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LILYGO SoftRF T-BeamSUPREME Specializes in Radio Transmissions

Posted on by Saumitra Jagdale

Compatibility becomes an important factor when a number of units work together for a particular use. LILYGO and SoftRF have co-designed and created the LILYGO SoftRF T-BeamSUPREME. It is a development board specifically for test experiments to determine whether the development module meets individual requirements.

The CORE constitutes the Espressif ESP32-S3-dual-core Xtensa LX7 with 2.4 GHz radio, LoRa SX1262, and GPS interchangeable with a U-Blox MAX-M10S-00B or with an L76K Chip. The ESP32-S3 comes with a whopping FLASH memory of 8MB, enough to walk through many versatile applications.

When plugged in with the UBlox MAX-M10S-00B, the T-BeamSUPREME acts as an ultra-low-power, high-performance Global Navigation Satellite System (GNSS) Module. While the L76K chip version leads to a more compact and budget-friendly GNSS module.

Additionally, the development board includes a 1.3-inch SH1106 OLED, a LoRA SX1262 capable of transmission/ perception at 433/868/915 MHz, a 6-axis IMU (a 3-axis Gyroscope + 3-axis Accelerometer), and various connectors for external antennas.

The folks at SoftRF are excited to present a new flight recorder feature with this development module in addition to the barometric sensors which pre-existed in the SoftRF T-Beam Classic, but it will cost a minuscule more. Meanwhile, a 18650 Li-Po 2500 mAh battery is sufficient to power LILYGO SoftRF T-BeamSUPREME, which can be attached via the USB port.

Technical specifications of Espressif ESP32-S3 SoC:

  • GNSS: built-in Ublox MAX-M10S or Quectel L76K
  • Sub-1Ghz radio: built-in Semtech SX1262
  • Output: Type-C USB CDC ACM (default); Wi-Fi UDP or TCP; Bluetooth LE or UART 38400, 8N1
  • Display: built-in: 1.3″ I2C OLED
  • Sensors:
    •      IMU: QST Corp. QMI8658
    •      Magnetometer: QST Corp. QMC6310
    •      Air Pressure:      Bosch BME280
  • Storage: optional: micro-SD card
  • Battery: 18650 Li-Po 2500 mAh (optional)

Check out the GitHub-SoftRF documentation as well as the GitHub-LilyGO pages discussing the applications and the scope of use of the development module. They also draw a comparison between the two versions of the LILYGO SoftRF T-BeamSUPREME, which is essential information for experimentation.

Starting at $53.98, the multiple versions of the LILYGO SoftRF T-BeamSUPREME are available for pre-order on Aliexpress. It is estimated to be released on the 20th of May 2023.

iWave unveils TI AM62Ax Solderable SoM for Competitive Automotive & Automation Soln.

Posted on by mixos

Through a collaboration with Texas Instruments (TI), iWave Systems is excited to introduce iW-RainboW-G55M: TI AM62Ax Solderable System on Module (SoM). The SoM is powered by Texas Instruments AM62Ax Sitara processors and is built on the OSM v1.1 solderable SoM standard, offering an extensive set of interfaces in a compact form factor.

The iW-RainboW-G55M leverages the TI AM62Ax automotive-grade family of heterogeneous Arm®-based processors with its quad Arm Cortex®-A53 CPUs, a vision processing and deep learning accelerator, Arm Cortex-R5F CPUs for control and device management, display interface, extensive automotive peripheral and networking options, allowing for the development of products and solutions that require the implementation of man-machine synergy at the edge.

iWave adapted the OSM standard for the TI AM62Ax SoM to provide the user with a compact form factor, ruggedness (vibration resistance), and technology scalability based on the processor and application needs. The SoM enables customers to shorten their time to market with reduced risk and complexity.

Key features of iW-RainboW-G55M OSM SoM

  • AM62Ax processor
    • 4 x Cortex- A53 @ 1.4GHz
    • 1 x Cortex-R5F @ 800MHz (MPU Channel with FFI)
    • 1 x Cortex-R5F @ 800MHz (to support Device Management)
    • C7xV-256 Deep Learning Accelerator (up to 2 TOPS)
  • 2GB LPDDR4 RAM, 16GB eMMC Flash, 16Mb QSPI Flash
  • Compliant with AEC-Q104 Global Standard
  • IEEE 802.11 ac/ax, IEEE 802.15.4, and Bluetooth 5.3 Connectivity
  • 2 x RGMII, 2 x USB 2.0, 1 x SD (4-bit)
  • 1 x MIPI CSI, RGB 18-bit, I2S Audio x2
  • 3 x UART, 1 x CAN, 2 x I2C, 1 x QSPI, 3 x GPIO, 2 x PWM
  • MCU interfaces – 1 x MCAN, 1 x I2C, 1 x SPI, 2 x UART, 8 x GPIOs
  • Size-LF Form Factor: 45 mm x 45 mm
  • Solderable LGA Package in OSM v1.1 Standard
  • 622 Contacts
  • Linux & Free RTOS OS Support

The TI AM62Ax SoM satisfies diverse memory requirements and interfaces for embedded applications. With 2GB LPDDR4 (Expandable up to 8GB), 16GB eMMC Flash (Expandable up to 128GB), 16Mb QSPI Flash, and enhanced external memory access can meet diverse application needs. An onboard Wi-Fi 6 + BT 5.3 + LR-WPAN module gives needed wireless connectivity versatility, while a pair of CAN and ethernet connectors with TSN compatibility enables industrial/automotive deterministic networking options. The iW-RainboW-G55M OSM expands the RGB display interface and Camera peripheral to bring multimedia and AI @ Edge.

“By collaborating with TI, iWave aims to enable product development for customers through an extensive portfolio of embedded computing platforms on the TI AM62Ax processor series. The System on Module and Single Board Computers from iWave are targeted towards industrial, automation and automotive applications,” says Mr. Abdullah Khan M Director-Engineering at iWave Systems.” Through a well-established product longevity program and manufacturing eco-system, iWave helps customers focus on their core competencies and reduce their time to market.”

“TI vision processors like the AM62A family are easy to use, with integrated AI accelerators, common software, and open-source machine learning frameworks and models,” said Artem Aginskiy, general manager, Processors, Texas Instruments. “The new TI AM62Ax-based SoM from iWave further streamlines embedded designs – helping engineers expand the AI and vision processing capabilities of their automotive and industrial systems.”

AM62Ax OSM SoM is available on a carrier board as a Single Board Computer (SBC), which can also be used as an evaluation kit. This feature-rich multimedia insert-ready SBC is available in Pico-ITX form factor, ready to be integrated across diverse automotive and automation markets.

Key features of AM62Ax Single Board Computer

  • AM62Ax processor
  • 2GB LPDDR4 RAM, 16GB eMMC Flash, 16Mb QSPI Flash
  • Micro SD, M.2 connector Key B (USB, Nano SIM Connector)
  • Gigabit Ethernet (RGMII), USB 2.0 OTG, USB 2.0 Host
  • RS232 x1, CAN x1, GNSS receiver
  • 5mm Audio IN/OUT Jack, Speaker Header
  • Expansion: CAN x1, SPIx1, PWM x1, UART x2
  • DC 12V Input, -40°C to +85°C Industrial
  • 100mm x 72mm
  • Linux 5.4.7(Or higher), Free RTOS

The System on Module and Single Board Computer are go-to-market and production ready complete with documentation, software drivers, and a board support package.

With a built-in Hardware Security Module, Advance power management, AEC-Q104*, compatibility for open-source operating systems, and a product longevity cycle of 10+ years, the iW-RainboW-G55M OSM is ideally suited for competitive application in the automotive, broad set of industrial applications, and automation markets.

iWave Systems is a global leader in designing and manufacturing System on Modules and Single Board Computers. With over 23 years of diverse experience in the embedded domain, iWave has been a dependable technology partner serving multiple domains across the globe, such as industrial, medical, automotive, IoT, and computer vision.

For more information on the TI AM62Ax SoM and development ecosystem, please visit https://www.iwavesystems.com/product/ti-am62ax-based-osm-lf-module/

Murata Type 1SE Cellular Module intergrates MCU, eSIM and LTE-M/NB1 modem

Posted on by mixos

The Murata Type 1SE is a highly integrated (MCU, eSIM and LTE-M/NB1 modem), certified end device with an antenna connection for ease of integration with several different types of applications. The Type 1SE (LBAD0ZZ1SE) module is a Cat. M1/NB-IoT module which meets the certification standards in Japan and supports Truphone eSIM technology.

Typical applications for this module includes smart metering, wearables, tracking, M2M and internet of things (IoT) edge nodes accommodating a wide range of temperature ranges.

Block Diagram

Featuring Truphone

With Truphone, your IoT devices can be updated and connected remotely and at scale allowing you to deploy and manage connectivity for thousands of devices at the touch of a button.

Video

more information: https://www.murata.com/en-global/products/connectivitymodule/lpwa/overview/lineup/type-1se

Cambridge GaN devices launched second series of its ICeGaN 650 V Gallium Nitride HEMT family

Posted on by mixos

Second series of ICeGaN 650 V Gallium Nitride HEMT family deliver best-in-class robustness, Ease-Of-Use & high efficiency

Cambridge GaN Devices launched the second series of its ICeGaN 650 V gallium nitride HEMT family, delivering industry-leading robustness, ease-of-use and maximised efficiency. H2 Series ICeGaN HEMTs employ CGD’s smart gate interface that virtually eliminates typical e-mode GaN weaknesses, delivering significantly improved overvoltage robustness, higher noise-immune threshold, dV/dt suppression and ESD protection. Like previous generation devices, the new 650 V H2 ICeGaN transistors are driven similarly to Si MOSFETs, eliminating the need for complex and inefficient circuits, instead using commercially available industry gate drivers. Finally, H2 ICeGaN HEMTs feature a QG that is 10x lower than silicon parts and QOSS is 5x less, This enables H2 ICeGaN HEMTs to greatly reduce switching losses at high switching frequencies, reducing size and weight. This results in class-leading efficiency performance, a full 2% better than Industry’s best Si MOSFETs in SMPS applications.

Giorgia longobardi | CEO & Co-founder, CGD “CGD has established an innovative leadership position with the H2 series ICeGaN. Independent research by Virginia Tech has proven ICeGaN to be industry’s most rugged GaN devices, and in terms of ease-of-use, they can be driven like a standard silicon MOSFET, so the learning curve which can slow market acceptance is eliminated. The efficiency of GaN is well known, and ICeGaN is impressive across the full load range.”

ICeGaN 650 V Gallium Nitride HEMT

ICeGaN H2 Series feature an innovative NL3 (No Load and Light Load) Circuit, integrated on-chip alongside the GaN switch, resulting in record-low power losses. An advanced clamping structure with integrated Miller Clamp – also on-chip – eliminates the need for negative gate voltages, achieving true zero-volt turn-off, and improving dynamic RDS(ON) performance.  These e-mode (normally off) single chip GaN HEMTs include a monolithically-integrated interface and protection circuit for unmatched gate reliability and design simplicity. Finally, a Current Sense function reduces power dissipation and allows direct connection to ground for optimised cooling and EMI.

Giorgia longobardi | CEO & Co-founder, CGD “CGD has solved all the challenges that normally slow the adoption of a new technology. Furthermore, we are now ready to satisfy the mass market with our H2 Series ICeGaN transistors which are available through an established supply chain.”

more information: https://camgandevices.com

Honeywell IPM Intelligent Particulate Matter Sensors

Posted on by mixos

Honeywell IPM Intelligent Particulate Matter Sensors are laser-based sensors that detect and measure particle concentration using light scattering for monitoring air quality. The detection concentration range for Honeywell IPM is 0µg/m3 to 1000µg/m3. A laser light source illuminates a particle as it is pulled through the detection chamber. As particles pass through the laser beam, the light reflects off the particles and is recorded on the photo or light detector. The sensor then analyzes the light and converts it to an electrical signal to calculate particle concentration. During the production calibration, the sensor records the original laser light-intensity parameters and fan speed. The calibration algorithm is applied to the sensor output to minimize drift and improve the sensor’s lifetime accuracy. This self-calibration occurs on each power-on cycle.

Features

  • Laser-based (class 1) particle light scattering particle sensing
  • 0µg/m3 to 1000µg/m3 concentration range
  • Detects 0.3µm to 10µm particles
  • Up to 8 years life with continuous operation
  • Factory calibrated
  • RoHS and REACH compliant

Applications

  • Air-quality monitors (indoors and outdoors)
  • Air purifiers (commercial and residential)
  • Automotive cabin air purifiers
  • HVAC (commercial and residential)

more information: https://sps.honeywell.com/us/en/products/advanced-sensing-technologies/healthcare-sensing/particulate-matter-sensors

Monolithic Power Systems (MPS) MP6651 Single-Phase BLDC Drivers

Posted on by mixos

Monolithic Power Systems (MPS) MP6651 Single-Phase BLDC Drivers are highly advanced and versatile single-phase brushless DC (BLDC) motor drivers. The Monolithic Power Systems (MPS) MP6651 has integrated power MOSFETs and a Hall-effect sensor to deliver maximum performance and efficiency. The device also provides a high degree of control and flexibility. Capable of operating on input voltages ranging from 3.3V to 18V, the MP6651 is perfect for various applications.

Features

  • On-chip hall sensor
  • Wide 3.3V to 18V operating input voltage (VIN) range
  • 2A continuous current with QFN-10 package
  • 1.5A continuous current with SOIC-8 SL package
  • Integrated power MOSFETs
  • Configurable starting duty cycle
  • Configurable min output duty cycle
  • Configurable soft-on/off commutating angle (max 45°)
  • Configurable hall offset angle (max ±45°)
  • 4-step configurable current limit
  • 2kHz to 100kHz PWM input range
  • 2.4s to 19.2s configurable soft-start time
  • Fixed 27kHz output switching frequency (fSW)
  • Rotor lock protection with auto-recovery
  • Thermal protection with auto-recovery
  • Built-in input OVP and UVLO with auto-recovery
  • Available in SOIC-8 SL and QFN-10 (2mm x 3mm) packages

Typical Application

more information: https://www.monolithicpower.com/en/mp6651.html

Nexperia NCA95xx I2C GPIO Expanders

Posted on by mixos

Nexperia NCA95xx I2C General-Purpose I/O (GPIO) Expanders provide an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum. Housed in TSSOP24 and HWQFN24, these GPIO expanders are equipped with multiple features Interrupt, Hardware RESET, Internal pull-up resistors, and configurable pull-ups. These Nexperia NCA95xx GPIO expanders feature benefits such as extremely low static power consumption and reduce the PCB design complexity through trace reduction and routing simplification, thereby reducing the BOM cost.

Features

  • Single supply GPIO expander supporting operating power supply voltage range of 1.65V to 5.5V operation
  • Serial to parallel (SDA to P0-P16) and parallel to serial (P0-P16) conversion with I2C protocol
  • Schmitt-trigger action allows slow input transition and better switching noise immunity at the SCL and SDA inputs
  • Low power consumption of 2.5µA maximum
  • 400kHz operation (FM I2C mode)
  • Glitch-free power-up with all channels configured as inputs with weak pull-up resistors
  • 5V tolerant I/Os and 16 I/Os pins, which defaults to 16 inputs
  • Latched outputs with 25mA drive maximum capability for directly driving LEDs
  • Polarity inversion register
  • External RESET pin to reset state machine and internal registers
  • Noise filters on SCL and SDA inputs
  • TSSOP24 and HWQFN24 packages
  • Specified from -40°C to +85°C and -40°C to +125°C

more information: https://assets.nexperia.com/documents/user-manual/UM90013.pdf

Broadcom AEDR-9930E 3-Ch Reflective Optical Encoder

Posted on by mixos

Broadcom AEDR-9930E 3-Channel Reflective Optical Encoder offers selectable and programmable options of digitally differential A, B, and I outputs. The AEDR-9930E digital encoder mode provides two-channel (AB) quadrature digital outputs and a third-channel digital index output.

The Broadcom AEDR-9930E encoder is TTL compatible with interfaced outputs for most signal processing circuitries. Therefore, the AEDR-9930E enables easy integration and flexible design-in into existing systems.

The device is developed to operate over a -40°C to +115°C temperature range and is ideal for commercial, industrial, and automotive end applications. The encoder encloses an LED light source and photo-detecting circuitry in a 5.00mm × 5.00mm  × 1.05mm (LxWxH) single package. The small size of the AEDR-9930E permits usage in a wide range of miniature commercial applications, where size and space are primary concerns.

Features

  • Digital output option: three-channel differential or TTL compatible; two-channel quadrature (AB) digital outputs for direction sensing and a third channel, index digital output
  • Wide-selection built-in interpolator with 1x to 10x, 12x, 14x, 15x, 16x, 18x, 20x, 25x, 32x, 50x, 64x, 80x, 100x, 128x, 160x, 256x to 512x and other user-programmable interpolation factors
  • SPI programmable interpolator from 1x to 1024x
  • 5.0mm × 5.0mm × 1.05mm (LxWxH) surface-mount leadless package
  • Operating voltage of 3.3V and 5.0V supply
  • Built-in LED current regulation
  • Wide operating temperature range from -40°C to +115°C
  • High encoding resolution of 397LPI (lines per in.) or 15.63LPmm (lines per mm)

more information: https://www.broadcom.com/products/motion-control-encoders/incremental-encoders/reflective-encoders/aedr-9930

Silicon Photomultiplier is utilized for ultra-sensitive precision measurements of single photons

Posted on by mixos

Broadcom AFBR-S4N66P014M NUV-MT Silicon Photomultiplier is utilized for ultra-sensitive precision measurements of single photons. The single-channel SiPM is based on the NUV-MT technology, which integrates improved photo-detection efficiency (PDE) with a decreased dark count rate and crosstalk compared to the NUV-HD technology. The device has a SPAD pitch of 40µm. By tiling multiple Broadcom AFBRS4N66P014M SiPMs, larger areas can be covered.

The Broadcom AFBR-S4N44P044M array encapsulates an epoxy clear mold compound for excellent mechanical stability and robustness. The epoxy is highly transparent down to UV wavelengths, resulting in a broad response in the visible light spectrum with high sensitivity toward the blue and near UV region.

The device is well suited for detecting low-level pulsed light sources, especially Cherenkov or scintillation light from the most common organic (plastic) and inorganic scintillator materials (for example, LSO, LYSO, BGO, NaI, CsI, BaF, or LaBr3).

Features

  • 2×2 SiPM array
  • Array size of 8.26mm × 8.26mm
  • High PDE (63% at 420nm)
  • Excellent SPTR and CRT
  • Excellent uniformity of breakdown voltage
  • Excellent uniformity of gain
  • 4-side tileable, with high fill factors
  • 40μm cell pitch
  • Highly transparent epoxy protection layer
  • Operating temperature range from -20°C to +50°C
  • RoHS, CFM, and REACH compliant

more information: https://www.broadcom.com/products/motion-control-encoders/incremental-encoders/reflective-encoders/aedr-9930

M5Stack CoreS3 ESP32S3 loT Development Kit

Posted on by mixos

M5Stack CoreS3 ESP32S3 loT Development Kit is based on ESP32-S3 solution, dual-core XTensa LX7 processor. This kit features 240MHz frequency, WiFi® at 16M flash, 8M PSRAM, built-in camera, proximity sensor, speaker, power indicator, I2S amplifier, dual microphone, and condenser touch screen. The CoreS3 kit supports OTG, CDC functions, and Arduino and UIFlow programming platforms. Typical applications include Internet of Things (IoT) development, various DIY project development, smart home control system, and industrial automation control system.

Features

  • Developed based on ESP32, supports WiFi® at 16M flash, and 8M PSRAM
  • Built-in camera, proximity sensor, speaker, power indicator, RTC, I2S amplifier, dual microphone, and condenser touchscreen
  • Power button, reset button, and gyroscope
  • TF card slot
  • High-strength glass
  • Support OTG and CDC functions
  • AXP2101 power management and low power design
  • Arduino and UIFlow-supported programming platforms

Specifications

  • 2-inch at 320*240 ILI9342C touch the IPS LCD screen
  • GC0308 at 30 megapixels camera
  • LTR-553ALS-WA proximity sensors
  • 16bits-I2S power amplifier chip AW88298 at 1W
  • ES7210, dual microphone inputs audio decoding chip

more information: https://m5stack.com

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