SECO SOM-SMARC-Genio510 and Genio700 Modules with MediaTek Genio 510 and 700 SoCs for Edge AI Applications

SECO has unveiled two new SMARC system-on-modules: the SOM-SMARC-Genio510 and SOM-SMARC-Genio700, powered by MediaTek Genio 510 and 700 SoCs featuring Cortex-A78 and Cortex-A55 cores. These industrial-grade modules are designed for high power efficiency, delivering reduced energy consumption even during intensive edge AI workloads. They are well-suited for applications such as retail touchscreens, intelligent industrial sensors, advanced conferencing systems, and dynamic digital signage.

The SOM-SMARC-Genio510, powered by the MediaTek Genio 510, offers industrial-grade performance optimized for demanding AI tasks. It supports up to 8GB of LPDDR4 memory, 64GB of eMMC flash storage, dual Ethernet interfaces via RGMII, USB connectivity, camera inputs, and an optional M.2 slot for Wi-Fi and Bluetooth modules, providing versatile connectivity and expansion options.

Previously, we covered the IBASE ISR500, powered by the MediaTek Genio 700 (MT8390) 2.2GHz or Genio 510 (MT8370) 2.0GHz processors, delivering highly responsive multi-core and real-time AI performance of up to 3.2 TOPS. Be sure to check out this product for more details.

Key Features of SECO SOM-SMARC-Genio510 and SOM-SMARC-Genio700:

• SoC Options:
• SOM-SMARC-Genio700: MediaTek Genio 700 (MT8390)
  • CPU: Octa-core (2x Cortex-A78 @ up to 2.2 GHz + 6x Cortex-A55 @ up to 2.0 GHz)
  • GPU: Arm Mali-G57 MC3 with OpenGL ES 1.1/2.0/3.2, OpenCL 2.2, Vulkan 1.0/1.1
  • AI Accelerator: Mediatek DLA + VP6 (INT8/INT16/FP16) up to 4.0 TOPS
  • VPU:
    • Encoding: Up to 4Kp30 (H.265/HEVC, H.264)
    • Decoding: Up to 4Kp75 (AV1, VP9, HEVC, H.264)
  • DSP: Tensilica HiFi5 audio DSP
• SOM-SMARC-Genio510: MediaTek Genio 510 (MT8370)
  • CPU: Hexa-core (2x Cortex-A78 @ up to 2.2 GHz + 4x Cortex-A55 @ up to 2.0 GHz)
  • GPU: Arm Mali-G57 MC2
  • AI Accelerator: Mediatek DLA + VP6 (INT8/INT16/FP16) up to 3.2 TOPS
  • VPU:
    • Encoding: Up to 4Kp30 (H.265/HEVC, H.264)
    • Decoding: Up to 4Kp60 (AV1, VP9, HEVC, H.264)
  • DSP: Tensilica HiFi5 audio DSP
• Memory and Storage:
  • Soldered LPDDR4X-3733/LPDDR4-3200, up to 8GB
  • On-board eMMC 5.1 storage, up to 64GB
• Networking:
  • Gigabit Ethernet PHY
  • 100Mbit Ethernet via USB with a 4-port USB hub
  • Optional Wi-Fi 802.11 a/b/g/n/ac 2×2 and Bluetooth 5.3 (via M.2 module)
• Connectivity and Interfaces:
  • 314-pin MXM 3.0 connector
  • USB: 1x USB 3.1, 1x USB 2.0 Host/Slave, 4x USB 2.0 Host
  • Audio: 2x I2S ports
  • Serial: 2x UART (4-wire), 2x UART (2-wire)
  • Camera Interface: MIPI-CSI
  • GPIOs, PWM ports, General Purpose I2C Bus
• Storage and Security:
  • SDIO interface
  • TPM support
• Power Supply:
  • +5V DC ±5%
  • +3.3V_RTC
• Dimensions: 82 x 50 mm (SMARC form factor)
• Temperature Range:
  • 0°C to 60°C (Commercial)
  • -20°C to 85°C (Extended Commercial)
  • -40°C to 85°C (Industrial

The Genio 510 and Genio 700 SMARC modules are fully compatible with SECO’s open-source modular software suite, Clea. They support various operating systems, including Android, Yocto Linux, and Ubuntu. SECO also offers a development kit featuring a carrier board, adapter cables, and video and SATA cables. For additional details, visit the DEV-KIT-SMARC product page.

As of now, the company has not disclosed pricing details for these products. For more information, visit the SOM-SMARC-Genio700 and SOM-SMARC-Genio510 product pages, as well as the press release page.

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