Renesas RA8E1 and RA8E2 Microcontrollers Features High-Performance Arm Cortex-M85 for Automation and AIoT Applications

Renesas Electronics has introduced the RA8E1 and RA8E2 microcontrollers (MCUs) groups, part of the RA8 Series, which utilize the Arm Cortex-M85 core with Helium and TrustZone technology. These MCUs deliver exceptional performance of up to 6.39 CoreMark/MHz and leverage Arm Helium for a 4X boost in DSP and machine learning (ML) tasks, making them ideal for AIoT applications. Designed for industrial automation, home appliances, smart homes, healthcare, and consumer electronics, the RA8E1 and RA8E2 MCUs offer customized features to balance cost and performance. Key features include low power consumption, large memory configurations, advanced peripherals like Ethernet, USBFS, CAN-FD, and TFT-LCD controllers, and packages ranging from 100-pin LQFP to 224-pin BGA. Supported by the RA Flexible Software Package (FSP), they ensure easy development with tools for AI, motor control, and cloud solutions, enabling faster time to market. These MCUs serve applications requiring high performance, energy efficiency, and affordability in diverse sectors.

To be Accurate, the RA8E1 runs at 360 MHz, while the RA8E2 runs at 480 MHz Arm Cortex-M85 microcontrollers differ in clock speed, memory options, communication features, and package sizes. The RA8E1 includes an Ethernet MAC and a camera interface, which the RA8E2 lacks. However, the RA8E2 is better suited for HMI applications, offering an RGB LED interface, a 2D drawing engine, and external memory support. Both MCUs provide high performance, advanced memory, and flexible peripherals.

Recently, we have written about Renesas RX260 and RX261, 32-bit microcontrollers based on RXv3 core, designed for outstanding power efficiency, advanced touch functions, and robust security. We have also covered some Renesas MCUs, including the RX23W Module and the RA2L1 single-chip module, which share some features with RA8E1 and RA8E2.

Renesas RA8E1 and RA8E2 Microcontrollers Specifications:

• MCU Core:
  • ARM Cortex-M85, clocked at 360 MHz for RA8E1 and 480MHz for RA8E2
  • Helium MVE (M-Profile Vector Extension)
  • ARM TrustZone
  • 12KB data flash
• Memory & Storage:
  • 544KB SRAM (32KB TCM with ECC, 512KB user SRAM with parity protection) for RA8E1
  • 672KB SRAM (including 32KB TCM) for RA8E2
  • 1KB standby SRAM
  • 32KB instruction/data caches
  • 1MB code flash
• Camera:
  • 8-bit Capture Engine Unit (CEU) interface for RA8E1 only
• Display interfaces with features for RA8E2:
  • Graphics LCD Controller (GLCDC) supporting up to WXGA resolution (1280×800)
  • 2D Drawing Engine (DRW)
• Communication Interfaces:
  • Ethernet controller with DMA
  • USB 2.0 High-Speed & Full-Speed interfaces
  • 2x CAN-FD
  • xSPI compliant Octal SPI with XIP
  • Up to 6x SCI (UART, Simple SPI, Simple I2C)
  • 1x SPI/I2C multi-master interface
  • 2x SSI
• Analog:
  • 2x 12-bit ADC
  • 1x 12-bit DAC
  • 2-channel High-Speed Analog Comparator
  • Temperature sensor
• System:
  • Low power modes
  • Battery backup function (VBATT)
  • Event Link Controller (ELC)
  • Data Transfer Controller (DTC)
  • 8-channel DMA Controller (DMAC)
  • Power-on reset
  • Programmable Voltage Detection (PVD) with voltage settings
• Timers:
  • 32-bit & 16-bit Timers
  • 32-bit Ultra-Low-Power Timer
  • Watchdog
  • RTC
• Security:
  • ARMv8-M TrustZone Security
  • Renesas Secure IP (RSIP-E51A)
  • On-chip immutable ROM for First Stage Bootloader with hardware Root-of-Trust
  • Secure authenticated debug
  • Secure factory programming
  • Tamper protection
• Packages:
  • LQFP100 and LQFP144 for RA8E1
  • 224-pin BGA for RA8E2

As per the company, both MCUs will be compatible with Renesas Flexible Software Package (FSP), which offers a range of software components including BSP software, drivers, RTOS, middleware, and reference software designed for AI, motor control, and cloud-based applications. Additionally, Renesas has created two Winning Combinations for these new MCUs, a basic voice and vision AI system, as well as a Human Machine Interface (HMI) solution customized for appliances.

The RA8E1 and RA8E2 Group MCUs are now available, priced at approximately $7.57 and $9.28 per 1000 units, respectively, including the FSP software. Renesas is also offering a Fast Prototyping Board for the RA8E1 at £24.82 i.e. $26.09 (excluding TAX), and plans to release an RA8E2 Evaluation Kit with a TFT Display in early Q1 2025. For more information, visit renesas.com/RA8E1 and renesas.com/RA8E2. Samples and kits can be ordered directly from the Renesas website or through authorized distributors. You can find more details on the product pages and in the press release.

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