Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon

4 August, 2016

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Toshiba will start mass production of 64-layer 3D NAND, BiCS3, with 3-bit-per-cell technology and a 64GB capacity in the first half of 2017. The applications of this new massive storage chip include enterprise and consumer SSD, smartphones, tablets and memory cards. This achievement succeeds the 48-layer BiCS FLASH one.

Western Digital, the well known industry-leading provider of storage technologies, recently announced world’s first 64 Layer 3D NAND. “BiCS3 has been developed jointly with Western Digital’s technology and manufacturing partner Toshiba. It will be initially deployed in 256 gigabit(32GB) capacity” according to Western Digital’s press release.

In the same context, Samsung seems going to start production of 64-layer 3D NAND at the end of this year 2016.

Via: electronicsweekly 1&2

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About Yahya Tawil

Email : yahya.tawil@gmail.com Website : https://www.linkedin.com/in/yahya-tawil-88377989

Embedded Hardware Engineer interested in open hardware and was born in the same year as Linux. Yahya is the editor-in-chief of Atadiat and believes in the importance of sharing free, practical, spam-free and high quality written content with others. His experience with Embedded Systems includes developing firmware with bare-metal C and Arduino, designing PCB&schematic and content creation.

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