Audio Pioneer xMEMS Announces General Availability of the World’s Only All-Silicon, Solid-State FidelityTM Micro Speakers

xMEMS Labs, pioneers in Solid-State Fidelity, today announced the general availability of three revolutionary solutions for immediate integration into next-generation true wireless (TWS) earphones, in-ear-monitors (IEMs), digital hearing aids, and other emerging personal audio electronics, including smart glasses and sleep buds.

xMEMS Labs’ patented silicon-based speaker technology is slated to replace century-old coil speakers, allowing for high-volume, reliable mass production of solid-state speakers using semiconductor fabrication methods and resulting in more precise, higher fidelity, high-resolution audio.

“Since our first product release, we have been overwhelmed by the audio industry’s appreciation of Solid-State Fidelity,” said Mike Housholder, VP of Marketing and Business Development of xMEMS. ”Unlike conventional coil speakers, our speakers are monolithic, with silicon membranes offering far better material stiffness and exponentially faster impulse response than conventional speakers, resulting in the superior sound performance of xMEMS Solid-State Fidelity technologies.”

In fact, the xMEMS silicon membrane architecture has shown to be 95 times stiffer, offering improved clarity and eliminating the muddy midrange and treble response created by traditional speaker membrane materials.

The silicon architecture also delivers 150 times faster impulse response than traditional designs, offering the most pulse-true and accurate sound reproduction, which is not possible with the slow attack and decay of coil architectures.

With the announcement, xMEMS Labs has begun shipping three unique solid-state fidelity solutions:

  • Cowell, now starting mass production shipments, is the world’s smallest solid-state micro speaker, delivering superior high-frequency response and clarity, plus a wider sound stage, for TWS earphones and hearing aids.
  • Montara Plus, the world’s highest output MEMS micro speaker, is capable of sound pressure levels up to 120 dB @ 200 Hz making it an ideal full-bandwidth transducer for audiophile-level, high-resolution in-ear monitors, creating a path to smaller, lighter, simpler IEM designs without the phase alignment and design complexities of multi-driver IEM implementations.
  • Skyline DynamicVent, the world’s first piezoMEMS, DSP-controllable vent blends the benefits of open- and closed-fit earbuds and hearing aids. Skyline ushers in a new era of active ambient control (AAC), offering enhanced adaptive ANC and transparency mode implementations with reduced occlusion effects, eliminating the uncomfortable amplification of one’s own voice or footsteps when their ears are covered.

xMEMS Solid-State Fidelity technology dramatically advances the shift to all-silicon audio systems. This transition started to gain traction in 2007, when MEMS microphones accounted for just 5% of the total microphone market. By 2022 the share was more than 80%*. xMEMS is leading a similar transition for the speaker.

“The market for MEMS micro speakers is expected to follow a similar trajectory to MEMS microphones,” said Peter Cooney, founder of SAR Insight. “Consumer demand for high-resolution, spatial, lossless streaming audio represents a generational shift in audio content that requires a similar evolution in sound reproduction. Solid-state fidelity is able to create a more accurate reproduction of the source audio and a vastly superior listening experience.”

This is accomplished using thin-film piezo technology as the speaker actuator, replacing the coil and magnet, which when combined with silicon as the speaker diaphragm instead of plastic or paper creates the world’s first solid-state speaker. Unlike traditional coil speakers used in electronics, xMEMS micro speakers utilize standard semiconductor processes and packaging so they can be produced rapidly, uniformly, and cost-effectively at scale.

The result is a high-performing speaker that is about 1/10th the weight and 40 percent the size of a similar coil speaker. And with no moving parts, an xMEMS solid-state micro speaker is more reliable and durable than prior technologies, even meeting IP58 standards of protection from dust and sweat.

“Solid-State Fidelity and a monolithic architecture not only provide the best listening experience, they also create the most robust speakers in the industry,” Housholder continued.

Because of their architecture, Solid-State Fidelity earbuds can survive harsh conditions, like going through a washing machine and dryer when left in a user’s pocket.

“Solid-state fidelity is a game-changer,” Housholder concluded. “Until now, speakers remained one of the few electronic components unimproved by silicon technology. xMEMS true solid-state micro speakers are now here to fundamentally change the way people experience sound.”

For more information about xMEMS and its solid-state fidelity solutions, visit xmems.com.

SparkFun launched Thing Plus Matter with integrated MGM240P wireless module

SparkFun Thing Plus Matter

SparkFun has launched SparkFun Thing Plus Matter, a development and prototyping board based on Matter secure connectivity and also supports Zigbee and OpenThread. The board integrates the MGM240P wireless module from Silicon Labs, letting it operate consistently between smart home devices and IoT platforms even without an internet connection.

Interestingly, the SparkFun Thing Plus Matter combines wireless connectivity with the Qwiic ecosystem that allows the developer to interface with external sensors and actuators to gather surrounding information easily. The Silicon Labs’ Matter IoT protocol module is specifically designed for home automation applications.

Silicon Labs MGM240P is a high-performance wireless module designed for IoT devices powered by batteries for 2.4 GHz mesh networks. The Series 2 EFR32MG24 system-on-chip is inside the module, enabling IEEE802.15.4 and Bluetooth Low Energy connectivity. It also delivers high RF performance and energy efficiency.

Specifications of SparkFun Thing Plus Matter board

  • Wireless module: Silicon Labs MGM240P
    • Processor: A 32-bit ARM-M33 core processor clocked at 39MHz
    • Memory: 256kB RAM
    • Storage: 1536kB flash memory
    • Security: Secure vault support
  • Form Factor: Feather compatible
    • Dimensions: 2.30″ x 0.9″
    • Two Mounting Holes
    • 21x GPIO PTH Breakouts
  • Connectors: USB Type-C connector
  • Battery support: 2-Pin JST LiPo battery connector for a LiPo battery and MC73831 Single-Cell LiPo charger
  • Interfaces: 4-Pin JST Qwiic connector
  • LEDs: Red, Yellow, and Blue
  • Reset button: Physical push-button

One of the key features of the Thing Plus Matter is its Qwiic connector, which allows for quick and easy integration with a wide range of sensors and other modules. This makes it easy to add new functionality to your project without complex wiring or additional programming.

The board also includes a LiPo battery connector, allowing you to power your project with a rechargeable battery. The MCP73831 single-cell LiPo charger and MAX17048 fuel gauge ensure that your battery is charged and monitored properly, making it easy to keep your project running smoothly.

In addition to these features, the Thing Plus Matter includes multiple GPIO pins that allow you to easily control a wide range of peripherals and components, making it a great option for projects requiring high flexibility and control. The board also includes a µSD card slot, allowing easy storage and retrieval of data from external memory. This is particularly useful for projects requiring large amounts of data storage or logging.

SparkFun Thing Plus Matter is available for purchase on the official product page for $24.95, with quantity discounts available.

STMicroelectronics launched LSM6DSV16BX – an integrated sensor

STMicroelectronics LSM6DSV16BX integrated sensor

STMicroelectronics has introduced the LSM6DSV16BX, a highly integrated sensor that integrates a 6-axis inertial measurement unit (IMU) to detect head movements and activities and an audio accelerometer that identifies voice using bone conduction in a frequency range surpassing 1KHz. This single chip is specifically created to save significant space in wearable devices, including earbuds for sports and general use.

Besides the 6-axis IMU and audio accelerometer, the LSM6DSV16BX sensor integrates ST’s Qvar charge-variation detection technology to facilitate user-interface controls, such as swiping and touching. The sensor is particularly suited for applications like TWS headphones and headsets used in augmented, virtual, and mixed reality.

The LSM6DSV16BX brings superior capabilities to ear-based devices by integrating ST’s Sensor Fusion Low Power (SFLP) technology, which is designed explicitly for head tracking and 3D sound, along with in-edge processing resources found in ST’s third-generation MEMS sensors.

These include the Finite State Machine (FSM) for gesture recognition, the Machine-Learning Core (MLC) for activity recognition and voice detection, and adaptive self-configuration (ASC), which automatically optimizes performance and efficiency.

These features help reduce system latency while saving overall power and offloading the host processor. STMicroelectronics claims that the advanced integration and in-edge processing technologies save up to 70 percent of the system’s power consumption and 45 percent of PCB area.

The LSM6DSV16BX includes various software examples accessible on ST MEMS GitHub FSM and MLC Model Zoo. These examples comprise of pick-up gesture detection to enable automatic activation of services on some devices, TWS headsets’ in-ear and out-of-ear detection, and 3D sound head gestures in headphones, among others. To save developers time, pre-integrated application examples are also available in the X-CUBE-MEMS1 package.

The LSM6DSV16BX is available in a VFLGA package measuring 2.5mm x 3.0mm x 0.74mm and is available for purchase at a starting price of $3.95 for a minimum order of 1000 pieces. STMicroelectronics has provided software samples for the FSM and MLC cores on GitHub, and additional information can be found on the company’s website. Those who are interested can also request a free sample.

RAKwireless launches the RAK11720 with support for LoRa and Bluetooth

RAK11720 Ambiq Apollo3 SX1262 LoRa Bluetooth Module

RAKwireless, a leading IoT solutions provider, has recently launched its latest hybrid WisDuo module, RAK11720, which combines LoRa and Bluetooth BLE 5.0 capabilities, offering IoT developers greater flexibility and efficiency in creating new applications. The module is powered by the Ambiq Apollo3 Blue chip (AMA3B1KK-KBR-B0) and the Semtech SX1262, making it suitable for a wide range of IoT applications.

The RAK11720 comes with several noteworthy features, including the ability to configure it remotely via RAKwireless’s mobile app, WisToolBox. This feature offers users convenience in deploying and managing their IoT devices, particularly in smart buildings, factories, or cities. The RUI3 firmware development framework supports the RAK11720, making it compatible with other hybrid modules in RAKwireless’s range, such as RAK4600 and RAK4630.

Another advantage of the RAK11720 is its size and pin-to-pin compatibility with the popular RAK3172 module, enabling users to start with a LoRaWAN-only module and later upgrade to BLE capability without making significant changes to the PCB or coding. The RUI3 framework API allows users to share code between these modules and simplifies the porting process, saving time and reducing development costs.

The RAK11720 comes with a powerful AT command set that can be used with a co-processor or external computer over UART, allowing users to get started right away without writing any code. However, the RUI framework also enables users to compile their functionality directly into the module, saving money and lowering the total bill of materials (BOM) cost.

Additionally, the RAK11720 has a better usable ROM and RAM capacity than previous modules, offering 1MB and 384KB, respectively. This feature enables users to create custom firmware using RUI3 APIs via Arduino, eliminating limitations and opening doors to more edge applications.

The RAK11720 module is now available on the RAKwireless store for $7.99 plus shipping, a $2 premium over the company’s LoRa-only RAK3172, or $18 with a breakout board. IoT developers can take advantage of its numerous advantages to create new applications and business use cases.

Nicomatic launches SnapEDA CAD models for over 8 million connectors to accelerate circuit board design

Engineers can now design faster with ready-to-use symbols and footprints for Nicomatic’s micro connectors

Nicomatic, an international interconnect solutions provider, and SnapEDA, the first search engine for electronic design, are releasing computer-aided design (CAD) models for over 8 million of Nicomatic’s connectors to help engineers bring their designs to live faster.

A printed circuit board (PCB) is built with many small components, each of them with special characteristics and features. Previously, engineers had to design CAD models for each of them, a tedious and error-prone process. Just a single mistake can cause weeks of delays as well as thousands of dollars of rework.

With this new collaboration, engineers can now instantly generate and download models for Nicomatic’s 220 and 320 two-row micro connector series. Over 8 million connector configurations are available. Options range from 4 to 60 for signal contacts and 4 to 54 for coaxial or power contacts with locking or racking fixings. The models can be used in a wide selection of applications including aerospace, defense, medical equipment, transportation and more.

To generate the parts, engineers simply need to go to Nicomatic’s micro connector configurator for the 220 or 320 series and choose the part configuration of their preference. Once done, they can click on the SnapEDA website button on the PCB footprint section to generate the CAD model and download it instantly.

The CAD model generator has been designed and verified by SnapEDA’s engineering team. The models have undergone a rigorous quality assurance process powered by SnapEDA’s patented verification technology.

The models are designed following a combination of Nicomatic’s recommended patterns, IPC-7351B, and SnapEDA’s internal standards. To give engineers transparency into manufacturability, they can also view an automated quality report after the model has been generated.

Nicomatic is a full in-house international interconnect solutions provider. Their portfolio is dedicated to multiple configurations of board-to-board, board-to-wire and wire-to-wire connectors as well as man-machine interface switching technologies. Their parts are targeted to multiple sectors including aerospace, defense, health care and more.

“Nicomatic’s dedication to providing high-quality interconnect solutions has made them a trusted partner in industries such as aerospace and defense. We are excited to collaborate with them and provide the engineering community the tools they need to design electronics faster”, said Natasha, CEO and Founder of SnapEDA.

The libraries can be downloaded for free in over 15 different PCB design formats including Altium, Cadence OrCAD/Allegro, KiCad, Autodesk EAGLE and Fusion360, Proteus, PADS and more. The connectors can be used in a wide range of applications including aerospace, industrial automation, medical equipment, transportation and many more.

Seeed Studio unveils another XIAO board, but this time with the ESP32S3

Seeed Studio XIAO ESP32S3

We have previously covered many articles on the Seeed Studio XIAO, with the latest on the XIAO ESP32C3 low-power microcontroller board, designed to support Wi-Fi and Bluetooth wireless connectivity. This time, the company has decided to continue its XIAO series with the launch of its XIAO ESP32S3, which also comes with support for IEEE802.11 Wi-Fi leveraging the ESP32S3 32-bit dual-core processor.

As the name suggests, the XIAO ESP32S3 has the popular Espressif ESP32S3 32-bit LX7 dual-core processor clocked up to a frequency of 240MHz, allowing deep sleep mode and low power consumption of 14μA. The microcontroller board is perfectly designed for wearable wireless devices, smart homes, IoT applications, and simple robotic projects.

The ESP32-S3 is a highly advanced microcontroller unit (MCU) with a range of exciting features that help developers optimize their applications. One of the most noteworthy features of this MCU is its support for vector instructions, which enable the acceleration of neural network computing and signal processing workloads.

Seeed Studio XIAO ESP32S3 Hardware Overview

Vector instructions refer to a type of instruction that allows for the parallel execution of a single instruction across multiple data elements. This means that instead of processing one piece of data at a time, multiple pieces can be processed simultaneously, resulting in significant improvements in speed and efficiency.

The ESP32-S3’s support for vector instructions is a significant step forward for developers working on complex applications that require high-speed computation. By using the ESP-DSP and ESP-NN libraries, developers can take full advantage of the vector instructions in the MCU, allowing for highly optimized applications that can easily perform complex calculations.

The XIAO ESP32S3 measures just 21 x 17.5mm, so it can easily fit into any project and is ideal for developing and testing IoT applications that require portability and mobility. The board is designed with a breadboard-friendly and surface-mount design, making it suitable for production. The board’s compact design allows it to be used in a wide range of applications where space is limited, such as wearable devices, smart home automation systems, and other IoT applications.

Seeed Studio has listed the XIAO ESP32S3 microcontroller board for sale on its official website for $7.49, but it will be available on April 21, 2023.

Espressif released the ESP-SR speech recognition library to support various ESP32 modules

Espressif ESP-SR Speech Recognition

Espressif has released the ESP-SR speech recognition framework that helps the developer to build AI speech applications based on the ESP32 or ESP32-S3 modules. The ESP-SR framework includes four modules– audio front-end (AFR), wake word engine (WakeNet), speech command word recognition (MultiNet), and speech synthesis (for the Chinese language).

  • Audio Front-End: Espressif’s audio front-end algorithms are designed to enhance the accuracy and robustness of voice recognition systems in noisy environments. They apply various digital signal processing techniques to the audio signal, such as noise suppression, acoustic echo cancellation, blind source separation, and voice activity detection.

Espressif’s AEC algorithm supports up to two microphones, meaning it can effectively remove the echo from the microphone input signal for devices with two microphones. This can help improve the performance of speech recognition systems, as the removal of echo can result in cleaner and more accurate speech signals for processing. Espressif’s NS algorithm supports single-channel processing, which means it can suppress non-human noise in single-channel audio.

  • Wake Word Engine: Espressif’s wake word engine, WakeNet, is a specialized software designed to provide users with a high-performance, low-memory footprint wake word detection algorithm. WakeNet has been specifically optimized for use with Espressif’s ESP32-S3 series of chips, providing developers with a reliable and efficient way to add wake word detection to their products.

Espressif has provided an official wake word detection model, including wake words such as “Hi, Lexin” and “Hi, ESP,” to the public for free. This enables developers to quickly and easily add wake word detection functionality to their products without creating their own model. However, Espressif also allows customized wake words, enabling developers to create unique ones to suit their specific product or application needs.

  • Speech Command Recognition: Espressif’s speech command recognition model, MultiNet, is designed to provide a flexible off-line speech command recognition model. MultiNet enables developers to add custom speech commands to their products without the need to train the model from scratch, making the process much simpler and more efficient.

The flexibility of MultiNet allows developers to add their own custom speech commands to their products. This eliminates the need to train the model again, which can be time-consuming. Developers can simply add custom commands, and MultiNet will recognize and respond to them accordingly.

DC UPS solution UPSI-2406 for compact system integration

Emergency power supply protects 24V industrial and medical applications

The new DC UPS solution UPSI-2406 + battery pack BP-LFP-1325S can be flexibly integrated into a wide range of applications to protect sensitive or safety-relevant systems in case of power failure, voltage dip or flicker. The 24V DC emergency power supply ensures fail-safe operation in an emergency and prevents data loss.

All advantages at a glance

  • Integratable 24VDC emergency power supply
  • Ideal for long bridging times: 600 min (2W) – 25 min (70W) – 10 min (150W)
  • 10-year battery pack LiFePO4
  • USB & RS232 interface and relay contact
  • UPS management software included
  • Shutdown & Reboot function for IPC
  • Extended temperature range -20 to +55°C
  • IEC 62133-2 safety approval
  • UN 38.3 Transport certificate

The LiFePO4 energy storage (lithium iron phosphate) with 33 Wh convinces in safety-relevant applications with a particularly stable battery chemistry, a long service life of at least ten years and more than 6,000 full charge and discharge cycles. Bicker Elektronik deliberately relies on the particularly safe lithium iron phosphate chemistry for all high-performance battery packs, which makes thermal runaway almost impossible.

The new UPS management software ‘UPScom’ with cross-platform technology and intuitive user interface offers extensive functions for monitoring, parameterisation and messenger services.

Intuitive user interface and extensive functionality

The software ‘UPScom’ allows the connected devices to be shut down and switched off in a controlled manner during a power failure in order to avoid data loss or damage. The responsive WEB UI is called up in a web browser to set and pre-program all parameters of the DC UPS system and for real-time monitoring with state-of-charge indicator. The adjustable parameters include, among other things, load sensor (mA), shutdown delay, maximum backup time, minimum charge capacity before system start, notifications by email.

Cross platform technology

‘UPScom’ uses the new WebAssembly (WASM) architecture, which runs in most current web browsers. ‘UPScom’ runs on x86 compatible systems and also on most ARM-64 based systems under Microsoft® Windows and various Linux distributions.

Secure Shutdown & Reboot function for IPC systems

In the event of a “power failure”, the UPS signals the failure of the supply voltage via the integrated USB or RS232 interface, so that a controlled shutdown of the computer system is initiated and valuable data is saved. A script (batch) can also be executed before the system is shut down in order to process your own application-relevant processes. The integrated reboot function of the DC UPS automatically restarts the supplied IPC after the supply voltage returns, without the need for time-consuming on-site intervention by a service employee, e.g. in the case of completely self-sufficient computer systems at inaccessible locations.

Email messenger service

‘UPScom’ can be used for various events such as loss of connection to the UPS, system shutdown or power failure. These preventative measures can reduce or eliminate downtime.

Avnet launches RASynBoard with onboard machine learning capabilities

Avne RASynBoard Development Kit

The technology solutions company, Avnet, has released a new development kit called RASynBoard. This kit is specifically created to assist both hardware and software engineers in seamlessly incorporating edge artificial intelligence (AI) functions into their products, with the aim of speeding up the integration process.

The RASynBoard, developed jointly with Renesas, Syntiant, and TDK, incorporates a Renesas microcontroller and Syntiant Neural Decision Processor (NDP), as well as TDK sensors, to create an ultra-low-power edge AI platform. This compact kit is suitable for use as an additional sensor module for existing products or can be adapted and integrated into more comprehensive systems to meet more demanding sensing requirements.

The RASynBoard module is composed of two main domains: an AI processor that is always active and contains built-in sensors and a controller based on an MCU that has a low-power Wi-Fi and Bluetooth wireless module. The AI processor utilized on the RASynBoard is the Syntiant NDP120 Neural Decision Processor, while the MCU controller is the Renesas RA6M4.

Avnet RASynBoard front-view

The Core Board of RASynBoard contains the Renesas DA16600 module, which combines Wi-Fi and Bluetooth capabilities, and two TDK sensors: the ICM-42670-P 6-axis IMU and the MMICT5838 PDM digital microphone. The AI processing system can activate the MCU controller when it detects an AI-triggered “event,” allowing the MCU system to act or send a wireless notification before reverting to low-power AI sensing mode. The developers can personalize both the sensors connected to the AI processor and the AI algorithm that runs on the AI processor.

The RASynBoard Development Kit comes with the IO Board, which features built-in debugging and programming capabilities for the RA6M4 MCU, as well as expansion options for both the MCU and NDP120. Additionally, the IO Board is equipped with a micro-SD card interface for the RA6M4 MCU that can be utilized for extra data storage if required. Both Pmod and Click interfaces can be added to the IO Board to provide various sensing or control capabilities.

Avnet has collaborated with Edge Impulse to offer assistance to RASynBoard through the Studio machine learning platform. Avnet’s Vice President of Advanced Applications Group, Jim Beneke, stated, “Our design customization and manufacturing capabilities also allow us to offer production-ready solutions for customers needing a full-turnkey option.”

Avnet is currently accepting pre-orders for the RASynBoard Core Board and IO Board bundle on its website, which costs $99. The delivery of the bundle is anticipated to take place towards the end of the second quarter of 2023.

B&K Precision 9240 Multi-Range DC Power Supplies

B&K Precision 9240 Multi-Range DC Power Supplies provide up to 120W (9240 and 9241) or 200W (9242) of multi-range power in a compact 2U half-rack form factor. These power supplies combine an easy-to-use interface with an advanced list of programming features, battery charge mode, and data logging. The battery charge mode provides configurable fail-safe settings to disable the output when a specified energy, capacity, or time threshold is reached. The 9240 power supplies offer system integrators with LXI-compliant LAN and USB interfaces standard for remote control and programming with a GPIB model option.

The 9240 power supplies feature isolated and floating output with front panel remote sense, thermostatically-controlled fan for quiet operation, and adjustable voltage and current slew rate. These power supplies support Over-Voltage Protection (OVP), Over-Current Protection (OCP), Over-Temperature Protection (OTP), key-lock function, remote inhibit, and voltage fault. The 9240 power supplies are TUVus certified, indicating compliance with Canadian and U.S. National safety standards. These power supplies comply with cTUVus certification, which fulfills CSA and UL safety standards.

Features

  • Isolated and floating output with front panel remote sense
  • Up to 120W or 200W of multi-range power in a compact 2U half-rack form factor
  • Voltage range:
    • 0V to 32V (9240)
    • 0V to 60V (9241 and 9242)
  • Clean output power with less than 1mVRMS of noise
  • Advanced list mode programming with internal storage for 10 list mode programs
  • Battery charge mode with fail-safe conditions
  • Direct data logging to a USB flash drive
  • Thermostatically-controlled fan for quiet operation
  • Adjustable voltage and current slew rate
  • LED test mode for protecting components from inrush currents
  • Digital I/O terminal offers external triggering, voltage fault, and remote inhibit capabilities
  • LabVIEW, IVI-C, and IVI.NET drivers
  • Remote PC control software available
  • Convenient front-panel user calibration
  • cTUVus certification mark fulfills CSA and UL safety standards
  • NISPOM-compliant sanitization to securely restore factory settings

more information: https://www.bkprecision.com/products/power-supplies/9240

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