote and hybrid working environments, for which organizations must balance network functionality with data security.

The increased prevalence of SD-WAN and SaaS solutions illustrates a positive and necessary shift towards institutions prioritizing network security and reliability as hybrid working environments become the new norm. This is why AAEON choose to work with elite providers like Adaptiv to ensure organizations receive the benefits that its white box solutions offer.

For more information about AAEON’s network appliance range, please visit our website or contact an AAEON representative directly.

For more information about Adaptiv’s award-winning cloud-managed network connectivity solutions, please visit their website.

Rugged COM Express CPU Module with Intel Atom x6000 Processors

Posted on by mixos

IBASE Technology Inc., a leading provider of industrial motherboards and embedded computing solutions, has announced the release of its latest ET880 COM Express CPU module designed to meet the demands of embedded applications that require low power consumption and fanless operation. The module integrated Intel Atom x6000 series processors that are built on 10nm technology support clock speeds of up to 3.2 GHz and Intel’s Time Coordinated Computing (TCC) technology, which enables precise clock synchronization across multiple devices.

The ET880 delivers robust performance and reliability, with features that make it an ideal choice for a variety of industrial and IoT applications. The module boasts onboard 8GB DDR4 memory and a DDR4 SO-DIMM slot for a total RAM capacity of 24GB to ensure efficient system operation. It is equipped with a range of connectivity options, such as a I226IT PCI-E 2.5G LAN controller, two USB 3.1, four USB 2.0, two SATA III, two UART (Tx/Rx only), and three independent displays via the DisplayPort / DVI-D / LVDS or eDP interfaces on the IBASE IP419 carrier board.

The ET880 is compatible with Windows 10 and Linux operating systems, and manufactured to meet the stringent requirements of industrial applications, with an extended temperature range of -40°C ~ +85°C, and long-term availability.

ET880 FEATURES:

  • Onboard Intel® Atom® x6000 series processors
  • Onboard 8GB DDR4 memory + 1x DDR4 SO-DIMM, IBECC compatible
  • 1x I226IT PCI-E 2.5G LAN
  • 2x USB 3.1, 4x USB 2.0, 2x SATA III, 2x UART (Tx/Rx only)
  • Supports 3x independent displays, DisplayPort /DVI-D / LVDS or eDP via carrier board (IP419)
  • Supports wide-range operating temperature of -40°C ~ +85°C

The ET880 is available now from IBASE. For more information, please visit www.ibase.com.tw

PICO-ITX board with Elkhard Lake processor

Posted on by mixos

The high-performance Hyper-EHL board from ICP Germany is a cost-effective solution for applications requiring high reliability, such as industrial automation, machine control, traffic engineering and display systems.

The Hyper-EHL board can be purchased with two different Elkhard Lake CPUs: Variant one with Intel® Celeron J6412 offers four processor cores, a base clock frequency of 2.00 GHz, 1.5 MB cache and an Intel® processor graphics unit with 400 MHz, while variant two with Intel® Celeron N6210 brings two processor cores, 1.20 GHz base clock frequency, 1.50 MB cache an Intel® processor graphics unit with 250 MHz. An LPDDR4 working memory with 4GB is soldered onto the board. Optionally 8GB are possible from 100 pieces. An iSATA slot and an M.2 slot with M Key are available for mass storage.

Specifications

  • Pico-ITX board with Intel® Celeron J6412 or N6210 CPU
  • LPDDR4 4GB memory (optional 8GB)
  • Three independent displays: HDMI, Display Port and optional IDPM
  • 2.5 GbE Intel® I225V
  • Two USB 3.2, two USB 2.0, one iSATA, one COM interface
  • Extensions: one M.2 M slot, one PCIe x4 slot

The Hyper-EHL has numerous connectors, including HDMI, Display Port, optional iDPM, a 2.5 GbE Intel® I225V LAN interface, two USB 3.0, two internal USB 2.0 and an internal RS232/422/485 interface. With a voltage input of 12V DC, the wafer EHL can be used in environments from 0°C to 60°C.

ICP Germany supplies the Hyper-EHL with appropriate memory and CPU on request.

iWave Unveils STM32MP13x Solderable System on Module in OSM Size-0 Form Factor

Posted on by mixos

In line with the new industry standard, Open Standard Module or OSM, defined by SGET, iWave announces the release of the iW-RainboW-G54S: STM32MP13x LGA System on Module (SoM). The SoM incorporates STM32MP13x MPU from STMicroelectronics and is built on OSM Size-0 standard, providing high performance, power efficiency, and a rich set of interfaces to meet versatile market needs.

High-end wearables and other low-powered embedded & consumer applications benefit from the new STM32MP13x MPUs featuring the ARM Cortex-A7 application processors running at 1GHz. Cortex-A7 has all the features of the high-performance Cortex-A15 and Cortex-A17 processors, including physical virtualization, NEON, and 128-bit AMBA 4 AXI bus interfaces.

Key features of STM32MP13x OSM System on Module

  • STM32MP13x MPU with Arm Cortex-A7
  • Up to 1GB DDR3L, 16Mb QSPI NOR Flash
  • 1 x RGMII, 1 x USB 2.0 OTG, 1 x USB 2.0 Host
  • 2 x SDMMC, 2 x ADC
  • 4 x UART, 1 x Console UART, 2 x SPI, 2 x I2S, 2 x I2C
  • 16 x OSM GPIOs
  • Size-0 Form Factor: 30 mm x 15 mm
  • Solderable LGA Package in OSM v1.1 Standard
  • 188 Contacts

The STM32MP13x System on Module is built on a 30 mm x 15 mm OSM Size-0 standard, the smallest size in the OSM variants making it an ideal choice for building portable consumer products. The 188 LGA contacts available on its back for mating with the carrier board make the platform resistant to shock and vibrations, ensuring high levels of robustness.

iWave brings design compactness while enabling modularity and scalability to ST customers. To fulfill the ever-increasing need for rapid data transfer, the SoM supports dual USB 2.0 interfaces and Gigabit Ethernet delivering a robust, high-performance, consistent, high-quality user experience.

Key features of STM32MP13x Single Board Computer

  • STM32MP13x MPU with Arm Cortex-A7
  • Up to 1GB DDR3L, 16Mb QSPI NOR Flash, 16Mb SPI NOR Flash
  • Micro SD, M.2 connector Key B (USB, Nano SIM connector)
  • Gigabit Ethernet (RGMII), USB 2.0 OTG, USB 2.0 Host
  • RS232, CAN x1, GNSS receiver, RTC Battery
  • 3.5mm Audio IN/OUT Jack, Speaker Header
  • Expansion: CAN x1, SDMMC 8bit, SPIx1, PWM x1, ADC x2, UART x2
  • DC 12V Input, -40°C to +85°C Industrial Grade
  • 100 mm x 72 mm (Pico ITX Form Factor)
  • Linux 5.15.67

The System on Module forms the building block for products and solutions that require a rich set of interfaces with high performance and efficiency. The SoM enables customers to shorten their time to market with reduced risk and complexity.

“STM32MP13x MPU incorporating Cortex-A7 offers power and performance balance for a variety of devices with varying requirements,” said Ahmed Shameem, Hardware Project Manager at iWave Systems. “The STM32MP13x Solderable System on Module leverages the processor features to provide rich performance for diverse low-power embedded applications that ST customers require.”

STM32MP13x OSM SoM is mounted on a carrier board as a Single Board Computer (SBC), which can also be used as an evaluation kit. This feature-rich multimedia insert-ready SBC is available in Pico-ITX form factor, ready to be integrated across diverse machine learning applications.

The System on Module and Single Board Computer are go-to-market and production ready complete with documentation, software drivers, and a board support package. iWave maintains a product longevity program that ensures that modules availability for long periods of time (10+ years).

More information on STM32MP13x OSM System on Module can be found here.

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