Qualcomm’s RB3 Gen 2 Development Kit: Advanced IoT Development Platform

The Qualcomm® RB3 Gen 2 Development Kit is the latest iteration in the RB3 series, designed to enhance performance and accessibility for IoT development. Powered by the advanced Qualcomm® QCS6490 Chipset, this kit offers a significant upgrade over its predecessor, with substantial improvements in AI computing and overall processing capabilities.

Key features of the Qualcomm® RB3 Gen 2 Development Kit include a powerful QCS6490 processor, which supports a variety of Linux-based distributions tailored for IoT applications. The AI computing performance has quadrupled, reaching an impressive 12 TOPS. This development kit is compatible with multiple SDKs and tools, such as the Qualcomm® Neural Processing SDK for AI, Qualcomm® Intelligent Multimedia Product SDK, and Qualcomm® Intelligent Robotics Product SDK. Additionally, it provides a comprehensive set of demo applications and tutorials to accelerate IoT application development. The kit adheres to the 96Boards specification and supports a wide array of sensors, including multiple cameras, depth sensing solutions, and various other sensors like IMU, pressure sensors, and magnetometers.

The RB3 Gen 2 offers robust AI processing and computer vision capabilities, making it suitable for a broad range of IoT solutions across enterprise, robotics, industrial, and automation sectors. It features support for Qualcomm® Linux®, a complete package of OS, software, tools, and documentation specifically designed for Qualcomm’s IoT platforms. The QCS6490 chipset significantly boosts AI processing capabilities, enabling higher inferences per second, improved power efficiency, and the ability to run multiple networks simultaneously. This on-device machine learning capability, combined with edge computing, allows for near real-time processing of vast data amounts.

Qualcomm® RB3 Gen 2 Development Kit Features:

• Advanced ISPs for superior image and video capture with single or multiple concurrent camera support.
• AI-accelerated workplace security and visibility.
• Multi-gigabit Wi-Fi 6E for fast, low-latency wireless connectivity.
• Superior Bluetooth® 5.2 and LE audio with low latency and extended range.
• Low-speed expansion for GPIOs, I2C, SPI, UART, and audio.
• High-speed expansion for PCIe, USB, MIPI CSI/DSI, and SDIO, designed for 96Boards mezzanines.

The development kit includes hardware that complies with the 96Boards open hardware specification, allowing for a range of mezzanine-board expansions, starting with the Vision Mezzanine. The Qualcomm® Spectra™ ISP 570L image processing engine delivers exceptional photography and videography experiences. It supports connections to multiple cameras, including stereo, depth, and Time-of-Flight (ToF). The Qualcomm® Adreno™ 633 VPU provides UltraHD video encoding and decoding, while the Adreno 1075 DPU supports both on-device and external UltraHD displays. Additionally, the kit features multi-gigabit Wi-Fi 6E for fast wireless connectivity and low latency, along with advanced features such as Qualcomm® 4K QAM and support for high-speed 160MHz channels.

The Qualcomm® Kryo™ 670 CPU and Qualcomm® Hexagon™ processor with a fused AI-accelerator architecture ensure powerful connections and computing performance. This makes the RB3 Gen 2 development kit ideal for various industrial and commercial IoT applications, including ruggedized handhelds, human-machine interface systems, point-of-sale systems, drones, kiosks, edge AI boxes, and connected cameras.

Qualcomm RB3 Gen 2 platform is available for pre-order now on Thundercomm for $399 (Core Kit) and $599 (Vision Kit) with a 12V wall power supply, a USB Type-C cable, mini speakers, a setup guide, and a pick tool for setting switches, and the Vision Kit also adds a mounting bracket for the high-resolution and low-resolution CSI cameras part of the kit. More details may be found on the product page.

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