MYIR Launched RENESAS RZ/G2L based SoM for HMI and Edge Gateway Applications

MYIR has launched MYC-YG2LX CPU Module based on RENESAS RZ/G2L SoC which features 1.2GHz dual ARM Cortex-A55 and 200MHz Cortex-M33 cores with high-performance Mali-G31 GPU and built-in video codec engine as well as various peripheral interfaces such as camera input, display output, USB 2.0, and GigE-Ether. In addition to the SoC, the MYC-YG2LX has integrated 1GB/2GB DDR4, 8GB eMMC, 32Kbit EEPROM and PMIC. A variety of peripheral and IO signals are accessible via the 1.0 mm pitch 222-pin Castellated-Hole expansion interface. It provides a cost-effective SoM solution for advanced HMI, IoT Edge Computing Gateway and embedded devices with video capabilities.

The MYC-YG2LX CPU Module has a small form factor, measuring only 45mm by 43mm. It is ready to run Linux OS and provided with image files, kernel and driver source codes, application demos and compilation tools to enable users to start their development rapidly and easily.

Features Of MYC-YG2LX CPU Module

  • Dimensions: 45mm x 43mm
  • PCB Layers: 10-layer design
  • Power supply: 5V/1A
  • Working temperature: -40~85 Celsius (industrial grade)
  • RENESAS RZ/G2L processor (R9A07G044L23GBG)
  • 1G/2G DDR4 (supports optional 4GB)
  • 8GB eMMC (supports optional 4GB, 16GB / 32GB)
  • 32KB EEPROM
  • Power Management IC (RAA215300)
  • 0mm pitch 222-pin stamp hole expansion interface
    – 2 x RGMII
    – 4 x I2C
    – 3 x SPI
    – 2 x USB 2.0
    – 1 x MIPI DSI
    – 1 x MIPI CSI
    – 1 x Parallel CSI
    – 1 x RGB
    – 2 x SCI
    – 5 x SCIF
    – 8 x ADC
    – 4 x SSI
    – 1 x SRC
    – 2 x CAN
    – Up to 118 GPIOs

Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and CPU Module pin-out description file.

  • Linux OS

MYIR has designed a versatile development board MYD-YG2LX, using the MYC-YG2LX CPU Module as core controller module. It is a complete evaluation platform and has provided an ideal base board prototype reference design for using the MYC-YG2LX. A plenty of peripherals interfaces are carried out to the base board through the 1.0 mm pitch 222-pin Castellated-Hole expansion interface including Serial ports, two Gigabit Ethernet, two USB 2.0 HOST and one USB 2.0 OTG, one Micro SD card slot, one M.2 Socket for USB based 4G/5G LTE Module with two SIM card holders, one USB2.0 based WiFi module, one GPIO/I2C/UART/SPI/CAN extension header, Audio input/output, MIPI-CSI camera interface as well as HDMI, LVDS and RGB video output interfaces, etc. MYIR also offers camera modules, RPI COM Module (RS232/RS485/CAN) and LCD modules as add-on options to work with the board for further enhancing the functionality of the board.

MYD-YG2LX Development Board Function Block Diagram

MYIR offers 1GB and 2GB DDR4 version options for the MYC-YG2LX CPU Module. The prices are economic but the module has high performance and reliable quality. Discount is to be offered for volume quantities. MYIR also provides OEM/ODM services to help customers accelerate their time to market and save costs.

More information about the above new products can be found at: https://www.myirtech.com/list.asp?id=719

Fischer Connectors enhances IIoT connectivity with ultra-rugged solutions using Single Pair Ethernet and USB 3.2 protocols

Fischer Connectors, the Swiss-based global leader in high-performance connectivity, releases ultra-robust Single Pair Ethernet (SPE) and USB 3.2 Gen 2 connectivity solutions to meet the specific requirements of Industrial Internet of Things (IIoT) applications in rugged environments.

With the increase in sensor density, actuators and controllers in Industry 4.0 and IIoT operational settings, high power levels and massive amounts of data must be securely and efficiently managed through ultra-fast transmission lines with cables running over long distances. Miniature connectors and cables are needed to interconnect smaller and smaller devices and sensors in areas that are sometimes confined and hard to access. And connectivity must be ruggedized to resist shock, vibration, extreme temperatures, water and corrosion when exposed to demanding environmental and chemical conditions, both indoors and outdoors.

To address these challenges, Fischer Connectors has developed new high-speed data and power connectivity solutions combining Single Pair Ethernet and USB 3.2 Gen 2 high-speed protocols with the rugged, high-density and miniature features of its flagship product lines. They enable space-saving and cost-efficient integration in industrial automation and robotics, chemical plants, food processing, automotive production lines, outdoor sensing and unmanned systems.

The Single Pair Ethernet solutions from the Fischer Core Series and Fischer UltiMate™ Series allow for 1 Gbit/s data transfer per IEEE 802.3bp – 1000Base-T1. Exceptionally rugged by any market standards, they outperform other suppliers’ SPE solutions in terms of security, durability, as well as environmental and mechanical performance. Fischer SPE is compliant with MIL-STD norms (through Fischer UltiMate™) and offers 10,000 mating cycles, three locking mechanisms (push-pull, screw, quick-release), and hermetic sealing in addition to IP68/ IP69 ratings. SPE is also featured in the ultra-miniature Fischer MiniMax™ connector in ‘size 06’ (Ø 10 mm receptacle).

The demand for USB 3.0+ protocol is high in Industry 4.0 operations, as it offers high data transfer rates with low latency for IIoT control applications, nearly twice the power output than USB 2.0 (900 mA vs. 500 mA), better power efficiency due to lower consumption in idle state, and larger bandwidth. Fischer MiniMax™ connectors with USB 3.2 Gen 2 allow for 10 Gbit/s data transfer, offer additional power contacts up to 8 A, and are half the size of some competitor connectors with similar speed but no power.

To accompany its product release, Fischer Connectors has published a trend paper entitled “The Connectivity Challenge – Connecting Industry 4.0”. It describes three challenges facing OEM engineers designing IIoT applications, as well as three innovation practices addressing cybersecurity, global logistics and Edge/Cloud infrastructure.

The innovation-driven IIoT market is growing exponentially. With billions of smart sensors, computers and machines connected and operating across the Internet, experts expect an annual increase of over 20%, reaching 1.5 trillion euros by 2030.

M95P32-I – Ultra low-power 32 Mbit serial SPI page EEPROM

The M95P32-I is a high-density, page-erasable SPI EEPROM memory that combines flexibility, performance, and ultra-low power. It is a unique non-volatile memory solution for ultra-low power systems that require an external NVM to boot by downloading firmware before execution in RAM, to upload firmware versions by OTA, and to run parameter monitoring, data log, or event recording.

Key Features:

  • 32Mbit (4Mbytes) SPI Page EEPROM
  • Write byte flexibility
  • Write page 512 bytes
  • Extended range: -40 °C to +105 °C

Applications:

  • Wearable
  • Medical and healthcare
  • IoT for smart home and city
  • IoT for smart industry

more information: https://www.avnet.com/wps/portal/ebv/products/new-products/npi/2022/stmicroelectronics-m95p32-i

Vecow and Allxon partner to provide advanced embedded AI solutions with remote management technology

Vecow EAC-500 has OOB remote management capability

Vecow has teamed up with Allxon, a company that offers solutions for remote device management, to provide integrated solutions for the Vecow EAC Series, which is powered by the NVIDIA Jetson Platform. The Vecow EAC Series, including the EAC-5000, EAC-3000, and EAC-2000, runs on Jetson AGX Orin, Jetson AGX Xavier, and Jetson Xavier NX Series, and offers high-performance artificial intelligence suitable for a wide range of applications, such as in-vehicle computing, autonomous mobile robots, real-time video analytics, and AOI.

To streamline remote management operations, the industry requires remote management of edge devices and Out-of-Band remote management operation technology. The Allxon Device Management Solution platform caters to Edge AI devices with features such as In-Band Management, Out-of-Band Management, and Plugin Station. The In-Band Management component is specifically designed for NVIDIA Jetson-based Edge AI computers and offers various functionalities like CPU and GPU performance monitoring, remote command, BSP image-based OTA, and provisioning.

“As AIoT and number of use cases continue to grow, the market will demand a large amount of Edge AI appliances, as well as an optimized remote management tool for those devices, “said Thomas Su, Vice President of Vecow. “Our partnership with Allxon delivers an easy monitoring and control solution for Edge AI appliances anywhere, anytime while esnuring all Edge AI devices are reliable and robust.”

Out-of-Band (OOB) management is a hardware-based technology that allows service providers to remotely turn devices on and off and revive unresponsive systems. Cloud-based OOB management, using simple SaaS services, enables service providers to optimize the operations of edge AI devices more efficiently. By integrating OOB technology with SaaS, Managed Service Providers (MSPs) can overcome the challenges of deploying large numbers of edge AI devices in harsh, remote, and inaccessible locations.

The EAC-5000-OOB, which is part of the EAC Series, includes the OOB remote management operation technology, allowing it to offer robust disaster recovery services for Edge AI applications. Furthermore, the EAC-5000, EAC-3000, and EAC-2000 models all support In-Band Management Service.

Vecow Partners with Allxon

The Vecow EAC-5000 Series Edge AI Computing System, which uses NVIDIA Jetson AGX Orin, has a high-performance AI capability of up to 275 TOPS, thanks to the advanced NVIDIA Ampere architecture. As a result, it is a benchmark in the ecosystem of in-vehicle computing systems, making it a perfect fit for various applications such as automated agricultural machinery, robotic control, in-vehicle computing, intelligent video analytics, machine vision, mobile robots, and embedded AI.

Quectel introduces the RedCap Rx255C module series for IoT applications

Quectel RedCap Rx255C module series

Quectel Wireless Solutions has launched its 5G RedCap (Reduced Capability) modules, the Rx255C series. The company has designed these modules to improve wireless performance and low-latency communication. Along with its integrated 5G connectivity, the modules offer significant optimization in size and energy savings.

The modules are based on Snapdragon X35 5G Modem-RF System, which is ideal for various industries and mobile broadband applications. The new modules are backward compatible with LTE networks and meet the 3GPP Release 17 standards, supporting 5G standalone mode and a maximum bandwidth of 20MHz on the sub-6GHz frequency band.

The Rx255C series modules also offer theoretical peak downlink data rates of around 220 Mbps and uplink data rates of around 100 Mbps. They can be deployed in various IoT applications such as robotics, DTU, drones, smart ports, smart grid, AR/VR wearables, educational laptops, and entry-level mobile broadband devices.

Qualcomm Technologies Snapdragon X35 5G Modem-RF System

The onboard Snapdragon X35 5G Modem-RF System is claimed to be the world’s first 5G NR light Modem RF system. It features a streamlined and optimized architecture and system enhancements that expand the 5G ecosystem and fuel the 5G-connected intelligent edge. The optimized NR light Modem RF system combines the power efficiency benefits of lower complexity design with new Release 17 power-saving features and a tightly integrated modem RF, delivering superior power efficiency.

Qualcomm Technologies’ Snapdragon X35 provides a long-term migration path to replace LTE CAT4+ devices and enable various use cases, such as entry-level industrial IoT devices, mass-tier fixed wireless access consumer premise equipment, mass-tier connected PCs, and first-generation 5G consumer IoT devices like direct-to-cloud glasses and premium wearables.

RedCap technology allows the Rx255C series modules to optimize the number of antennas, reduce the transmitting and receiving bandwidth, and provide 64QAM/256QAM (optional) modulation to optimize the size. The high level of integration and unique architecture of Snapdragon X35 ensures that the modules have low power consumption, which drives 5G adoption in an entirely new category of devices.

To help customers facilitate their designs, Quectel offers a variety of high-performance 5G antennas that significantly boost wireless connectivity. With the launch of the Rx255C series, Quectel is taking a critical step toward the 5G vision of connecting virtually everything around us.

Lanner Launches 5G-Ready Edge AI Appliance EAI-I131 Powered by NVIDIA Jetson Orin NX and Orin Nano System-on-Modules

Lanner Electronics, a leading provider of intelligent edge computing appliances, has unveiled its latest industrial-grade Edge AI platform, the EAI-I131, designed for next-generation video analytics solutions. The EAI-I131 is powered by NVIDIA® Jetson Orin™ NX or Jetson Orin Nano™ system-on-modules, delivering up to 100 TOPS of AI computing performance for a wide range of AI workloads.

Designed to deliver high performance in challenging environments, the IP40-rated fanless EAI-I131 is equipped with a -40 ~ 75°C wide operating temperature design that enhances reliability and durability in industrial settings. The device also supports LTE, 5G Sub6, and WiFi wireless connectivity and provides rich connectivity options, including 2x GbE PoE, 2x COM, 2x USB, and 4x DI/DO ports.

The EAI-I131 is also compatible with the NVIDIA JetPack SDK, which provides Jetson Linux, developer tools, CUDA-X accelerated libraries, and other NVIDIA technologies. The NVIDIA JetPack SDK enables end-to-end acceleration for AI-based video analytics solutions across diverse industries, such as retail queue management, disaster response, traffic management, and critical asset protection.

“We are excited to launch the EAI-I131, which showcases our commitment to delivering robust and reliable edge AI computing solutions that meet the needs of our customers,” said Jeans Tseng, Chief Technology Officer, Lanner. “The EAI-I131’s powerful AI computing performance from NVIDIA Jetson Orin NX and Orin Nano system-on-modules, combined with its rugged design, makes it an ideal solution for enabling AI-driven decision-making in industrial settings.”

With the launch of the EAI-I131, Lanner continues to expand its portfolio of intelligent edge computing appliances, enabling solution providers to harness the power of AI in real-world applications.

https://www.lannerinc.com

Powercore EDM Cuts through solid metal With Ease

The popularity of 3D printing has spurred a competition to make automated machine tools and fabrication methods more accessible to hobbyists. Laser cutting is a great example of this, as it used to be too expensive for hobbyists, but now can be purchased for a few hundred dollars. However, these laser cutters are not powerful enough to cut through metal, which is why the new Powercore desktop EDM machine is so desirable, as it can cut through sheet metal. If you’re looking to make a project quickly, you do not have to wait days or weeks for laser-cut components to arrive when you can get high-quality parts in minutes with Electrical Discharge Machining (EDM). The Powercore is an ideal tool for Makers, as it is similarly priced to laser cutters, but can cut solid aluminum much faster.

EDM is a process that uses sparks to cut thin lines in hard metals like tool steel, which would be difficult for conventional mills to handle. It is a clean process that does not require powerful motors, as there is no physical contact between the tool and the material, thus requiring very little torque. This makes it suitable for desktop use, as the machine can be small and lightweight. The sparks are created by pulsing electricity between two electrodes with sheet metal in between them, and the electrodes are moved around the material at a relatively slow pace.

EDM is much more gentle than traditional subtractive manufacturing, making it an attractive option for home labs. Unlike metal-capable CNC mills which require large castings to contain cutting forces, EDM can use light-duty structures and still produce precise parts. Powercore is an example of this, as it is designed to replace the extruder of a 3D printer and is composed of parts that can be printed on the same machine.

EDM is a more attractive option for home labs than traditional subtractive manufacturing due to its gentleness, and it can produce precise parts with light-duty structures, unlike metal-capable CNC mills which require large castings to contain cutting forces. Powercore is designed to replace the extruder of a 3D printer and is composed of parts that can be printed on the same machine.

Rack Robotics claims they have been able to cut material as thick as 4mm, but suggest keeping it below 1mm for the small vat with a standard material stock of 3×3″ aluminum sheet. Cut rates are estimated to be around 10mm per minute. Rack Robotics suggests that the Powercore is best suited for cutting small, thin aluminum sheet metal parts that require precise, clean edges, as well as delicate parts that would be difficult to fabricate with conventional methods without damage. It is not suitable for cutting large sheets, very thick sheets, or fast jobs.

Rack Robotics‘ Powercore is currently on Kickstarter with a goal of $5,000, and has already raised over $120,000, showing how enthusiastic the hobbyist community is about this product. The Kickstarter campaign will end on April 1st, and the special price is $399. The package includes a power supply, ten brass electrodes, 10 pieces of aluminum stock, two electrode holder kits, and a work-holding kit.

However, backers will need to print some parts themselves in order to complete the build, and rewards are expected to be shipped out in July 2023.

Raspberry Pi Global Shutter Camera is an Ideal Camera for Machine Vision

Raspberry Pi has unveiled a new camera module, the Raspberry Pi Global Shutter Camera, which is a variation of its High-Quality Camera Module but with a global shutter instead of a rolling shutter. Since the first Raspberry Pi Camera Module, all subsequent models have utilized rolling shutters, which capture an image line-by-line. This works well for most applications, but if you’re trying to capture fast-moving objects, the image can become distorted. A global shutter, on the other hand, captures the entire image simultaneously, eliminating any shearing or smearing of the image. Eben Upton, co-founder of Raspberry Pi, explains that the Global Shutter Camera, which is built around Sony’s 1.6-megapixel IMX296 sensor, is able to capture rapid motion without introducing rolling shutter artifacts. This makes it an ideal choice for sports photography and machine vision applications, as even the slightest distortion can significantly reduce inference performance.

The Raspberry Pi Global Shutter Camera, based on the same design as the Raspberry Pi High-Quality Camera Module, features a backplate to protect the PCB, a feature that won’t be available on other models in the range. Additionally, there is no news yet on an M12-mount version. The company explains why the new Raspberry Pi Global Shutter Camera is useful ‘‘Fast-moving objects, like those propeller blades, are now easy to capture; we can also synchronize several cameras to take a photo at precisely the same moment in time. There are plenty of benefits here, like minimizing distortion when capturing stereo images. (The human brain is confused if any movement that appears in the left eye has not appeared in the right eye yet.)

The Raspberry Pi Global Shutter Camera can also operate with shorter exposure times – down to 30µs, given enough light – than a rolling shutter camera, which makes it useful for “high-speed photography.’’

It is easy to connect the camera. Insert the flex cable into the CAMERA connector on the Raspberry Pi, located between the Ethernet and HDMI ports, with the silver contacts facing the HDMI port. To open the connector, pull the tabs on the top of the connector upwards, then towards the Ethernet port. Make sure to insert the cable firmly, taking care not to bend the flex at too acute an angle. To close the connector, push the top part of the connector towards the HDMI port and down, while holding the flex cable in place. The company has provided a video on how to do it.

The Raspberry Pi Global Shutter Camera can now be purchased from any seller for $50, and further details can be found on the company’s documentation website, and announcement page.

Aetina Launches AIE-CP1A-A1 ASIC-based Edge AI System for Computer Vision Applications

Aetina Corporation is a Taiwanese company that designs and manufactures high-performance edge computing hardware and low or no-code software for AI and IoT. The company recently launched a new ASIC-based edge AI system designed for different computer vision applications; the AIE-CP1A-A1.

The AIE-CP1A-A1 system is powered by a compact Blaize Pathfinder P1600 Embedded SoM which is equipped with a dual ARM Cortex A53 processor, the Blaize GSP 16 TOPS AI accelerator, and H.264/H.265 video encoder & decoder for fast image recognition and video analytics tasks. The SoM also boasts extended temperature ranges that make it suitable for use in rugged and challenging environments and also in complex embedded systems and applications. Others include 4GB RAM, PCIe Gen 3.0, and MIPI CSI/DPI camera interfaces.

The ASIC-based AIE-CP1A-A1 embedded computer is fanless has a compact chassis design and can be used for a variety of applications including object detection, human motion detection, and automated inspection. It features an HDMI video output, one microSD card slot, one Gigabit Ethernet port, two USB 3.2 ports, one USB Type-C, a power LED, a reset button, and a host of many others. It enables the flexible development of highly-accurate custom AI algorithms via the Blaize NetDeploy and Picasso SDK. The software platform supports PyTorch, TensorFlow, and ONNX machine learning frameworks.

Features and Specifications of the AIE-CP1A-A1 System Include

  • Blaize PathFinder P1600 SoM with:
    • Blaize 1600 dual Arm Cortex A53 processors
    • Blaize GSP 16 TOPS AI accelerator supporting INT8, INT16, BF16, FP16, FP32 and FP64 data formats
    • H.264/H.265 encode and decode
    • MIPI CSI/DPI camera interfaces
    • 4GB RAM
    • 64MB Quad SPI NOR flash
    • PCIe Gen 3.0
    • 400-pin board-to-board connector
    • Thermal transfer plate and temperature sensing and fan control
    • Power Consumption: 10W typ.
    • Dimensions: 100 mm x 50 mm x 12 mm
    • Temperature range: 0°C – 70°C (commercial); -40°C to +85°C (industrial)
    • Certifications: RoHS, WEE, CE, FCC
  • 8GB eMMC flash
  • MicroSD card slot
  • 1x HDMI 1.4 with HDMI Type-A connector
  • 1x GbE RJ45 port
  • 2x USB 3.2 Gen1 Type-A ports
  • 1x RS232 COM port
  • 1x USB Type-C port
  • 1x Power LED for SoM
  • 1x Reset Button
  • Power Supply: 12V via DC jack or 4-pin connector
  • Dimensions: 160 mm x 125 mm x 80 mm
  • Weight: 1.886 kilograms
  • Temperature range: 0°C – 60°C (operating); -40°C – +85°C (storage)
  • Certifications: CE/FCC

You’ll find some additional information about the AIE-CP1A-A1 on the company’s news page or its product page.

You can also check here for more details on the Blaize P1600 SoM, the Blaize Graph Streaming Processor, and the Blaize Picasso software development kit.

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